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SBR8040R Microchip Technology 8410-coc-110-datasheet Description: DIODE SCHOTTKY 40V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
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SBR8045 Microchip Technology Description: DIODE SCHOTTKY 45V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
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SBR8040 Microchip Technology Description: DIODE SCHOTTKY 40V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
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SBR8045R Microchip Technology 8410-coc-110-datasheet Description: DIODE SCHOTTKY 45V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky, Reverse Polarity
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
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DSC1001DE5-019.2000T DSC1001DE5-019.2000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 19.2 MHz
Base Resonator: MEMS
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DSC1001DE5-019.2000T DSC1001DE5-019.2000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 19.2 MHz
Base Resonator: MEMS
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MIC37300-1.8WR MIC37300-1.8WR Microchip Technology MIC37300-01-02-03-3.0A-Low-Voltage-microCap-LDO-Regulator-DS20006169A.pdf Description: IC REG LINEAR 1.8V 3A SPAK-3
Packaging: Tube
Package / Case: Spak-3 (3 Leads + Tab)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: S-PAK-3
Voltage - Output (Min/Fixed): 1.8V
Part Status: Active
Protection Features: Over Current, Over Temperature, Reverse Polarity
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LX7220-03ILQ-TR LX7220-03ILQ-TR Microchip Technology 1243666-lx7220-datasheet Description: IC REG BUCK 0.95V 6A 14VQFN
Packaging: Cut Tape (CT)
Package / Case: 14-PowerTFQFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 14-VQFN (2x3)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.95V
Part Status: Active
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MCP6004T-I/SLVAO MCP6004T-I/SLVAO Microchip Technology MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6004T-E/STVAO MCP6004T-E/STVAO Microchip Technology MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf Description: IC OP AMP 4CH 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6004-I/SLGVAO MCP6004-I/SLGVAO Microchip Technology MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6004-I/SLVAO MCP6004-I/SLVAO Microchip Technology MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MCP6004-E/SLVAO MCP6004-E/SLVAO Microchip Technology MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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MIC39101-2.5YM MIC39101-2.5YM Microchip Technology 20005834A.pdf Description: IC REG LINEAR 2.5V 1A 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Active
Voltage Dropout (Max): 0.63V @ 1A
Protection Features: Over Current, Over Temperature, Reverse Polarity
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SY89838UMG-TR SY89838UMG-TR Microchip Technology sy89838u.pdf Description: IC CLK BUFFER 2:8 2GHZ 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 2:8
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Frequency - Max: 2 GHz
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SY89833LMG-TR SY89833LMG-TR Microchip Technology sy89833l.pdf Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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SY89832UMG-TR SY89832UMG-TR Microchip Technology sy89832u.pdf Description: IC CLK BUFFER 1:4 2.5GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2.5 GHz
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SY89876LMG-TR SY89876LMG-TR Microchip Technology sy89876l.pdf Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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SY89876LMG-TR SY89876LMG-TR Microchip Technology sy89876l.pdf Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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SY89831UMG-TR SY89831UMG-TR Microchip Technology sy89831u.pdf Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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SY89464UMY-TR SY89464UMY-TR Microchip Technology sy89464u.pdf Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
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SY89464UMY-TR SY89464UMY-TR Microchip Technology sy89464u.pdf Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Cut Tape (CT)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
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1N2784 Microchip Technology S,R21.pdf Description: DIODE GEN PURP 200V 22A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 22A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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WP3232M6NFEI-320B2 WP3232M6NFEI-320B2 Microchip Technology Description: WINPATH3 232M6 PROC. 320MHZ LF
Packaging: Tray
Package / Case: 896-BGA, FCBGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-FCBGA (31x31)
Part Status: Active
DigiKey Programmable: Not Verified
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PIC16F18857T-E/SSVAO PIC16F18857T-E/SSVAO Microchip Technology Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F18857T-I/SO PIC16F18857T-I/SO Microchip Technology 40001768A.pdf Description: IC MCU 8BIT 56KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC16F18857-E/SSVAO PIC16F18857-E/SSVAO Microchip Technology Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JANS1N5712-1/TR JANS1N5712-1/TR Microchip Technology Description: DIODE SCHOTTKY 20V 75MA DO35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-35 (DO-204AH)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Qualification: MIL-PRF-19500/444
Produkt ist nicht verfügbar
