| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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P8088-2 | Intel |
 Description: IC MPU IAPX86 8MHZ 40DIPPackaging: Bulk Package / Case: 40-DIP Mounting Type: Through Hole Speed: 8MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 8088 Voltage - I/O: 5V Supplier Device Package: 40-DIP Number of Cores/Bus Width: 1 Core, 8-Bit Graphics Acceleration: No Part Status: Active Additional Interfaces: EBI/EMI |
auf Bestellung 16825 Stücke: Lieferzeit 21-28 Tag (e) |
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P80C151SB16 | Intel |
Description: 8-BIT, 80151 CPU, 16MHZ PDIP40 Packaging: Bulk Package / Case: 40-DIP (0.620", 15.75mm) Mounting Type: Through Hole Speed: 16MHz RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: 80C151SB Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: Serial Port Peripherals: PWM, WDT Supplier Device Package: 40-PDIP Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP2AGX95DF25I5G | Intel |
Description: IC FPGA 260 I/O 572FBGA Packaging: Tray Package / Case: 572-BGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 89178 Supplier Device Package: 572-FBGA, FC (25x25) Number of LABs/CLBs: 3747 Total RAM Bits: 6839296 Number of I/O: 260 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP2AGX95EF29C4G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 89178 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 3747 Total RAM Bits: 6839296 Part Status: Active Number of I/O: 372 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EP2AGX95EF29I5G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 89178 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 3747 Total RAM Bits: 6839296 Part Status: Active Number of I/O: 372 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EN6382QI | Intel |
Description: DC DC CONVERTER 0.6-5.9V |
Produkt ist nicht verfügbar |
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EN6382QI | Intel |
Description: DC DC CONVERTER 0.6-5.9V |
Produkt ist nicht verfügbar |
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| PEF66016E | Intel | Description: GEMINAX D16XXS 16-CH DIGITAL FRO |
auf Bestellung 10000 Stücke: Lieferzeit 21-28 Tag (e) |
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PEF66008E | Intel | Description: DATA COMM PEF66008E LFBGA225 SLL |
auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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1SX165HN3F43I3VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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1SX165HN2F43E2VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
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JS28F128P30B85A | Intel |
Description: IC FLASH 128MBIT PAR 56TSOP Packaging: Tray Package / Case: 56-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 128Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 2V Technology: FLASH - NOR Clock Frequency: 40 MHz Memory Format: FLASH Supplier Device Package: 56-TSOP Part Status: Obsolete Write Cycle Time - Word, Page: 85ns Memory Interface: Parallel Access Time: 85 ns Memory Organization: 8M x 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EP4S40G4H40I2NAA | Intel |
Description: IC FPGA 1517HBGA |
Produkt ist nicht verfügbar |
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| EMBCDTNMCCDVK | Intel | Description: EMBCDTNMCCDVK |
auf Bestellung 2 Stücke: Lieferzeit 21-28 Tag (e) |
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5CEBA7F31C8N | Intel |
Description: IC FPGA 480 I/O 896FBGA Packaging: Tray Package / Case: 896-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 149500 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 56480 Total RAM Bits: 7880704 Number of I/O: 480 DigiKey Programmable: Not Verified |
auf Bestellung 17 Stücke: Lieferzeit 21-28 Tag (e) |
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10CX220YF672E6G | Intel |
Description: IC FPGA 236 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.9V Number of Logic Elements/Cells: 220000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 80330 Total RAM Bits: 13752320 Part Status: Active Number of I/O: 236 DigiKey Programmable: Not Verified |
auf Bestellung 95 Stücke: Lieferzeit 21-28 Tag (e) |
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10CX220YU484E6G | Intel |
Description: IC FPGA 188 I/O 484UBGA |
Produkt ist nicht verfügbar |
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10CX220YU484E5G | Intel |
Description: IC FPGA 188 I/O 484UBGA |
Produkt ist nicht verfügbar |
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10CX220YU484I5G | Intel |
Description: IC FPGA 188 I/O 484UBGA Packaging: Tray Package / Case: 484-BFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.9V Number of Logic Elements/Cells: 220000 Supplier Device Package: 484-UBGA (19x19) Number of LABs/CLBs: 80330 Total RAM Bits: 13752320 Number of I/O: 188 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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10CX220YF672I6G | Intel |
