Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (337567) > Seite 1655 nach 5627
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| PIC32CM5164JH01064-I/PT | Microchip Technology |
Description: 64TQFP, 512KB FLASH, 48MHZ, TRAY Packaging: Tray Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32CM6408MC00032T-E/RTB | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 32VQFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT Supplier Device Package: 32-VQFN (5x5) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3300 Stücke: Lieferzeit 10-14 Tag (e) |
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UT262 | Microchip Technology |
Description: DIODE GEN PURP 200V 2A A AXIAL Packaging: Bulk Package / Case: A, Axial Mounting Type: Through Hole Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 2A Supplier Device Package: A, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 200 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 900 mA Current - Reverse Leakage @ Vr: 2 µA @ 200 V |
Produkt ist nicht verfügbar |
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UT267 | Microchip Technology | Description: DIODE GEN PURP 600V 2A A AXIAL |
Produkt ist nicht verfügbar |
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PIC32MK0128MCA048-E/6MX | Microchip Technology |
Description: IC MCU 32BIT 128KB FLASH 48VQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 18x12b SAR; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Part Status: Active Number of I/O: 37 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 183 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MK0128MCA048-E/Y8X | Microchip Technology |
Description: IC MCU 32BIT 128KB FLASH 48TQFPPackaging: Tray Package / Case: 48-TQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 18x12b SAR; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Part Status: Active Number of I/O: 37 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 496 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MK0128MCA032-I/RTB | Microchip Technology |
Description: IC MCU 32BIT 128KB FLASH 32VQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 120MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x12b SAR; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 32-VQFN (5x5) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
auf Bestellung 316 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MK0128MCA032-E/RTB | Microchip Technology |
Description: IC MCU 32BIT 128KB FLASH 32VQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 12x12b SAR; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 32-VQFN (5x5) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 463 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32MK0256GPG064T-I/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256GPG064-I/PT | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256GPG064T-E/PT | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Tape & Reel (TR) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256GPG064-E/PT | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256GPG064T-E/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256GPG064T-I/PT | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Tape & Reel (TR) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256GPG064-I/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256GPG064-E/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256MCJ064-I/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256MCJ064T-E/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256MCJ064-E/PT | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256MCJ064T-I/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256MCJ064-I/PT | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256MCJ064T-E/PT | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Tape & Reel (TR) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32MK0256MCJ064-E/R4X | Microchip Technology |
Description: IC MCU 32BIT 256KB FLASH 64VQFNPackaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 30x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| RN42APL-I/RM | Microchip Technology |
Description: MODULEPackaging: Bulk Package / Case: 35-SMD Module Sensitivity: -86dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Power - Output: 4dBm Data Rate: 3Mbps Protocol: Bluetooth v2.1 + EDR, Class 2 Antenna Type: PCB Trace RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| RN42-I/RMMGK477 | Microchip Technology |
Description: MODULE Packaging: Bulk Package / Case: 35-SMD Module Sensitivity: -86dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Power - Output: 4dBm Data Rate: 3Mbps Protocol: Bluetooth v2.1 + EDR, Class 2 Antenna Type: PCB Trace RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| RN42-I/RM477 | Microchip Technology |
Description: MODULE Packaging: Bulk Package / Case: 35-SMD Module Sensitivity: -86dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Power - Output: 4dBm Data Rate: 3Mbps Protocol: Bluetooth v2.1 + EDR, Class 2 Antenna Type: PCB Trace RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| RN42APL-I/RM545 | Microchip Technology |
Description: MODULEPackaging: Bulk Package / Case: 35-SMD Module Sensitivity: -86dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Power - Output: 4dBm Data Rate: 3Mbps Protocol: Bluetooth v2.1 + EDR, Class 2 Antenna Type: PCB Trace RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| RN42APL-I/RM543 | Microchip Technology |
Description: MODULEPackaging: Bulk Package / Case: 35-SMD Module Sensitivity: -86dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Power - Output: 4dBm Data Rate: 3Mbps Protocol: Bluetooth v2.1 + EDR, Class 2 Antenna Type: PCB Trace RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| RN42N-I/RM477 | Microchip Technology |
Description: MODULEPackaging: Bulk Package / Case: 35-SMD Module Sensitivity: -86dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Power - Output: 4dBm Data Rate: 3Mbps Protocol: Bluetooth v2.1 + EDR, Class 2 Antenna Type: PCB Trace RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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1N6063AE3 | Microchip Technology |
Description: TVS DIODE 82VWM 137VC DO13Packaging: Bulk Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 11A Voltage - Reverse Standoff (Typ): 82V Supplier Device Package: DO-13 (DO-202AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 95V Voltage - Clamping (Max) @ Ipp: 137V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
