Produkte > KESTER SOLDER > Alle Produkte des Herstellers KESTER SOLDER (754) > Seite 10 nach 13
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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70-1003-0610 | Kester Solder | Description: SOLDER PASTE WATER SOLUBLE 500GM |
Produkt ist nicht verfügbar |
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70-1003-0611 | Kester Solder | Description: SOLDER PASTE WATER SOLUBLE 600GM |
Produkt ist nicht verfügbar |
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70-1003-0618 | Kester Solder | Description: SOLDER PASTE WATER SOLUBLE 1400G |
Produkt ist nicht verfügbar |
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70-1302-0511 | Kester Solder | Description: SOLDER PASTE R231 ROSIN 600GM |
Produkt ist nicht verfügbar |
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70-1506-1410 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn95Sb5 (95/5) Type: Solder Paste Melting Point: 450 ~ 464°F (232 ~ 240°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 4 Months |
Produkt ist nicht verfügbar |
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70-1506-1510 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn96.3Ag3.7 (96.3/3.7) Type: Solder Paste Melting Point: 430 ~ 444°F (221 ~ 223°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 4 Months |
Produkt ist nicht verfügbar |
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70-1506-1710 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn95Sb5 (95/5) Type: Solder Paste Melting Point: 450 ~ 464°F (232 ~ 240°C) Form: Jar, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 4 Months |
Produkt ist nicht verfügbar |
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70-1607-0504 | Kester Solder |
Description: SOLDERPASTE NO CLEAN 63/37 100GM Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-1607-0520 | Kester Solder |
Description: SOLDERPASTE NO CLEAN 63/37 35GM Packaging: Dispenser Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 294 Stücke: Lieferzeit 10-14 Tag (e) |
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70-1608-0804 | Kester Solder | Description: SOLDER PASTE NO CLEAN 100GM |
Produkt ist nicht verfügbar |
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70-1608-0820 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 35GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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70-1608-0904 | Kester Solder |
Description: R276 SN96.5AG3.0CU0.5 T4 86% 100 Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Form: Syringe, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-1708-0504 | Kester Solder |
Description: R500 SN63PB37 T3 86% 100G SYR Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Form: Syringe, 3.53 oz (100g) Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-1708-0520 | Kester Solder |
Description: SOLDERPASTE WATER SOL SYR 35GM Packaging: Dispenser Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 92 Stücke: Lieferzeit 10-14 Tag (e) |
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70-1709-0820 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 35GM Packaging: Bulk Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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70-1903-0810 | Kester Solder |
Description: SOLDER 500G JAR,SN96.5 AG3.0 Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 4 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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70-1903-0911 | Kester Solder | Description: SOLDER PASTE WATER SOLUBLE 600GM |
Produkt ist nicht verfügbar |
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70-2002-0310 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 500GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Process: Leaded Flux Type: Water Soluble Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-2002-0311 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Process: Leaded Flux Type: Water Soluble Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-2002-0510 | Kester Solder |
Description: SOLDERPASTE WATER SOLUABLE 500GM Packaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-2002-0511 | Kester Solder | Description: SOLDER PASTE WATER SOLUBLE 600GM |
Produkt ist nicht verfügbar |
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70-2102-0310 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 500GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-2102-0311 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM Packaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-2102-0510 | Kester Solder |
Description: R562 SOLDERPASTE WATER SOL 500G Packaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-2102-0511 | Kester Solder | Description: SOLDER PASTE WATER SOLUBLE 600GM |
Produkt ist nicht verfügbar |
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70-2103-0511 | Kester Solder | Description: SOLDER PASTE WATER SOLUBLE 600GM |
Produkt ist nicht verfügbar |
