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1ST085EN1F43I2VG 1ST085EN1F43I2VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP1SGX40DF1020I6N EP1SGX40DF1020I6N Intel Stratix%20GX%20FPGA%20Family%20Data%20Sheet.pdf Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HU1F50I1VGAS 1SG280HU1F50I1VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HU1F50I1VG 1SG280HU1F50I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH1F55E1VG 1SG280HH1F55E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH1F55E1VGS3 1SG280HH1F55E1VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EVB-EN6382QI EVB-EN6382QI Intel en6382qi_evb_user_guide.pdf Description: EVAL BOARD FOR EN6382QI
Packaging: Bulk
Voltage - Input: 3V ~ 6.5V
Current - Output: 8A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EN6382QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
auf Bestellung 3 Stücke:
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1ST085ES1F50E2VG 1ST085ES1F50E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50E2VG 1ST110ES1F50E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50E1VG 1ST085ES1F50E1VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50I2VG 1ST085ES1F50I2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50E2LG 1ST085ES1F50E2LG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50E1VG 1ST110ES1F50E1VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50I2VG 1ST110ES1F50I2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50I1VG 1ST085ES1F50I1VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50E2LG 1ST110ES1F50E2LG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50I2LG 1ST085ES1F50I2LG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50I1VG 1ST110ES1F50I1VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50I2LG 1ST110ES1F50I2LG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FW21555AB Intel INTLS00854-1.pdf?t.download=true&u=5oefqw Description: 21555 - NON-TRANSPARENT PCI-TO-
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
auf Bestellung 15605 Stücke:
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10+52.14 EUR
Mindestbestellmenge: 10
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RJ80530MZ001256 Intel Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
auf Bestellung 4368 Stücke:
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13+39.68 EUR
Mindestbestellmenge: 13
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1SX250HH3F55I3VG 1SX250HH3F55I3VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH3F55E2VG 1SX250HH3F55E2VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH3F55E1VG 1SX250HH3F55E1VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH3F55I2VG 1SX250HH3F55I2VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH2F55E2VG 1SX250HH2F55E2VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG250HH3F55E2LG 1SG250HH3F55E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX250HH3F55E2LG 1SX250HH3F55E2LG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55I2VG 1SG280HH3F55I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH2F55E2VG 1SG280HH2F55E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH2F55E2VGAS 1SG280HH2F55E2VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH2F55E2VGS3 1SG280HH2F55E2VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG250HH3F55E3XG 1SG250HH3F55E3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX280HH2F55E2VGS3 1SX280HH2F55E2VGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1E2V Intel Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2E1V Intel Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2I2V Intel Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1E1V Intel Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1I2V Intel Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2I1V Intel Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1I1V Intel Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EP20K300EFC672-2N EP20K300EFC672-2N Intel 20K_Family_DS.pdf Description: IC FPGA 408 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 728000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 11520
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1152
Total RAM Bits: 147456
Number of I/O: 408
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP20K300EFC672-1N EP20K300EFC672-1N Intel 20K_Family_DS.pdf Description: IC FPGA 408 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 728000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 11520
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1152
Total RAM Bits: 147456
Number of I/O: 408
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17C6G Intel Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17C5G Intel Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17I5G Intel Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17I3G Intel Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX165HN3F43E2VG 1SX165HN3F43E2VG Intel Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX040HH2F35I2LG 1SX040HH2F35I2LG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10SX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 400K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1152-FBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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JHL5320 S LL39 Intel Intel-DSL5320-Thunderbolt-2-Controller Description: I/O CONTROLLER INTERFACE IC DISC
Packaging: Bulk
DigiKey Programmable: Not Verified
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JHL5320 S LL3A Intel Intel-DSL5320-Thunderbolt-2-Controller Description: I/O CONTROLLER INTERFACE IC DISC
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 7454 Stücke:
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23+21.78 EUR
Mindestbestellmenge: 23
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5AGXMA1D4F27C4G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX250HH3F55I1VG 1SX250HH3F55I1VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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EPM570T100C3 EPM570T100C3 Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.5V, 3.3V
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX250HH2F55I1VG 1SX250HH2F55I1VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG110HN3F43E2LG 1SG110HN3F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG110HN3F43E3VGS1 1SG110HN3F43E3VGS1 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG210HN1F43I2VG 1SG210HN1F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG210HN2F43I2VG 1SG210HN2F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG210HU2F50I2VG 1SG210HU2F50I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN1F43I2VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN1F43I2VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP1SGX40DF1020I6N Stratix%20GX%20FPGA%20Family%20Data%20Sheet.pdf
EP1SGX40DF1020I6N
Hersteller: Intel
Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HU1F50I1VGAS 10_GX_SX_Device_Overview.pdf
1SG280HU1F50I1VGAS
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HU1F50I1VG 10_GX_SX_Device_Overview.pdf
1SG280HU1F50I1VG
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH1F55E1VG 10_GX_SX_Device_Overview.pdf
1SG280HH1F55E1VG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH1F55E1VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH1F55E1VGS3
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EVB-EN6382QI en6382qi_evb_user_guide.pdf
