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QGE7320MC Intel Intel-E7320-Memory-Controller Description: MEMORY CONTROLLER HUB (MCH)
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 11040 Stücke:
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8+66.11 EUR
Mindestbestellmenge: 8
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5SGXMA4H2F35I3LG 5SGXMA4H2F35I3LG Intel Description: IC FPGA 600 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 158500
Total RAM Bits: 37888000
Number of I/O: 600
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXFB1H4F40I3G 5AGXFB1H4F40I3G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXFB3H4F40I3G 5AGXFB3H4F40I3G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGTFD3H3F40I3G 5AGTFD3H3F40I3G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXFB7K4F40I3G 5AGXFB7K4F40I3G Intel Arria_V_DS.pdf Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 504140
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 23786
Total RAM Bits: 2975744
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DH82Z97 Intel 5-chipset-3400-chipset-datasheet.pdf Description: DH82Z97 PLATFORM CONTROLLER HUB
Packaging: Bulk
auf Bestellung 15200 Stücke:
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DH82H97 Intel 5-chipset-3400-chipset-datasheet.pdf Description: DH82H97 PLATFORM CONTROLLER HUB
Packaging: Bulk
auf Bestellung 9600 Stücke:
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198+2.50 EUR
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1SX280HH3F55I2VG 1SX280HH3F55I2VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH2F55E2VG 1SX280HH2F55E2VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E2LG 1SX280HH3F55E2LG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E2LGS3 1SX280HH3F55E2LGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1ST085EN3F43E3VG 1ST085EN3F43E3VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN3F43E3VGAS 1ST085EN3F43E3VGAS Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN3F43I3VGAS 1ST085EN3F43I3VGAS Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN3F43I3VG 1ST085EN3F43I3VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43E2VG 1ST085EN2F43E2VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN1F43E2VG 1ST085EN1F43E2VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43E1VG 1ST085EN2F43E1VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43I2VGAS 1ST085EN2F43I2VGAS Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43I2VG 1ST085EN2F43I2VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43E2LG 1ST085EN2F43E2LG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN1F43E2LG 1ST085EN1F43E2LG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES3F50I3XG 1ST085ES3F50I3XG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43I1VG 1ST085EN2F43I1VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN1F43I1VG 1ST085EN1F43I1VG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43I2LGAS 1ST085EN2F43I2LGAS Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43I2LG 1ST085EN2F43I2LG Intel Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4SE360H29I3G EP4SE360H29I3G Intel Description: IC FPGA 488 I/O 780HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4SGX230HF35I3G Intel Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4S100G5H40I1G EP4S100G5H40I1G Intel Description: IC FPGA 654 I/O 1517HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4SGX70HF35I4G EP4SGX70HF35I4G Intel Description: IC FPGA 488 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 72600
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 2904
Total RAM Bits: 7564880
Number of I/O: 488
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QG82945GC Intel INTLS02636-1.pdf?t.download=true&u=5oefqw Description: DRAM CONTROLLER, 64M X 16, CMOS,
Packaging: Bulk
Package / Case: 1202-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 99°C (TC)
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 1202-FCBGA (34x34)
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EP4SGX530HH35C4G Intel Description: IC FPGA 564 I/O 1152HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPF8452ATC100-3 EPF8452ATC100-3 Intel DS_363_FLEX_8000.pdf Description: IC FPGA 78 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 4000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 336
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 42
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KC80526LY700128 Intel Description: RISC MPU, 32-BIT, 700MHZ
Packaging: Bulk
auf Bestellung 7266 Stücke:
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3+167.16 EUR
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5CEFA9U19I7N 5CEFA9U19I7N Intel Cyclone_V_Device_Overview_Web.pdf Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 301000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 113560
Total RAM Bits: 14251008
Number of I/O: 240
DigiKey Programmable: Not Verified
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RD38F2240WWYTQ0 Intel RD38F2240WWYTQ0.pdf?t.download=true&u=axiww2 Description: WIRELESS FLASH MEMORY
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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28+17.55 EUR
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P82C088 P82C088 Intel INTLD030-3-3.pdf?t.download=true&u=5oefqw Description: DRAM CONTROLLER, 1M X 8, CMOS
Packaging: Bulk
Package / Case: 48-DIP
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 48-DIP
