Produkte > MEIG SMART TECHNOLOGY > Alle Produkte des Herstellers MEIG SMART TECHNOLOGY (36) > Seite 1 nach 1
Foto | Bezeichnung | Hersteller | Beschreibung |
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750VE71S | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Dimensions: 29x32x2.9mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; I2C; PCM; SD; SGMII; UART; USB Kind of network: WiFi Operating temperature: -40...85°C |
auf Bestellung 23 Stücke: Lieferzeit 14-21 Tag (e) |
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750VE71S | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Dimensions: 29x32x2.9mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; I2C; PCM; SD; SGMII; UART; USB Kind of network: WiFi Operating temperature: -40...85°C Anzahl je Verpackung: 1 Stücke |
auf Bestellung 23 Stücke: Lieferzeit 7-14 Tag (e) |
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770ACE4A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Case: LCC+LGA Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA Dimensions: 29x32x2.4mm Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP Interface: PCM; SIM; UART; USB Operating temperature: -40...85°C |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |
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770ACE4A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Case: LCC+LGA Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA Dimensions: 29x32x2.4mm Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP Interface: PCM; SIM; UART; USB Operating temperature: -40...85°C Anzahl je Verpackung: 1 Stücke |
auf Bestellung 20 Stücke: Lieferzeit 7-14 Tag (e) |
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770ACE4C | MEIG SMART TECHNOLOGY | SLM770A-E-MPCIE-4C M2M (GPRS/LTE/5G) modules |
auf Bestellung 6 Stücke: Lieferzeit 7-14 Tag (e) |
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M156LA0A | MEIG SMART TECHNOLOGY | SLM156 M2M (GPRS/LTE/5G) modules |
auf Bestellung 40 Stücke: Lieferzeit 7-14 Tag (e) |
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M320PE1A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Dimensions: 32x29x2.4mm Type of communications module: LTE Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps Bluetooth version: 4.2 Operating temperature: -30...70°C Kind of network: WiFi |
auf Bestellung 38 Stücke: Lieferzeit 14-21 Tag (e) |
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M320PE1A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Dimensions: 32x29x2.4mm Type of communications module: LTE Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps Bluetooth version: 4.2 Operating temperature: -30...70°C Kind of network: WiFi Anzahl je Verpackung: 1 Stücke |
auf Bestellung 38 Stücke: Lieferzeit 7-14 Tag (e) |
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M320PE2C | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Dimensions: 32x29x2.4mm Type of communications module: LTE Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps Bluetooth version: 4.2 Operating temperature: -30...70°C Kind of network: WiFi |
auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
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M320PE2C | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Dimensions: 32x29x2.4mm Type of communications module: LTE Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps Bluetooth version: 4.2 Operating temperature: -30...70°C Kind of network: WiFi Anzahl je Verpackung: 1 Stücke |
auf Bestellung 40 Stücke: Lieferzeit 7-14 Tag (e) |
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M326E00A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps Interface: I2C; I2S; SIM; SPI; UART; USB Dimensions: 27.6x25.4x2.3mm Type of communications module: LTE Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps Bluetooth version: 4.2; BLE Operating temperature: -30...75°C Kind of network: WiFi |
auf Bestellung 29 Stücke: Lieferzeit 14-21 Tag (e) |
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M326E00A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps Interface: I2C; I2S; SIM; SPI; UART; USB Dimensions: 27.6x25.4x2.3mm Type of communications module: LTE Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps Bluetooth version: 4.2; BLE Operating temperature: -30...75°C Kind of network: WiFi Anzahl je Verpackung: 1 Stücke |
auf Bestellung 29 Stücke: Lieferzeit 7-14 Tag (e) |
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M326LZBA | MEIG SMART TECHNOLOGY | SLM326-EVB-KIT Development kits for data transmission |
auf Bestellung 1 Stücke: Lieferzeit 7-14 Tag (e) |
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M336QE1B | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LTE CAT1,LTE-FDD; Comp: QCX216 Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Transmission: LTE CAT1; LTE-FDD Dimensions: 23.6x19.9x2.4mm Interface: I2C; SIM; SPI; UART; USB 2.0 Operating temperature: -30...75°C Components: QCX216 Band: B1; B3; B5; B7; B8; B20; B28 |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
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M336QE1B | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LTE CAT1,LTE-FDD; Comp: QCX216 Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Transmission: LTE CAT1; LTE-FDD Dimensions: 23.6x19.9x2.4mm Interface: I2C; SIM; SPI; UART; USB 2.0 Operating temperature: -30...75°C Components: QCX216 Band: B1; B3; B5; B7; B8; B20; B28 Anzahl je Verpackung: 1 Stücke |
auf Bestellung 4 Stücke: Lieferzeit 7-14 Tag (e) |
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M750ZE1A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: LCC Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 32x29x2.8mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB Kind of network: WiFi Operating temperature: -40...85°C |
auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
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M750ZE1A | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: LCC Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 32x29x2.8mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB Kind of network: WiFi Operating temperature: -40...85°C Anzahl je Verpackung: 1 Stücke |
auf Bestellung 40 Stücke: Lieferzeit 7-14 Tag (e) |
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M815N44A | MEIG SMART TECHNOLOGY |
![]() Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm Type of communications module: IoT Case: M.2 Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -40...85°C Components: Qualcomm X62 |
auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
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M815N44A | MEIG SMART TECHNOLOGY |
