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1SX280LN3F43I2VG 1SX280LN3F43I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU2F50I2VG 1SX280LU2F50I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU3F50I2VG 1SX280LU3F50I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH2F55E2VG 1SX280LH2F55E2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU3F50I3VG 1SX280LU3F50I3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH2F55I2VG 1SX280LH2F55I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LN2F43E1VG 1SX280LN2F43E1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH2F55E2LG 1SX280LH2F55E2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH3F55I2LG 1SX280LH3F55I2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU2F50I2LG 1SX280LU2F50I2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH3F55I3VG 1SX280LH3F55I3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU3F50E3VG 1SX280LU3F50E3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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EPM7256AETI144-7AA Intel Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QCIXF1002ED Intel Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2756 Stücke:
Lieferzeit 10-14 Tag (e)
2+280.92 EUR
Mindestbestellmenge: 2
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KD82750PB-25 KD82750PB-25 Intel INTLS03387-1.pdf?t.download=true&u=5oefqw Description: CONSUMER CIRCUIT, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-BQFP
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Active
Control Interface: Serial
auf Bestellung 2063 Stücke:
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2+323.96 EUR
Mindestbestellmenge: 2
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KU82307-25 KU82307-25 Intel INTLS05014-1.pdf?t.download=true&u=5oefqw Description: DMA CONTROLLER, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-QFP Bumpered
Function: Controller
Interface: Bus
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 180mA
Supplier Device Package: 132-QFP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 912 Stücke:
Lieferzeit 10-14 Tag (e)
5+112.62 EUR
Mindestbestellmenge: 5
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EP2S130F1020C5NRB EP2S130F1020C5NRB Intel Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX165HN1F43E2VG 1SX165HN1F43E2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU1F50I2VG 1SX165HU1F50I2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HN3F43E3VG 1SX165HN3F43E3VG Intel Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU1F50E2VG 1SX165HU1F50E2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HN2F43I2VG 1SX165HN2F43I2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU2F50E2VG 1SX165HU2F50E2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HN3F43I2VG 1SX165HN3F43I2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU3F50E3VG 1SX165HU3F50E3VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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5CSEBA2U23I7LN 5CSEBA2U23I7LN Intel Cyclone_V_Device_Overview_Web.pdf Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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10AS066K2F40I1HG 10AS066K2F40I1HG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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10AS066H2F34E1HG 10AS066H2F34E1HG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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10AS066K1F40I1HG 10AS066K1F40I1HG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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DK-DEV-1SGX-H-0ES Intel Description: DEV KIT STRATIX 10 ENG SAMPLE
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s)
Platform: Stratix 10 GX FPGA PCIe Card
Part Status: Obsolete
Produkt ist nicht verfügbar
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10AS027H4F35I3LG 10AS027H4F35I3LG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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QSHDC-QSPI-A Intel Arria%2010%20SoC%20Dev%20Kit%20User%20Guide.pdf Description: ARRIA 10 QSPI DAUGHTER CARD
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: MT25QU01GBBA8E12- 0SIT
Platform: Arria
Part Status: Active
Produkt ist nicht verfügbar
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EPM7064BFC49-5 EPM7064BFC49-5 Intel MAX%207000B.pdf Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM7064TC44-7YY EPM7064TC44-7YY Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 64MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LAB Intel Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LAA Intel Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LNAC Intel Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LNAD Intel Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGIC040R39A2E3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I3V Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2E2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1E2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2E2VR0 Intel Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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F28F020-150 Intel Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 3372 Stücke:
Lieferzeit 10-14 Tag (e)
100+4.84 EUR
300+4.75 EUR
500+4.66 EUR
1000+4.58 EUR
Mindestbestellmenge: 100
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RD48F2100W0YTQ0 Intel Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
34+15.91 EUR
Mindestbestellmenge: 34
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EP2AGX45DF29I3NAD EP2AGX45DF29I3NAD Intel Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NE80546RE072256 Intel INTLS01681-1.pdf?t.download=true&u=5oefqw Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
auf Bestellung 3249 Stücke:
Lieferzeit 10-14 Tag (e)
6+86.81 EUR
Mindestbestellmenge: 6
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D2912-A Intel INTLS03201-1.pdf?t.download=true&u=5oefqw Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
8+71.17 EUR
Mindestbestellmenge: 8
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5CGXFC4C6F23I7N 5CGXFC4C6F23I7N Intel Cyclone_V_Device_Overview_Web.pdf Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+445.74 EUR
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EPM570ZM100C6N EPM570ZM100C6N Intel max2_mii51006.pdf Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM7064QC100-10YY EPM7064QC100-10YY Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGFB012R24B2I2V Intel Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGFB012R24C2I1V Intel Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LN3F43I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43I2VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU2F50I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU2F50I2VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU3F50I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50I2VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH2F55E2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55E2VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU3F50I3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50I3VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH2F55I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55I2VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LN2F43E1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN2F43E1VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH2F55E2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55E2LG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH3F55I2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55I2LG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU2F50I2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU2F50I2LG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LH3F55I3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55I3VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX280LU3F50E3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50E3VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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EPM7256AETI144-7AA