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JANS1N5712UR-1 JANS1N5712UR-1 Microchip Technology Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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JANS1N5712UR-1/TR JANS1N5712UR-1/TR Microchip Technology Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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JANS1N5712UBD/TR JANS1N5712UBD/TR Microchip Technology Description: DIODE SCHOTTKY 16V 75MA UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: UB
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
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EV03J37A EV03J37A Microchip Technology dsPIC33CK64MC105-Motor-Control-DIM-Info-Sheet-DS50003344.pdf Description: DSPIC33CK64MC105 MC DIM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Utilized IC / Part: dsPIC33CK64MC105
Platform: Dual-Inline Module (DIM)
Part Status: Active
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EV84C64A EV84C64A Microchip Technology 50W_Interleaved_LLC_Converter_Development_Board_User%27s_Guide.pdf Description: ILLC DEVELOPMENT BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Utilized IC / Part: dsPIC33CH128MP506
Part Status: Active
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MNS2N2222AUBP/TR MNS2N2222AUBP/TR Microchip Technology 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
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MSR2N2222AUB MSR2N2222AUB Microchip Technology Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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DSA1101BL3-040.0000VAO Microchip Technology Description: MEMS OSC AUTO LOWPWR -40C-105C
Frequency: 40 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BL3-001.0000 DSC1001BL3-001.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 1 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSA1101BL3-050.0000TVAO Microchip Technology Description: MEMS OSC AUTO LOW JITTER -40C-10
Base Resonator: MEMS
Frequency: 50 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSA1001BL3-025.0000VAO Microchip Technology DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Base Resonator: MEMS
Frequency: 25 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSA1101BL3-050.0000VAO Microchip Technology Description: MEMS OSC AUTO LOW JITTER -40C-10
Base Resonator: MEMS
Frequency: 50 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSA1001BL3-025.0000TVAO Microchip Technology DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Base Resonator: MEMS
Frequency: 25 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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ATTINY426-SFR ATTINY426-SFR Microchip Technology ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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ATTINY427-MFR ATTINY427-MFR Microchip Technology ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf Description: IC MCU 8BIT 4KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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UPS5819E3/TR13 UPS5819E3/TR13 Microchip Technology UPS5817e3.pdf Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Tape & Reel (TR)
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UPS5819E3/TR13 UPS5819E3/TR13 Microchip Technology UPS5817e3.pdf Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Cut Tape (CT)
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
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UPS5817E3/TR7 UPS5817E3/TR7 Microchip Technology UPS5817e3.pdf Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Current - Average Rectified (Io): 1A
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
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UPS5817E3/TR7 UPS5817E3/TR7 Microchip Technology UPS5817e3.pdf Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Current - Average Rectified (Io): 1A
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Cut Tape (CT)
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
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MSCGLQ50DH120CTBL2NG Microchip Technology MSCGLQ50DH120CTBL2NG.pdf Description: PM-IGBT-SBD-BL2
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A
NTC Thermistor: Yes
Part Status: Active
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 375 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
Produkt ist nicht verfügbar
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EQCO125T40C1T-I/8EX EQCO125T40C1T-I/8EX Microchip Technology 60001589D.pdf Description: IC DRIVER 1/0 16QFN TR
Part Status: Last Time Buy
Supplier Device Package: 16-QFN (4x4)
Data Rate: 12.5Gbps
Number of Drivers/Receivers: 1/0
Voltage - Supply: 1.25V
Operating Temperature: -40°C ~ 85°C
Type: Driver
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
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EQCO125T40C1T-I/8EX EQCO125T40C1T-I/8EX Microchip Technology 60001589D.pdf Description: IC DRIVER 1/0 16QFN TR
Part Status: Last Time Buy
Supplier Device Package: 16-QFN (4x4)
Data Rate: 12.5Gbps
Number of Drivers/Receivers: 1/0
Voltage - Supply: 1.25V
Operating Temperature: -40°C ~ 85°C
Type: Driver
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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2CGA301A-MSCL Microchip Technology Description: POWER BJT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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2CGA201A-MSCL Microchip Technology Description: POWER BJT
Part Status: Active
Packaging: Bulk
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CMLRGLQ80V601AMXG-AS Microchip Technology Description: IC POWER MODULE SMD
Packaging: Tray
Part Status: Obsolete
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MCP3202-CI/SNVAO MCP3202-CI/SNVAO Microchip Technology 21034F.pdf Description: IC ADC 12BIT SAR 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential, Single Ended
Number of Inputs: 1, 2
Supplier Device Package: 8-SOIC
