Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||
---|---|---|---|---|---|---|---|---|---|
![]() |
EP1SGX25DF672I6N | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
HLDC-DDR4-4GB-A | Intel |
Description: DAUGHTER CARD HILO DDR4 4GB Packaging: Bulk Function: SDRAM Type: Memory Contents: Board(s) Utilized IC / Part: EDY4016AABG-DR-F Platform: Arria |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
SPTSBP3PCCWA002 | Intel |
Description: OPTOELECTRONICS Packaging: Bulk Connector Type: LC Mounting Type: Pluggable, SFP28 Applications: Optical Data Rate: 100Gbps |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
![]() |
10M40DDF484C8G | Intel |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 360 DigiKey Programmable: Not Verified |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||
![]() |
10M40DDF672C8G | Intel |
![]() Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 500 DigiKey Programmable: Not Verified |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||
![]() |
10M40DDF484I7G | Intel |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 360 DigiKey Programmable: Not Verified |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||
![]() |
10M40DDF672I7G | Intel |
![]() Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 500 DigiKey Programmable: Not Verified |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||
![]() |
EPM2210GF256C3 | Intel |
![]() Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 7 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
![]() |
EPM2210GF256C4N | Intel |
![]() Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 7 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
EPM2210F256C4RR | Intel |
Description: IC CPLD 1700MC 9.1NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
EPM2210F256C5NGA | Intel |
Description: IC CPLD 1700MC 11.2NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 11.2 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
EPM2210F256C5RR | Intel |
Description: IC CPLD 1700MC 11.2NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 11.2 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
EPM2210F324C4RR | Intel |
Description: IC CPLD 1700MC 9.1NS 324FBGA Packaging: Tray Package / Case: 324-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 324-FBGA (19x19) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 272 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
|
5SEEBF45C4G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45I4G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45C3G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45C2G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45I3LG | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45C2LG | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45I3G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45I2G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
|
5SEEBF45I2LG | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
![]() |
EPM570GT100I5 | Intel |
![]() Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 76 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
EPM570ZM144C7N | Intel |
![]() Packaging: Tray Package / Case: 144-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 144-MBGA (7x7) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 116 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
EPM570GT100I5NRR | Intel |
Description: IC CPLD 440MC 5.4NS 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
![]() |
EPM570GT144C4N | Intel |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 116 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
![]() |
5962-9099703MRA | Intel |
![]() Packaging: Bulk Package / Case: 20-CDIP (0.300", 7.62mm) Function: Controller Interface: Bus Operating Temperature: -55°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Current - Supply: 75mA Supplier Device Package: 20-CDIP DigiKey Programmable: Not Verified |
auf Bestellung 826 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||
UG80960HA4016 | Intel |
Description: RISC MICROCONTROLLER, 32BIT, I96 Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||
AGFA006R16A3E4F | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA008R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB008R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R16A3E3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R16A3E3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA008R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB008R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R24C3E3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R24C3E3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA008R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB008R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R16A3I3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R16A2E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R16A2E4F | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R16A3I3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R16A2E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA008R16A3E3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB008R16A3E3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB008R24D2E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Package / Case: 2340-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2340-BGA (45x42) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA012R24B3E3E | Intel |
Description: IC FPGA AGILEX-F 2486FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R24C3I3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R24C2E4F | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA006R24C2E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R24C2E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFB006R24C3I3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AGFA008R24C3E3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
EP1SGX25DF672I6N |
![]() |
Hersteller: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
HLDC-DDR4-4GB-A |
Hersteller: Intel
Description: DAUGHTER CARD HILO DDR4 4GB
Packaging: Bulk
Function: SDRAM
Type: Memory
Contents: Board(s)
Utilized IC / Part: EDY4016AABG-DR-F
Platform: Arria
Description: DAUGHTER CARD HILO DDR4 4GB
Packaging: Bulk
Function: SDRAM
Type: Memory
Contents: Board(s)
Utilized IC / Part: EDY4016AABG-DR-F
Platform: Arria
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPTSBP3PCCWA002 |
Hersteller: Intel
Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
10M40DDF484C8G |
![]() |
Hersteller: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 226.46 EUR |
25+ | 190.21 EUR |
10M40DDF672C8G |
![]() |
Hersteller: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 256.45 EUR |
25+ | 215.43 EUR |
10M40DDF484I7G |
![]() |
Hersteller: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 301.93 EUR |
25+ | 253.64 EUR |
10M40DDF672I7G |
![]() |
Hersteller: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 341.97 EUR |
25+ | 287.22 EUR |
EPM2210GF256C3 |
![]() |
Hersteller: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM2210GF256C4N |
![]() |
Hersteller: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM2210F256C4RR |
Hersteller: Intel
Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM2210F256C5NGA |
Hersteller: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM2210F256C5RR |
Hersteller: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM2210F324C4RR |
Hersteller: Intel
Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45C4G |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45I4G |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45C3G |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45C2G |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45I3LG |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45C2LG |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45I3G |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45I2G |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5SEEBF45I2LG |
Hersteller: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM570GT100I5 |
![]() |
Hersteller: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM570ZM144C7N |
![]() |
Hersteller: Intel
Description: IC CPLD 440MC 9NS 144MBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 144-MBGA (7x7)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 144MBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 144-MBGA (7x7)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM570GT100I5NRR |
Hersteller: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EPM570GT144C4N |
![]() |
Hersteller: Intel
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
5962-9099703MRA |
![]() |
Hersteller: Intel
Description: MICROPROCESSOR CIRCUIT, CMOS
Packaging: Bulk
Package / Case: 20-CDIP (0.300", 7.62mm)
Function: Controller
Interface: Bus
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 75mA
Supplier Device Package: 20-CDIP
DigiKey Programmable: Not Verified
Description: MICROPROCESSOR CIRCUIT, CMOS
Packaging: Bulk
Package / Case: 20-CDIP (0.300", 7.62mm)
Function: Controller
Interface: Bus
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 75mA
Supplier Device Package: 20-CDIP
DigiKey Programmable: Not Verified
auf Bestellung 826 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 148.87 EUR |
UG80960HA4016 |
Hersteller: Intel
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 97.65 EUR |
AGFA006R16A3E4F |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R16A3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R16A3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R24C3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R24C3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R16A3I3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R16A3I3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA008R16A3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB008R16A3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R16A3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R16A3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA008R24C3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB008R24C3E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R24C3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R24C3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA008R16A3I3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB008R16A3I3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R16A3I3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R16A2E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R16A2E4F |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R16A3I3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R16A2E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA008R16A3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB008R16A3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB008R24D2E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA012R24B3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R24C3I3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R24C2E4F |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA006R24C2E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R24C2E3V |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFB006R24C3I3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
AGFA008R24C3E3E |
Hersteller: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH