Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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5AGZME5H2F35I3L | Intel |
Description: IC FPGA 150960 I/O 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Number of Gates: 534 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 603840 Supplier Device Package: 1152-FBGA (35x35) Number of LABs/CLBs: 400000 Total RAM Bits: 34322432 Number of I/O: 150960 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
NU80579EZ009C | Intel |
![]() Packaging: Tray Package / Case: 1088-BGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 95°C (TC) Core Processor: Intel® EP80579 Integrated Processor Supplier Device Package: 1088-FCBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2 Graphics Acceleration: No SATA: SATA (2) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
AT80574JH046NT S LBBT-CONS | Intel |
Description: AT805INTXEPROCESSL5408 Packaging: Tape & Box (TB) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
EP20K100EF324I2XGZ | Intel |
![]() Packaging: Tray Package / Case: 324-BGA Mounting Type: Surface Mount Number of Gates: 263000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 4160 Supplier Device Package: 324-FBGA (19x19) Number of LABs/CLBs: 416 Total RAM Bits: 53248 Number of I/O: 246 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
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10AS027E3F27E2LG | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 270K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-FBGA, FC (27x27) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
EPM570XXA | Intel |
Description: IC MAX IIZ CPLD 570 Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
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10AS027E2F27E1HG | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 270K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-FBGA, FC (27x27) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SG280HH3F55E3VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SG280HH3F55E3VGS3 | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HH3F55E3VGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HH3F55E3VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HU3F50E3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SG280HH3F55E2VGS3 | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SG280HH3F55I3VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SG280HH3F55E2VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HH3F55E2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HH3F55I3VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HH3F55E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280LN3F43I3VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SG280HH3F55E1VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SG280HH3F55E1VGS3 | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HH3F55E1VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HH3F55E1VGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HU3F50I3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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1SX280HU3F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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10AX032E3F27I2SG | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 320000 Supplier Device Package: 672-FBGA, FC (27x27) Number of LABs/CLBs: 119900 Total RAM Bits: 21040128 Number of I/O: 240 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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10AX032H2F34I1HG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.98V Number of Logic Elements/Cells: 320000 Supplier Device Package: 1152-FCBGA (35x35) Number of LABs/CLBs: 119900 Total RAM Bits: 21040128 Number of I/O: 384 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EPM7032LC44-15S02A | Intel |
![]() Packaging: Tray Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 600 Number of Macrocells: 32 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 44-PLCC (16.59x16.59) Number of Logic Elements/Blocks: 2 Voltage Supply - Internal: 4.75V ~ 5.25V Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F780C4G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F1152C4G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F780I4G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F780C3G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F1152C3G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F1152I4G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F780C4LG | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F1152C4LG | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F780C2G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F780I3G | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F780I4LG | Intel |
Description: IC FPGA 488 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F1152I3G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F1152I4LG | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP3SL150F1152C2G | Intel |
Description: IC FPGA 744 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
GWIXP455BAB | Intel |
![]() Packaging: Bulk Package / Case: 544-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: Intel® IXP45X Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 544-PBGA (35x35) Ethernet: Mll (3), SMII (3) USB: USB 1.1 (1), USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, RNG, SHA1 |
auf Bestellung 1994 Stücke: Lieferzeit 10-14 Tag (e) |
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GWIXP455BAC | Intel |
![]() Packaging: Bulk Package / Case: 544-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: Intel® IXP45X Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 544-PBGA (35x35) Ethernet: Mll (3), SMII (3) USB: USB 1.1 (1), USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, RNG, SHA1 |
auf Bestellung 1629 Stücke: Lieferzeit 10-14 Tag (e) |
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EWIXP455BAC | Intel |
![]() Packaging: Bulk Package / Case: 544-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: Intel® IXP45X Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 544-PBGA (35x35) Ethernet: Mll (3), SMII (3) USB: USB 1.1 (1), USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, RNG, SHA1 |
auf Bestellung 10840 Stücke: Lieferzeit 10-14 Tag (e) |
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RK80546KF1071M | Intel |
Description: XEON PROCESSOR 64-BIT Packaging: Bulk |
auf Bestellung 1229 Stücke: Lieferzeit 10-14 Tag (e) |
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RK80532EC041512 | Intel |
Description: MPU XEON PROCESSOR, X86 ARCH. 64 Packaging: Bulk |
auf Bestellung 5103 Stücke: Lieferzeit 10-14 Tag (e) |
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RK80546KG1122MMS | Intel |