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
Grade: Automotive
Qualification: AEC-Q100
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MSMBJ26CAe3 MSMBJ26CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 26VWM 42.1VC SMBJ
Qualification: MIL-PRF-19500
Grade: Military
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
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MASMBJ26CAe3 MASMBJ26CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 26VWM 42.1VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
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MXSMBJ26CAe3 MXSMBJ26CAe3 Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 26VWM 42.1VC SMBJ
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
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MXLSMBJ26CA MXLSMBJ26CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 26VWM 42.1VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
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MXSMBJ26CA MXSMBJ26CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 26VWM 42.1VC SMBJ
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
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MASMBJ26CA MASMBJ26CA Microchip Technology 10560-msmb-datasheet Description: TVS DIODE 26VWM 42.1VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Produkt ist nicht verfügbar
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SBR8040R 8410-coc-110-datasheet
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
Produkt ist nicht verfügbar
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SBR8045
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 45V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
Produkt ist nicht verfügbar
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SBR8040
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
Produkt ist nicht verfügbar
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SBR8045R 8410-coc-110-datasheet
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 45V 80A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky, Reverse Polarity
Current - Average Rectified (Io): 80A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 45 V
Voltage - Forward (Vf) (Max) @ If: 740 mV @ 80 A
Produkt ist nicht verfügbar
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DSC1001DE5-019.2000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001DE5-019.2000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 19.2 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001DE5-019.2000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001DE5-019.2000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 19.2000MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 19.2 MHz
Base Resonator: MEMS
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MIC37300-1.8WR MIC37300-01-02-03-3.0A-Low-Voltage-microCap-LDO-Regulator-DS20006169A.pdf
MIC37300-1.8WR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.8V 3A SPAK-3
Packaging: Tube
Package / Case: Spak-3 (3 Leads + Tab)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: S-PAK-3
Voltage - Output (Min/Fixed): 1.8V
Part Status: Active
Protection Features: Over Current, Over Temperature, Reverse Polarity
Produkt ist nicht verfügbar
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LX7220-03ILQ-TR 1243666-lx7220-datasheet
LX7220-03ILQ-TR
Hersteller: Microchip Technology
Description: IC REG BUCK 0.95V 6A 14VQFN
Packaging: Cut Tape (CT)
Package / Case: 14-PowerTFQFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 14-VQFN (2x3)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.95V
Part Status: Active
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7+3.27 EUR
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MCP6004T-I/SLVAO MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf
MCP6004T-I/SLVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6004T-E/STVAO MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf
MCP6004T-E/STVAO
Hersteller: Microchip Technology
Description: IC OP AMP 4CH 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
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2500+1.06 EUR
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MCP6004-I/SLGVAO MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf
MCP6004-I/SLGVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6004-I/SLVAO MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf
MCP6004-I/SLVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MCP6004-E/SLVAO MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf
MCP6004-E/SLVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-SOIC
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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MIC39101-2.5YM 20005834A.pdf
MIC39101-2.5YM
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.5V 1A 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Active
Voltage Dropout (Max): 0.63V @ 1A
Protection Features: Over Current, Over Temperature, Reverse Polarity
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SY89838UMG-TR sy89838u.pdf
SY89838UMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:8 2GHZ 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 2:8
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Frequency - Max: 2 GHz
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SY89833LMG-TR sy89833l.pdf
SY89833LMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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SY89832UMG-TR sy89832u.pdf
SY89832UMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 2.5GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2.5 GHz
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SY89876LMG-TR sy89876l.pdf
SY89876LMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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SY89876LMG-TR sy89876l.pdf
SY89876LMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVDS
