Produkte > MEIG SMART TECHNOLOGY > Alle Produkte des Herstellers MEIG SMART TECHNOLOGY (15) > Seite 1 nach 1
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
750VE71S | MEIG SMART TECHNOLOGY |
 Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi Interface: ADC; I2C; PCM; SD; SGMII; UART; USB Kind of network: WiFi Type of communications module: LTE Operating temperature: -40...85°C Dimensions: 29x32x2.9mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Downlink transfer rate: 150Mbps Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Uplink ransfer rate: 50Mbps |
auf Bestellung 11 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
770ACE4A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Case: LCC+LGA Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA Dimensions: 29x32x2.4mm Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP Interface: PCM; SIM; UART; USB Operating temperature: -40...85°C |
auf Bestellung 17 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M156LA0A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; EGPRS,GNSS,LTE Cat.NB2,LTE CAT1; 21x20x2.3mm Operating temperature: -35...75°C Communictions protocol: DNS; DTLS; HTTP client; IPv4; IPv6; LwM2M; MQTT; TCP Dimensions: 21x20x2.3mm Interface: ADC; I2C; I2S; PCM; SIM; UART; USB Type of communications module: LTE Transmission: EGPRS; GNSS; LTE CAT1; LTE Cat.NB2 |
auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M320PE1A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Kind of network: WiFi Type of communications module: LTE Operating temperature: -30...70°C Dimensions: 32x29x2.4mm Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Bluetooth version: 4.2 Downlink transfer rate: 10Mbps Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps |
auf Bestellung 38 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M320PE2C | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Kind of network: WiFi Type of communications module: LTE Operating temperature: -30...70°C Dimensions: 32x29x2.4mm Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Bluetooth version: 4.2 Downlink transfer rate: 10Mbps Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps |
auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M326E00A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps Interface: I2C; I2S; SIM; SPI; UART; USB Kind of network: WiFi Type of communications module: LTE Operating temperature: -30...75°C Dimensions: 27.6x25.4x2.3mm Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Bluetooth version: 4.2; BLE Downlink transfer rate: 10Mbps Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps |
auf Bestellung 29 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M750ZE1A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi Case: LCC Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB Kind of network: WiFi Type of communications module: LTE Operating temperature: -40...85°C Dimensions: 32x29x2.8mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Downlink transfer rate: 10Mbps Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Uplink ransfer rate: 5Mbps |
auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M815N44A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm Components: Qualcomm X62 Type of communications module: IoT Operating temperature: -40...85°C Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Case: M.2 Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G |
auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M815NEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM815 Type of development kit: LTE Components: SRM815 Connection: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M82824AA | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x4.5mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -40...85°C Kind of network: WiFi |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M828G23B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 600Mbps Uplink ransfer rate: 150Mbps Case: LGA Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M828G23D | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: LGA Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C |
auf Bestellung 19 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
M828GEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Connection: D-Sub 9pin x2; RJ11; SD; SIM x2; solder pads; USB |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
MPEVB00B | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Connection: D-Sub 9pin x2; pin header; power supply; SIM; solder pads; USB Type of development kit: evaluation |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
 |
NBEVB00A | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: IoT; Comp: SLM156 Connection: D-Sub 9pin x2; nanoSIM; pin header; USB x2 Type of development kit: IoT Components: SLM156 |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 750VE71S |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -40...85°C
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Downlink transfer rate: 150Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Uplink ransfer rate: 50Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -40...85°C
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Downlink transfer rate: 150Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Uplink ransfer rate: 50Mbps
auf Bestellung 11 Stücke:
Lieferzeit 14-21 Tag (e)
| 770ACE4A |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: LCC+LGA
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Interface: PCM; SIM; UART; USB
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: LCC+LGA
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Interface: PCM; SIM; UART; USB
Operating temperature: -40...85°C
auf Bestellung 17 Stücke:
Lieferzeit 14-21 Tag (e)
| M156LA0A |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; EGPRS,GNSS,LTE Cat.NB2,LTE CAT1; 21x20x2.3mm
Operating temperature: -35...75°C
Communictions protocol: DNS; DTLS; HTTP client; IPv4; IPv6; LwM2M; MQTT; TCP
Dimensions: 21x20x2.3mm
Interface: ADC; I2C; I2S; PCM; SIM; UART; USB
Type of communications module: LTE
Transmission: EGPRS; GNSS; LTE CAT1; LTE Cat.NB2
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; EGPRS,GNSS,LTE Cat.NB2,LTE CAT1; 21x20x2.3mm
Operating temperature: -35...75°C
Communictions protocol: DNS; DTLS; HTTP client; IPv4; IPv6; LwM2M; MQTT; TCP
Dimensions: 21x20x2.3mm
Interface: ADC; I2C; I2S; PCM; SIM; UART; USB
Type of communications module: LTE
Transmission: EGPRS; GNSS; LTE CAT1; LTE Cat.NB2
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)
| M320PE1A |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -30...70°C
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -30...70°C
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
auf Bestellung 38 Stücke:
Lieferzeit 14-21 Tag (e)
| M320PE2C |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -30...70°C
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -30...70°C
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)
| M326E00A |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Interface: I2C; I2S; SIM; SPI; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -30...75°C
Dimensions: 27.6x25.4x2.3mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2; BLE
Downlink transfer rate: 10Mbps
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Interface: I2C; I2S; SIM; SPI; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -30...75°C
Dimensions: 27.6x25.4x2.3mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2; BLE
Downlink transfer rate: 10Mbps
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
auf Bestellung 29 Stücke:
Lieferzeit 14-21 Tag (e)
| M750ZE1A |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Case: LCC
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -40...85°C
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Downlink transfer rate: 10Mbps
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Case: LCC
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Type of communications module: LTE
Operating temperature: -40...85°C
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Downlink transfer rate: 10Mbps
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 5Mbps
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)
| M815N44A |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Components: Qualcomm X62
Type of communications module: IoT
Operating temperature: -40...85°C
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Case: M.2
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Components: Qualcomm X62
Type of communications module: IoT
Operating temperature: -40...85°C
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Case: M.2
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
auf Bestellung 5 Stücke:
Lieferzeit 14-21 Tag (e)
| M815NEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Components: SRM815
Connection: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Components: SRM815
Connection: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)
| M82824AA |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -40...85°C
Kind of network: WiFi
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -40...85°C
Kind of network: WiFi
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)
| M828G23B |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
auf Bestellung 20 Stücke:
Lieferzeit 14-21 Tag (e)
| M828G23D |
|
Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
auf Bestellung 19 Stücke:
Lieferzeit 14-21 Tag (e)
| M828GEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Connection: D-Sub 9pin x2; RJ11; SD; SIM x2; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Connection: D-Sub 9pin x2; RJ11; SD; SIM x2; solder pads; USB
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)
| MPEVB00B |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Connection: D-Sub 9pin x2; pin header; power supply; SIM; solder pads; USB
Type of development kit: evaluation
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Connection: D-Sub 9pin x2; pin header; power supply; SIM; solder pads; USB
Type of development kit: evaluation
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)
| NBEVB00A |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Connection: D-Sub 9pin x2; nanoSIM; pin header; USB x2
Type of development kit: IoT
Components: SLM156
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Connection: D-Sub 9pin x2; nanoSIM; pin header; USB x2
Type of development kit: IoT
Components: SLM156
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)