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70-2501-0003 | Kester Solder |
Description: SOLDER FLUX RF741 NO CLEAN 30GM Packaging: Bulk Type: Flux - No Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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70-2501-0004 | Kester Solder |
Description: SOLDER FLUX RF741 NO CLEAN 100GM Packaging: Bulk Type: Flux - No Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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70-2601-0003 | Kester Solder | Description: FLUX - WATER SOLUBLE SYRINGE 30G |
Produkt ist nicht verfügbar |
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70-3205-0819 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 750GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 24.69 oz (700g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
Produkt ist nicht verfügbar |
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70-3205-1810 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 500GM Packaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Solder Paste Melting Point: 441°F (227°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
Produkt ist nicht verfügbar |
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70-3205-1812 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 1000G Packaging: Bulk Composition: Sn99Cu0.7Ag0.3 (99/0.7/0.3) Type: Solder Paste Form: Cartridge, 35.27 oz (1kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
Produkt ist nicht verfügbar |
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70-3213-0810 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 500GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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70-3213-0811 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 600GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
Produkt ist nicht verfügbar |
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70-4003-2110 | Kester Solder |
Description: NP505 LT SN42BI57AG1 T4 89.0% 50 Packaging: Bulk |
Produkt ist nicht verfügbar |
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70-4003-2111 | Kester Solder |
Description: NP505 LT SN42BI57AG1 T4 89.0% 60 Packaging: Bulk |
Produkt ist nicht verfügbar |
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70-4006-2010 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-4006-2011 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-4021-0811 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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70-4021-0919 | Kester Solder | Description: SOLDER PASTE NO CLEAN 750GM |
Produkt ist nicht verfügbar |
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70-4021-1410 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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70-4102-0610 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 79 Stücke: Lieferzeit 10-14 Tag (e) |
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70-4102-0611 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GM Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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70-4105-0910 | Kester Solder | Description: SOLDER PASTE NO CLEAN 500GM |
Produkt ist nicht verfügbar |
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70-4105-0911 | Kester Solder | Description: SOLDER PASTE NO CLEAN 600GM |
Produkt ist nicht verfügbar |
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70-4105-0919 | Kester Solder | Description: SOLDER PASTE NO CLEAN 750GM |
Produkt ist nicht verfügbar |
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70-4823-0910 | Kester Solder |
Description: NP560 SN96.5AG3.0CU0.5 T4 500 G Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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70-4823-0911 | Kester Solder |
Description: NP560 SN96.5AG3.0CU0.5 T4 600 G Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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70-4825-0904 | Kester Solder |
Description: NP560 SN96.5AG3.0CU0.5 T4 100 GM Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Syringe, 3.53 oz (100g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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70-5022-0910 | Kester Solder |
Description: SOLDER PASTE WP616 500GM JAR Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-5022-0911 | Kester Solder |
Description: WP616 SN96.5AG3.0CU0.5 T4 88.8% Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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70-5023-2210 | Kester Solder |
Description: WP616 SN96.5AG3.0CU0.5 T5 88.3% Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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70-5306-2410 | Kester Solder |
Description: NP510-LT HRL1 T4 88% 500G JAR Packaging: Bulk Type: Solder Paste Melting Point: 304°F (151°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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70-5426-2410 | Kester Solder |
