| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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1SG250HU1F50E2LG | Intel |
 Description: IC FPGA 704 I/O 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2500000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 312500 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG250HU2F50I2LG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2500000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 312500 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG250HU3F50I2LG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2500000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 312500 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG250LN3F43I3XG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2500000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 312500 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH1F55I2VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH2F55E2LG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH2F55E2LGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH2F55I1VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH3F55E2LGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH3F55E2LG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HH3F55E3XG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HN1F43E1VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HN1F43E1VGS3 | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HN1F43E1VGAS | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HN1F43I2LGAS | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HN1F43I2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HN2F43E2VGS3 | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HN3F43E2LGS3 | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU1F50E1VGS3 | Intel |
Description: IC FPGA 704 I/O 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU1F50E2VGAS | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU1F50E2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280HU1F50E2VGS3 | Intel |
Description: IC FPGA 704 I/O 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU1F50I2LG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU2F50E2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU2F50E2VGS3 | Intel |
Description: IC FPGA 704 I/O 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU2F50I1VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU2F50I2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU3F50E2LG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SG280HU3F50E2LGS3 | Intel |
Description: IC FPGA 704 I/O 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280LU3F50I3XGAS | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1SG280LU3F50I3XG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SX250HH1F55E1VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH1F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH1F55I2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH2F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH2F55I2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HH3F55I3XG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HN2F43I1VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU1F50I2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU2F50E2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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1SX250HU2F50I2LG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SX250HU2F50I2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SX250HU3F50E1VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SX250HU3F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SX250HU3F50I3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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Im Einkaufswagen Stück im Wert von UAH |
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1SX250LU3F50I3XG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
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Im Einkaufswagen Stück im Wert von UAH |
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1SX280HH2F55I2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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Im Einkaufswagen Stück im Wert von UAH |
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1SX280HN1F43E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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1SX280HN1F43I1VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
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Im Einkaufswagen Stück im Wert von UAH |
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1SX280HN3F43E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA |
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Im Einkaufswagen Stück im Wert von UAH |
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1SX280HU1F50E2LGS3 | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| IP-OM-3D-LUT | Intel |
Description: PROTOTYPE Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |
 |
EP4SGX180DF29C4G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| EP4SGX180FF35C4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |
 |
EP4SGX180HF35C4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
EP4SGX180KF40C4G | Intel |
Description: IC FPGA 744 I/O 1517FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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EP4SGX180DF29I4G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
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EP4SGX180DF29C3G | Intel |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| EP4SGX180FF35I4G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |
 |
EP4SGX180FF35C3G | Intel |
Description: IC FPGA 564 I/O 1152FBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 1SG250HU1F50E2LG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG250HU2F50I2LG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG250HU3F50I2LG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG250LN3F43I3XG |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 312500
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 312500
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HH1F55I2VG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HH2F55E2LG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HH2F55E2LGS3 |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HH2F55I1VG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HH3F55E2LGS3 |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HH3F55E2LG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HH3F55E3XG |
|
Hersteller: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HN1F43E1VG |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HN1F43E1VGS3 |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HN1F43E1VGAS |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HN1F43I2LGAS |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HN1F43I2LG |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HN2F43E2VGS3 |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SG280HN3F43E2LGS3 |
|
Hersteller: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG280HU1F50E1VGS3 |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280HU1F50E2VGAS |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280HU1F50E2VG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280HU1F50E2VGS3 |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280HU1F50I2LG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280HU2F50E2VG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280HU2F50E2VGS3 |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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Im Einkaufswagen
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| 1SG280HU2F50I1VG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280HU2F50I2VG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HU3F50E2LG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SG280HU3F50E2LGS3 |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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| 1SG280LU3F50I3XGAS |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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Im Einkaufswagen
Stück im Wert von UAH
| 1SG280LU3F50I3XG |
|
Hersteller: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX250HH1F55E1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 1SX250HH1F55E2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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Im Einkaufswagen
Stück im Wert von UAH
| 1SX250HH1F55I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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Stück im Wert von UAH
| 1SX250HH2F55E2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| 1SX250HH2F55I2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SX250HH3F55I3XG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SX250HN2F43I1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX250HU1F50I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1SX250HU2F50E2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
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| 1SX250HU2F50I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 1SX250HU2F50I2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 1SX250HU3F50E1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX250HU3F50E2VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX250HU3F50I3VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX250LU3F50I3XG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX280HH2F55I2LG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX280HN1F43E2VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| 1SX280HN1F43I1VG |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX280HN3F43E2VGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 1SX280HU1F50E2LGS3 |
Hersteller: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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| EP4SGX180DF29C4G |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EP4SGX180FF35C4G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EP4SGX180HF35C4G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EP4SGX180KF40C4G |
Hersteller: Intel
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 744 I/O 1517FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EP4SGX180DF29I4G |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EP4SGX180DF29C3G |
Hersteller: Intel
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EP4SGX180FF35I4G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| EP4SGX180FF35C3G |
Hersteller: Intel
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 564 I/O 1152FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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