Type: Fanout Buffer (Distribution), Divider
Input: CML, HSTL, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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2+13.32 EUR
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SY89831UMG-TR sy89831u.pdf
SY89831UMG-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:4 2GHZ 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Translator
Input: CML, LVDS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-MLF® (3x3)
Part Status: Active
Frequency - Max: 2 GHz
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2+16.1 EUR
25+13.42 EUR
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SY89464UMY-TR sy89464u.pdf
SY89464UMY-TR
Hersteller: Microchip Technology
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
Produkt ist nicht verfügbar
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SY89464UMY-TR sy89464u.pdf
SY89464UMY-TR
Hersteller: Microchip Technology
Description: IC CLK MULTIPLX 2:10 2GHZ 44MLF
Packaging: Cut Tape (CT)
Package / Case: 44-VFQFN Exposed Pad, 44-MLF®
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Multiplexer
Input: CML, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.6V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 44-MLF® (7x7)
Part Status: Active
Frequency - Max: 2 GHz
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2+18.66 EUR
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1N2784 S,R21.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 22A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 22A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
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WP3232M6NFEI-320B2
WP3232M6NFEI-320B2
Hersteller: Microchip Technology
Description: WINPATH3 232M6 PROC. 320MHZ LF
Packaging: Tray
Package / Case: 896-BGA, FCBGA
Mounting Type: Surface Mount
Interface: I2C, RMII, UART
Program Memory Type: SRAM
Applications: Network Processor
Core Processor: MIPS32® 34Kc™
Supplier Device Package: 896-FCBGA (31x31)
Part Status: Active
DigiKey Programmable: Not Verified
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1+589.95 EUR
25+491.51 EUR
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PIC16F18857T-E/SSVAO
PIC16F18857T-E/SSVAO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC16F18857T-I/SO 40001768A.pdf
PIC16F18857T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 56KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F18857-E/SSVAO
PIC16F18857-E/SSVAO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 56KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 56KB (32K x 14)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JANS1N5712-1/TR
JANS1N5712-1/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 75MA DO35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-35 (DO-204AH)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Qualification: MIL-PRF-19500/444
Produkt ist nicht verfügbar
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JANS1N5712UR-1
JANS1N5712UR-1
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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JANS1N5712UR-1/TR
JANS1N5712UR-1/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 75MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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JANS1N5712UBD/TR
JANS1N5712UBD/TR
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 16V 75MA UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 75mA
Supplier Device Package: UB
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 16 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
Current - Reverse Leakage @ Vr: 150 nA @ 16 V
Produkt ist nicht verfügbar
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EV03J37A dsPIC33CK64MC105-Motor-Control-DIM-Info-Sheet-DS50003344.pdf
EV03J37A
Hersteller: Microchip Technology
Description: DSPIC33CK64MC105 MC DIM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Utilized IC / Part: dsPIC33CK64MC105
Platform: Dual-Inline Module (DIM)
Part Status: Active
auf Bestellung 7 Stücke:
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1+33.21 EUR
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EV84C64A 50W_Interleaved_LLC_Converter_Development_Board_User%27s_Guide.pdf
EV84C64A
Hersteller: Microchip Technology
Description: ILLC DEVELOPMENT BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: dsPIC
Utilized IC / Part: dsPIC33CH128MP506
Part Status: Active
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MNS2N2222AUBP/TR 2N2221+2N2222+A+AL+AUA+AB+MIL-PRF-19500_255.pdf
MNS2N2222AUBP/TR
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Grade: Military
Qualification: MIL-PRF-19500/255
Produkt ist nicht verfügbar
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MSR2N2222AUB
MSR2N2222AUB
Hersteller: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Active
Supplier Device Package: UB
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Current - Collector Cutoff (Max): 50nA
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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DSA1101BL3-040.0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
Frequency: 40 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BL3-001.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL3-001.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 1 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.5mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSA1101BL3-050.0000TVAO
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOW JITTER -40C-10
Base Resonator: MEMS
Frequency: 50 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSA1001BL3-025.0000VAO DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Base Resonator: MEMS
Frequency: 25 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSA1101BL3-050.0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOW JITTER -40C-10