Description: PRESCOTT CELERON PROCESSOR Packaging: Bulk |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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N82586 | Intel |
![]() Packaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Type: Signal Coprocessor Supplier Device Package: 68-PLCC DigiKey Programmable: Not Verified |
auf Bestellung 4957 Stücke: Lieferzeit 10-14 Tag (e) |
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N82C08-8 | Intel |
![]() Packaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Controller Type: Dynamic RAM (DRAM) Supplier Device Package: 68-PLCC |
auf Bestellung 328 Stücke: Lieferzeit 10-14 Tag (e) |
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N82C08-20 | Intel |
![]() Packaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Controller Type: Dynamic RAM (DRAM) Supplier Device Package: 68-PLCC |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
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N82C08-10 | Intel |
![]() Packaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Controller Type: Dynamic RAM (DRAM) Supplier Device Package: 68-PLCC |
auf Bestellung 665 Stücke: Lieferzeit 10-14 Tag (e) |
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HGLXT17001ME.A1 | Intel |
Description: LXT17001 - 10 GBPS LASER DRIVER Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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GCIXF440AC | Intel |
![]() Packaging: Bulk Package / Case: 352-BGA Function: Controller Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Current - Supply: 830mA Protocol: Ethernet DigiKey Programmable: Not Verified |
auf Bestellung 15359 Stücke: Lieferzeit 10-14 Tag (e) |
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GCIXF440ACT | Intel |
![]() Packaging: Bulk Package / Case: 352-LBGA Function: Controller Interface: FIFO, MII Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3V ~ 3.6V Current - Supply: 830mA Protocol: Ethernet Standards: IEEE 802.3, 10/100 Base-T/TX Supplier Device Package: 352-BGA (35x35) DigiKey Programmable: Not Verified |
auf Bestellung 1832 Stücke: Lieferzeit 10-14 Tag (e) |
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EP4CE75F29C8N | Intel |
![]() Packaging: Tray Package / Case: 780-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 75408 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 4713 Total RAM Bits: 2810880 Number of I/O: 426 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||
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EP4CE40F23I7 | Intel |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 39600 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2475 Total RAM Bits: 1161216 Number of I/O: 328 DigiKey Programmable: Not Verified |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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RJ80530VY800256 | Intel |
Description: TUALITAN PENTIUM PROCESSOR Packaging: Bulk |
auf Bestellung 5066 Stücke: Lieferzeit 10-14 Tag (e) |
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EP2SEVOL2F672NAA | Intel |
Description: IC FPGA STRATIX II 672BGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||
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10M50DDF484C8G | Intel |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 50000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 360 DigiKey Programmable: Not Verified |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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5AGZME5H2F35I3L |
Hersteller: Intel
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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NU80579EZ009C |
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Hersteller: Intel
Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
Produkt ist nicht verfügbar
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EP20K100EF324I2XGZ |
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Hersteller: Intel
Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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10AS027E3F27E2LG |
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Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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10AS027E2F27E1HG |
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Hersteller: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SG280HH3F55E3VG |
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Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1SG280HH3F55E3VGS3 |
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Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SX280HH3F55E3VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SX280HU3F50E3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SG280HH3F55E2VGS3 |
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Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SG280HH3F55I3VG |
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Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1SG280HH3F55E2VG |
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Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SX280HH3F55E2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SX280HH3F55I3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1SX280HH3F55E2VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SX280LN3F43I3VG |
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Hersteller: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SG280HH3F55E1VG |
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Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SG280HH3F55E1VGS3 |
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Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
1SX280HH3F55E1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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1SX280HH3F55E1VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SX280HU3F50I3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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1SX280HU3F50E2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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10AX032E3F27I2SG |
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Hersteller: Intel
Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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10AX032H2F34I1HG |
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Hersteller: Intel
Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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EPM7032LC44-15S02A |
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Hersteller: Intel
Description: IC CPLD 32MC 15NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC CPLD 32MC 15NS 44PLCC
