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ATSAML11E15A-MUT ATSAML11E15A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 32KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC32MZ1025DAR169T-I/6J PIC32MZ1025DAR169T-I/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 120
Supplier Device Package: 169-LFBGA (11x11)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 45x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Program Memory Size: 1MB (1M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tape & Reel (TR)
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PIC32MZ1025DAR169T-I/6J PIC32MZ1025DAR169T-I/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 120
Supplier Device Package: 169-LFBGA (11x11)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 45x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Program Memory Size: 1MB (1M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Cut Tape (CT)
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PIC32MZ1025DAR169-I/6J PIC32MZ1025DAR169-I/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 120
Supplier Device Package: 169-LFBGA (11x11)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 45x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Program Memory Size: 1MB (1M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tray
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PIC32MZ2025DAR169-I/6J PIC32MZ2025DAR169-I/6J Microchip Technology PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf Description: IC MCU 32BIT 2MB FLASH 169LFBGA
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ATSAMS70Q21B-CN ATSAMS70Q21B-CN Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 2MB FLASH 144LFBGA
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
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JANTXV1N2990B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 33V 10W DO213AA
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USB3326C-GL-TR USB3326C-GL-TR Microchip Technology 00001902A.pdf Description: IC TRANSCEIVER HALF 1/1 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 2V, 3V ~ 3.6V
Number of Drivers/Receivers: 1/1
Protocol: USB
Supplier Device Package: 25-WLCSP (1.97x1.97)
Receiver Hysteresis: 150 mV
Duplex: Half
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USB3322C-GL-TR USB3322C-GL-TR Microchip Technology 00001902A.pdf Description: IC TRANSCEIVER HALF 1/1 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Number of Drivers/Receivers: 1/1
Protocol: USB
Supplier Device Package: 25-WLCSP (1.97x1.97)
Receiver Hysteresis: 150 mV
Duplex: Half
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ATSAM4S2CB-CNR ATSAM4S2CB-CNR Microchip Technology Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf Description: IC MCU 32BIT 128KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tape & Reel (TR)
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ATSAM4S2CB-CNR ATSAM4S2CB-CNR Microchip Technology Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf Description: IC MCU 32BIT 128KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
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ATSAM4S8CB-CNR ATSAM4S8CB-CNR Microchip Technology Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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2N6318 2N6318 Microchip Technology Description: PNP SILICON POWER TRANSISTOR
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APT25GN120SG/TR APT25GN120SG/TR Microchip Technology 6785-apt25gn120bg-apt25gn120sg-datasheet Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Switching Energy: -, 2.15J (off)
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
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APT25GN120SG/TR APT25GN120SG/TR Microchip Technology 6785-apt25gn120bg-apt25gn120sg-datasheet Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Cut Tape (CT)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Switching Energy: -, 2.15J (off)
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
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APT35GN120SG/TR APT35GN120SG/TR Microchip Technology 6968-apt35gn120bg-apt35gn120sg-datasheet Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 35A
Supplier Device Package: D3Pak
IGBT Type: NPT, Trench Field Stop
Td (on/off) @ 25°C: 24ns/300ns
Switching Energy: -, 2.315mJ (off)
Test Condition: 800V, 35A, 2.2Ohm, 15V
Gate Charge: 220 nC
Part Status: Active
Current - Collector (Ic) (Max): 84 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 105 A
Power - Max: 379 W
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APT35GN120SG/TR APT35GN120SG/TR Microchip Technology 6968-apt35gn120bg-apt35gn120sg-datasheet Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Cut Tape (CT)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 35A
Supplier Device Package: D3Pak
IGBT Type: NPT, Trench Field Stop
Td (on/off) @ 25°C: 24ns/300ns
Switching Energy: -, 2.315mJ (off)
Test Condition: 800V, 35A, 2.2Ohm, 15V
Gate Charge: 220 nC
Part Status: Active
Current - Collector (Ic) (Max): 84 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 105 A