Description: IC FPGA 236 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.9V Number of Logic Elements/Cells: 220000 Supplier Device Package: 672-FBGA, FC (27x27) Number of LABs/CLBs: 80330 Total RAM Bits: 13752320 Number of I/O: 236 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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10CX220YF672E5G | Intel |
Description: IC FPGA 236 I/O 672FBGA |
Produkt ist nicht verfügbar |
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10CX220YF672I5G | Intel |
Description: IC FPGA 236 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.9V Number of Logic Elements/Cells: 220000 Supplier Device Package: 672-FBGA, FC (27x27) Number of LABs/CLBs: 80330 Total RAM Bits: 13752320 Number of I/O: 236 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EN6363QI | Intel |
Description: DC DC CONVERTER 0.75-6.12V Packaging: Cut Tape (CT) Features: Remote On/Off, OCP, OTP, SCP, UVLO Package / Case: 34-PowerBFQFN Module Size / Dimension: 0.24" L x 0.16" W x 0.10" H (6.0mm x 4.0mm x 2.5mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 6.6V Efficiency: 95% Current - Output (Max): 6A Supplier Device Package: 34-QFN (4x6) Voltage - Input (Min): 2.7V Voltage - Output 1: 0.75 ~ 6.12V Control Features: Enable, Active High Part Status: Obsolete Number of Outputs: 1 |
auf Bestellung 2384 Stücke: Lieferzeit 21-28 Tag (e) |
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| PL-ENET-BLASTERZ | Intel |
Description: ETHERNET BLASTER Packaging: Box For Use With/Related Products: CPLD, FPGA Type: Programmer (In-Circuit/In-System) Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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EN63A0QA | Intel |
Description: DC DC CONVERTER 0.6-5.4V Packaging: Cut Tape (CT) Features: OCP, OTP, SCP, UVLO Package / Case: 76-PowerBFQFN Module Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 105°C Applications: ITE (Commercial) Voltage - Input (Max): 6.6V Efficiency: 96% Current - Output (Max): 12A Supplier Device Package: 76-QFN (11x10) Voltage - Input (Min): 2.5V Voltage - Output 1: 0.6 ~ 5.4V Part Status: Obsolete Number of Outputs: 1 |
auf Bestellung 4667 Stücke: Lieferzeit 21-28 Tag (e) |
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EPM7064STC44-6N | Intel |
Description: EE PLD, 6NS, 64-CELL, CMOS, PQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 6 ns Supplier Device Package: 44-TQFP (10x10) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 1078 Stücke: Lieferzeit 21-28 Tag (e) |
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MD2147H3 | Intel |
Description: IC SRAM 4KBIT PARALLEL 18CDIP Packaging: Bulk Package / Case: 18-CDIP Mounting Type: Through Hole Memory Size: 4Kbit Memory Type: Volatile Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 4.5V ~ 5.5V Technology: SRAM - Asynchronous Memory Format: SRAM Supplier Device Package: 18-CDIP Write Cycle Time - Word, Page: 55ns Memory Interface: Parallel Access Time: 55 ns Memory Organization: 4K x 1 DigiKey Programmable: Not Verified |
auf Bestellung 132 Stücke: Lieferzeit 21-28 Tag (e) |
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10M08SAU324I7G | Intel |
Description: IC FPGA 246 I/O 324UBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 8000 Supplier Device Package: 324-UBGA (15x15) Number of LABs/CLBs: 500 Total RAM Bits: 387072 Number of I/O: 246 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FAGD1655348BA | Intel |
Description: MUX/DEMUX, 1-FUNC, PQFP48 Packaging: Bulk Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Circuit: 1 x 4:1 Type: Multiplexer Operating Temperature: 0°C ~ 85°C Voltage - Supply: -4.7V ~ -5.5V Independent Circuits: 1 Current - Output High, Low: 60mA, 8mA Voltage Supply Source: Single Supply Supplier Device Package: 48-TQFP-EDQUAD (7x7) Part Status: Active |
auf Bestellung 6254 Stücke: Lieferzeit 21-28 Tag (e) |
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| NE80546RE061256 | Intel |
Description: LOW VOLTAGE INTEL XEON PROCESSOR Packaging: Bulk |
auf Bestellung 273 Stücke: Lieferzeit 21-28 Tag (e) |
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| 5AGTFC7H3F35I3NAD | Intel | Description: IC FPGA 544 I/O 1152FBGA |
Produkt ist nicht verfügbar |
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| JL82598EB S LJB | Intel | Description: JL82598EB S LJB |
Produkt ist nicht verfügbar |
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D2911A1 | Intel |