Description: NP505-HR INNOLOT T4 88.2% 500G J Packaging: Bulk Type: Solder Paste Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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70-5426-2411 | Kester Solder |
Description: NP505-HR INNOLOT T4 88.2% 600G C Packaging: Bulk Type: Solder Paste Form: Cartridge, 21.16 oz (600g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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77-6337-0030 | Kester Solder |
Description: SOLDER BAR 63/37 ULD FLO 10LB Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Bar Solder Melting Point: 361°F (183°C) Form: Bar, 10 lbs (4.54kg) Process: Leaded Part Status: Active |
Produkt ist nicht verfügbar |
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77-6337-0050 | Kester Solder |
Description: SOLDR BAR UP 63/37 FLO-BAR 10LB Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Bar Solder Melting Point: 361°F (183°C) Form: Bar, 10 lbs (4.54kg) Process: Leaded Part Status: Active |
Produkt ist nicht verfügbar |
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77-6337-1930 | Kester Solder |
Description: SOLDER BAR 63/37 ULD FLO BAR 8.5 Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Bar Solder Melting Point: 361°F (183°C) Form: Bar, 8.5 lbs (3.86kg) Process: Leaded Part Status: Active |
Produkt ist nicht verfügbar |
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77-7031-1900 | Kester Solder |
Description: SOLDER BAR FLO-BAR 5LB 22.5" L Packaging: Bulk Composition: Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2) Type: Bar Solder Form: Bar, 7.4 lbs (3.36kg) Process: Lead Free |
Produkt ist nicht verfügbar |
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77-7033-0000 | Kester Solder |
Description: SOLDER BAR 5LB TRIANGULAR Packaging: Bulk Composition: Sn97Ag3 (97/3) Type: Bar Solder Melting Point: 430 ~ 435°F (221 ~ 224°C) Form: Bar, 5 lbs (2.27kg) Process: Lead Free |
Produkt ist nicht verfügbar |
70-1003-0610 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Description: SOLDER PASTE WATER SOLUBLE 500GM
Produkt ist nicht verfügbar
70-1003-0611 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
Produkt ist nicht verfügbar
70-1003-0618 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 1400G
Description: SOLDER PASTE WATER SOLUBLE 1400G
Produkt ist nicht verfügbar
70-1302-0511 |
Hersteller: Kester Solder
Description: SOLDER PASTE R231 ROSIN 600GM
Description: SOLDER PASTE R231 ROSIN 600GM
Produkt ist nicht verfügbar
70-1506-1410 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn95Sb5 (95/5)
Type: Solder Paste
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn95Sb5 (95/5)
Type: Solder Paste
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Produkt ist nicht verfügbar
70-1506-1510 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.3Ag3.7 (96.3/3.7)
Type: Solder Paste
Melting Point: 430 ~ 444°F (221 ~ 223°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.3Ag3.7 (96.3/3.7)
Type: Solder Paste
Melting Point: 430 ~ 444°F (221 ~ 223°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Produkt ist nicht verfügbar
70-1506-1710 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn95Sb5 (95/5)
Type: Solder Paste
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn95Sb5 (95/5)
Type: Solder Paste
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Produkt ist nicht verfügbar
70-1607-0504 |
Hersteller: Kester Solder
Description: SOLDERPASTE NO CLEAN 63/37 100GM
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDERPASTE NO CLEAN 63/37 100GM
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-1607-0520 |
Hersteller: Kester Solder
Description: SOLDERPASTE NO CLEAN 63/37 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDERPASTE NO CLEAN 63/37 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 294 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 65.6 EUR |
5+ | 60.13 EUR |
10+ | 51.93 EUR |
25+ | 46.46 EUR |
50+ | 43.73 EUR |
100+ | 41 EUR |
70-1608-0804 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 100GM
Description: SOLDER PASTE NO CLEAN 100GM
Produkt ist nicht verfügbar
70-1608-0820 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 35GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 35GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 77.12 EUR |
5+ | 70.69 EUR |
10+ | 61.05 EUR |
25+ | 54.62 EUR |
50+ | 51.41 EUR |
70-1608-0904 |
Hersteller: Kester Solder
Description: R276 SN96.5AG3.0CU0.5 T4 86% 100
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Syringe, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: R276 SN96.5AG3.0CU0.5 T4 86% 100
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Syringe, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-1708-0504 |
Hersteller: Kester Solder
Description: R500 SN63PB37 T3 86% 100G SYR
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: R500 SN63PB37 T3 86% 100G SYR
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-1708-0520 |