Hersteller: Intel
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QCIXF1002ED
Hersteller: Intel
Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2756 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+280.92 EUR
Mindestbestellmenge: 2
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KD82750PB-25 INTLS03387-1.pdf?t.download=true&u=5oefqw
KD82750PB-25
Hersteller: Intel
Description: CONSUMER CIRCUIT, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-BQFP
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Active
Control Interface: Serial
auf Bestellung 2063 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+323.96 EUR
Mindestbestellmenge: 2
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KU82307-25 INTLS05014-1.pdf?t.download=true&u=5oefqw
KU82307-25
Hersteller: Intel
Description: DMA CONTROLLER, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-QFP Bumpered
Function: Controller
Interface: Bus
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 180mA
Supplier Device Package: 132-QFP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 912 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+112.62 EUR
Mindestbestellmenge: 5
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EP2S130F1020C5NRB
EP2S130F1020C5NRB
Hersteller: Intel
Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX165HN1F43E2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HN1F43E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU1F50I2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HU1F50I2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HN3F43E3VG
1SX165HN3F43E3VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU1F50E2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HU1F50E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HN2F43I2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HN2F43I2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU2F50E2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HU2F50E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HN3F43I2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HN3F43I2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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1SX165HU3F50E3VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HU3F50E3VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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5CSEBA2U23I7LN Cyclone_V_Device_Overview_Web.pdf
5CSEBA2U23I7LN
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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10AS066K2F40I1HG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS066K2F40I1HG
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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10AS066H2F34E1HG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS066H2F34E1HG
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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10AS066K1F40I1HG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS066K1F40I1HG
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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DK-DEV-1SGX-H-0ES
Hersteller: Intel
Description: DEV KIT STRATIX 10 ENG SAMPLE
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s)
Platform: Stratix 10 GX FPGA PCIe Card
Part Status: Obsolete
Produkt ist nicht verfügbar
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10AS027H4F35I3LG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS027H4F35I3LG
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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QSHDC-QSPI-A Arria%2010%20SoC%20Dev%20Kit%20User%20Guide.pdf
Hersteller: Intel
Description: ARRIA 10 QSPI DAUGHTER CARD
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: MT25QU01GBBA8E12- 0SIT
Platform: Arria
Part Status: Active
Produkt ist nicht verfügbar
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EPM7064BFC49-5 MAX%207000B.pdf
EPM7064BFC49-5
Hersteller: Intel
Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM7064TC44-7YY MAX_7000_Ver6.7_9-12-05.pdf
EPM7064TC44-7YY
Hersteller: Intel
Description: IC CPLD 64MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LAB
Hersteller: Intel
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LAA
Hersteller: Intel
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LNAC
Hersteller: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5SGXEF40I2LNAD
Hersteller: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGIC040R39A2E3E
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1I2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2I3E
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A1I1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGIC040R39A2E2VR0 Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf
Hersteller: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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F28F020-150
Hersteller: Intel
Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 3372 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+4.84 EUR
300+4.75 EUR
500+4.66 EUR
1000+4.58 EUR
Mindestbestellmenge: 100
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RD48F2100W0YTQ0
Hersteller: Intel
Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
34+15.91 EUR
Mindestbestellmenge: 34
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EP2AGX45DF29I3NAD
EP2AGX45DF29I3NAD
Hersteller: Intel
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NE80546RE072256 INTLS01681-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
auf Bestellung 3249 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+86.81 EUR
Mindestbestellmenge: 6
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D2912-A INTLS03201-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+71.17 EUR
Mindestbestellmenge: 8
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5CGXFC4C6F23I7N Cyclone_V_Device_Overview_Web.pdf
5CGXFC4C6F23I7N
Hersteller: Intel
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+445.74 EUR
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EPM570ZM100C6N max2_mii51006.pdf
EPM570ZM100C6N
Hersteller: Intel
Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM7064QC100-10YY MAX_7000_Ver6.7_9-12-05.pdf
EPM7064QC100-10YY
Hersteller: Intel
Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGFB012R24B2I2V Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf
Hersteller: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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AGFB012R24C2I1V Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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