Description: PCM CODEC, A-LAW, MOS, CDIP22 Packaging: Bulk Package / Case: 22-CDIP Mounting Type: Through Hole Type: PCM Data Interface: PCM Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply, Analog: 11.4V ~ 12.6V, ±4.75V ~ ±5.25V Voltage - Supply, Digital: 11.4V ~ 12.6V, ±4.75V ~ ±5.25V Resolution (Bits): 8 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No Supplier Device Package: 22-CDIP Part Status: Active |
auf Bestellung 912 Stücke: Lieferzeit 21-28 Tag (e) |
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| A80860XP-50 | Intel |
Description: RISC MPU, 64-BIT, 50MHZ CPGA262 Packaging: Bulk |
auf Bestellung 3138 Stücke: Lieferzeit 21-28 Tag (e) |
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| A80860XP-40 | Intel |
Description: IC MPU I860 XR 40MHZ 262CPGA Packaging: Bulk Package / Case: 262-CPGA Mounting Type: Through Hole Speed: 40MHz Operating Temperature: -40°C ~ 125°C (TC) Core Processor: i860® XR Voltage - I/O: 5V Supplier Device Package: 262-CPGA (49.53x49.53) Graphics Acceleration: No |
auf Bestellung 349 Stücke: Lieferzeit 21-28 Tag (e) |
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10M08SAE144I7P | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 8000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 500 Total RAM Bits: 387072 Part Status: Active Number of I/O: 101 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PSB3186F | Intel |
Description: ISDN CONTROLLER, 1-FUNC, CMOS, P Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Function: ISDN Interface: IOM-2 Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3.135V ~ 3.465V Current - Supply: 30mA Supplier Device Package: P-TQFP-64-1 Part Status: Active Number of Circuits: 1 |
auf Bestellung 1428 Stücke: Lieferzeit 21-28 Tag (e) |
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| HH80547RE067CN | Intel |
Description: IC MPU 331 2.66GHZ 775LGA Packaging: Bulk Package / Case: 775-LGA Mounting Type: Surface Mount Speed: 2.66GHz Operating Temperature: 67.7°C (TC) Core Processor: Intel® Celeron® D Processor 331 Voltage - I/O: 1.25V, 1.4V Supplier Device Package: 775-LGA (37.5x37.5) Number of Cores/Bus Width: 1 Core, 64-Bit |
auf Bestellung 202 Stücke: Lieferzeit 21-28 Tag (e) |
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| RK80532PC064512 | Intel |
Description: IC MPU INTEL PENT 2.6GHZ 478PPGA Packaging: Bulk Package / Case: 478-PGA Mounting Type: Through Hole Speed: 2.6GHz Operating Temperature: 70°C (TC) Core Processor: Intel® Pentium® 4 Processor Voltage - I/O: 1.345V, 1.525V Supplier Device Package: 478-PPGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Active |
auf Bestellung 68430 Stücke: Lieferzeit 21-28 Tag (e) |
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PEF82902F | Intel |
Description: ISDN CONTROLLER S/T/U 192KBPS |
auf Bestellung 14400 Stücke: Lieferzeit 21-28 Tag (e) |
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10M08SFE144C7G | Intel |
Description: IC FPGA 101 I/O 144EQFP |
Produkt ist nicht verfügbar |
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DK-SOC-1SSX-H-A | Intel |
Description: KIT DEV STRATIX 10 SX SOC H-TILE |
Produkt ist nicht verfügbar |
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| DK-SI-1STX-E-0ES | Intel | Description: DEV STRATIX 10 ENGINEERING SMPL |
Produkt ist nicht verfügbar |
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| EP20K30EXXC | Intel | Description: IC FPGA |
Produkt ist nicht verfügbar |
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GE28F008B3BA90 | Intel |
Description: FLASH, 1MX8, 90NS, PBGA46 |
auf Bestellung 4838 Stücke: Lieferzeit 21-28 Tag (e) |
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| KC80526LY400128 | Intel |
Description: MPU, 32-BIT, 400MHZ PBGA495 Packaging: Bulk Package / Case: 495-BGA Mounting Type: Surface Mount Speed: 400MHz Core Processor: Mobile Intel® Celeron® Voltage - I/O: 1.35V Supplier Device Package: 495-BGA (31x27) Number of Cores/Bus Width: 1 Core, 32-Bit Part Status: Active |
auf Bestellung 15373 Stücke: Lieferzeit 21-28 Tag (e) |
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| KC80526LY500256 | Intel |
Description: IC MPU MOBIL PENT 500MHZ PBGA495 Packaging: Bulk Package / Case: 495-BGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: 100°C (TJ) Core Processor: Mobile Intel® Pentium® III Voltage - I/O: 1.6V Supplier Device Package: 495-PBGA Number of Cores/Bus Width: 1 Core, 32-Bit |
auf Bestellung 27428 Stücke: Lieferzeit 21-28 Tag (e) |
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AN87C196JT | Intel |
Description: 16-BIT, OTPROM, 8096 CPU, 16MHZ Packaging: Bulk Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: External Program Memory Type: OTP Core Processor: MCS 96 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SIO Peripherals: PWM Supplier Device Package: 52-PLCC (19x19) Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
auf Bestellung 3000 Stücke: Lieferzeit 21-28 Tag (e) |
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DE28F800F3T95 | Intel |
