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5AGZME5H2F35I3L 5AGZME5H2F35I3L Intel Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NU80579EZ009C Intel Intel-EP80579-Integrated-Processor-with-Intel-QuickAssist-Technology-600-MHz Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
Produkt ist nicht verfügbar
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AT80574JH046NT S LBBT-CONS Intel Description: AT805INTXEPROCESSL5408
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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EP20K100EF324I2XGZ Intel APEX_20K_Ver5.1_Mar2004.pdf Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AS027E3F27E2LG 10AS027E3F27E2LG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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EPM570XXA Intel Description: IC MAX IIZ CPLD 570
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AS027E2F27E1HG 10AS027E2F27E1HG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55E3VG 1SG280HH3F55E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55E3VGS3 1SG280HH3F55E3VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX280HH3F55E3VGS3 1SX280HH3F55E3VGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E3VG 1SX280HH3F55E3VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HU3F50E3VG 1SX280HU3F50E3VG Intel Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55E2VGS3 1SG280HH3F55E2VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55I3VG 1SG280HH3F55I3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55E2VG 1SG280HH3F55E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX280HH3F55E2VG 1SX280HH3F55E2VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55I3VG 1SX280HH3F55I3VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E2VGS3 1SX280HH3F55E2VGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280LN3F43I3VG 1SX280LN3F43I3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55E1VG 1SG280HH3F55E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55E1VGS3 1SG280HH3F55E1VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX280HH3F55E1VG 1SX280HH3F55E1VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E1VGS3 1SX280HH3F55E1VGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HU3F50I3VG 1SX280HU3F50I3VG Intel Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HU3F50E2VG 1SX280HU3F50E2VG Intel Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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10AX032E3F27I2SG 10AX032E3F27I2SG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AX032H2F34I1HG 10AX032H2F34I1HG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
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EPM7032LC44-15S02A EPM7032LC44-15S02A Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 32MC 15NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F780C4G EP3SL150F780C4G Intel Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F1152C4G EP3SL150F1152C4G Intel Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780I4G EP3SL150F780I4G Intel Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780C3G EP3SL150F780C3G Intel Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F1152C3G EP3SL150F1152C3G Intel Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F1152I4G EP3SL150F1152I4G Intel Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780C4LG EP3SL150F780C4LG Intel Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F1152C4LG EP3SL150F1152C4LG Intel Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780C2G EP3SL150F780C2G Intel Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780I3G EP3SL150F780I3G Intel Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F780I4LG EP3SL150F780I4LG Intel Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F1152I3G EP3SL150F1152I3G Intel Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F1152I4LG EP3SL150F1152I4LG Intel Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F1152C2G EP3SL150F1152C2G Intel Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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GWIXP455BAB Intel INTLS05373-1.pdf?t.download=true&u=5oefqw Description: IC MPU INTEL 266MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
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12+47.59 EUR
Mindestbestellmenge: 12
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GWIXP455BAC Intel INTLS05373-1.pdf?t.download=true&u=5oefqw Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
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9+64.24 EUR
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EWIXP455BAC Intel INTLS05373-1.pdf?t.download=true&u=5oefqw Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
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9+64.24 EUR
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RK80546KF1071M Intel Description: XEON PROCESSOR 64-BIT
Packaging: Bulk
auf Bestellung 1229 Stücke:
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5+105.39 EUR
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RK80532EC041512 Intel Description: MPU XEON PROCESSOR, X86 ARCH. 64
Packaging: Bulk
auf Bestellung 5103 Stücke:
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RK80546KG1122MMS Intel Description: PRESCOTT CELERON PROCESSOR
Packaging: Bulk
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N82586 N82586 Intel INTLD034-1-1.pdf?t.download=true&u=5oefqw Description: IC SIGNAL COPROCESSOR 68PLCC
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Signal Coprocessor
Supplier Device Package: 68-PLCC
DigiKey Programmable: Not Verified
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N82C08-8 N82C08-8 Intel INTLD030-3-3.pdf?t.download=true&u=5oefqw Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