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1N6043A/TR | Microchip Technology |
Description: TVS DIODE 12VWM 21.2VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 71A Voltage - Reverse Standoff (Typ): 12V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 14.3V Voltage - Clamping (Max) @ Ipp: 21.2V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6069A/TR | Microchip Technology |
Description: TVS DIODE 150VWM 261VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 5.7A Voltage - Reverse Standoff (Typ): 150V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 171V Voltage - Clamping (Max) @ Ipp: 261V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6056A/TR | Microchip Technology |
Description: TVS DIODE 43VWM 70.1VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 21.4A Voltage - Reverse Standoff (Typ): 43V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 48.5V Voltage - Clamping (Max) @ Ipp: 70.1V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6037A/TR | Microchip Technology |
Description: TVS DIODE 7VWM 12.1VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 124A Voltage - Reverse Standoff (Typ): 7V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 7.79V Voltage - Clamping (Max) @ Ipp: 12.1V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6045A/TR | Microchip Technology |
Description: TVS DIODE 15VWM 25.2VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 59.5A Voltage - Reverse Standoff (Typ): 15V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 17.1V Voltage - Clamping (Max) @ Ipp: 25.2V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6036A/TR | Microchip Technology |
Description: TVS DIODE 6VWM 11.3VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 132A Voltage - Reverse Standoff (Typ): 6V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 7.13V Voltage - Clamping (Max) @ Ipp: 11.3V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6063AE3/TR | Microchip Technology |
Description: TVS DIODE 82VWM 137VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 11A Voltage - Reverse Standoff (Typ): 82V Supplier Device Package: DO-13 (DO-202AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 95V Voltage - Clamping (Max) @ Ipp: 137V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6067A/TR | Microchip Technology |
Description: TVS DIODE 128VWM 213VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 7A Voltage - Reverse Standoff (Typ): 128V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 143V Voltage - Clamping (Max) @ Ipp: 213V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6071/TR | Microchip Technology |
Description: TVS DIODE 165VWM 308VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 4.9A Voltage - Reverse Standoff (Typ): 165V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 180V Voltage - Clamping (Max) @ Ipp: 308V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6072A/TR | Microchip Technology |
Description: TVS DIODE 185VWM 328VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 4.6A Voltage - Reverse Standoff (Typ): 185V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 209V Voltage - Clamping (Max) @ Ipp: 328V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6062A/TR | Microchip Technology |
Description: TVS DIODE 75VWM 125VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 12A Voltage - Reverse Standoff (Typ): 75V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 86.5V Voltage - Clamping (Max) @ Ipp: 125V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6051A/TR | Microchip Technology |
Description: TVS DIODE 28VWM 45.7VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 33A Voltage - Reverse Standoff (Typ): 28V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 31.4V Voltage - Clamping (Max) @ Ipp: 45.7V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6054A/TR | Microchip Technology |
Description: TVS DIODE 36VWM 59.3VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 25.3A Voltage - Reverse Standoff (Typ): 36V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 40.9V Voltage - Clamping (Max) @ Ipp: 59.3V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6039A/TR | Microchip Technology |
Description: TVS DIODE 8.5VWM 14.5VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 103A Voltage - Reverse Standoff (Typ): 8.5V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 9.5V Voltage - Clamping (Max) @ Ipp: 14.5V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6063A/TR | Microchip Technology |
Description: TVS DIODE 82VWM 137VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 11A Voltage - Reverse Standoff (Typ): 82V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 95V Voltage - Clamping (Max) @ Ipp: 137V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6060AE3 | Microchip Technology |
Description: BI-DIRECTIONAL TVS Packaging: Bulk Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 14.6A Voltage - Reverse Standoff (Typ): 64V Supplier Device Package: DO-13 (DO-202AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 71.3V Voltage - Clamping (Max) @ Ipp: 103V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6056/TR | Microchip Technology |
Description: TVS DIODE 41VWM 73.5VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 20.4A Voltage - Reverse Standoff (Typ): 41V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 45.9V Voltage - Clamping (Max) @ Ipp: 73.5V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6050A/TR | Microchip Technology |
Description: TVS DIODE 25VWM 41.4VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 36A Voltage - Reverse Standoff (Typ): 25V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 28.5V Voltage - Clamping (Max) @ Ipp: 41.4V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6071A/TR | Microchip Technology |
Description: TVS DIODE 170VWM 294VC DO13 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6057A/TR | Microchip Technology |
Description: TVS DIODE 47VWM 77VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 19.5A Voltage - Reverse Standoff (Typ): 47V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 53.2V Voltage - Clamping (Max) @ Ipp: 77V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6061A/TR | Microchip Technology |
