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1N5229BUR-1/TR 1N5229BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: DIODE ZENER 4.3V 500MW DO213AA
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 22 Ohms
Supplier Device Package: DO-213AA
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
auf Bestellung 319 Stücke:
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4+4.77 EUR
Mindestbestellmenge: 4
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ATMEGA328P-AURA0 Microchip Technology Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Bulk
Part Status: Last Time Buy
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 23
Produkt ist nicht verfügbar
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2ASC-12A2HP 2ASC-12A2HP Microchip Technology 2ASC-12A2HP-1200VDualChannelSiCCore2SpecSheetV4.pdf Description: IC GATE DRVR HALF-BRIDGE MODULE
Packaging: Bulk
Package / Case: 30-DIP Module
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 14V ~ 16V
Input Type: Non-Inverting
Supplier Device Package: Module
Rise / Fall Time (Typ): 80ns, 90ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, SiC MOSFET
Logic Voltage - VIL, VIH: 1.25V, 3.5V
Current - Peak Output (Source, Sink): 10A, 10A
Part Status: Active
DigiKey Programmable: Not Verified
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ASDAK-2ASC-12A1HP-62 ASDAK-2ASC-12A1HP-62 Microchip Technology ASDAK+Data+Sheet+V01.pdf Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2ASC-12A1HP
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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XMCA1 XMCA1 Microchip Technology XMCA1-XM3CoreAdapterBoard1SpecSheetV1.pdf Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2ASC-12A1HP
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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SP6CA1 SP6CA1 Microchip Technology SP6CA1-Driver-Core-Board-SpecSheet-1200V.pdf Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ASC-12A1HP
Supplied Contents: Board(s)
Part Status: Active
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MPFS095TLS-FCVG484I MPFS095TLS-FCVG484I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS025T-1FCVG484I MPFS025T-1FCVG484I Microchip Technology PolarFire-SoC-Product-Overview-60001656.pdf Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS025T-1FCVG484E MPFS025T-1FCVG484E Microchip Technology PolarFire-SoC-Product-Overview-60001656.pdf Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 230.4KB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS025TLS-FCVG484I MPFS025TLS-FCVG484I Microchip Technology 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS025TS-FCVG484I MPFS025TS-FCVG484I Microchip Technology 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS025TS-1FCVG484I MPFS025TS-1FCVG484I Microchip Technology 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+177.41 EUR
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MPFS095T-FCVG784E MPFS095T-FCVG784E Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS095T-1FCVG784E MPFS095T-1FCVG784E Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+412.26 EUR
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MPFS095T-FCVG784I MPFS095T-FCVG784I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS095TLS-FCVG784I MPFS095TLS-FCVG784I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+624.85 EUR
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MPFS095T-FCSG325I MPFS095T-FCSG325I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 325LFBGA
Packaging: Bulk
Package / Case: 325-LFBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 325-LFBGA (11x14.5)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+362.79 EUR
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MPFS160T-1FCVG484I MPFS160T-1FCVG484I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 1.4125MB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 161K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+533.67 EUR
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MPFS025TL-FCVG484I MPFS025TL-FCVG484I Microchip Technology 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+145.90 EUR
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MPFS095T-1FCVG784I MPFS095T-1FCVG784I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+493.29 EUR
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MPFS095TS-1FCVG784I MPFS095TS-1FCVG784I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS095T-FCVG484I MPFS095T-FCVG484I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MPFS095TL-FCVG484I MPFS095TL-FCVG484I Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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MCP1811BT-025/LT MCP1811BT-025/LT Microchip Technology MCP1811A-11B-12A-12B-Family-Data-Sheet-DS20006088C.pdf Description: IC REG LINEAR 2.5V 150MA SC-70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Produkt ist nicht verfügbar
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MCP1811BT-025/LT MCP1811BT-025/LT Microchip Technology MCP1811A-11B-12A-12B-Family-Data-Sheet-DS20006088C.pdf Description: IC REG LINEAR 2.5V 150MA SC-70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Produkt ist nicht verfügbar
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ATTINY861V-10MUR ATTINY861V-10MUR Microchip Technology Atmel-2588-8-bit-AVR-Microcontrollers-tinyAVR-ATtiny261-ATtiny461-ATtiny861_Datasheet-Summary.pdf Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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ATTINY861V-10MUR ATTINY861V-10MUR Microchip Technology Atmel-2588-8-bit-AVR-Microcontrollers-tinyAVR-ATtiny261-ATtiny461-ATtiny861_Datasheet-Summary.pdf Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
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4+5.60 EUR
25+5.15 EUR
100+4.64 EUR
Mindestbestellmenge: 4
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MSCSM70TLM10C3AG MSCSM70TLM10C3AG Microchip Technology Description: SIC 4N-CH 700V 241A MODULE
Packaging: Box
Package / Case: Module
Mounting Type: Through Hole
Configuration: 4 N-Channel
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 690W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 241A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA (Typ)
Supplier Device Package: Module
Part Status: Active
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1+607.48 EUR