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N82C08-20 N82C08-20 Intel INTLD030-3-3.pdf?t.download=true&u=5oefqw Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
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N82C08-10 N82C08-10 Intel INTLD030-3-3.pdf?t.download=true&u=5oefqw Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
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HGLXT17001ME.A1 Intel Description: LXT17001 - 10 GBPS LASER DRIVER
Packaging: Bulk
DigiKey Programmable: Not Verified
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GCIXF440AC GCIXF440AC Intel INTLS01300-1.pdf?t.download=true&u=5oefqw Description: LAN CONTROLLER, 8 CHANNEL(S), 12
Packaging: Bulk
Package / Case: 352-BGA
Function: Controller
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
DigiKey Programmable: Not Verified
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GCIXF440ACT GCIXF440ACT Intel INTLS01300-1.pdf?t.download=true&u=5oefqw Description: LAN CONTROLLER
Packaging: Bulk
Package / Case: 352-LBGA
Function: Controller
Interface: FIFO, MII
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX
Supplier Device Package: 352-BGA (35x35)
DigiKey Programmable: Not Verified
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EP4CE75F29C8N EP4CE75F29C8N Intel Cyclone IV Device Handbook, Volume 3_Web.pdf Description: IC FPGA 426 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 75408
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4713
Total RAM Bits: 2810880
Number of I/O: 426
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4CE40F23I7 EP4CE40F23I7 Intel Cyclone%20IV%20Device%20Handbook%2C%20Volume%203_Web.pdf Description: IC FPGA 328 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 39600
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2475
Total RAM Bits: 1161216
Number of I/O: 328
DigiKey Programmable: Not Verified
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RJ80530VY800256 Intel Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
auf Bestellung 5066 Stücke:
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17+32.60 EUR
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EP2SEVOL2F672NAA Intel Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10M50DDF484C8G 10M50DDF484C8G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
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1+344.94 EUR
25+289.74 EUR
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5AGZME5H2F35I3L
5AGZME5H2F35I3L
Hersteller: Intel
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NU80579EZ009C Intel-EP80579-Integrated-Processor-with-Intel-QuickAssist-Technology-600-MHz
Hersteller: Intel
Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
Produkt ist nicht verfügbar
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AT80574JH046NT S LBBT-CONS
Hersteller: Intel
Description: AT805INTXEPROCESSL5408
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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EP20K100EF324I2XGZ APEX_20K_Ver5.1_Mar2004.pdf
Hersteller: Intel
Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AS027E3F27E2LG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS027E3F27E2LG
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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EPM570XXA
Hersteller: Intel
Description: IC MAX IIZ CPLD 570
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AS027E2F27E1HG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS027E2F27E1HG
Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55E3VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E3VG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55E3VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E3VGS3
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX280HH3F55E3VGS3
1SX280HH3F55E3VGS3
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E3VG
1SX280HH3F55E3VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HU3F50E3VG
1SX280HU3F50E3VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55E2VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E2VGS3
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55I3VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55I3VG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55E2VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E2VG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SX280HH3F55E2VG
1SX280HH3F55E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55I3VG
1SX280HH3F55I3VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E2VGS3
1SX280HH3F55E2VGS3
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280LN3F43I3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43I3VG
Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55E1VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E1VG
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55E1VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E1VGS3
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1SX280HH3F55E1VG
1SX280HH3F55E1VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E1VGS3
1SX280HH3F55E1VGS3
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HU3F50I3VG
1SX280HU3F50I3VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HU3F50E2VG
1SX280HU3F50E2VG
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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10AX032E3F27I2SG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AX032E3F27I2SG
Hersteller: Intel
Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10AX032H2F34I1HG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AX032H2F34I1HG
Hersteller: Intel
Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EPM7032LC44-15S02A MAX_7000_Ver6.7_9-12-05.pdf
EPM7032LC44-15S02A
Hersteller: Intel