Power - Max: 379 W
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EV91M41A EV91M41A Microchip Technology Description: ATUSB-GESTIC-PCB BRIDGE BOARD
Packaging: Bulk
Function: USB to I2C
Type: Interface
Utilized IC / Part: EV91M41A
Supplied Contents: Board(s)
Part Status: Active
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WFI32E01PE-I WFI32E01PE-I Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: RF TXRX MOD WIFI PCB TRACE SMD
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Antenna Type: PCB Trace
Utilized IC / Part: WFI32E01
RF Family/Standard: WiFi
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
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DSPIC33FJ32MC204T-I/ML DSPIC33FJ32MC204T-I/ML Microchip Technology 70283K.pdf Description: IC MCU 16BIT 32KB FLASH 44QFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 9x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 44-QFN (8x8)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
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BM64SPKS1MC1-0003AA BM64SPKS1MC1-0003AA Microchip Technology BM62-64-Bluetooth-Stereo-Audio-Module-DS60001403.pdf Description: RF TXRX MOD BT TH SMD
Packaging: Tray
Package / Case: 43-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3.2V ~ 4.2V
Power - Output: 15dBm
Data Rate: 3Mbps
Protocol: Bluetooth v5.0
Antenna Type: Integrated, Trace
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2S, UART
DigiKey Programmable: Not Verified
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BM64SPKS1MC2-0003AA BM64SPKS1MC2-0003AA Microchip Technology BM62-64-Bluetooth-Stereo-Audio-Module-DS60001403.pdf Description: RF TXRX MOD BT TH SMD
Packaging: Tray
Package / Case: 43-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3.2V ~ 4.2V
Power - Output: 2dBm
Data Rate: 3Mbps
Protocol: Bluetooth v5.0
Antenna Type: Integrated, Trace
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2S, UART
DigiKey Programmable: Not Verified
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ATXMEGA32A4-MHSL951 Microchip Technology Description: ATXMEGA32A4-MHSL951
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ATMEGA324PV-10MUA1 Microchip Technology Description: ATMEGA324PV-10MUA1
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JANTXV1N4955 JANTXV1N4955 Microchip Technology 10913-sa5-37-datasheet Description: DIODE ZENER 7.5V 5W AXIAL
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AT24C16C-MEHM-T Microchip Technology AT24C16C-data-sheet-20006051A.pdf Description: IC EEPROM 16KBIT I2C 1MHZ 8XDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-XDFN (1.8x2.2)
Part Status: Obsolete
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
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ATMXT2113TDAT-SPI-PCB ATMXT2113TDAT-SPI-PCB Microchip Technology Description: ATMXT2113TDAT-SPI-PCB DEV PCB
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ATTINY2313-20SUR/BKN Microchip Technology Description: ATTINY2313-20SUR/BKN
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TC620CV0A Microchip Technology Description: TC620CV0A
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24C02/P 24C02/P Microchip Technology MCHPS04508-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 2KBIT I2C 400KHZ 8DIP
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Access Time: 900 ns
Memory Interface: I2C
Write Cycle Time - Word, Page: 5ms
Part Status: Active
Supplier Device Package: 8-PDIP
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Kbit
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Bulk
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AC164408 AC164408 Microchip Technology AC1643xx_AC1644xx_Web.pdf Description: PM3 SOCKET MODULE FOR 8L DFN/20L
Packaging: Bulk
For Use With/Related Products: MPLAB® PM3
Module/Board Type: Socket Module - DFN/QFN
Part Status: Active
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AC164365 AC164365 Microchip Technology Description: PM3 I2C 8L SSOP SOCKET MODULE
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AC164366 AC164366 Microchip Technology Description: PM3 I2C 8L MSOP SOCKET MODULE
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AC164392 AC164392 Microchip Technology Description: PM3 SOCKET MODULE 64L TQFP
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PIC16F15223T-I/SL PIC16F15223T-I/SL Microchip Technology PIC16F15213-14-23-24-43-44-Data-Sheet-40002195D.pdf Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9/2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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PIC16F15223T-I/SL PIC16F15223T-I/SL Microchip Technology PIC16F15213-14-23-24-43-44-Data-Sheet-40002195D.pdf Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9/2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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PIC16F15214-E/SN PIC16F15214-E/SN Microchip Technology PIC16F15213-14-23-24-43-44-Data-Sheet-40002195D.pdf Description: IC MCU 8BIT 7KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 5/2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
