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KC80526LY700128 Intel Description: RISC MPU, 32-BIT, 700MHZ
Packaging: Bulk
auf Bestellung 7266 Stücke:
Lieferzeit 10-14 Tag (e)
3+167.16 EUR
Mindestbestellmenge: 3
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5CEFA9U19I7N 5CEFA9U19I7N Intel Cyclone_V_Device_Overview_Web.pdf Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 301000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 113560
Total RAM Bits: 14251008
Number of I/O: 240
DigiKey Programmable: Not Verified
auf Bestellung 79 Stücke:
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1+1034.53 EUR
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RD38F2240WWYTQ0 Intel RD38F2240WWYTQ0.pdf?t.download=true&u=axiww2 Description: WIRELESS FLASH MEMORY
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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28+17.55 EUR
Mindestbestellmenge: 28
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P82C088 P82C088 Intel INTLD030-3-3.pdf?t.download=true&u=5oefqw Description: DRAM CONTROLLER, 1M X 8, CMOS
Packaging: Bulk
Package / Case: 48-DIP
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 48-DIP
auf Bestellung 1008 Stücke:
Lieferzeit 10-14 Tag (e)
14+36.25 EUR
Mindestbestellmenge: 14
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TN87C196KJ TN87C196KJ Intel Description: 196 MICROPROCESSOR
Packaging: Bulk
auf Bestellung 1295 Stücke:
Lieferzeit 10-14 Tag (e)
7+77.19 EUR
Mindestbestellmenge: 7
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EPF6010ATC100-2 EPF6010ATC100-2 Intel FLEX_6000_Programmable_Logic_Device_Family.pdf Description: IC FPGA 71 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 880
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 88
Number of I/O: 71
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM570ZM256C6N EPM570ZM256C6N Intel max2_mii51006.pdf Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM570ZM256I8N EPM570ZM256I8N Intel max2_mii51006.pdf Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PA28F008SA85 Intel 28F008SA%20%28x8%29.pdf Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 1160 Stücke:
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54+9.13 EUR
Mindestbestellmenge: 54
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1ST040EH3F35E3VG 1ST040EH3F35E3VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH3F35I3VG 1ST040EH3F35I3VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH3F35E3XG 1ST040EH3F35E3XG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH2F35E2VG 1ST040EH2F35E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH1F35E2VG 1ST040EH1F35E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH3F35I3XG 1ST040EH3F35I3XG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPF8820ABC225-4 Intel DS_363_FLEX_8000.pdf Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGIB022R29A2E3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2I3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E1V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A1E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A1E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EE80C186XL20 Intel Description: IC MPU I186 20MHZ 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 5V
Supplier Device Package: 68-PLCC
Number of Cores/Bus Width: 1 Core, 16-Bit
Co-Processors/DSP: Math Engine; 80C187
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 253 Stücke:
Lieferzeit 10-14 Tag (e)
12+18.97 EUR
Mindestbestellmenge: 12
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DK-CMC-AGI027RBES Intel Description: IC DEV TOOLS
Packaging: Bulk
Produkt ist nicht verfügbar
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DJLXP730LE.A1 Intel Description: LXP730 - MULTI-RATE DSL FRAMER
Packaging: Bulk
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
31+16.22 EUR
Mindestbestellmenge: 31
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UG80960HD8016 Intel 80960HA_HD_HT_Sep02.pdf Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 968 Stücke:
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4+132.57 EUR
Mindestbestellmenge: 4
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5AGXBA1D6F27C6G Intel arria-v-device-overview.html Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D6F31C6G 5AGXBA1D6F31C6G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27C5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F31C6G 5AGXMA1D6F31C6G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31C5G 5AGXBA1D4F31C5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27C5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27C4G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27I5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31C5G 5AGXMA1D4F31C5G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31C4G 5AGXBA1D4F31C4G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31I5G 5AGXBA1D4F31I5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31C4G 5AGXMA1D4F31C4G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31I5G 5AGXMA1D4F31I5G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10AX016E4F29E3SG 10AX016E4F29E3SG Intel Arria10_DeviceOverview.pdf Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I3G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA3D6F31C6G 5AGXBA3D6F31C6G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA3D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31I3G 5AGXMA1D4F31I3G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA5D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
KC80526LY700128
Hersteller: Intel
Description: RISC MPU, 32-BIT, 700MHZ
Packaging: Bulk
auf Bestellung 7266 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+167.16 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