Description: IC FLASH 8MBIT CUI 56SSOP Packaging: Bulk Package / Case: 56-SOP Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3V ~ 3.6V Technology: FLASH - Boot Block Memory Format: FLASH Supplier Device Package: 56-SSOP Write Cycle Time - Word, Page: 200µs Memory Interface: CUI Access Time: 95 ns Memory Organization: 512K x 16 DigiKey Programmable: Not Verified |
auf Bestellung 7168 Stücke: Lieferzeit 21-28 Tag (e) |
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| E28F008S3150 | Intel |
Description: IC FLASH 8MBIT PARALLEL 40TSOP Packaging: Bulk Package / Case: 40-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR (SLC) Memory Format: FLASH Supplier Device Package: 40-TSOP Part Status: Active Memory Interface: Parallel Access Time: 150 ns Memory Organization: 1M x 8 DigiKey Programmable: Not Verified |
auf Bestellung 5130 Stücke: Lieferzeit 21-28 Tag (e) |
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TE28F800B3TA120 | Intel |
Description: ADVANCED BOOT BLOCK FLASH MEMORY Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 31102 Stücke: Lieferzeit 21-28 Tag (e) |
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TE28F160B3BA110S | Intel |
Description: 16M-BIT FLASH MEM, PARALLEL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 11549 Stücke: Lieferzeit 21-28 Tag (e) |
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TE28F008BVT90 | Intel |
Description: IC FLASH 8MBIT PARALLEL 40TSOP Packaging: Bulk Package / Case: 40-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - Boot Block Memory Format: FLASH Supplier Device Package: 40-TSOP Part Status: Active Write Cycle Time - Word, Page: 90ns Memory Interface: Parallel Access Time: 90 ns Memory Organization: 1M x 8 DigiKey Programmable: Not Verified |
auf Bestellung 29835 Stücke: Lieferzeit 21-28 Tag (e) |
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TE28F008BET120 | Intel |
Description: IC FLASH 8MBIT PARALLEL 40TSOP Packaging: Bulk Package / Case: 40-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - Boot Block Memory Format: FLASH Supplier Device Package: 40-TSOP Part Status: Active Write Cycle Time - Word, Page: 120ns Memory Interface: Parallel Access Time: 120 ns Memory Organization: 1M x 8 DigiKey Programmable: Not Verified |
auf Bestellung 16320 Stücke: Lieferzeit 21-28 Tag (e) |
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10CX085YU484E5G | Intel |
Description: IC FPGA 208 I/O 484UBGA Packaging: Tray Package / Case: 484-FBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Number of Logic Elements/Cells: 85000 Supplier Device Package: 484-UBGA (19x19) Number of LABs/CLBs: 31000 Total RAM Bits: 5959680 Number of I/O: 188 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EPCS4SI8 | Intel |
Description: IC CONFIG DEVICE 4MBIT 8SOIC |
auf Bestellung 2773 Stücke: Lieferzeit 21-28 Tag (e) |
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| FH8065301685598S R1UB | Intel |
Description: FH8065301685598S - INTEL ATOM Z3 Packaging: Bulk Part Status: Active |
auf Bestellung 508 Stücke: Lieferzeit 21-28 Tag (e) |
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P8042AH | Intel |
Description: 8-BIT, MROM, 8048 CPU Packaging: Bulk Package / Case: 40-DIP Mounting Type: Through Hole Speed: 12.5MHz Program Memory Size: 2KB (2K x 8) RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROM Core Processor: 8048 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 4.5V Peripherals: DMA Supplier Device Package: 40-DIP Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 944 Stücke: Lieferzeit 21-28 Tag (e) |
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P80862 | Intel |
Description: MPU, 16-BIT, 8MHZ, NMOS |
auf Bestellung 1326 Stücke: Lieferzeit 21-28 Tag (e) |
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| P80A39AHL | Intel |
Description: SINGLE-CHIP 8 BIT MCU Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 367 Stücke: Lieferzeit 21-28 Tag (e) |
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| P8088-2 |
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Hersteller: Intel
Description: IC MPU IAPX86 8MHZ 40DIP
Packaging: Bulk
Package / Case: 40-DIP
Mounting Type: Through Hole
Speed: 8MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 8088
Voltage - I/O: 5V
Supplier Device Package: 40-DIP
Number of Cores/Bus Width: 1 Core, 8-Bit
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: EBI/EMI
Description: IC MPU IAPX86 8MHZ 40DIP
Packaging: Bulk
Package / Case: 40-DIP
Mounting Type: Through Hole
Speed: 8MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 8088
Voltage - I/O: 5V
Supplier Device Package: 40-DIP
Number of Cores/Bus Width: 1 Core, 8-Bit
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: EBI/EMI
auf Bestellung 16825 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 52+ | 13.74 EUR |
| P80C151SB16 |
|
Hersteller: Intel