Description: TVS DIODE 70VWM 113VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 13.3A Voltage - Reverse Standoff (Typ): 70V Supplier Device Package: DO-13 Bidirectional Channels: 1 Voltage - Breakdown (Min): 77.9V Voltage - Clamping (Max) @ Ipp: 113V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SY75602ATWL-TR | Microchip Technology |
Description: IC CLK BUFFER 1:2 250MHZ 8VDFNPackaging: Tape & Reel (TR) Package / Case: 8-VFDFN Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:2 Differential - Input:Output: Yes/Yes Supplier Device Package: 8-VDFN (1.6x1.4) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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SY75602ATWL-TR | Microchip Technology |
Description: IC CLK BUFFER 1:2 250MHZ 8VDFNPackaging: Cut Tape (CT) Package / Case: 8-VFDFN Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:2 Differential - Input:Output: Yes/Yes Supplier Device Package: 8-VDFN (1.6x1.4) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
auf Bestellung 3734 Stücke: Lieferzeit 10-14 Tag (e) |
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SY75603BTWL | Microchip Technology |
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN Packaging: Tube Package / Case: 16-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:2 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-VQFN (3x3) Frequency - Max: 250 MHz |
auf Bestellung 664 Stücke: Lieferzeit 10-14 Tag (e) |
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SY75604ATWL | Microchip Technology |
Description: IC CLK BUFFER 1:4 250MHZ 16VQFNPackaging: Tube Package / Case: 16-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-VQFN (3x3) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
auf Bestellung 927 Stücke: Lieferzeit 10-14 Tag (e) |
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SY75604BTWL | Microchip Technology |
Description: IC CLK BUFFER 1:4 250MHZ 16VQFNPackaging: Tube Package / Case: 16-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-VQFN (3x3) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
auf Bestellung 271 Stücke: Lieferzeit 10-14 Tag (e) |
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SY75603BTWL-TR | Microchip Technology |
Description: IC CLK BUFFER 1:2 250MHZ 16VQFNPackaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:2 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-VQFN (3x3) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
auf Bestellung 3300 Stücke: Lieferzeit 10-14 Tag (e) |
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SY75603BTWL-TR | Microchip Technology |
Description: IC CLK BUFFER 1:2 250MHZ 16VQFNPackaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:2 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-VQFN (3x3) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
auf Bestellung 7735 Stücke: Lieferzeit 10-14 Tag (e) |
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SY75604BTWL-TR | Microchip Technology |
Description: IC CLK BUFFER 1:4 250MHZ 16VQFNPackaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-VQFN (3x3) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SY75604BTWL-TR | Microchip Technology |
Description: IC CLK BUFFER 1:4 250MHZ 16VQFNPackaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Number of Circuits: 1 Mounting Type: Surface Mount, Wettable Flank Output: LP-HCSL Type: Clock Buffer Input: HCSL Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-VQFN (3x3) Frequency - Max: 250 MHz Frequency - Max: 250MHz Main Purpose: PCI Express (PCIe) Number of Circuits: 1 |
auf Bestellung 3064 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIC32CM5164JH01064-I/PT |
Hersteller: Microchip Technology
Description: 64TQFP, 512KB FLASH, 48MHZ, TRAY
Packaging: Tray
Part Status: Active
Description: 64TQFP, 512KB FLASH, 48MHZ, TRAY
Packaging: Tray
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.03 EUR |
| PIC32CM6408MC00032T-E/RTB |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 64KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b, 1x16b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SERCOM, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3300+ | 3.79 EUR |
| UT262 |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 2A A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 900 mA
Current - Reverse Leakage @ Vr: 2 µA @ 200 V
Description: DIODE GEN PURP 200V 2A A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 900 mA
Current - Reverse Leakage @ Vr: 2 µA @ 200 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UT267 |
Hersteller: Microchip Technology
Description: DIODE GEN PURP 600V 2A A AXIAL
Description: DIODE GEN PURP 600V 2A A AXIAL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0128MCA048-E/6MX |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 18x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 128KB FLASH 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 18x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.8 EUR |
| 25+ | 7.14 EUR |
| 100+ | 6.46 EUR |
| PIC32MK0128MCA048-E/Y8X |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 18x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 128KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 18x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 496 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.59 EUR |
| 25+ | 6.95 EUR |
| 100+ | 6.32 EUR |
| PIC32MK0128MCA032-I/RTB |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 316 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.81 EUR |
| 25+ | 6.25 EUR |
| 100+ | 5.66 EUR |
| PIC32MK0128MCA032-E/RTB |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 128KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 12x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 463 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.48 EUR |
| 25+ | 6.86 EUR |
| 100+ | 6.21 EUR |
| PIC32MK0256GPG064T-I/R4X |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256GPG064-I/PT |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256GPG064T-E/PT |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256GPG064-E/PT |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256GPG064T-E/R4X |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256GPG064T-I/PT |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256GPG064-I/R4X |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256GPG064-E/R4X |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256MCJ064-I/R4X |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256MCJ064T-E/R4X |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIC32MK0256MCJ064-E/PT |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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| PIC32MK0256MCJ064T-I/R4X |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
