Produkte > MEIG SMART TECHNOLOGY > Alle Produkte des Herstellers MEIG SMART TECHNOLOGY (8) > Seite 1 nach 1
| Foto | Bezeichnung | Hersteller | Beschreibung |
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750VE71S | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi Type of communications module: LTE Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Uplink ransfer rate: 50Mbps Downlink transfer rate: 150Mbps Interface: ADC; I2C; PCM; SD; SGMII; UART; USB Dimensions: 29x32x2.9mm Operating temperature: -40...85°C Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Kind of network: WiFi |
auf Bestellung 22 Stücke: Lieferzeit 14-21 Tag (e) |
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770ACE4A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm Type of communications module: LTE Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA Uplink ransfer rate: 50Mbps Downlink transfer rate: 150Mbps Interface: PCM; SIM; UART; USB Dimensions: 29x32x2.4mm Operating temperature: -40...85°C Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP Case: LCC+LGA |
auf Bestellung 17 Stücke: Lieferzeit 14-21 Tag (e) |
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M750ZE1A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi Type of communications module: LTE Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Uplink ransfer rate: 5Mbps Downlink transfer rate: 10Mbps Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB Dimensions: 32x29x2.8mm Operating temperature: -40...85°C Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Kind of network: WiFi Case: LCC |
auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
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M815NEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM815 Type of development kit: LTE Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB Components: SRM815 |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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M82824AA | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x4.5mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Kind of network: WiFi Operating temperature: -40...85°C |
auf Bestellung 7 Stücke: Lieferzeit 14-21 Tag (e) |
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M828GEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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MPEVB00B | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB |
auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) |
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NBEVB00A | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: IoT; Comp: SLM156 Type of development kit: IoT Components: SLM156 Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2 |
auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) |
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| 750VE71S |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Type of communications module: LTE
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 150Mbps
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Dimensions: 29x32x2.9mm
Operating temperature: -40...85°C
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Kind of network: WiFi
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Type of communications module: LTE
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 150Mbps
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Dimensions: 29x32x2.9mm
Operating temperature: -40...85°C
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Kind of network: WiFi
auf Bestellung 22 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 39.24 EUR |
| 10+ | 39.22 EUR |
| 770ACE4A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 150Mbps
Interface: PCM; SIM; UART; USB
Dimensions: 29x32x2.4mm
Operating temperature: -40...85°C
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Case: LCC+LGA
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Type of communications module: LTE
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 150Mbps
Interface: PCM; SIM; UART; USB
Dimensions: 29x32x2.4mm
Operating temperature: -40...85°C
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Case: LCC+LGA
auf Bestellung 17 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 27.68 EUR |
| 10+ | 26.87 EUR |
| M750ZE1A |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Dimensions: 32x29x2.8mm
Operating temperature: -40...85°C
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Kind of network: WiFi
Case: LCC
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 5Mbps
Downlink transfer rate: 10Mbps
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Dimensions: 32x29x2.8mm
Operating temperature: -40...85°C
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Kind of network: WiFi
Case: LCC
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 35.16 EUR |
| M815NEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Components: SRM815
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Components: SRM815
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 385.64 EUR |
| M82824AA |
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Hersteller: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
auf Bestellung 7 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 68.4 EUR |
| M828GEVB |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 78.54 EUR |
| MPEVB00B |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 78.21 EUR |
| NBEVB00A |
Hersteller: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 97.77 EUR |








