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ATSAML10D16A-MUT ATSAML10D16A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML10D16A-MFT ATSAML10D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML10D16A-MFT ATSAML10D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML11D16A-MUT ATSAML11D16A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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ATSAML11D16A-MUT ATSAML11D16A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML11D16A-MFT ATSAML11D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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ATSAML11D16A-MFT ATSAML11D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
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LM2576-12BUTR LM2576-12BUTR Microchip Technology MCRLS03589-1.pdf?t.download=true&u=5oefqw Description: IC REG BUCK 12V 3A TO263-5
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 3A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Packaging: Bulk
Part Status: Active
Voltage - Output (Min/Fixed): 12V
Voltage - Input (Min): 4V
Synchronous Rectifier: No
Supplier Device Package: TO-263-5
Topology: Buck
Voltage - Input (Max): 40V
Frequency - Switching: 52kHz
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LM2576-12BU TR LM2576-12BU TR Microchip Technology MCRLS03589-1.pdf?t.download=true&u=5oefqw Description: IC REG BUCK 12V 3A TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Part Status: Active
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ATSAMA5D21C-CUR ATSAMA5D21C-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + HSIC
Ethernet: 10/100Mbps (1)
Supplier Device Package: 196-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Tape & Reel (TR)
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ATSAMA5D21C-CUR ATSAMA5D21C-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + HSIC
Ethernet: 10/100Mbps (1)
Supplier Device Package: 196-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Cut Tape (CT)
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ATSAMA5D22C-CUR ATSAMA5D22C-CUR Microchip Technology SAMA5D2-Series-Datasheet-DS60001476H.pdf Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATSAMA5D22C-CUR ATSAMA5D22C-CUR Microchip Technology SAMA5D2-Series-Datasheet-DS60001476H.pdf Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATSAMA5D24C-CUR ATSAMA5D24C-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATSAMA5D24C-CUR ATSAMA5D24C-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Cut Tape (CT)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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AT28HC256-90SU AT28HC256-90SU Microchip Technology AT28HC256-256-Kbit-32%2C768x8-High-Speed-Parallel-EEPROM-DS20006428.pdf Description: IC EEPROM 256KBIT PAR 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-90SU-T AT28HC64B-90SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
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AT28HC64B-90SU-T AT28HC64B-90SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
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AT28HC64BF-12SU-T AT28HC64BF-12SU-T Microchip Technology doc3648.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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AT28HC64BF-12SU-T AT28HC64BF-12SU-T Microchip Technology doc3648.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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AT28HC64B-12SU-T AT28HC64B-12SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-12SU-T AT28HC64B-12SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-70SU-T AT28HC64B-70SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-70SU-T AT28HC64B-70SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-90TU-T AT28HC64B-90TU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28TSOP
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AT28HC64B-90TU-T AT28HC64B-90TU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28TSOP
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AT28HC256-90TU-T AT28HC256-90TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-90TU-T AT28HC256-90TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-12TU-T AT28HC256-12TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-12TU-T AT28HC256-12TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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EV44C93A EV44C93A Microchip Technology EVB-LAN9252_SAM-D51-Evaluation-Board-Users-Guide-50003012A.pdf Description: EVAL BOARD FOR SAMD51
Supplied Contents: Board(s)
Utilized IC / Part: SAMD51
Type: Interface
Function: Motor Controller/Driver
Packaging: Bulk
Contents: Board(s)
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PIC18LF46K42-I/P PIC18LF46K42-I/P Microchip Technology filehandler.aspx?ddocname=en598760 Description: IC MCU 8BIT 64KB FLASH 40DIP
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PIC18LF46K42-E/P PIC18LF46K42-E/P Microchip Technology PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf Description: IC MCU 8BIT 64KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 35x12b; D/A 1x5b