Description: IC CPLD 32MC 15NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F780C4G
EP3SL150F780C4G
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F1152C4G
EP3SL150F1152C4G
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F780I4G
EP3SL150F780I4G
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F780C3G
EP3SL150F780C3G
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F1152C3G
EP3SL150F1152C3G
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F1152I4G
EP3SL150F1152I4G
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780C4LG
EP3SL150F780C4LG
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F1152C4LG
EP3SL150F1152C4LG
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780C2G
EP3SL150F780C2G
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F780I3G
EP3SL150F780I3G
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F780I4LG
EP3SL150F780I4LG
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP3SL150F1152I3G
EP3SL150F1152I3G
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F1152I4LG
EP3SL150F1152I4LG
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP3SL150F1152C2G
EP3SL150F1152C2G
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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GWIXP455BAB INTLS05373-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: IC MPU INTEL 266MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
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12+47.59 EUR
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GWIXP455BAC INTLS05373-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
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9+64.24 EUR
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EWIXP455BAC INTLS05373-1.pdf?t.download=true&u=5oefqw
Hersteller: Intel
Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
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9+64.24 EUR
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RK80546KF1071M
Hersteller: Intel
Description: XEON PROCESSOR 64-BIT
Packaging: Bulk
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RK80532EC041512
Hersteller: Intel
Description: MPU XEON PROCESSOR, X86 ARCH. 64
Packaging: Bulk
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15+34.26 EUR
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RK80546KG1122MMS
Hersteller: Intel
Description: PRESCOTT CELERON PROCESSOR
Packaging: Bulk
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N82586 INTLD034-1-1.pdf?t.download=true&u=5oefqw
N82586
Hersteller: Intel
Description: IC SIGNAL COPROCESSOR 68PLCC
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Signal Coprocessor
Supplier Device Package: 68-PLCC
DigiKey Programmable: Not Verified
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N82C08-8 INTLD030-3-3.pdf?t.download=true&u=5oefqw
N82C08-8
Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
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N82C08-20 INTLD030-3-3.pdf?t.download=true&u=5oefqw
N82C08-20
Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
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N82C08-10 INTLD030-3-3.pdf?t.download=true&u=5oefqw
N82C08-10
Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
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HGLXT17001ME.A1
Hersteller: Intel
Description: LXT17001 - 10 GBPS LASER DRIVER
Packaging: Bulk
DigiKey Programmable: Not Verified
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3+182.44 EUR
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GCIXF440AC INTLS01300-1.pdf?t.download=true&u=5oefqw
GCIXF440AC
Hersteller: Intel
Description: LAN CONTROLLER, 8 CHANNEL(S), 12
Packaging: Bulk
Package / Case: 352-BGA
Function: Controller
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
DigiKey Programmable: Not Verified
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7+81.35 EUR
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GCIXF440ACT INTLS01300-1.pdf?t.download=true&u=5oefqw
GCIXF440ACT
Hersteller: Intel
Description: LAN CONTROLLER
Packaging: Bulk
Package / Case: 352-LBGA
Function: Controller
Interface: FIFO, MII
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX
Supplier Device Package: 352-BGA (35x35)
DigiKey Programmable: Not Verified
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6+94.09 EUR
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EP4CE75F29C8N Cyclone IV Device Handbook, Volume 3_Web.pdf
EP4CE75F29C8N
Hersteller: Intel
Description: IC FPGA 426 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 75408
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4713
Total RAM Bits: 2810880
Number of I/O: 426
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EP4CE40F23I7 Cyclone%20IV%20Device%20Handbook%2C%20Volume%203_Web.pdf
EP4CE40F23I7
Hersteller: Intel
Description: IC FPGA 328 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 39600
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2475
Total RAM Bits: 1161216
Number of I/O: 328
DigiKey Programmable: Not Verified
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Anzahl Preis
1+236.47 EUR
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RJ80530VY800256
Hersteller: Intel
Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
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17+32.60 EUR
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EP2SEVOL2F672NAA
Hersteller: Intel
Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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10M50DDF484C8G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M50DDF484C8G
Hersteller: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
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Anzahl Preis
1+344.94 EUR
25+289.74 EUR
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