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APT10M19BVRG APT10M19BVRG Microchip Technology 6596-apt10m19bvr-datasheet Description: MOSFET N-CH 100V 75A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 500mA, 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-247 [B]
Part Status: Active
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 300 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6120 pF @ 25 V
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1+20.38 EUR
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dsPIC33EP32GS502T-I/MM dsPIC33EP32GS502T-I/MM Microchip Technology 70005127d.pdf Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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dsPIC33EP32GS502T-I/MM dsPIC33EP32GS502T-I/MM Microchip Technology 70005127d.pdf Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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ATMEGA88PA-MMH ATMEGA88PA-MMH Microchip Technology ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf description Description: IC MCU 8BIT 8KB FLASH 28VQFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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ATTINY44A-PU ATTINY44A-PU Microchip Technology ATtiny24A-44A-84A-DataSheet-DS40002269A.pdf Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
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AT89LV52-12PI AT89LV52-12PI Microchip Technology AT89LV52.pdf Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT89LV51-12PI AT89LV51-12PI Microchip Technology AT89LV51.pdf Description: IC MCU 8BIT 4KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N5809 1N5809 Microchip Technology 123509-lds-0168-datasheet Description: DIODE STANDARD 100V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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1N5804 1N5804 Microchip Technology 11055-sd40a-datasheet Description: DIODE GEN PURP 100V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
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MNS2N3700UB/TR MNS2N3700UB/TR Microchip Technology Description: MNS2N3700UB
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
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MNS2N3700UB/TR MNS2N3700UB/TR Microchip Technology Description: MNS2N3700UB
Packaging: Cut Tape (CT)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
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ATTINY24A-MMHR ATTINY24A-MMHR Microchip Technology 8183S.pdf Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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ATTINY24A-MMHR ATTINY24A-MMHR Microchip Technology 8183S.pdf Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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DSA400-3333Q0172KL2VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0078KL1TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0172KL1VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0001KL1TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4441Q0170KL1TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-1111Q0169KL2VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0171KL1TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0001KL2VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0172KL2TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0001KL1VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0167KL1VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0001KL2TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0078KL2VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0172KL1TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0167KL2TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0001KL2TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0078KL2TVAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-1111Q0169KL1VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0171KL1VAO Microchip Technology DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1N5229BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
1N5229BUR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 4.3V 500MW DO213AA
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 22 Ohms
Supplier Device Package: DO-213AA
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
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Anzahl Preis
4+4.77 EUR
Mindestbestellmenge: 4
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ATMEGA328P-AURA0
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Bulk
Part Status: Last Time Buy
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 23
Produkt ist nicht verfügbar
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2ASC-12A2HP 2ASC-12A2HP-1200VDualChannelSiCCore2SpecSheetV4.pdf
2ASC-12A2HP
Hersteller: Microchip Technology
Description: IC GATE DRVR HALF-BRIDGE MODULE
Packaging: Bulk
Package / Case: 30-DIP Module
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 14V ~ 16V
Input Type: Non-Inverting
Supplier Device Package: Module
Rise / Fall Time (Typ): 80ns, 90ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, SiC MOSFET
Logic Voltage - VIL, VIH: 1.25V, 3.5V
Current - Peak Output (Source, Sink): 10A, 10A
Part Status: Active
DigiKey Programmable: Not Verified
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1+219.54 EUR
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ASDAK-2ASC-12A1HP-62 ASDAK+Data+Sheet+V01.pdf
ASDAK-2ASC-12A1HP-62
Hersteller: Microchip Technology
Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2ASC-12A1HP
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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XMCA1 XMCA1-XM3CoreAdapterBoard1SpecSheetV1.pdf
XMCA1
Hersteller: Microchip Technology
Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2ASC-12A1HP
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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Anzahl Preis
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SP6CA1 SP6CA1-Driver-Core-Board-SpecSheet-1200V.pdf
SP6CA1
Hersteller: Microchip Technology
Description: EVAL BOARD FOR 2ASC-12A1HP
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ASC-12A1HP
Supplied Contents: Board(s)
Part Status: Active
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MPFS095TLS-FCVG484I 1244583-polarfire-soc-advance-datasheet
MPFS095TLS-FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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1+474.16 EUR