Core Processor: PIC
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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AT97SC3205-G3M4200B AT97SC3205-G3M4200B Microchip Technology Atmel-8884S-TPM-AT97SC3205-Datasheet-Summary.pdf Description: PRODSTD COM SPI TPM 4X4 32VQFN
DigiKey Programmable: Not Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 32-VQFN (4x4)
Core Processor: AVR
Applications: Trusted Platform Module (TPM)
Program Memory Type: EEPROM
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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MCP47FVB04T-20E/ST MCP47FVB04T-20E/ST Microchip Technology MCP47FXBX48-Data-Sheet-DS200006368A.pdf Description: IC DAC 8BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: Yes
INL/DNL (LSB): ±0.1, ±0.0125
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 6µs
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Reference Type: External
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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MCP47FVB04T-20E/ST MCP47FVB04T-20E/ST Microchip Technology MCP47FXBX48-Data-Sheet-DS200006368A.pdf Description: IC DAC 8BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: Yes
INL/DNL (LSB): ±0.1, ±0.0125
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 6µs
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Reference Type: External
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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MCP47FVB08T-20E/ST MCP47FVB08T-20E/ST Microchip Technology MCP47FXBX48-Data-Sheet-DS200006368A.pdf Description: IC DAC 8BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.25 (Max), -
Number of D/A Converters: 8
Supplier Device Package: 20-TSSOP
Settling Time: 6µs
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Supply
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered, Voltage - Unbuffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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PIC18F27Q43-I/SS PIC18F27Q43-I/SS Microchip Technology PIC18F27-47-57Q43-Data-Sheet-DS40002147D.pdf Description: IC MCU 8BIT 128KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
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VXM9-9007-62M5000000TR VXM9-9007-62M5000000TR Microchip Technology VXM9-April-2020.pdf Description: 2.0X1.65 SMD CRYSTAL
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -30°C ~ 85°C
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.022" (0.55mm)
Frequency: 62.5 MHz
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VXM9-9007-62M5000000TR VXM9-9007-62M5000000TR Microchip Technology VXM9-April-2020.pdf Description: 2.0X1.65 SMD CRYSTAL
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -30°C ~ 85°C
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.022" (0.55mm)
Frequency: 62.5 MHz
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VXM9-9007-62M5000000 VXM9-9007-62M5000000 Microchip Technology VXM9-April-2020.pdf Description: CRYSTAL
Packaging: Strip
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -30°C ~ 85°C
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.022" (0.55mm)
Frequency: 62.5 MHz
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APT36GA60SD15 APT36GA60SD15 Microchip Technology APT36GA60B_SD15_D.pdf Description: IGBT PT 600V 65A D3PAK
Switching Energy: 307µJ (on), 254µJ (off)
Td (on/off) @ 25°C: 16ns/122ns
IGBT Type: PT
Supplier Device Package: D3Pak
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 20A
Reverse Recovery Time (trr): 19 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tube
Power - Max: 290 W
Current - Collector Pulsed (Icm): 109 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 65 A
Gate Charge: 102 nC
Test Condition: 400V, 20A, 10Ohm, 15V
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2N6277 2N6277 Microchip Technology 8973-lds-0163-datasheet Description: TRANS NPN 150V 50A TO-3
Power - Max: 250 W
Voltage - Collector Emitter Breakdown (Max): 150 V
Current - Collector (Ic) (Max): 50 A
Supplier Device Package: TO-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 1A, 4V
Current - Collector Cutoff (Max): 50µA
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
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JAN2N6277 Microchip Technology 8973-lds-0163-datasheet Description: TRANS NPN 150V 50A TO3
Current - Collector Cutoff (Max): 50µA
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
Qualification: MIL-PRF-19500/514
Power - Max: 250 W
Voltage - Collector Emitter Breakdown (Max): 150 V
Current - Collector (Ic) (Max): 50 A
Grade: Military
Supplier Device Package: TO-3 (TO-204AA)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
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JANTX2N6277 Microchip Technology 8973-lds-0163-datasheet Description: TRANS NPN 150V 50A TO3
Qualification: MIL-PRF-19500/514
Power - Max: 250 W
Voltage - Collector Emitter Breakdown (Max): 150 V
Current - Collector (Ic) (Max): 50 A
Grade: Military
Supplier Device Package: TO-3 (TO-204AA)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Current - Collector Cutoff (Max): 50µA