auf Bestellung 1008 Stücke:
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14+36.25 EUR
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TN87C196KJ TN87C196KJ Intel Description: 196 MICROPROCESSOR
Packaging: Bulk
auf Bestellung 1295 Stücke:
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EPF6010ATC100-2 EPF6010ATC100-2 Intel FLEX_6000_Programmable_Logic_Device_Family.pdf Description: IC FPGA 71 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 880
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 88
Number of I/O: 71
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM570ZM256C6N EPM570ZM256C6N Intel max2_mii51006.pdf Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM570ZM256I8N EPM570ZM256I8N Intel max2_mii51006.pdf Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PA28F008SA85 Intel 28F008SA%20%28x8%29.pdf Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 1160 Stücke:
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1ST040EH3F35E3VG 1ST040EH3F35E3VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH3F35I3VG 1ST040EH3F35I3VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH3F35E3XG 1ST040EH3F35E3XG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH2F35E2VG 1ST040EH2F35E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH1F35E2VG 1ST040EH1F35E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH3F35I3XG 1ST040EH3F35I3XG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM7064BTC100-3 EPM7064BTC100-3 Intel MAX7000B.pdf Description: IC CPLD 64MC 3.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 3.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPF8820ABC225-4 Intel DS_363_FLEX_8000.pdf Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGIB022R29A2E3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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QGE7320MC Intel-E7320-Memory-Controller
Hersteller: Intel
Description: MEMORY CONTROLLER HUB (MCH)
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 11040 Stücke:
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Anzahl Preis
8+66.11 EUR
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5SGXMA4H2F35I3LG
5SGXMA4H2F35I3LG
Hersteller: Intel
Description: IC FPGA 600 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 158500
Total RAM Bits: 37888000
Number of I/O: 600
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXFB1H4F40I3G
5AGXFB1H4F40I3G
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXFB3H4F40I3G
5AGXFB3H4F40I3G
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGTFD3H3F40I3G
5AGTFD3H3F40I3G
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5AGXFB7K4F40I3G Arria_V_DS.pdf
5AGXFB7K4F40I3G
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 504140
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 23786
Total RAM Bits: 2975744
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DH82Z97 5-chipset-3400-chipset-datasheet.pdf
Hersteller: Intel
Description: DH82Z97 PLATFORM CONTROLLER HUB
Packaging: Bulk
auf Bestellung 15200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
211+2.34 EUR
Mindestbestellmenge: 211
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DH82H97 5-chipset-3400-chipset-datasheet.pdf
Hersteller: Intel
Description: DH82H97 PLATFORM CONTROLLER HUB
Packaging: Bulk
auf Bestellung 9600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
198+2.50 EUR
Mindestbestellmenge: 198
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1SX280HH3F55I2VG
1SX280HH3F55I2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH2F55E2VG
1SX280HH2F55E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E2LG
1SX280HH3F55E2LG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E2LGS3
1SX280HH3F55E2LGS3
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1ST085EN3F43E3VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN3F43E3VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN3F43E3VGAS Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN3F43E3VGAS
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN3F43I3VGAS Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN3F43I3VGAS
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN3F43I3VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN3F43I3VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43E2VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43E2VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN1F43E2VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN1F43E2VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43E1VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43E1VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43I2VGAS Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43I2VGAS
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST085EN2F43I2VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43I2VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST085EN2F43E2LG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43E2LG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST085EN1F43E2LG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN1F43E2LG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085ES3F50I3XG s10_datasheet-683181-666450.pdf
1ST085ES3F50I3XG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST085EN2F43I1VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43I1VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST085EN1F43I1VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN1F43I1VG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST085EN2F43I2LGAS Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43I2LGAS