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| PIC32MK0256MCJ064-I/PT |
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Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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| PIC32MK0256MCJ064T-E/PT |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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| PIC32MK0256MCJ064-E/R4X |
![]() |
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 30x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
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| RN42APL-I/RM |
![]() |
Hersteller: Microchip Technology
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| RN42-I/RMMGK477 |
Hersteller: Microchip Technology
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| RN42-I/RM477 |
Hersteller: Microchip Technology
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| RN42APL-I/RM545 |
![]() |
Hersteller: Microchip Technology
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| RN42APL-I/RM543 |
![]() |
Hersteller: Microchip Technology
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| RN42N-I/RM477 |
![]() |
Hersteller: Microchip Technology
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: MODULE
Packaging: Bulk
Package / Case: 35-SMD Module
Sensitivity: -86dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 4dBm
Data Rate: 3Mbps
Protocol: Bluetooth v2.1 + EDR, Class 2
Antenna Type: PCB Trace
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| 1N6063AE3 |
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Hersteller: Microchip Technology
Description: TVS DIODE 82VWM 137VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 82VWM 137VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6043A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 21.2VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 71A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.3V
Voltage - Clamping (Max) @ Ipp: 21.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 12VWM 21.2VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 71A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 14.3V
Voltage - Clamping (Max) @ Ipp: 21.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6069A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 150VWM 261VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.7A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 261V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 150VWM 261VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.7A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 261V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6056A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 43VWM 70.1VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.4A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 48.5V
Voltage - Clamping (Max) @ Ipp: 70.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 43VWM 70.1VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.4A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 48.5V
Voltage - Clamping (Max) @ Ipp: 70.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6037A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 7VWM 12.1VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 124A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.79V
Voltage - Clamping (Max) @ Ipp: 12.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 7VWM 12.1VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 124A
Voltage - Reverse Standoff (Typ): 7V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.79V
Voltage - Clamping (Max) @ Ipp: 12.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6045A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 15VWM 25.2VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 15VWM 25.2VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6036A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 6VWM 11.3VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 132A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.13V
Voltage - Clamping (Max) @ Ipp: 11.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 6VWM 11.3VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 132A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.13V
Voltage - Clamping (Max) @ Ipp: 11.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6063AE3/TR |
![]() |
Hersteller: Microchip Technology
Description: TVS DIODE 82VWM 137VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 82VWM 137VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6067A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 128VWM 213VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7A
Voltage - Reverse Standoff (Typ): 128V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 143V
Voltage - Clamping (Max) @ Ipp: 213V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 128VWM 213VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7A
Voltage - Reverse Standoff (Typ): 128V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 143V
Voltage - Clamping (Max) @ Ipp: 213V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6071/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 165VWM 308VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 4.9A
Voltage - Reverse Standoff (Typ): 165V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 180V
Voltage - Clamping (Max) @ Ipp: 308V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 165VWM 308VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 4.9A
Voltage - Reverse Standoff (Typ): 165V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 180V
Voltage - Clamping (Max) @ Ipp: 308V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6072A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 185VWM 328VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 4.6A
Voltage - Reverse Standoff (Typ): 185V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 209V
Voltage - Clamping (Max) @ Ipp: 328V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 185VWM 328VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 4.6A
Voltage - Reverse Standoff (Typ): 185V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 209V