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
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MXSMCG16A Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 16VWM 26VC SMCG
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 26V
Voltage - Breakdown (Min): 17.8V
Unidirectional Channels: 1
Supplier Device Package: SMCG (DO-215AB)
Voltage - Reverse Standoff (Typ): 16V
Current - Peak Pulse (10/1000µs): 57.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
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PIC16LF72T-I/SO PIC16LF72T-I/SO Microchip Technology filehandler.aspx?ddocname=en011381 Description: IC MCU 8BIT 3.5KB FLASH 28SOIC
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ATSAMD21E17D-AU ATSAMD21E17D-AU Microchip Technology SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf Description: IC MCU 32BIT 128KB FLASH 32TQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
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LE79271AMQC Microchip Technology LE79271_Web.pdf Description: IC TELECOM INTERFACE QFN28
Part Status: Active
Supplier Device Package: 28-QFN
Interface: 2-Wire
Mounting Type: Surface Mount
Package / Case: 28-QFN
Packaging: Tray
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LE79271AMQCT Microchip Technology LE79271_Web.pdf Description: IC TELECOM INTERFACE QFN28
Part Status: Active
Supplier Device Package: 28-QFN
Interface: 2-Wire
Mounting Type: Surface Mount
Package / Case: 28-QFN
Packaging: Tape & Reel (TR)
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1N4492US 1N4492US Microchip Technology 124793-lds-0183-1-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 130 V
Impedance (Max) (Zzt): 500 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 104 V
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24CW1280-I/ST 24CW1280-I/ST Microchip Technology 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf Description: IC EEPROM 128KBIT I2C 8TSSOP
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JANTXV1N5645A JANTXV1N5645A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 28.2VWM 45.7VC DO13
Qualification: MIL-PRF-19500/500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 28.2V
Current - Peak Pulse (10/1000µs): 33A
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
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1N5267A 1N5267A Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 75V 500MW DO204AH
Current - Reverse Leakage @ Vr: 100 nA @ 53 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 270 Ohms
Voltage - Zener (Nom) (Vz): 75 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±10%
Packaging: Bulk
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1N5267BUR-1 Microchip Technology 1N5221BUR-1 thru 1N5281BUR-1.pdf Description: DIODE ZENER
Current - Reverse Leakage @ Vr: 100 nA @ 56 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 270 Ohms
Voltage - Zener (Nom) (Vz): 75 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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ATSAML21G17B-ANT ATSAML21G17B-ANT Microchip Technology SAM_L21_Family_DataSheet_DS60001477C.pdf Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SCI, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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ATSAML21G17B-ANT ATSAML21G17B-ANT Microchip Technology SAM_L21_Family_DataSheet_DS60001477C.pdf Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SCI, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
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APT1201R2BLLG APT1201R2BLLG Microchip Technology Description: MOSFET N-CH 1200V 12A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 1.2Ohm @ 6A, 10V
Power Dissipation (Max): 400W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
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VSC7422XJG-04 VSC7422XJG-04 Microchip Technology VMDS-10392_VSC7420-02_VSC7421-02_VSC7422-02.pdf Description: IC TELECOM INTERFACE 672HSBGA
Number of Circuits: 1
Supplier Device Package: 672-HSBGA (27x27)
Voltage - Supply: 1V
Interface: Serial
Function: Ethernet Switch
Mounting Type: Surface Mount
Package / Case: 672-BGA
Packaging: Tray
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MXLSMCJ70CAe3 MXLSMCJ70CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 70VWM 113VC DO214AB
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ATSAML10D16A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML10D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML10D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML11D16A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAML11D16A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML11D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAML11D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
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LM2576-12BUTR MCRLS03589-1.pdf?t.download=true&u=5oefqw
LM2576-12BUTR
Hersteller: Microchip Technology
Description: IC REG BUCK 12V 3A TO263-5