Description: 8-BIT, 80151 CPU, 16MHZ PDIP40
Packaging: Bulk
Package / Case: 40-DIP (0.620", 15.75mm)
Mounting Type: Through Hole
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: 80C151SB
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: Serial Port
Peripherals: PWM, WDT
Supplier Device Package: 40-PDIP
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: 8-BIT, 80151 CPU, 16MHZ PDIP40
Packaging: Bulk
Package / Case: 40-DIP (0.620", 15.75mm)
Mounting Type: Through Hole
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: 80C151SB
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: Serial Port
Peripherals: PWM, WDT
Supplier Device Package: 40-PDIP
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP2AGX95DF25I5G |
|
Hersteller: Intel
Description: IC FPGA 260 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Number of I/O: 260
DigiKey Programmable: Not Verified
Description: IC FPGA 260 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Number of I/O: 260
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP2AGX95EF29C4G |
|
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Part Status: Active
Number of I/O: 372
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Part Status: Active
Number of I/O: 372
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EP2AGX95EF29I5G |
|
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Part Status: Active
Number of I/O: 372
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Part Status: Active
Number of I/O: 372
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PEF66016E |
Hersteller: Intel
Description: GEMINAX D16XXS 16-CH DIGITAL FRO
Description: GEMINAX D16XXS 16-CH DIGITAL FRO
auf Bestellung 10000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 61.51 EUR |
| PEF66008E |
Hersteller: Intel
Description: DATA COMM PEF66008E LFBGA225 SLL
Description: DATA COMM PEF66008E LFBGA225 SLL
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 61.51 EUR |
| 1SX165HN3F43I3VG |
|
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 1SX165HN2F43E2VG |
|
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| JS28F128P30B85A |
|
Hersteller: Intel
Description: IC FLASH 128MBIT PAR 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
Description: IC FLASH 128MBIT PAR 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EMBCDTNMCCDVK |
Hersteller: Intel
Description: EMBCDTNMCCDVK
Description: EMBCDTNMCCDVK
auf Bestellung 2 Stücke:
Lieferzeit 21-28 Tag (e)| 5CEBA7F31C8N |
|
Hersteller: Intel
Description: IC FPGA 480 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 149500
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 56480
Total RAM Bits: 7880704
Number of I/O: 480
DigiKey Programmable: Not Verified
Description: IC FPGA 480 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 149500
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 56480
Total RAM Bits: 7880704
Number of I/O: 480
DigiKey Programmable: Not Verified
auf Bestellung 17 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 607.13 EUR |
| 10CX220YF672E6G |
Hersteller: Intel
Description: IC FPGA 236 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Part Status: Active
Number of I/O: 236
DigiKey Programmable: Not Verified
Description: IC FPGA 236 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Part Status: Active
Number of I/O: 236
DigiKey Programmable: Not Verified
auf Bestellung 95 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 853.19 EUR |
| 25+ | 810.53 EUR |
| 10CX220YU484I5G |
|
Hersteller: Intel
Description: IC FPGA 188 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 188
DigiKey Programmable: Not Verified
Description: IC FPGA 188 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 188
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 10CX220YF672I6G |
|
Hersteller: Intel
Description: IC FPGA 236 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 236
DigiKey Programmable: Not Verified
Description: IC FPGA 236 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 236
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 10CX220YF672I5G |
|
Hersteller: Intel
Description: IC FPGA 236 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 236
DigiKey Programmable: Not Verified
Description: IC FPGA 236 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.9V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 236
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EN6363QI |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.75-6.12V
Packaging: Cut Tape (CT)
Features: Remote On/Off, OCP, OTP, SCP, UVLO
Package / Case: 34-PowerBFQFN Module
Size / Dimension: 0.24" L x 0.16" W x 0.10" H (6.0mm x 4.0mm x 2.5mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 6.6V
Efficiency: 95%
Current - Output (Max): 6A
Supplier Device Package: 34-QFN (4x6)
Voltage - Input (Min): 2.7V