Hersteller: Kester Solder
Description: SOLDERPASTE WATER SOL SYR 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDERPASTE WATER SOL SYR 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 72.51 EUR |
5+ | 66.46 EUR |
10+ | 57.4 EUR |
25+ | 51.36 EUR |
50+ | 48.34 EUR |
70-1709-0820 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 35GM
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 35GM
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 99.67 EUR |
5+ | 90.39 EUR |
10+ | 81.12 EUR |
25+ | 74.16 EUR |
70-1903-0810 |
Hersteller: Kester Solder
Description: SOLDER 500G JAR,SN96.5 AG3.0
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Description: SOLDER 500G JAR,SN96.5 AG3.0
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 335.14 EUR |
5+ | 314.19 EUR |
70-1903-0911 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
Produkt ist nicht verfügbar
70-2002-0310 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-2002-0311 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-2002-0510 |
Hersteller: Kester Solder
Description: SOLDERPASTE WATER SOLUABLE 500GM
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDERPASTE WATER SOLUABLE 500GM
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-2002-0511 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
Produkt ist nicht verfügbar
70-2102-0310 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-2102-0311 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-2102-0510 |
Hersteller: Kester Solder
Description: R562 SOLDERPASTE WATER SOL 500G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: R562 SOLDERPASTE WATER SOL 500G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-2102-0511 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
Produkt ist nicht verfügbar
70-2103-0511 |
Hersteller: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
Produkt ist nicht verfügbar
70-2501-0003 |
Hersteller: Kester Solder
Description: SOLDER FLUX RF741 NO CLEAN 30GM
Packaging: Bulk
Type: Flux - No Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER FLUX RF741 NO CLEAN 30GM
Packaging: Bulk
Type: Flux - No Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 64.72 EUR |
5+ | 59.32 EUR |
10+ | 51.23 EUR |
70-2501-0004 |
Hersteller: Kester Solder
Description: SOLDER FLUX RF741 NO CLEAN 100GM
Packaging: Bulk
Type: Flux - No Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER FLUX RF741 NO CLEAN 100GM
Packaging: Bulk
Type: Flux - No Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
70-2601-0003 |
Hersteller: Kester Solder
Description: FLUX - WATER SOLUBLE SYRINGE 30G
Description: FLUX - WATER SOLUBLE SYRINGE 30G
Produkt ist nicht verfügbar
70-3205-0819 |
Hersteller: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 750GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 24.69 oz (700g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 750GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 24.69 oz (700g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Produkt ist nicht verfügbar
70-3205-1810 |
Hersteller: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Solder Paste
Melting Point: 441°F (227°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Solder Paste
Melting Point: 441°F (227°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Produkt ist nicht verfügbar
70-3205-1812 |
Hersteller: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 1000G
Packaging: Bulk
Composition: Sn99Cu0.7Ag0.3 (99/0.7/0.3)
Type: Solder Paste
Form: Cartridge, 35.27 oz (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 1000G
Packaging: Bulk
Composition: Sn99Cu0.7Ag0.3 (99/0.7/0.3)
Type: Solder Paste
Form: Cartridge, 35.27 oz (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Produkt ist nicht verfügbar
70-3213-0810 |
Hersteller: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 282.11 EUR |
5+ | 259.25 EUR |
10+ | 244 EUR |
70-3213-0811 |
Hersteller: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Produkt ist nicht verfügbar
70-4003-2110 |
Produkt ist nicht verfügbar
70-4003-2111 |
Produkt ist nicht verfügbar
70-4006-2010 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-4006-2011 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-4021-0811 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 307.72 EUR |
5+ | 288.48 EUR |
10+ | 269.25 EUR |
70-4021-0919 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 750GM
Description: SOLDER PASTE NO CLEAN 750GM
Produkt ist nicht verfügbar
70-4021-1410 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 298.06 EUR |
5+ | 273.89 EUR |
70-4102-0610 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 261.11 EUR |
5+ | 239.94 EUR |
10+ | 225.82 EUR |
30+ | 211.71 EUR |
50+ | 197.59 EUR |
70-4102-0611 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 266.62 EUR |
5+ | 249.96 EUR |
70-4105-0910 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Description: SOLDER PASTE NO CLEAN 500GM
Produkt ist nicht verfügbar