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 3A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Packaging: Bulk
Part Status: Active
Voltage - Output (Min/Fixed): 12V
Voltage - Input (Min): 4V
Synchronous Rectifier: No
Supplier Device Package: TO-263-5
Topology: Buck
Voltage - Input (Max): 40V
Frequency - Switching: 52kHz
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LM2576-12BU TR MCRLS03589-1.pdf?t.download=true&u=5oefqw
LM2576-12BU TR
Hersteller: Microchip Technology
Description: IC REG BUCK 12V 3A TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Part Status: Active
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ATSAMA5D21C-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D21C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + HSIC
Ethernet: 10/100Mbps (1)
Supplier Device Package: 196-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Tape & Reel (TR)
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1500+14.07 EUR
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ATSAMA5D21C-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D21C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: Yes
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + HSIC
Ethernet: 10/100Mbps (1)
Supplier Device Package: 196-TFBGA (11x11)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Cut Tape (CT)
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ATSAMA5D22C-CUR SAMA5D2-Series-Datasheet-DS60001476H.pdf
ATSAMA5D22C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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1500+16.56 EUR
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ATSAMA5D22C-CUR SAMA5D2-Series-Datasheet-DS60001476H.pdf
ATSAMA5D22C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATSAMA5D24C-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D24C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Produkt ist nicht verfügbar
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ATSAMA5D24C-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D24C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Cut Tape (CT)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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AT28HC256-90SU AT28HC256-256-Kbit-32%2C768x8-High-Speed-Parallel-EEPROM-DS20006428.pdf
AT28HC256-90SU
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-90SU-T doc0274.pdf
AT28HC64B-90SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Produkt ist nicht verfügbar
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AT28HC64B-90SU-T doc0274.pdf
AT28HC64B-90SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Produkt ist nicht verfügbar
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AT28HC64BF-12SU-T doc3648.pdf
AT28HC64BF-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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1000+11.91 EUR
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AT28HC64BF-12SU-T doc3648.pdf
AT28HC64BF-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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2+13.01 EUR
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AT28HC64B-12SU-T doc0274.pdf
AT28HC64B-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT28HC64B-12SU-T doc0274.pdf
AT28HC64B-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
auf Bestellung 482 Stücke:
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2+14.27 EUR
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100+13.21 EUR
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AT28HC64B-70SU-T doc0274.pdf
AT28HC64B-70SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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1000+13.39 EUR
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AT28HC64B-70SU-T doc0274.pdf
AT28HC64B-70SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-90TU-T doc0274.pdf
AT28HC64B-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28TSOP
Produkt ist nicht verfügbar
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AT28HC64B-90TU-T doc0274.pdf
AT28HC64B-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28TSOP
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AT28HC256-90TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-90TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-12TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-12TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-12TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-12TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
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EV44C93A EVB-LAN9252_SAM-D51-Evaluation-Board-Users-Guide-50003012A.pdf
EV44C93A
Hersteller: Microchip Technology
Description: EVAL BOARD FOR SAMD51
Supplied Contents: Board(s)
Utilized IC / Part: SAMD51
Type: Interface
Function: Motor Controller/Driver
Packaging: Bulk
Contents: Board(s)
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PIC18LF46K42-I/P filehandler.aspx?ddocname=en598760
PIC18LF46K42-I/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 40DIP
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PIC18LF46K42-E/P PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf
PIC18LF46K42-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 35x12b; D/A 1x5b
Core Processor: PIC
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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AT97SC3205-G3M4200B Atmel-8884S-TPM-AT97SC3205-Datasheet-Summary.pdf
AT97SC3205-G3M4200B
Hersteller: Microchip Technology
Description: PRODSTD COM SPI TPM 4X4 32VQFN
DigiKey Programmable: Not Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 32-VQFN (4x4)
Core Processor: AVR
Applications: Trusted Platform Module (TPM)
Program Memory Type: EEPROM
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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MCP47FVB04T-20E/ST MCP47FXBX48-Data-Sheet-DS200006368A.pdf
MCP47FVB04T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 8BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: Yes
INL/DNL (LSB): ±0.1, ±0.0125
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 6µs
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Reference Type: External
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCP47FVB04T-20E/ST MCP47FXBX48-Data-Sheet-DS200006368A.pdf
MCP47FVB04T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 8BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: Yes
INL/DNL (LSB): ±0.1, ±0.0125
Number of D/A Converters: 4
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 6µs
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Reference Type: External
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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MCP47FVB08T-20E/ST MCP47FXBX48-Data-Sheet-DS200006368A.pdf
MCP47FVB08T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 8BIT V-OUT 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Differential Output: No
INL/DNL (LSB): ±0.25 (Max), -
Number of D/A Converters: 8
Supplier Device Package: 20-TSSOP
Settling Time: 6µs
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Supply
Data Interface: I2C
Number of Bits: 8
Mounting Type: Surface Mount
Output Type: Voltage - Buffered, Voltage - Unbuffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F27Q43-I/SS PIC18F27-47-57Q43-Data-Sheet-DS40002147D.pdf
PIC18F27Q43-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
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VXM9-9007-62M5000000TR VXM9-April-2020.pdf
VXM9-9007-62M5000000TR
Hersteller: Microchip Technology
Description: 2.0X1.65 SMD CRYSTAL
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -30°C ~ 85°C
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.022" (0.55mm)
Frequency: 62.5 MHz
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VXM9-9007-62M5000000TR VXM9-April-2020.pdf
VXM9-9007-62M5000000TR
Hersteller: Microchip Technology
Description: 2.0X1.65 SMD CRYSTAL
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -30°C ~ 85°C
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.022" (0.55mm)
Frequency: 62.5 MHz
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VXM9-9007-62M5000000 VXM9-April-2020.pdf
VXM9-9007-62M5000000
Hersteller: Microchip Technology
Description: CRYSTAL
Packaging: Strip
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -30°C ~ 85°C
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Height - Seated (Max): 0.022" (0.55mm)
Frequency: 62.5 MHz
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APT36GA60SD15 APT36GA60B_SD15_D.pdf
APT36GA60SD15
Hersteller: Microchip Technology
Description: IGBT PT 600V 65A D3PAK
Switching Energy: 307µJ (on), 254µJ (off)
Td (on/off) @ 25°C: 16ns/122ns
IGBT Type: PT
Supplier Device Package: D3Pak
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 20A
Reverse Recovery Time (trr): 19 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tube
Power - Max: 290 W
Current - Collector Pulsed (Icm): 109 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 65 A
Gate Charge: 102 nC
Test Condition: 400V, 20A, 10Ohm, 15V
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2N6277 8973-lds-0163-datasheet
2N6277
Hersteller: Microchip Technology
Description: TRANS NPN 150V 50A TO-3
Power - Max: 250 W
Voltage - Collector Emitter Breakdown (Max): 150 V
Current - Collector (Ic) (Max): 50 A
Supplier Device Package: TO-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 1A, 4V
Current - Collector Cutoff (Max): 50µA
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
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JAN2N6277 8973-lds-0163-datasheet
Hersteller: Microchip Technology
Description: TRANS NPN 150V 50A TO3
Current - Collector Cutoff (Max): 50µA
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
Qualification: MIL-PRF-19500/514
Power - Max: 250 W
Voltage - Collector Emitter Breakdown (Max): 150 V
Current - Collector (Ic) (Max): 50 A
Grade: Military
Supplier Device Package: TO-3 (TO-204AA)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
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JANTX2N6277 8973-lds-0163-datasheet
Hersteller: Microchip Technology
Description: TRANS NPN 150V 50A TO3
Qualification: MIL-PRF-19500/514
Power - Max: 250 W
