Produkte > INTEL > Alle Produkte des Herstellers INTEL (37080) > Seite 98 nach 618

Wählen Sie Seite:   [  << Vorherige Seite ]  1 61 93 94 95 96 97 98 99 100 101 102 103 122 183 244 305 366 427 488 549 610 618  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
1ST040EH3F35I3VG 1ST040EH3F35I3VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35E3XG 1ST040EH3F35E3XG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH2F35E2VG 1ST040EH2F35E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH1F35E2VG 1ST040EH1F35E2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35I3XG 1ST040EH3F35I3XG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EPM7064BTC100-3 EPM7064BTC100-3 Intel MAX7000B.pdf Description: IC CPLD 64MC 3.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 3.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EPF8820ABC225-4 Intel DS_363_FLEX_8000.pdf Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2I3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E1V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2I3V Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2I2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2I2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E1V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E1VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A1E2VB Intel Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A1E2V Intel Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EE80C186XL20 Intel Description: IC MPU I186 20MHZ 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 5V
Supplier Device Package: 68-PLCC
Number of Cores/Bus Width: 1 Core, 16-Bit
Co-Processors/DSP: Math Engine; 80C187
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 253 Stücke:
Lieferzeit 10-14 Tag (e)
12+18.97 EUR
Mindestbestellmenge: 12
Im Einkaufswagen  Stück im Wert von  UAH
DK-CMC-AGI027RBES Intel Description: IC DEV TOOLS
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DJLXP730LE.A1 Intel Description: LXP730 - MULTI-RATE DSL FRAMER
Packaging: Bulk
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
31+16.22 EUR
Mindestbestellmenge: 31
Im Einkaufswagen  Stück im Wert von  UAH
UG80960HD8016 Intel 80960HA_HD_HT_Sep02.pdf Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 968 Stücke:
Lieferzeit 10-14 Tag (e)
4+132.57 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D6F27C6G Intel arria-v-device-overview.html Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D6F31C6G 5AGXBA1D6F31C6G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27C5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F31C6G 5AGXMA1D6F31C6G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31C5G 5AGXBA1D4F31C5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27C5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27C4G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27I5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31C5G 5AGXMA1D4F31C5G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31C4G 5AGXBA1D4F31C4G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31I5G 5AGXBA1D4F31I5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31C4G 5AGXMA1D4F31C4G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31I5G 5AGXMA1D4F31I5G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10AX016E4F29E3SG 10AX016E4F29E3SG Intel Arria10_DeviceOverview.pdf Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I3G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA3D6F31C6G 5AGXBA3D6F31C6G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA3D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31I3G 5AGXMA1D4F31I3G Intel Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA5D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10AX022C4U19I3SG 10AX022C4U19I3SG Intel Arria10_DeviceOverview.pdf Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10M25DAF256A7G 10M25DAF256A7G Intel Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 178
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
1+212.20 EUR
25+169.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
QG82945GSE S LB2R Intel INTLS03772-1.pdf?t.download=true&u=5oefqw Description: CHIPSETS 945GSE EXPRESS CHIP SET
Packaging: Bulk
Package / Case: 998-BGA, FCBGA
Mounting Type: Surface Mount
Voltage - Supply: 1V ~ 1.1V, 1.425V ~ 1.575V
Controller Type: Graphics and Memory Controller
Supplier Device Package: 998-FCBGA (27x27)
auf Bestellung 810273 Stücke:
Lieferzeit 10-14 Tag (e)
13+39.73 EUR
Mindestbestellmenge: 13
Im Einkaufswagen  Stück im Wert von  UAH
PR21555BB Intel INTLS00854-1.pdf?t.download=true&u=5oefqw Description: NON-TRANSPARENT PCI-TO PCI BRIDG
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: JTAG, PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
auf Bestellung 14384 Stücke:
Lieferzeit 10-14 Tag (e)
5+105.03 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
A5ED065BB23AE5SR0 Intel Description: IC MPU FPGA AGILEX5E ES 839BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+1500.31 EUR
Im Einkaufswagen  Stück im Wert von  UAH
A5ED065BB32AE4SR0 Intel Description: IC MPU FPGA AGILEX5E ES 1591BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+1837.26 EUR
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBB1D6F40C6G 5AGXBB1D6F40C6G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMB1G6F40C6G 5AGXMB1G6F40C6G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBB1D4F40C5G 5AGXBB1D4F40C5G Intel Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35I3VG s10_datasheet-683181-666450.pdf
1ST040EH3F35I3VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35E3XG s10_datasheet-683181-666450.pdf
1ST040EH3F35E3XG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH2F35E2VG s10_datasheet-683181-666450.pdf
1ST040EH2F35E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH1F35E2VG s10_datasheet-683181-666450.pdf