70-4105-0911 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Description: SOLDER PASTE NO CLEAN 600GM
Produkt ist nicht verfügbar
70-4105-0919 |
Hersteller: Kester Solder
Description: SOLDER PASTE NO CLEAN 750GM
Description: SOLDER PASTE NO CLEAN 750GM
Produkt ist nicht verfügbar
70-4823-0910 |
Hersteller: Kester Solder
Description: NP560 SN96.5AG3.0CU0.5 T4 500 G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: NP560 SN96.5AG3.0CU0.5 T4 500 G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 292.74 EUR |
5+ | 268.99 EUR |
10+ | 253.17 EUR |
25+ | 237.35 EUR |
70-4823-0911 |
Hersteller: Kester Solder
Description: NP560 SN96.5AG3.0CU0.5 T4 600 G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: NP560 SN96.5AG3.0CU0.5 T4 600 G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 304.2 EUR |
5+ | 285.19 EUR |
70-4825-0904 |
Hersteller: Kester Solder
Description: NP560 SN96.5AG3.0CU0.5 T4 100 GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 3.53 oz (100g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: NP560 SN96.5AG3.0CU0.5 T4 100 GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 3.53 oz (100g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 176 EUR |
5+ | 159.63 EUR |
70-5022-0910 |
Hersteller: Kester Solder
Description: SOLDER PASTE WP616 500GM JAR
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WP616 500GM JAR
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-5022-0911 |
Hersteller: Kester Solder
Description: WP616 SN96.5AG3.0CU0.5 T4 88.8%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WP616 SN96.5AG3.0CU0.5 T4 88.8%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
70-5023-2210 |
Hersteller: Kester Solder
Description: WP616 SN96.5AG3.0CU0.5 T5 88.3%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WP616 SN96.5AG3.0CU0.5 T5 88.3%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 334.05 EUR |
5+ | 323.28 EUR |
70-5306-2410 |
Hersteller: Kester Solder
Description: NP510-LT HRL1 T4 88% 500G JAR
Packaging: Bulk
Type: Solder Paste
Melting Point: 304°F (151°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: NP510-LT HRL1 T4 88% 500G JAR
Packaging: Bulk
Type: Solder Paste
Melting Point: 304°F (151°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 260.43 EUR |
5+ | 239.31 EUR |
10+ | 225.23 EUR |
70-5426-2410 |
Hersteller: Kester Solder
Description: NP505-HR INNOLOT T4 88.2% 500G J
Packaging: Bulk
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: NP505-HR INNOLOT T4 88.2% 500G J
Packaging: Bulk
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 434.44 EUR |
5+ | 407.29 EUR |
70-5426-2411 |
Hersteller: Kester Solder
Description: NP505-HR INNOLOT T4 88.2% 600G C
Packaging: Bulk
Type: Solder Paste
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: NP505-HR INNOLOT T4 88.2% 600G C
Packaging: Bulk
Type: Solder Paste
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 521.33 EUR |
5+ | 488.75 EUR |
10+ | 456.17 EUR |
77-6337-0030 |
Hersteller: Kester Solder
Description: SOLDER BAR 63/37 ULD FLO 10LB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 10 lbs (4.54kg)
Process: Leaded
Part Status: Active
Description: SOLDER BAR 63/37 ULD FLO 10LB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 10 lbs (4.54kg)
Process: Leaded
Part Status: Active
Produkt ist nicht verfügbar
77-6337-0050 |
Hersteller: Kester Solder
Description: SOLDR BAR UP 63/37 FLO-BAR 10LB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 10 lbs (4.54kg)
Process: Leaded
Part Status: Active
Description: SOLDR BAR UP 63/37 FLO-BAR 10LB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 10 lbs (4.54kg)
Process: Leaded
Part Status: Active
Produkt ist nicht verfügbar
77-6337-1930 |
Hersteller: Kester Solder
Description: SOLDER BAR 63/37 ULD FLO BAR 8.5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 8.5 lbs (3.86kg)
Process: Leaded
Part Status: Active
Description: SOLDER BAR 63/37 ULD FLO BAR 8.5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Bar Solder
Melting Point: 361°F (183°C)
Form: Bar, 8.5 lbs (3.86kg)
Process: Leaded
Part Status: Active
Produkt ist nicht verfügbar
77-7031-1900 |
Hersteller: Kester Solder
Description: SOLDER BAR FLO-BAR 5LB 22.5" L
Packaging: Bulk
Composition: Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2)
Type: Bar Solder
Form: Bar, 7.4 lbs (3.36kg)
Process: Lead Free
Description: SOLDER BAR FLO-BAR 5LB 22.5" L
Packaging: Bulk
Composition: Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2)
Type: Bar Solder
Form: Bar, 7.4 lbs (3.36kg)
Process: Lead Free
Produkt ist nicht verfügbar
77-7033-0000 |
Hersteller: Kester Solder
Description: SOLDER BAR 5LB TRIANGULAR
Packaging: Bulk
Composition: Sn97Ag3 (97/3)
Type: Bar Solder
Melting Point: 430 ~ 435°F (221 ~ 224°C)
Form: Bar, 5 lbs (2.27kg)
Process: Lead Free
Description: SOLDER BAR 5LB TRIANGULAR
Packaging: Bulk
Composition: Sn97Ag3 (97/3)
Type: Bar Solder
Melting Point: 430 ~ 435°F (221 ~ 224°C)
Form: Bar, 5 lbs (2.27kg)
Process: Lead Free
Produkt ist nicht verfügbar