![]() Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm Type of communications module: IoT Case: M.2 Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -40...85°C Components: Qualcomm X62 Anzahl je Verpackung: 1 Stücke |
auf Bestellung 5 Stücke: Lieferzeit 7-14 Tag (e) |
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M815NEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM815 Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB Type of development kit: LTE Components: SRM815 |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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M815NEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM815 Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB Type of development kit: LTE Components: SRM815 Anzahl je Verpackung: 1 Stücke |
auf Bestellung 1 Stücke: Lieferzeit 7-14 Tag (e) |
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M825W5GH | MEIG SMART TECHNOLOGY | SRM825N-EVB-KIT Development kits for data transmission |
auf Bestellung 1 Stücke: Lieferzeit 7-14 Tag (e) |
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M82824AA | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x4.5mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Kind of network: WiFi Operating temperature: -40...85°C |
auf Bestellung 7 Stücke: Lieferzeit 14-21 Tag (e) |
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M82824AA | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x4.5mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Kind of network: WiFi Operating temperature: -40...85°C Anzahl je Verpackung: 1 Stücke |
auf Bestellung 7 Stücke: Lieferzeit 7-14 Tag (e) |
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M828G23B | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 600Mbps Uplink ransfer rate: 150Mbps Case: LGA Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |
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M828G23B | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 600Mbps Uplink ransfer rate: 150Mbps Case: LGA Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C Anzahl je Verpackung: 1 Stücke |
auf Bestellung 20 Stücke: Lieferzeit 7-14 Tag (e) |
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M828G23D | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: LGA Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C |
auf Bestellung 19 Stücke: Lieferzeit 14-21 Tag (e) |
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M828G23D | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: LGA Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C Anzahl je Verpackung: 1 Stücke |
auf Bestellung 19 Stücke: Lieferzeit 7-14 Tag (e) |
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M828GEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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M828GEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB Anzahl je Verpackung: 1 Stücke |
auf Bestellung 2 Stücke: Lieferzeit 7-14 Tag (e) |
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MPEVB00B | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
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MPEVB00B | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB Anzahl je Verpackung: 1 Stücke |
auf Bestellung 4 Stücke: Lieferzeit 7-14 Tag (e) |
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NBEVB00A | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: IoT; Comp: SLM156 Type of development kit: IoT Components: SLM156 Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2 |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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NBEVB00A | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: IoT; Comp: SLM156 Type of development kit: IoT Components: SLM156 Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2 Anzahl je Verpackung: 1 Stücke |
auf Bestellung 1 Stücke: Lieferzeit 7-14 Tag (e) |
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ZE1AMP1B | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: Mini PCIe Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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ZE1AMP1B | MEIG SMART TECHNOLOGY |
![]() Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: Mini PCIe Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C Anzahl je Verpackung: 1 Stücke |
auf Bestellung 2 Stücke: Lieferzeit 7-14 Tag (e) |
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750VE71S |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
auf Bestellung 23 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
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2+ | 37.35 EUR |
750VE71S |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
auf Bestellung 23 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
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2+ | 37.35 EUR |
770ACE4A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: LCC+LGA
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Interface: PCM; SIM; UART; USB
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: LCC+LGA
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Interface: PCM; SIM; UART; USB
Operating temperature: -40...85°C
auf Bestellung 20 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
3+ | 26.05 EUR |
10+ | 25.85 EUR |
770ACE4A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: LCC+LGA
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Interface: PCM; SIM; UART; USB
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: LCC+LGA
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Interface: PCM; SIM; UART; USB
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
auf Bestellung 20 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 26.05 EUR |
10+ | 25.85 EUR |
770ACE4C |
Hersteller: MEIG SMART TECHNOLOGY
SLM770A-E-MPCIE-4C M2M (GPRS/LTE/5G) modules
SLM770A-E-MPCIE-4C M2M (GPRS/LTE/5G) modules
auf Bestellung 6 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 37.55 EUR |
3+ | 35.51 EUR |
5+ | 30.67 EUR |
M156LA0A |
Hersteller: MEIG SMART TECHNOLOGY
SLM156 M2M (GPRS/LTE/5G) modules
SLM156 M2M (GPRS/LTE/5G) modules
auf Bestellung 40 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 25.88 EUR |
25+ | 21.14 EUR |
M320PE1A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
auf Bestellung 38 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
5+ | 17.8 EUR |
M320PE1A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
Anzahl je Verpackung: 1 Stücke
auf Bestellung 38 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 17.8 EUR |
M320PE2C |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
5+ | 17.8 EUR |