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PIC18F06Q41-I/ST PIC18F06Q41-I/ST Microchip Technology PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41-E/ST PIC18F06Q41-E/ST Microchip Technology PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41-E/SL PIC18F06Q41-E/SL Microchip Technology PIC18F06-16Q41-DataSheet-40002214C.pdf Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41T-I/SL PIC18F06Q41T-I/SL Microchip Technology PIC18F06-16Q41-DataSheet-40002214C.pdf Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41T-I/SL PIC18F06Q41T-I/SL Microchip Technology PIC18F06-16Q41-DataSheet-40002214C.pdf Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41-I/SL PIC18F06Q41-I/SL Microchip Technology PIC18F06-16Q41-DataSheet-40002214C.pdf Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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100+2.06 EUR
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PIC18F06Q41T-I/ST PIC18F06Q41T-I/ST Microchip Technology PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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2500+2.09 EUR
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PIC18F06Q41T-I/ST PIC18F06Q41T-I/ST Microchip Technology PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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DSC1203NI2-148M5000T Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: LOW JITTET MEMS OCILLATOT 148.5M
Produkt ist nicht verfügbar
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IS1871SF-202-TRAY IS1871SF-202-TRAY Microchip Technology IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf Description: BLUETOOTH BLE5 IC 4X4MM
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Protocol: Bluetooth v5.0
Current - Receiving: 10mA
Data Rate (Max): 921.6kbps
Current - Transmitting: 10mA
Supplier Device Package: 32-QFN (4x4)
GPIO: 15
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, I²C, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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25+4.07 EUR
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IS1870SF-202 IS1870SF-202 Microchip Technology IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf Description: BLUETOOTH BLE5 IC 6X6MM
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 31
Supplier Device Package: 48-QFN (6x6)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IS1870SF-202 IS1870SF-202 Microchip Technology IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf Description: BLUETOOTH BLE5 IC 6X6MM
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 31
Supplier Device Package: 48-QFN (6x6)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
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IS1870SF-202-TRAY IS1870SF-202-TRAY Microchip Technology IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf Description: BLUETOOTH BLE5 IC 6X6MM
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 31
Supplier Device Package: 48-QFN (6x6)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
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IS1871SF-202 IS1871SF-202 Microchip Technology IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf Description: BLUETOOTH BLE5 IC 4X4MM
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 15
Supplier Device Package: 32-QFN (4x4)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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IS1871SF-202 IS1871SF-202 Microchip Technology IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf Description: BLUETOOTH BLE5 IC 4X4MM
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 15
Supplier Device Package: 32-QFN (4x4)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
DigiKey Programmable: Not Verified
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1N5221B/TR 1N5221B/TR Microchip Technology 1N5221%20-%201N5281B.pdf Description: VOLTAGE REGULATOR
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1N5221BE3/TR 1N5221BE3/TR Microchip Technology 1N5221%20-%201N5281B.pdf Description: VOLTAGE REGULATOR
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1N5221/TR 1N5221/TR Microchip Technology 1N5221%20-%201N5281B.pdf Description: VOLTAGE REGULATOR
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1N5221 Microchip Technology Description: ZENER DIODE
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DSC6011ML3B-003.0720T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011HL3B-003.0720T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011HL3B-003.0720 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011ML3B-003.0720 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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ATSAML11E15A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11E15A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 32KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32MZ1025DAR169T-I/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1025DAR169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 120