Voltage - Clamping (Max) @ Ipp: 328V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6062A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 75VWM 125VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 86.5V
Voltage - Clamping (Max) @ Ipp: 125V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 75VWM 125VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 86.5V
Voltage - Clamping (Max) @ Ipp: 125V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6051A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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| 1N6054A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 36VWM 59.3VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 25.3A
Voltage - Reverse Standoff (Typ): 36V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 40.9V
Voltage - Clamping (Max) @ Ipp: 59.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 36VWM 59.3VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 25.3A
Voltage - Reverse Standoff (Typ): 36V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 40.9V
Voltage - Clamping (Max) @ Ipp: 59.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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| 1N6039A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 8.5VWM 14.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 9.5V
Voltage - Clamping (Max) @ Ipp: 14.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 8.5VWM 14.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 8.5V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 9.5V
Voltage - Clamping (Max) @ Ipp: 14.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
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Stück im Wert von UAH
| 1N6063A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 82VWM 137VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 82VWM 137VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 82V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| 1N6060AE3 |
Hersteller: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: BI-DIRECTIONAL TVS
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 14.6A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| 1N6056/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 41VWM 73.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 20.4A
Voltage - Reverse Standoff (Typ): 41V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 45.9V
Voltage - Clamping (Max) @ Ipp: 73.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Description: TVS DIODE 41VWM 73.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 20.4A
Voltage - Reverse Standoff (Typ): 41V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 45.9V
Voltage - Clamping (Max) @ Ipp: 73.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| 1N6050A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 25VWM 41.4VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 25V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Description: TVS DIODE 25VWM 41.4VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 36A
Voltage - Reverse Standoff (Typ): 25V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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| 1N6071A/TR |
![]() |
Hersteller: Microchip Technology
Description: TVS DIODE 170VWM 294VC DO13
Description: TVS DIODE 170VWM 294VC DO13
Produkt ist nicht verfügbar
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| 1N6057A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 47VWM 77VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 19.5A
Voltage - Reverse Standoff (Typ): 47V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 53.2V
Voltage - Clamping (Max) @ Ipp: 77V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 47VWM 77VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 19.5A
Voltage - Reverse Standoff (Typ): 47V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 53.2V
Voltage - Clamping (Max) @ Ipp: 77V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| 1N6061A/TR |
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Hersteller: Microchip Technology
Description: TVS DIODE 70VWM 113VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Description: TVS DIODE 70VWM 113VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 70V
Supplier Device Package: DO-13
Bidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 113V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| SY75602ATWL-TR |
![]() |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 8-VDFN (1.6x1.4)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 8-VDFN (1.6x1.4)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2000+ | 1.51 EUR |
| SY75602ATWL-TR |
![]() |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 8-VDFN (1.6x1.4)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:2 250MHZ 8VDFN
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 8-VDFN (1.6x1.4)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
auf Bestellung 3734 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 10+ | 1.88 EUR |
| 25+ | 1.57 EUR |
| 100+ | 1.51 EUR |
| SY75603BTWL |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
auf Bestellung 664 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 2.99 EUR |
| 25+ | 2.5 EUR |
| 100+ | 2.41 EUR |
| SY75604ATWL |
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Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
auf Bestellung 927 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 3.27 EUR |
| 25+ | 2.81 EUR |
| SY75604BTWL |
![]() |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
auf Bestellung 271 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 3.27 EUR |
| 25+ | 2.73 EUR |
| 100+ | 2.64 EUR |
| SY75603BTWL-TR |
![]() |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3300+ | 0.92 EUR |
| SY75603BTWL-TR |
![]() |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
auf Bestellung 7735 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 16+ | 1.14 EUR |
| 25+ | 0.95 EUR |
| 100+ | 0.92 EUR |
| SY75604BTWL-TR |
![]() |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
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| SY75604BTWL-TR |
![]() |
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
Description: IC CLK BUFFER 1:4 250MHZ 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
Frequency - Max: 250MHz
Main Purpose: PCI Express (PCIe)
Number of Circuits: 1
auf Bestellung 3064 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13+ | 1.44 EUR |
| 25+ | 1.21 EUR |
| 100+ | 1.17 EUR |