Voltage - Output 1: 0.75 ~ 6.12V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
Description: DC DC CONVERTER 0.75-6.12V
Packaging: Cut Tape (CT)
Features: Remote On/Off, OCP, OTP, SCP, UVLO
Package / Case: 34-PowerBFQFN Module
Size / Dimension: 0.24" L x 0.16" W x 0.10" H (6.0mm x 4.0mm x 2.5mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 6.6V
Efficiency: 95%
Current - Output (Max): 6A
Supplier Device Package: 34-QFN (4x6)
Voltage - Input (Min): 2.7V
Voltage - Output 1: 0.75 ~ 6.12V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
auf Bestellung 2384 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 181.35 EUR |
| 25+ | 175.79 EUR |
| 100+ | 153.82 EUR |
| PL-ENET-BLASTERZ |
Hersteller: Intel
Description: ETHERNET BLASTER
Packaging: Box
For Use With/Related Products: CPLD, FPGA
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Obsolete
Description: ETHERNET BLASTER
Packaging: Box
For Use With/Related Products: CPLD, FPGA
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| EN63A0QA |
|
Hersteller: Intel
Description: DC DC CONVERTER 0.6-5.4V
Packaging: Cut Tape (CT)
Features: OCP, OTP, SCP, UVLO
Package / Case: 76-PowerBFQFN Module
Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 6.6V
Efficiency: 96%
Current - Output (Max): 12A
Supplier Device Package: 76-QFN (11x10)
Voltage - Input (Min): 2.5V
Voltage - Output 1: 0.6 ~ 5.4V
Part Status: Obsolete
Number of Outputs: 1
Description: DC DC CONVERTER 0.6-5.4V
Packaging: Cut Tape (CT)
Features: OCP, OTP, SCP, UVLO
Package / Case: 76-PowerBFQFN Module
Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 6.6V
Efficiency: 96%
Current - Output (Max): 12A
Supplier Device Package: 76-QFN (11x10)
Voltage - Input (Min): 2.5V
Voltage - Output 1: 0.6 ~ 5.4V
Part Status: Obsolete
Number of Outputs: 1
auf Bestellung 4667 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 542.57 EUR |
| 25+ | 460.67 EUR |
| EPM7064STC44-6N |
|
Hersteller: Intel
Description: EE PLD, 6NS, 64-CELL, CMOS, PQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: EE PLD, 6NS, 64-CELL, CMOS, PQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1078 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15+ | 89.8 EUR |
| MD2147H3 |
|
Hersteller: Intel
Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Write Cycle Time - Word, Page: 55ns
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 4K x 1
DigiKey Programmable: Not Verified
Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Write Cycle Time - Word, Page: 55ns
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 4K x 1
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 26+ | 27.4 EUR |
| 10M08SAU324I7G |
|
Hersteller: Intel
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Number of I/O: 246
DigiKey Programmable: Not Verified
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| FAGD1655348BA |
|
Hersteller: Intel
Description: MUX/DEMUX, 1-FUNC, PQFP48
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: -4.7V ~ -5.5V
Independent Circuits: 1
Current - Output High, Low: 60mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TQFP-EDQUAD (7x7)
Part Status: Active
Description: MUX/DEMUX, 1-FUNC, PQFP48
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: -4.7V ~ -5.5V
Independent Circuits: 1
Current - Output High, Low: 60mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TQFP-EDQUAD (7x7)
Part Status: Active
auf Bestellung 6254 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 190.75 EUR |
| NE80546RE061256 |
|
auf Bestellung 273 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 69.53 EUR |
| 5AGTFC7H3F35I3NAD |
Hersteller: Intel
Description: IC FPGA 544 I/O 1152FBGA
Description: IC FPGA 544 I/O 1152FBGA
Produkt ist nicht verfügbar
| D2911A1 |
|
Hersteller: Intel
Description: PCM CODEC, A-LAW, MOS, CDIP22
Packaging: Bulk
Package / Case: 22-CDIP
Mounting Type: Through Hole
Type: PCM
Data Interface: PCM
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply, Analog: 11.4V ~ 12.6V, ±4.75V ~ ±5.25V
Voltage - Supply, Digital: 11.4V ~ 12.6V, ±4.75V ~ ±5.25V
Resolution (Bits): 8 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 22-CDIP
Part Status: Active
Description: PCM CODEC, A-LAW, MOS, CDIP22
Packaging: Bulk
Package / Case: 22-CDIP
Mounting Type: Through Hole
Type: PCM
Data Interface: PCM
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply, Analog: 11.4V ~ 12.6V, ±4.75V ~ ±5.25V
Voltage - Supply, Digital: 11.4V ~ 12.6V, ±4.75V ~ ±5.25V
Resolution (Bits): 8 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 22-CDIP
Part Status: Active
auf Bestellung 912 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 97+ | 7.35 EUR |
| A80860XP-40 |
|
Hersteller: Intel
Description: IC MPU I860 XR 40MHZ 262CPGA
Packaging: Bulk
Package / Case: 262-CPGA
Mounting Type: Through Hole
Speed: 40MHz
Operating Temperature: -40°C ~ 125°C (TC)
Core Processor: i860® XR