Voltage - Collector Emitter Breakdown (Max): 150 V
Current - Collector (Ic) (Max): 50 A
Grade: Military
Supplier Device Package: TO-3 (TO-204AA)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Current - Collector Cutoff (Max): 50µA
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-204AA, TO-3
Packaging: Bulk
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MXSMCG16A 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 16VWM 26VC SMCG
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 26V
Voltage - Breakdown (Min): 17.8V
Unidirectional Channels: 1
Supplier Device Package: SMCG (DO-215AB)
Voltage - Reverse Standoff (Typ): 16V
Current - Peak Pulse (10/1000µs): 57.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
Produkt ist nicht verfügbar
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PIC16LF72T-I/SO filehandler.aspx?ddocname=en011381
PIC16LF72T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 28SOIC
Produkt ist nicht verfügbar
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ATSAMD21E17D-AU SAM-D21-DA1-Family-Data-Sheet-DS40001882H.pdf
ATSAMD21E17D-AU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 32TQFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-TQFP
Packaging: Tray
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4+5.43 EUR
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LE79271AMQC LE79271_Web.pdf
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE QFN28
Part Status: Active
Supplier Device Package: 28-QFN
Interface: 2-Wire
Mounting Type: Surface Mount
Package / Case: 28-QFN
Packaging: Tray
Produkt ist nicht verfügbar
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LE79271AMQCT LE79271_Web.pdf
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE QFN28
Part Status: Active
Supplier Device Package: 28-QFN
Interface: 2-Wire
Mounting Type: Surface Mount
Package / Case: 28-QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4492US 124793-lds-0183-1-datasheet
1N4492US
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 130 V
Impedance (Max) (Zzt): 500 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 250 nA @ 104 V
Produkt ist nicht verfügbar
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24CW1280-I/ST 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf
24CW1280-I/ST
Hersteller: Microchip Technology
Description: IC EEPROM 128KBIT I2C 8TSSOP
Produkt ist nicht verfügbar
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JANTXV1N5645A LDS-0096-REV3.pdf
JANTXV1N5645A
Hersteller: Microchip Technology
Description: TVS DIODE 28.2VWM 45.7VC DO13
Qualification: MIL-PRF-19500/500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 28.2V
Current - Peak Pulse (10/1000µs): 33A
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5267A 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5267A
Hersteller: Microchip Technology
Description: DIODE ZENER 75V 500MW DO204AH
Current - Reverse Leakage @ Vr: 100 nA @ 53 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 270 Ohms
Voltage - Zener (Nom) (Vz): 75 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±10%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5267BUR-1 1N5221BUR-1 thru 1N5281BUR-1.pdf
Hersteller: Microchip Technology
Description: DIODE ZENER
Current - Reverse Leakage @ Vr: 100 nA @ 56 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 270 Ohms
Voltage - Zener (Nom) (Vz): 75 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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ATSAML21G17B-ANT SAM_L21_Family_DataSheet_DS60001477C.pdf
ATSAML21G17B-ANT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SCI, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAML21G17B-ANT SAM_L21_Family_DataSheet_DS60001477C.pdf
ATSAML21G17B-ANT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SCI, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 2486 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.29 EUR
25+8.4 EUR
100+7.63 EUR
Mindestbestellmenge: 3 Stücke
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APT1201R2BLLG
APT1201R2BLLG
Hersteller: Microchip Technology
Description: MOSFET N-CH 1200V 12A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 1.2Ohm @ 6A, 10V
Power Dissipation (Max): 400W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
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1+53.62 EUR
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VSC7422XJG-04 VMDS-10392_VSC7420-02_VSC7421-02_VSC7422-02.pdf
VSC7422XJG-04
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 672HSBGA
Number of Circuits: 1
Supplier Device Package: 672-HSBGA (27x27)
Voltage - Supply: 1V
Interface: Serial
Function: Ethernet Switch
Mounting Type: Surface Mount
Package / Case: 672-BGA
Packaging: Tray
auf Bestellung 398 Stücke:
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1+159.53 EUR
25+132.93 EUR
100+128.46 EUR
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MXLSMCJ70CAe3 10561-msmc-datasheet
MXLSMCJ70CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 70VWM 113VC DO214AB
Produkt ist nicht verfügbar
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