M320PE2C |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Dimensions: 32x29x2.4mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2
Operating temperature: -30...70°C
Kind of network: WiFi
Anzahl je Verpackung: 1 Stücke
auf Bestellung 40 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 17.8 EUR |
M326E00A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Interface: I2C; I2S; SIM; SPI; UART; USB
Dimensions: 27.6x25.4x2.3mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2; BLE
Operating temperature: -30...75°C
Kind of network: WiFi
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Interface: I2C; I2S; SIM; SPI; UART; USB
Dimensions: 27.6x25.4x2.3mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2; BLE
Operating temperature: -30...75°C
Kind of network: WiFi
auf Bestellung 29 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
4+ | 18.23 EUR |
M326E00A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Interface: I2C; I2S; SIM; SPI; UART; USB
Dimensions: 27.6x25.4x2.3mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2; BLE
Operating temperature: -30...75°C
Kind of network: WiFi
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Interface: I2C; I2S; SIM; SPI; UART; USB
Dimensions: 27.6x25.4x2.3mm
Type of communications module: LTE
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Bluetooth version: 4.2; BLE
Operating temperature: -30...75°C
Kind of network: WiFi
Anzahl je Verpackung: 1 Stücke
auf Bestellung 29 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 18.23 EUR |
M326LZBA |
Hersteller: MEIG SMART TECHNOLOGY
SLM326-EVB-KIT Development kits for data transmission
SLM326-EVB-KIT Development kits for data transmission
auf Bestellung 1 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 71.5 EUR |
M336QE1B |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LTE CAT1,LTE-FDD; Comp: QCX216
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: LTE CAT1; LTE-FDD
Dimensions: 23.6x19.9x2.4mm
Interface: I2C; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: QCX216
Band: B1; B3; B5; B7; B8; B20; B28
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LTE CAT1,LTE-FDD; Comp: QCX216
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: LTE CAT1; LTE-FDD
Dimensions: 23.6x19.9x2.4mm
Interface: I2C; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: QCX216
Band: B1; B3; B5; B7; B8; B20; B28
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
4+ | 17.88 EUR |
M336QE1B |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LTE CAT1,LTE-FDD; Comp: QCX216
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: LTE CAT1; LTE-FDD
Dimensions: 23.6x19.9x2.4mm
Interface: I2C; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: QCX216
Band: B1; B3; B5; B7; B8; B20; B28
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LTE CAT1,LTE-FDD; Comp: QCX216
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Transmission: LTE CAT1; LTE-FDD
Dimensions: 23.6x19.9x2.4mm
Interface: I2C; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: QCX216
Band: B1; B3; B5; B7; B8; B20; B28
Anzahl je Verpackung: 1 Stücke
auf Bestellung 4 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 17.88 EUR |
M750ZE1A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
3+ | 34.81 EUR |
M750ZE1A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
auf Bestellung 40 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 34.81 EUR |
M815N44A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
auf Bestellung 5 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
1+ | 249.55 EUR |
M815N44A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
Anzahl je Verpackung: 1 Stücke
auf Bestellung 5 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 249.55 EUR |
M815NEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Type of development kit: LTE
Components: SRM815
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Type of development kit: LTE
Components: SRM815
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
1+ | 540.53 EUR |
M815NEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Type of development kit: LTE
Components: SRM815
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Type of development kit: LTE
Components: SRM815
Anzahl je Verpackung: 1 Stücke
auf Bestellung 1 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 540.53 EUR |
M825W5GH |
Hersteller: MEIG SMART TECHNOLOGY
SRM825N-EVB-KIT Development kits for data transmission
SRM825N-EVB-KIT Development kits for data transmission
auf Bestellung 1 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 158.03 EUR |
M82824AA |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
auf Bestellung 7 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
2+ | 65.12 EUR |
M82824AA |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
auf Bestellung 7 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 65.12 EUR |
M828G23B |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
auf Bestellung 20 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
1+ | 81.57 EUR |
4+ | 80.15 EUR |
10+ | 78.45 EUR |
M828G23B |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Anzahl je Verpackung: 1 Stücke
auf Bestellung 20 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 81.57 EUR |
4+ | 80.15 EUR |
10+ | 78.45 EUR |
M828G23D |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
auf Bestellung 19 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
2+ | 62.23 EUR |
3+ | 61.2 EUR |
M828G23D |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Anzahl je Verpackung: 1 Stücke
auf Bestellung 19 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 62.23 EUR |
3+ | 61.2 EUR |
M828GEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
1+ | 77.95 EUR |
M828GEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
Anzahl je Verpackung: 1 Stücke
auf Bestellung 2 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 77.95 EUR |
MPEVB00B |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
1+ | 76.62 EUR |
MPEVB00B |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
Anzahl je Verpackung: 1 Stücke
auf Bestellung 4 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 76.62 EUR |
NBEVB00A |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
1+ | 95.75 EUR |
NBEVB00A |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
Anzahl je Verpackung: 1 Stücke
auf Bestellung 1 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 95.75 EUR |
ZE1AMP1B |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)Anzahl | Preis |
---|---|
2+ | 40.23 EUR |
ZE1AMP1B |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Anzahl je Verpackung: 1 Stücke
auf Bestellung 2 Stücke:
Lieferzeit 7-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 40.23 EUR |