1ST040EH1F35E2VG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1ST040EH3F35I3XG s10_datasheet-683181-666450.pdf
1ST040EH3F35I3XG
Hersteller: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EPM7064BTC100-3 MAX7000B.pdf
EPM7064BTC100-3
Hersteller: Intel
Description: IC CPLD 64MC 3.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 3.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EPF8820ABC225-4 DS_363_FLEX_8000.pdf
Hersteller: Intel
Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2E1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2I3V
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2I2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A2I2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB022R29A1E1V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A2E1VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A1E2VB
Hersteller: Intel
Description: IC FPGA AGILEX-I 2957BGA
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AGIB027R29A1E2V
Hersteller: Intel
Description: IC
Packaging: Tray
Package / Case: 2957-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 2.7M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2957-BGA (56x45)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EE80C186XL20
Hersteller: Intel
Description: IC MPU I186 20MHZ 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 5V
Supplier Device Package: 68-PLCC
Number of Cores/Bus Width: 1 Core, 16-Bit
Co-Processors/DSP: Math Engine; 80C187
RAM Controllers: DRAM
Graphics Acceleration: No
auf Bestellung 253 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+18.97 EUR
Mindestbestellmenge: 12
Im Einkaufswagen  Stück im Wert von  UAH
DK-CMC-AGI027RBES
Hersteller: Intel
Description: IC DEV TOOLS
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DJLXP730LE.A1
Hersteller: Intel
Description: LXP730 - MULTI-RATE DSL FRAMER
Packaging: Bulk
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
31+16.22 EUR
Mindestbestellmenge: 31
Im Einkaufswagen  Stück im Wert von  UAH
UG80960HD8016 80960HA_HD_HT_Sep02.pdf
Hersteller: Intel
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 968 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+132.57 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D6F27C6G arria-v-device-overview.html
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D6F31C6G
5AGXBA1D6F31C6G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F27C6G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27C5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D6F31C6G
5AGXMA1D6F31C6G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31C5G
5AGXBA1D4F31C5G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27C5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27C4G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F27I5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31C5G
5AGXMA1D4F31C5G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31C4G
5AGXBA1D4F31C4G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA1D4F31I5G
5AGXBA1D4F31I5G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I5G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31C4G
5AGXMA1D4F31C4G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31I5G
5AGXMA1D4F31I5G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10AX016E4F29E3SG Arria10_DeviceOverview.pdf
10AX016E4F29E3SG
Hersteller: Intel
Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F27I3G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA3D6F31C6G
5AGXBA3D6F31C6G
Hersteller: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA3D6F27C6G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMA1D4F31I3G
5AGXMA1D4F31I3G
Hersteller: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBA5D6F27C6G
Hersteller: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10AX022C4U19I3SG Arria10_DeviceOverview.pdf
10AX022C4U19I3SG
Hersteller: Intel
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
10M25DAF256A7G Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf
10M25DAF256A7G
Hersteller: Intel
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 178
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+212.20 EUR
25+169.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
QG82945GSE S LB2R INTLS03772-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: CHIPSETS 945GSE EXPRESS CHIP SET
Packaging: Bulk
Package / Case: 998-BGA, FCBGA
Mounting Type: Surface Mount
Voltage - Supply: 1V ~ 1.1V, 1.425V ~ 1.575V
Controller Type: Graphics and Memory Controller
Supplier Device Package: 998-FCBGA (27x27)
auf Bestellung 810273 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+39.73 EUR
Mindestbestellmenge: 13
Im Einkaufswagen  Stück im Wert von  UAH
PR21555BB INTLS00854-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: NON-TRANSPARENT PCI-TO PCI BRIDG
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: JTAG, PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
auf Bestellung 14384 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+105.03 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
A5ED065BB23AE5SR0
Hersteller: Intel
Description: IC MPU FPGA AGILEX5E ES 839BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1500.31 EUR
Im Einkaufswagen  Stück im Wert von  UAH
A5ED065BB32AE4SR0
Hersteller: Intel
Description: IC MPU FPGA AGILEX5E ES 1591BGA
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1837.26 EUR
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBB1D6F40C6G
5AGXBB1D6F40C6G
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXMB1G6F40C6G
5AGXMB1G6F40C6G
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
5AGXBB1D4F40C5G
5AGXBB1D4F40C5G
Hersteller: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 61 93 94 95 96 97 98 99 100 101 102 103 122 183 244 305 366 427 488 549 610 618  [ Nächste Seite >> ]