Voltage - I/O: 5V
Supplier Device Package: 262-CPGA (49.53x49.53)
Graphics Acceleration: No
Description: IC MPU I860 XR 40MHZ 262CPGA
Packaging: Bulk
Package / Case: 262-CPGA
Mounting Type: Through Hole
Speed: 40MHz
Operating Temperature: -40°C ~ 125°C (TC)
Core Processor: i860® XR
Voltage - I/O: 5V
Supplier Device Package: 262-CPGA (49.53x49.53)
Graphics Acceleration: No
auf Bestellung 349 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1201.41 EUR |
| 10M08SAE144I7P |
|
Hersteller: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PSB3186F |
|
Hersteller: Intel
Description: ISDN CONTROLLER, 1-FUNC, CMOS, P
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Function: ISDN
Interface: IOM-2
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 30mA
Supplier Device Package: P-TQFP-64-1
Part Status: Active
Number of Circuits: 1
Description: ISDN CONTROLLER, 1-FUNC, CMOS, P
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Function: ISDN
Interface: IOM-2
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Current - Supply: 30mA
Supplier Device Package: P-TQFP-64-1
Part Status: Active
Number of Circuits: 1
auf Bestellung 1428 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 32+ | 23.7 EUR |
| HH80547RE067CN |
|
Hersteller: Intel
Description: IC MPU 331 2.66GHZ 775LGA
Packaging: Bulk
Package / Case: 775-LGA
Mounting Type: Surface Mount
Speed: 2.66GHz
Operating Temperature: 67.7°C (TC)
Core Processor: Intel® Celeron® D Processor 331
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 1 Core, 64-Bit
Description: IC MPU 331 2.66GHZ 775LGA
Packaging: Bulk
Package / Case: 775-LGA
Mounting Type: Surface Mount
Speed: 2.66GHz
Operating Temperature: 67.7°C (TC)
Core Processor: Intel® Celeron® D Processor 331
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 1 Core, 64-Bit
auf Bestellung 202 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 25+ | 29.63 EUR |
| RK80532PC064512 |
|
Hersteller: Intel
Description: IC MPU INTEL PENT 2.6GHZ 478PPGA
Packaging: Bulk
Package / Case: 478-PGA
Mounting Type: Through Hole
Speed: 2.6GHz
Operating Temperature: 70°C (TC)
Core Processor: Intel® Pentium® 4 Processor
Voltage - I/O: 1.345V, 1.525V
Supplier Device Package: 478-PPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Active
Description: IC MPU INTEL PENT 2.6GHZ 478PPGA
Packaging: Bulk
Package / Case: 478-PGA
Mounting Type: Through Hole
Speed: 2.6GHz
Operating Temperature: 70°C (TC)
Core Processor: Intel® Pentium® 4 Processor
Voltage - I/O: 1.345V, 1.525V
Supplier Device Package: 478-PPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Active
auf Bestellung 68430 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 17+ | 45.15 EUR |
| PEF82902F |
|
Hersteller: Intel
Description: ISDN CONTROLLER S/T/U 192KBPS
Description: ISDN CONTROLLER S/T/U 192KBPS
auf Bestellung 14400 Stücke:
Lieferzeit 21-28 Tag (e)| DK-SOC-1SSX-H-A |
|
Hersteller: Intel
Description: KIT DEV STRATIX 10 SX SOC H-TILE
Description: KIT DEV STRATIX 10 SX SOC H-TILE
Produkt ist nicht verfügbar
| DK-SI-1STX-E-0ES |
Hersteller: Intel
Description: DEV STRATIX 10 ENGINEERING SMPL
Description: DEV STRATIX 10 ENGINEERING SMPL
Produkt ist nicht verfügbar
| GE28F008B3BA90 |
|
Hersteller: Intel
Description: FLASH, 1MX8, 90NS, PBGA46
Description: FLASH, 1MX8, 90NS, PBGA46
auf Bestellung 4838 Stücke:
Lieferzeit 21-28 Tag (e)| KC80526LY400128 |
|
Hersteller: Intel
Description: MPU, 32-BIT, 400MHZ PBGA495
Packaging: Bulk
Package / Case: 495-BGA
Mounting Type: Surface Mount
Speed: 400MHz
Core Processor: Mobile Intel® Celeron®
Voltage - I/O: 1.35V
Supplier Device Package: 495-BGA (31x27)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
Description: MPU, 32-BIT, 400MHZ PBGA495
Packaging: Bulk
Package / Case: 495-BGA
Mounting Type: Surface Mount
Speed: 400MHz
Core Processor: Mobile Intel® Celeron®
Voltage - I/O: 1.35V
Supplier Device Package: 495-BGA (31x27)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
auf Bestellung 15373 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 145.92 EUR |
| KC80526LY500256 |
|
Hersteller: Intel
Description: IC MPU MOBIL PENT 500MHZ PBGA495
Packaging: Bulk
Package / Case: 495-BGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 100°C (TJ)
Core Processor: Mobile Intel® Pentium® III
Voltage - I/O: 1.6V
Supplier Device Package: 495-PBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Description: IC MPU MOBIL PENT 500MHZ PBGA495
Packaging: Bulk
Package / Case: 495-BGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 100°C (TJ)
Core Processor: Mobile Intel® Pentium® III
Voltage - I/O: 1.6V
Supplier Device Package: 495-PBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
auf Bestellung 27428 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 12+ | 64.03 EUR |
| AN87C196JT |
|
Hersteller: Intel