5CEFA9U19I7N Cyclone_V_Device_Overview_Web.pdf
5CEFA9U19I7N
Hersteller: Intel
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 301000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 113560
Total RAM Bits: 14251008
Number of I/O: 240
DigiKey Programmable: Not Verified
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1034.53 EUR
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RD38F2240WWYTQ0 RD38F2240WWYTQ0.pdf?t.download=true&u=axiww2
Hersteller: Intel
Description: WIRELESS FLASH MEMORY
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
28+17.55 EUR
Mindestbestellmenge: 28
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P82C088 INTLD030-3-3.pdf?t.download=true&u=5oefqw
P82C088
Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8, CMOS
Packaging: Bulk
Package / Case: 48-DIP
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 48-DIP
auf Bestellung 1008 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+36.25 EUR
Mindestbestellmenge: 14
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TN87C196KJ
TN87C196KJ
Hersteller: Intel
Description: 196 MICROPROCESSOR
Packaging: Bulk
auf Bestellung 1295 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+77.19 EUR
Mindestbestellmenge: 7
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EPF6010ATC100-2 FLEX_6000_Programmable_Logic_Device_Family.pdf
EPF6010ATC100-2
Hersteller: Intel
Description: IC FPGA 71 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 880
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 88
Number of I/O: 71
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EPM570ZM256C6N max2_mii51006.pdf
EPM570ZM256C6N
Hersteller: Intel
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM570ZM256I8N max2_mii51006.pdf
EPM570ZM256I8N
Hersteller: Intel
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PA28F008SA85 28F008SA%20%28x8%29.pdf
Hersteller: Intel
Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 1160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
54+9.13 EUR
Mindestbestellmenge: 54
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1ST040EH3F35E3VG s10_datasheet-683181-666450.pdf
1ST040EH3F35E3VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35I3VG s10_datasheet-683181-666450.pdf
1ST040EH3F35I3VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35E3XG s10_datasheet-683181-666450.pdf
1ST040EH3F35E3XG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH2F35E2VG s10_datasheet-683181-666450.pdf
1ST040EH2F35E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH1F35E2VG s10_datasheet-683181-666450.pdf
1ST040EH1F35E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35I3XG s10_datasheet-683181-666450.pdf
1ST040EH3F35I3XG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPF8820ABC225-4 DS_363_FLEX_8000.pdf
Hersteller: Intel
Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A1E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EE80C186XL20
Hersteller: Intel
Description: IC MPU I186 20MHZ 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 5V
Supplier Device Package: 68-PLCC
Number of Cores/Bus Width: 1 Core, 16-Bit
Co-Processors/DSP: Math Engine; 80C187
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 253 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+18.97 EUR
Mindestbestellmenge: 12
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DK-CMC-AGI027RBES
Hersteller: Intel
Description: IC DEV TOOLS
Packaging: Bulk
Produkt ist nicht verfügbar
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DJLXP730LE.A1
Hersteller: Intel
Description: LXP730 - MULTI-RATE DSL FRAMER
Packaging: Bulk
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
31+16.22 EUR
Mindestbestellmenge: 31
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UG80960HD8016 80960HA_HD_HT_Sep02.pdf
Hersteller: Intel
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 968 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+132.57 EUR
Mindestbestellmenge: 4
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5AGXBA1D6F27C6G arria-v-device-overview.html
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXBA1D6F31C6G
5AGXBA1D6F31C6G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F27C6G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXBA1D4F27C5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F31C6G
5AGXMA1D6F31C6G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXBA1D4F31C5G
5AGXBA1D4F31C5G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27C5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXBA1D4F27C4G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXBA1D4F27I5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXMA1D4F31C5G
5AGXMA1D4F31C5G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31C4G
5AGXBA1D4F31C4G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31I5G
5AGXBA1D4F31I5G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31C4G
5AGXMA1D4F31C4G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31I5G
5AGXMA1D4F31I5G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AX016E4F29E3SG Arria10_DeviceOverview.pdf
10AX016E4F29E3SG
Hersteller: Intel
Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I3G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXBA3D6F31C6G
5AGXBA3D6F31C6G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
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5AGXMA3D6F27C6G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
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5AGXMA1D4F31I3G
5AGXMA1D4F31I3G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
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5AGXBA5D6F27C6G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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