Packaging: Tray
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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EP3SL150F780C4G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F1152C4G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F780I4G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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EP3SL150F780C3G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F1152C3G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F1152I4G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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EP3SL150F780C4LG |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F1152C4LG |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F780C2G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F780I3G |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F780I4LG |
Hersteller: Intel
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 488 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F1152I3G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F1152I4LG |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP3SL150F1152C2G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
GWIXP455BAB |
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Hersteller: Intel
Description: IC MPU INTEL 266MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
Description: IC MPU INTEL 266MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
auf Bestellung 1994 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
12+ | 47.59 EUR |
GWIXP455BAC |
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Hersteller: Intel
Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
auf Bestellung 1629 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
9+ | 64.24 EUR |
EWIXP455BAC |
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Hersteller: Intel
Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
Description: IC MPU INTEL 400MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
auf Bestellung 10840 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
9+ | 64.24 EUR |
RK80546KF1071M |
auf Bestellung 1229 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 105.39 EUR |
RK80532EC041512 |
auf Bestellung 5103 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
15+ | 34.26 EUR |
RK80546KG1122MMS |
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 142.21 EUR |
N82586 |
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Hersteller: Intel
Description: IC SIGNAL COPROCESSOR 68PLCC
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Signal Coprocessor
Supplier Device Package: 68-PLCC
DigiKey Programmable: Not Verified
Description: IC SIGNAL COPROCESSOR 68PLCC
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Signal Coprocessor
Supplier Device Package: 68-PLCC
DigiKey Programmable: Not Verified
auf Bestellung 4957 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
17+ | 31.77 EUR |
N82C08-8 |
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Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
auf Bestellung 328 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
11+ | 48.42 EUR |
N82C08-20 |
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Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10+ | 54.47 EUR |
N82C08-10 |
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Hersteller: Intel
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
Description: DRAM CONTROLLER, 1M X 8 PQCC68
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 68-PLCC
auf Bestellung 665 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10+ | 54.47 EUR |
HGLXT17001ME.A1 |
Hersteller: Intel
Description: LXT17001 - 10 GBPS LASER DRIVER
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: LXT17001 - 10 GBPS LASER DRIVER
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 182.44 EUR |
GCIXF440AC |
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Hersteller: Intel
Description: LAN CONTROLLER, 8 CHANNEL(S), 12
Packaging: Bulk
Package / Case: 352-BGA
Function: Controller
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
DigiKey Programmable: Not Verified
Description: LAN CONTROLLER, 8 CHANNEL(S), 12
Packaging: Bulk
Package / Case: 352-BGA
Function: Controller
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
DigiKey Programmable: Not Verified
auf Bestellung 15359 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 81.35 EUR |
GCIXF440ACT |
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Hersteller: Intel
Description: LAN CONTROLLER
Packaging: Bulk
Package / Case: 352-LBGA
Function: Controller
Interface: FIFO, MII
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX
Supplier Device Package: 352-BGA (35x35)
DigiKey Programmable: Not Verified
Description: LAN CONTROLLER
Packaging: Bulk
Package / Case: 352-LBGA
Function: Controller
Interface: FIFO, MII
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Current - Supply: 830mA
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX
Supplier Device Package: 352-BGA (35x35)
DigiKey Programmable: Not Verified
auf Bestellung 1832 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 94.09 EUR |
EP4CE75F29C8N |
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Hersteller: Intel
Description: IC FPGA 426 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 75408
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4713
Total RAM Bits: 2810880
Number of I/O: 426
DigiKey Programmable: Not Verified
Description: IC FPGA 426 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 75408
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4713
Total RAM Bits: 2810880
Number of I/O: 426
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EP4CE40F23I7 |
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Hersteller: Intel
Description: IC FPGA 328 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 39600
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2475
Total RAM Bits: 1161216
Number of I/O: 328
DigiKey Programmable: Not Verified
Description: IC FPGA 328 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 39600
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2475
Total RAM Bits: 1161216
Number of I/O: 328
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 236.47 EUR |
RJ80530VY800256 |
auf Bestellung 5066 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
17+ | 32.60 EUR |
EP2SEVOL2F672NAA |
Hersteller: Intel
Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
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Im Einkaufswagen
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10M50DDF484C8G |
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Hersteller: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 344.94 EUR |
25+ | 289.74 EUR |