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST085EN2F43I2LG Stratix%2010%20TX%20Device%20Overview.pdf
1ST085EN2F43I2LG
Hersteller: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4SE360H29I3G
EP4SE360H29I3G
Hersteller: Intel
Description: IC FPGA 488 I/O 780HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4SGX230HF35I3G
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4S100G5H40I1G
EP4S100G5H40I1G
Hersteller: Intel
Description: IC FPGA 654 I/O 1517HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4SGX70HF35I4G
EP4SGX70HF35I4G
Hersteller: Intel
Description: IC FPGA 488 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 72600
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 2904
Total RAM Bits: 7564880
Number of I/O: 488
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QG82945GC INTLS02636-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: DRAM CONTROLLER, 64M X 16, CMOS,
Packaging: Bulk
Package / Case: 1202-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 99°C (TC)
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 1202-FCBGA (34x34)
auf Bestellung 128020 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
27+18.25 EUR
Mindestbestellmenge: 27
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EP4SGX530HH35C4G
Hersteller: Intel
Description: IC FPGA 564 I/O 1152HBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPF8452ATC100-3 DS_363_FLEX_8000.pdf
EPF8452ATC100-3
Hersteller: Intel
Description: IC FPGA 78 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 4000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 336
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 42
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KC80526LY700128
Hersteller: Intel
Description: RISC MPU, 32-BIT, 700MHZ
Packaging: Bulk
auf Bestellung 7266 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+167.16 EUR
Mindestbestellmenge: 3
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5CEFA9U19I7N Cyclone_V_Device_Overview_Web.pdf
5CEFA9U19I7N
Hersteller: Intel
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 301000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 113560
Total RAM Bits: 14251008
Number of I/O: 240
DigiKey Programmable: Not Verified
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1034.53 EUR
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RD38F2240WWYTQ0 RD38F2240WWYTQ0.pdf?t.download=true&u=axiww2
Hersteller: Intel
Description: WIRELESS FLASH MEMORY
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
28+17.55 EUR
Mindestbestellmenge: 28
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P82C088 INTLD030-3-3.pdf?t.download=true&u=5oefqw
P82C088
Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8, CMOS
Packaging: Bulk
Package / Case: 48-DIP
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 48-DIP
auf Bestellung 1008 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+36.25 EUR
Mindestbestellmenge: 14
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TN87C196KJ
TN87C196KJ
Hersteller: Intel
Description: 196 MICROPROCESSOR
Packaging: Bulk
auf Bestellung 1295 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+77.19 EUR
Mindestbestellmenge: 7
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EPF6010ATC100-2 FLEX_6000_Programmable_Logic_Device_Family.pdf
EPF6010ATC100-2
Hersteller: Intel
Description: IC FPGA 71 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 880
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 88
Number of I/O: 71
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM570ZM256C6N max2_mii51006.pdf
EPM570ZM256C6N
Hersteller: Intel
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM570ZM256I8N max2_mii51006.pdf
EPM570ZM256I8N
Hersteller: Intel
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PA28F008SA85 28F008SA%20%28x8%29.pdf
Hersteller: Intel
Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 1160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
54+9.13 EUR
Mindestbestellmenge: 54
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1ST040EH3F35E3VG s10_datasheet-683181-666450.pdf
1ST040EH3F35E3VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1ST040EH3F35I3VG s10_datasheet-683181-666450.pdf
1ST040EH3F35I3VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35E3XG s10_datasheet-683181-666450.pdf
1ST040EH3F35E3XG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH2F35E2VG s10_datasheet-683181-666450.pdf
1ST040EH2F35E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH1F35E2VG s10_datasheet-683181-666450.pdf
1ST040EH1F35E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35I3XG s10_datasheet-683181-666450.pdf
1ST040EH3F35I3XG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM7064BTC100-3 MAX7000B.pdf
EPM7064BTC100-3
Hersteller: Intel
Description: IC CPLD 64MC 3.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 3.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPF8820ABC225-4 DS_363_FLEX_8000.pdf
Hersteller: Intel
Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AGIB022R29A2E3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB027R29A2E3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
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AGIB022R29A2E1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
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