| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ABA-SAT-022-K04 | LOTES |
auf Bestellung 2694 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| ACA-SPI-001-T03 | LOTES |
auf Bestellung 2400 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
ACA-SPI-004-K01 | LOTES |
 Description: SPI 8 PIN_IC 208milFeatures: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 1680 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
 |
ACA-SPI-006-K01 | LOTES |
Description: SPI 16 PIN_IC 300mil Features: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| ACA-Z1F-046-K01-A | LOTES |
auf Bestellung 15 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| ACA-ZIF-068-P02 | LOTES |
auf Bestellung 958 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| AEA-BTB-023-T80 BTB HD | LOTES | 08+ SMD |
auf Bestellung 8746 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
 |
ASPI0001-P001A | LOTES |
Description: SPI 8 PIN_IC 150mil Features: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
 |
ASPI0002-P001A | LOTES |
Description: SPI 8Pin WSON 8X6 Features: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Phosphor Bronze Part Status: Active |
auf Bestellung 3400 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ABA-SAT-022-K04 |
Hersteller: LOTES
auf Bestellung 2694 Stücke:
Lieferzeit 21-28 Tag (e)
| ACA-SPI-001-T03 |
Hersteller: LOTES
auf Bestellung 2400 Stücke:
Lieferzeit 21-28 Tag (e)
| ACA-SPI-004-K01 |
|
Hersteller: LOTES
Description: SPI 8 PIN_IC 208mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8 PIN_IC 208mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 1680 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 37.34 EUR |
| 50+ | 18.67 EUR |
| 100+ | 11.21 EUR |
| 200+ | 7.47 EUR |
| 700+ | 3.74 EUR |
| ACA-SPI-006-K01 |
|
Hersteller: LOTES
Description: SPI 16 PIN_IC 300mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Description: SPI 16 PIN_IC 300mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ACA-Z1F-046-K01-A |
Hersteller: LOTES
auf Bestellung 15 Stücke:
Lieferzeit 21-28 Tag (e)
| ACA-ZIF-068-P02 |
Hersteller: LOTES
auf Bestellung 958 Stücke:
Lieferzeit 21-28 Tag (e)
| AEA-BTB-023-T80 BTB HD |
Hersteller: LOTES
08+ SMD
08+ SMD
auf Bestellung 8746 Stücke:
Lieferzeit 21-28 Tag (e)
| ASPI0001-P001A |
|
Hersteller: LOTES
Description: SPI 8 PIN_IC 150mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8 PIN_IC 150mil
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ASPI0002-P001A |
|
Hersteller: LOTES
Description: SPI 8Pin WSON 8X6
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8Pin WSON 8X6
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 3400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 38.64 EUR |
| 50+ | 19.31 EUR |
| 100+ | 11.59 EUR |
| 200+ | 7.72 EUR |
| 700+ | 3.87 EUR |