Supplier Device Package: 169-LFBGA (11x11)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 45x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Program Memory Size: 1MB (1M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32MZ1025DAR169T-I/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1025DAR169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 120
Supplier Device Package: 169-LFBGA (11x11)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 45x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Program Memory Size: 1MB (1M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Cut Tape (CT)
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PIC32MZ1025DAR169-I/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ1025DAR169-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 120
Supplier Device Package: 169-LFBGA (11x11)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Core Size: 32-Bit Single-Core
Data Converters: A/D 45x12b
Core Processor: MIPS32® microAptiv™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Program Memory Size: 1MB (1M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 169-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32MZ2025DAR169-I/6J PIC32MZ-DA-Family-DataSheet-DS60001565C.pdf
PIC32MZ2025DAR169-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 169LFBGA
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ATSAMS70Q21B-CN SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMS70Q21B-CN
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 144LFBGA
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 114
DigiKey Programmable: Not Verified
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JANTXV1N2990B 8914-lds-0075-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 33V 10W DO213AA
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USB3326C-GL-TR 00001902A.pdf
USB3326C-GL-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 2V, 3V ~ 3.6V
Number of Drivers/Receivers: 1/1
Protocol: USB
Supplier Device Package: 25-WLCSP (1.97x1.97)
Receiver Hysteresis: 150 mV
Duplex: Half
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USB3322C-GL-TR 00001902A.pdf
USB3322C-GL-TR
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Number of Drivers/Receivers: 1/1
Protocol: USB
Supplier Device Package: 25-WLCSP (1.97x1.97)
Receiver Hysteresis: 150 mV
Duplex: Half
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ATSAM4S2CB-CNR Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf
ATSAM4S2CB-CNR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tape & Reel (TR)
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ATSAM4S2CB-CNR Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf
ATSAM4S2CB-CNR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
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ATSAM4S8CB-CNR Atmel-11100-32-bit%20Cortex-M4-Microcontroller-SAM4S_Datasheet.pdf
ATSAM4S8CB-CNR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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2N6318
2N6318
Hersteller: Microchip Technology
Description: PNP SILICON POWER TRANSISTOR
Produkt ist nicht verfügbar
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APT25GN120SG/TR 6785-apt25gn120bg-apt25gn120sg-datasheet
APT25GN120SG/TR
Hersteller: Microchip Technology
Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Switching Energy: -, 2.15J (off)
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
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APT25GN120SG/TR 6785-apt25gn120bg-apt25gn120sg-datasheet
APT25GN120SG/TR
Hersteller: Microchip Technology
Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Cut Tape (CT)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Switching Energy: -, 2.15J (off)
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
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APT35GN120SG/TR 6968-apt35gn120bg-apt35gn120sg-datasheet
APT35GN120SG/TR
Hersteller: Microchip Technology
Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 35A
Supplier Device Package: D3Pak
IGBT Type: NPT, Trench Field Stop
Td (on/off) @ 25°C: 24ns/300ns
Switching Energy: -, 2.315mJ (off)
Test Condition: 800V, 35A, 2.2Ohm, 15V
Gate Charge: 220 nC
Part Status: Active
Current - Collector (Ic) (Max): 84 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 105 A
Power - Max: 379 W
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APT35GN120SG/TR 6968-apt35gn120bg-apt35gn120sg-datasheet
APT35GN120SG/TR
Hersteller: Microchip Technology
Description: IGBT FIELDSTOP LOW FREQUENCY SIN
Packaging: Cut Tape (CT)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 35A
Supplier Device Package: D3Pak
IGBT Type: NPT, Trench Field Stop
Td (on/off) @ 25°C: 24ns/300ns
Switching Energy: -, 2.315mJ (off)
Test Condition: 800V, 35A, 2.2Ohm, 15V
Gate Charge: 220 nC
Part Status: Active
Current - Collector (Ic) (Max): 84 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 105 A
Power - Max: 379 W
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EV91M41A
EV91M41A
Hersteller: Microchip Technology
Description: ATUSB-GESTIC-PCB BRIDGE BOARD
Packaging: Bulk
Function: USB to I2C
Type: Interface
Utilized IC / Part: EV91M41A