EVB-EN6382QI
Hersteller: Intel
Description: EVAL BOARD FOR EN6382QI
Packaging: Bulk
Voltage - Input: 3V ~ 6.5V
Current - Output: 8A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EN6382QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
auf Bestellung 3 Stücke:
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Anzahl Preis
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1ST085ES1F50E2VG s10_datasheet-683181-666450.pdf
1ST085ES1F50E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50E2VG s10_datasheet-683181-666450.pdf
1ST110ES1F50E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50E1VG s10_datasheet-683181-666450.pdf
1ST085ES1F50E1VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50I2VG s10_datasheet-683181-666450.pdf
1ST085ES1F50I2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50E2LG s10_datasheet-683181-666450.pdf
1ST085ES1F50E2LG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50E1VG s10_datasheet-683181-666450.pdf
1ST110ES1F50E1VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50I2VG s10_datasheet-683181-666450.pdf
1ST110ES1F50I2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50I1VG s10_datasheet-683181-666450.pdf
1ST085ES1F50I1VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50E2LG s10_datasheet-683181-666450.pdf
1ST110ES1F50E2LG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES1F50I2LG s10_datasheet-683181-666450.pdf
1ST085ES1F50I2LG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50I1VG s10_datasheet-683181-666450.pdf
1ST110ES1F50I1VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST110ES1F50I2LG s10_datasheet-683181-666450.pdf
1ST110ES1F50I2LG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FW21555AB INTLS00854-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: 21555 - NON-TRANSPARENT PCI-TO-
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
auf Bestellung 15605 Stücke:
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Anzahl Preis
10+52.14 EUR
Mindestbestellmenge: 10
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RJ80530MZ001256
Hersteller: Intel
Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
auf Bestellung 4368 Stücke:
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Anzahl Preis
13+39.68 EUR
Mindestbestellmenge: 13
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1SX250HH3F55I3VG
1SX250HH3F55I3VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH3F55E2VG
1SX250HH3F55E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH3F55E1VG
1SX250HH3F55E1VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH3F55I2VG
1SX250HH3F55I2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX250HH2F55E2VG
1SX250HH2F55E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG250HH3F55E2LG 10_GX_SX_Device_Overview.pdf
1SG250HH3F55E2LG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX250HH3F55E2LG
1SX250HH3F55E2LG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55I2VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55I2VG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH2F55E2VG 10_GX_SX_Device_Overview.pdf
1SG280HH2F55E2VG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH2F55E2VGAS 10_GX_SX_Device_Overview.pdf
1SG280HH2F55E2VGAS
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH2F55E2VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH2F55E2VGS3
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG250HH3F55E3XG 10_GX_SX_Device_Overview.pdf
1SG250HH3F55E3XG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX280HH2F55E2VGS3
1SX280HH2F55E2VGS3
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2E1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2I2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1E1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1I2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A2I1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIC035R39A1I1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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EP20K300EFC672-2N 20K_Family_DS.pdf
EP20K300EFC672-2N
Hersteller: Intel
Description: IC FPGA 408 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 728000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 11520
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1152
Total RAM Bits: 147456
Number of I/O: 408
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP20K300EFC672-1N 20K_Family_DS.pdf
EP20K300EFC672-1N
Hersteller: Intel
Description: IC FPGA 408 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 728000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 11520
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1152
Total RAM Bits: 147456
Number of I/O: 408
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17C6G
Hersteller: Intel
Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17C5G
Hersteller: Intel
Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17I5G
Hersteller: Intel
Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP2AGX65CU17I3G
Hersteller: Intel
Description: IC FPGA 156 I/O 358UBGA
Packaging: Tray
Package / Case: 358-LFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 60214
Supplier Device Package: 358-UBGA, FCBGA (17x17)
Number of LABs/CLBs: 2530
Total RAM Bits: 5371904
Number of I/O: 156
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX165HN3F43E2VG
1SX165HN3F43E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX040HH2F35I2LG s10_datasheet-683181-666450.pdf
1SX040HH2F35I2LG
Hersteller: Intel
Description: IC FPGA STRATIX10SX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 400K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1152-FBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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JHL5320 S LL39 Intel-DSL5320-Thunderbolt-2-Controller
Hersteller: Intel
Description: I/O CONTROLLER INTERFACE IC DISC
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 285600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
23+21.78 EUR
Mindestbestellmenge: 23
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JHL5320 S LL3A Intel-DSL5320-Thunderbolt-2-Controller
Hersteller: Intel
Description: I/O CONTROLLER INTERFACE IC DISC
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 7454 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
23+21.78 EUR
Mindestbestellmenge: 23
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5AGXMA1D4F27C4G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX250HH3F55I1VG
1SX250HH3F55I1VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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EPM570T100C3 max2_mii51006.pdf
EPM570T100C3
Hersteller: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.5V, 3.3V
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX250HH2F55I1VG
1SX250HH2F55I1VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG110HN3F43E2LG 10_GX_SX_Device_Overview.pdf
1SG110HN3F43E2LG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG110HN3F43E3VGS1 10_GX_SX_Device_Overview.pdf
1SG110HN3F43E3VGS1
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG210HN1F43I2VG 10_GX_SX_Device_Overview.pdf
1SG210HN1F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG210HN2F43I2VG 10_GX_SX_Device_Overview.pdf
1SG210HN2F43I2VG
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG210HU2F50I2VG 10_GX_SX_Device_Overview.pdf
1SG210HU2F50I2VG
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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