Description: 16-BIT, OTPROM, 8096 CPU, 16MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: External
Program Memory Type: OTP
Core Processor: MCS 96
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SIO
Peripherals: PWM
Supplier Device Package: 52-PLCC (19x19)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: 16-BIT, OTPROM, 8096 CPU, 16MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: External
Program Memory Type: OTP
Core Processor: MCS 96
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SIO
Peripherals: PWM
Supplier Device Package: 52-PLCC (19x19)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 18+ | 41.76 EUR |
| DE28F800F3T95 |
|
Hersteller: Intel
Description: IC FLASH 8MBIT CUI 56SSOP
Packaging: Bulk
Package / Case: 56-SOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - Boot Block
Memory Format: FLASH
Supplier Device Package: 56-SSOP
Write Cycle Time - Word, Page: 200µs
Memory Interface: CUI
Access Time: 95 ns
Memory Organization: 512K x 16
DigiKey Programmable: Not Verified
Description: IC FLASH 8MBIT CUI 56SSOP
Packaging: Bulk
Package / Case: 56-SOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - Boot Block
Memory Format: FLASH
Supplier Device Package: 56-SSOP
Write Cycle Time - Word, Page: 200µs
Memory Interface: CUI
Access Time: 95 ns
Memory Organization: 512K x 16
DigiKey Programmable: Not Verified
auf Bestellung 7168 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 70+ | 10.68 EUR |
| E28F008S3150 |
|
Hersteller: Intel
Description: IC FLASH 8MBIT PARALLEL 40TSOP
Packaging: Bulk
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Active
Memory Interface: Parallel
Access Time: 150 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 8MBIT PARALLEL 40TSOP
Packaging: Bulk
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Active
Memory Interface: Parallel
Access Time: 150 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 5130 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 75+ | 10.4 EUR |
| TE28F800B3TA120 |
Hersteller: Intel
Description: ADVANCED BOOT BLOCK FLASH MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: ADVANCED BOOT BLOCK FLASH MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 31102 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 67+ | 11.07 EUR |
| TE28F160B3BA110S |
Hersteller: Intel
Description: 16M-BIT FLASH MEM, PARALLEL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: 16M-BIT FLASH MEM, PARALLEL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 11549 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 52+ | 14.22 EUR |
| TE28F008BVT90 |
|
Hersteller: Intel
Description: IC FLASH 8MBIT PARALLEL 40TSOP
Packaging: Bulk
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - Boot Block
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 8MBIT PARALLEL 40TSOP
Packaging: Bulk
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - Boot Block
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 29835 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 38+ | 20.8 EUR |
| TE28F008BET120 |
|
Hersteller: Intel
Description: IC FLASH 8MBIT PARALLEL 40TSOP
Packaging: Bulk
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - Boot Block
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 120ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 8MBIT PARALLEL 40TSOP
Packaging: Bulk
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - Boot Block
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 120ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 16320 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 38+ | 20.8 EUR |
| 10CX085YU484E5G |
|
Hersteller: Intel
Description: IC FPGA 208 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 188
DigiKey Programmable: Not Verified
Description: IC FPGA 208 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 188
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EPCS4SI8 |
|
Hersteller: Intel
Description: IC CONFIG DEVICE 4MBIT 8SOIC
Description: IC CONFIG DEVICE 4MBIT 8SOIC
auf Bestellung 2773 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 72+ | 49.43 EUR |
| FH8065301685598S R1UB |
|
auf Bestellung 508 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15+ | 52.66 EUR |
| P8042AH |
|
Hersteller: Intel
Description: 8-BIT, MROM, 8048 CPU
Packaging: Bulk
Package / Case: 40-DIP
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: 8048
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 4.5V
Peripherals: DMA
Supplier Device Package: 40-DIP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: 8-BIT, MROM, 8048 CPU
Packaging: Bulk
Package / Case: 40-DIP
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: 8048
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 4.5V
Peripherals: DMA
Supplier Device Package: 40-DIP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 944 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 60+ | 12.01 EUR |