Base Resonator: MEMS
Frequency: 50 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 6-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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DSA1001BL3-025.0000TVAO DSA1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-for-Automotive-DS20005889B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, LOW
Base Resonator: MEMS
Frequency: 25 MHz
Part Status: Active
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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ATTINY426-SFR ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf
ATTINY426-SFR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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10+2.15 EUR
25+1.98 EUR
100+1.81 EUR
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ATTINY427-MFR ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf
ATTINY427-MFR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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10+2.12 EUR
25+2.07 EUR
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UPS5819E3/TR13 UPS5817e3.pdf
UPS5819E3/TR13
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Tape & Reel (TR)
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UPS5819E3/TR13 UPS5817e3.pdf
UPS5819E3/TR13
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 1A POWERMITE1
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Cut Tape (CT)
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 60pF @ 5V, 1MHz
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24+0.9 EUR
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UPS5817E3/TR7 UPS5817e3.pdf
UPS5817E3/TR7
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Current - Average Rectified (Io): 1A
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
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UPS5817E3/TR7 UPS5817e3.pdf
UPS5817E3/TR7
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 1A POWERMITE1
Voltage - Forward (Vf) (Max) @ If: 450 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Powermite 1 (DO216-AA)
Current - Average Rectified (Io): 1A
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: DO-216AA
Packaging: Cut Tape (CT)
Current - Reverse Leakage @ Vr: 1 mA @ 20 V
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24+0.9 EUR
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MSCGLQ50DH120CTBL2NG MSCGLQ50DH120CTBL2NG.pdf
Hersteller: Microchip Technology
Description: PM-IGBT-SBD-BL2
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A
NTC Thermistor: Yes
Part Status: Active
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 375 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 2.77 nF @ 25 V
Produkt ist nicht verfügbar
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EQCO125T40C1T-I/8EX 60001589D.pdf
EQCO125T40C1T-I/8EX
Hersteller: Microchip Technology
Description: IC DRIVER 1/0 16QFN TR
Part Status: Last Time Buy
Supplier Device Package: 16-QFN (4x4)
Data Rate: 12.5Gbps
Number of Drivers/Receivers: 1/0
Voltage - Supply: 1.25V
Operating Temperature: -40°C ~ 85°C
Type: Driver
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
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1000+62.43 EUR
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EQCO125T40C1T-I/8EX 60001589D.pdf
EQCO125T40C1T-I/8EX
Hersteller: Microchip Technology
Description: IC DRIVER 1/0 16QFN TR
Part Status: Last Time Buy
Supplier Device Package: 16-QFN (4x4)
Data Rate: 12.5Gbps
Number of Drivers/Receivers: 1/0
Voltage - Supply: 1.25V
Operating Temperature: -40°C ~ 85°C
Type: Driver
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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2CGA301A-MSCL
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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2CGA201A-MSCL
Hersteller: Microchip Technology
Description: POWER BJT
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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CMLRGLQ80V601AMXG-AS
Hersteller: Microchip Technology
Description: IC POWER MODULE SMD
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCP3202-CI/SNVAO 21034F.pdf
MCP3202-CI/SNVAO
Hersteller: Microchip Technology
Description: IC ADC 12BIT SAR 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential, Single Ended
Number of Inputs: 1, 2
Supplier Device Package: 8-SOIC
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MSMBJ26CAe3 10560-msmb-datasheet
MSMBJ26CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Qualification: MIL-PRF-19500
Grade: Military
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Produkt ist nicht verfügbar
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MASMBJ26CAe3 10560-msmb-datasheet
MASMBJ26CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Produkt ist nicht verfügbar
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MXSMBJ26CAe3 10560-msmb-datasheet
MXSMBJ26CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
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MXLSMBJ26CA 10560-msmb-datasheet
MXLSMBJ26CA
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Produkt ist nicht verfügbar
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MXSMBJ26CA 10560-msmb-datasheet
MXSMBJ26CA
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
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MASMBJ26CA 10560-msmb-datasheet
MASMBJ26CA
Hersteller: Microchip Technology
Description: TVS DIODE 26VWM 42.1VC SMBJ
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 42.1V
Voltage - Breakdown (Min): 28.9V
Bidirectional Channels: 1
Supplier Device Package: SMBJ (DO-214AA)
Voltage - Reverse Standoff (Typ): 26V
Current - Peak Pulse (10/1000µs): 14.2A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AA, SMB
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
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