Supplied Contents: Board(s)
Part Status: Active
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WFI32E01PE-I PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
WFI32E01PE-I
Hersteller: Microchip Technology
Description: RF TXRX MOD WIFI PCB TRACE SMD
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Antenna Type: PCB Trace
Utilized IC / Part: WFI32E01
RF Family/Standard: WiFi
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
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DSPIC33FJ32MC204T-I/ML 70283K.pdf
DSPIC33FJ32MC204T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 44QFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 9x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 44-QFN (8x8)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
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BM64SPKS1MC1-0003AA BM62-64-Bluetooth-Stereo-Audio-Module-DS60001403.pdf
BM64SPKS1MC1-0003AA
Hersteller: Microchip Technology
Description: RF TXRX MOD BT TH SMD
Packaging: Tray
Package / Case: 43-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3.2V ~ 4.2V
Power - Output: 15dBm
Data Rate: 3Mbps
Protocol: Bluetooth v5.0
Antenna Type: Integrated, Trace
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2S, UART
DigiKey Programmable: Not Verified
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BM64SPKS1MC2-0003AA BM62-64-Bluetooth-Stereo-Audio-Module-DS60001403.pdf
BM64SPKS1MC2-0003AA
Hersteller: Microchip Technology
Description: RF TXRX MOD BT TH SMD
Packaging: Tray
Package / Case: 43-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3.2V ~ 4.2V
Power - Output: 2dBm
Data Rate: 3Mbps
Protocol: Bluetooth v5.0
Antenna Type: Integrated, Trace
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2S, UART
DigiKey Programmable: Not Verified
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ATXMEGA32A4-MHSL951
Hersteller: Microchip Technology
Description: ATXMEGA32A4-MHSL951
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ATMEGA324PV-10MUA1
Hersteller: Microchip Technology
Description: ATMEGA324PV-10MUA1
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JANTXV1N4955 10913-sa5-37-datasheet
JANTXV1N4955
Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 5W AXIAL
Produkt ist nicht verfügbar
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AT24C16C-MEHM-T AT24C16C-data-sheet-20006051A.pdf
Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT I2C 1MHZ 8XDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-XDFN (1.8x2.2)
Part Status: Obsolete
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMXT2113TDAT-SPI-PCB
ATMXT2113TDAT-SPI-PCB
Hersteller: Microchip Technology
Description: ATMXT2113TDAT-SPI-PCB DEV PCB
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ATTINY2313-20SUR/BKN
Hersteller: Microchip Technology
Description: ATTINY2313-20SUR/BKN
Produkt ist nicht verfügbar
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TC620CV0A
Hersteller: Microchip Technology
Description: TC620CV0A
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24C02/P MCHPS04508-1.pdf?t.download=true&u=5oefqw
24C02/P
Hersteller: Microchip Technology
Description: IC EEPROM 2KBIT I2C 400KHZ 8DIP
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Access Time: 900 ns
Memory Interface: I2C
Write Cycle Time - Word, Page: 5ms
Part Status: Active
Supplier Device Package: 8-PDIP
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Kbit
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Bulk
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AC164408 AC1643xx_AC1644xx_Web.pdf
AC164408
Hersteller: Microchip Technology
Description: PM3 SOCKET MODULE FOR 8L DFN/20L
Packaging: Bulk
For Use With/Related Products: MPLAB® PM3
Module/Board Type: Socket Module - DFN/QFN
Part Status: Active
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AC164365
AC164365
Hersteller: Microchip Technology
Description: PM3 I2C 8L SSOP SOCKET MODULE
Produkt ist nicht verfügbar
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AC164366
AC164366
Hersteller: Microchip Technology
Description: PM3 I2C 8L MSOP SOCKET MODULE
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AC164392
AC164392
Hersteller: Microchip Technology
Description: PM3 SOCKET MODULE 64L TQFP
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PIC16F15223T-I/SL PIC16F15213-14-23-24-43-44-Data-Sheet-40002195D.pdf
PIC16F15223T-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9/2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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PIC16F15223T-I/SL PIC16F15213-14-23-24-43-44-Data-Sheet-40002195D.pdf
PIC16F15223T-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9/2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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PIC16F15214-E/SN PIC16F15213-14-23-24-43-44-Data-Sheet-40002195D.pdf
PIC16F15214-E/SN
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 5/2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
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PIC18F06Q41-I/ST PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf
PIC18F06Q41-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41-E/ST PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf
PIC18F06Q41-E/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41-E/SL PIC18F06-16Q41-DataSheet-40002214C.pdf
PIC18F06Q41-E/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41T-I/SL PIC18F06-16Q41-DataSheet-40002214C.pdf
PIC18F06Q41T-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41T-I/SL PIC18F06-16Q41-DataSheet-40002214C.pdf
PIC18F06Q41T-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41-I/SL PIC18F06-16Q41-DataSheet-40002214C.pdf
PIC18F06Q41-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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PIC18F06Q41T-I/ST PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf
PIC18F06Q41T-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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2500+2.09 EUR
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PIC18F06Q41T-I/ST PIC18F06-16Q40-Microcontroller-Data-Sheet-DS40002216.pdf
PIC18F06Q41T-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 4894 Stücke:
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DSC1203NI2-148M5000T DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
Hersteller: Microchip Technology
Description: LOW JITTET MEMS OCILLATOT 148.5M
Produkt ist nicht verfügbar
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IS1871SF-202-TRAY IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf
IS1871SF-202-TRAY
Hersteller: Microchip Technology
Description: BLUETOOTH BLE5 IC 4X4MM
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Protocol: Bluetooth v5.0
Current - Receiving: 10mA
Data Rate (Max): 921.6kbps
Current - Transmitting: 10mA
Supplier Device Package: 32-QFN (4x4)
GPIO: 15
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, I²C, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 280 Stücke:
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IS1870SF-202 IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf
IS1870SF-202
Hersteller: Microchip Technology
Description: BLUETOOTH BLE5 IC 6X6MM
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 31
Supplier Device Package: 48-QFN (6x6)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IS1870SF-202 IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf
IS1870SF-202
Hersteller: Microchip Technology
Description: BLUETOOTH BLE5 IC 6X6MM
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 31
Supplier Device Package: 48-QFN (6x6)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
auf Bestellung 4938 Stücke:
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IS1870SF-202-TRAY IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf
IS1870SF-202-TRAY
Hersteller: Microchip Technology
Description: BLUETOOTH BLE5 IC 6X6MM
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 31
Supplier Device Package: 48-QFN (6x6)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
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4+6.18 EUR
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IS1871SF-202 IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf
IS1871SF-202
Hersteller: Microchip Technology
Description: BLUETOOTH BLE5 IC 4X4MM
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 15
Supplier Device Package: 32-QFN (4x4)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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IS1871SF-202 IS1870-71-Bluetooth-Low-Energy-SoC-DS60001371G.pdf
IS1871SF-202
Hersteller: Microchip Technology
Description: BLUETOOTH BLE5 IC 4X4MM
Current - Receiving: 10mA
Protocol: Bluetooth v5.0
Power - Output: 0dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM
Frequency: 2.402GHz ~ 2.48GHz
Mounting Type: Surface Mount
Sensitivity: -90dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
GPIO: 15
Supplier Device Package: 32-QFN (4x4)
Current - Transmitting: 10mA
Data Rate (Max): 921.6kbps
DigiKey Programmable: Not Verified
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5+4.32 EUR
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1N5221B/TR 1N5221%20-%201N5281B.pdf
1N5221B/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Produkt ist nicht verfügbar
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1N5221BE3/TR 1N5221%20-%201N5281B.pdf
1N5221BE3/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Produkt ist nicht verfügbar
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1N5221/TR 1N5221%20-%201N5281B.pdf
1N5221/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Produkt ist nicht verfügbar
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1N5221
Hersteller: Microchip Technology
Description: ZENER DIODE
Produkt ist nicht verfügbar
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DSC6011ML3B-003.0720T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011HL3B-003.0720T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011HL3B-003.0720 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011ML3B-003.0720 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
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