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MPFS025T-1FCVG484I PolarFire-SoC-Product-Overview-60001656.pdf
MPFS025T-1FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
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MPFS025T-1FCVG484E PolarFire-SoC-Product-Overview-60001656.pdf
MPFS025T-1FCVG484E
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 230.4KB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+123.46 EUR
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MPFS025TLS-FCVG484I 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide
MPFS025TLS-FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+177.41 EUR
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MPFS025TS-FCVG484I 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide
MPFS025TS-FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+158.40 EUR
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MPFS025TS-1FCVG484I 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide
MPFS025TS-1FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+177.41 EUR
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MPFS095T-FCVG784E 1244583-polarfire-soc-advance-datasheet
MPFS095T-FCVG784E
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+374.79 EUR
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MPFS095T-1FCVG784E 1244583-polarfire-soc-advance-datasheet
MPFS095T-1FCVG784E
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+412.26 EUR
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MPFS095T-FCVG784I 1244583-polarfire-soc-advance-datasheet
MPFS095T-FCVG784I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+412.26 EUR
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MPFS095TLS-FCVG784I 1244583-polarfire-soc-advance-datasheet
MPFS095TLS-FCVG784I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+624.85 EUR
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MPFS095T-FCSG325I 1244583-polarfire-soc-advance-datasheet
MPFS095T-FCSG325I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 325LFBGA
Packaging: Bulk
Package / Case: 325-LFBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 325-LFBGA (11x14.5)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+362.79 EUR
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MPFS160T-1FCVG484I 1244583-polarfire-soc-advance-datasheet
MPFS160T-1FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 1.4125MB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 161K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+533.67 EUR
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MPFS025TL-FCVG484I 1244575-ug0897-polarfire-and-polarfire-soc-fpga-power-estimator-user-guide
MPFS025TL-FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+145.90 EUR
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MPFS095T-1FCVG784I 1244583-polarfire-soc-advance-datasheet
MPFS095T-1FCVG784I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+493.29 EUR
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MPFS095TS-1FCVG784I 1244583-polarfire-soc-advance-datasheet
MPFS095TS-1FCVG784I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+624.85 EUR
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MPFS095T-FCVG484I 1244583-polarfire-soc-advance-datasheet
MPFS095T-FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Anzahl Preis
1+330.65 EUR
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MPFS095TL-FCVG484I 1244583-polarfire-soc-advance-datasheet
MPFS095TL-FCVG484I
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+389.80 EUR
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MCP1811BT-025/LT MCP1811A-11B-12A-12B-Family-Data-Sheet-DS20006088C.pdf
MCP1811BT-025/LT
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.5V 150MA SC-70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Produkt ist nicht verfügbar
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MCP1811BT-025/LT MCP1811A-11B-12A-12B-Family-Data-Sheet-DS20006088C.pdf
MCP1811BT-025/LT
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.5V 150MA SC-70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Produkt ist nicht verfügbar
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ATTINY861V-10MUR Atmel-2588-8-bit-AVR-Microcontrollers-tinyAVR-ATtiny261-ATtiny461-ATtiny861_Datasheet-Summary.pdf
ATTINY861V-10MUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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ATTINY861V-10MUR Atmel-2588-8-bit-AVR-Microcontrollers-tinyAVR-ATtiny261-ATtiny461-ATtiny861_Datasheet-Summary.pdf
ATTINY861V-10MUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
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MSCSM70TLM10C3AG
MSCSM70TLM10C3AG
Hersteller: Microchip Technology
Description: SIC 4N-CH 700V 241A MODULE
Packaging: Box
Package / Case: Module
Mounting Type: Through Hole
Configuration: 4 N-Channel
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 690W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 241A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA (Typ)
Supplier Device Package: Module
Part Status: Active
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APT10M19BVRG 6596-apt10m19bvr-datasheet
APT10M19BVRG
Hersteller: Microchip Technology
Description: MOSFET N-CH 100V 75A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 500mA, 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-247 [B]
Part Status: Active
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 300 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6120 pF @ 25 V
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dsPIC33EP32GS502T-I/MM 70005127d.pdf
dsPIC33EP32GS502T-I/MM
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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Anzahl Preis
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dsPIC33EP32GS502T-I/MM 70005127d.pdf
dsPIC33EP32GS502T-I/MM
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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3+7.69 EUR
25+7.03 EUR
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ATMEGA88PA-MMH description ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf
ATMEGA88PA-MMH
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28VQFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
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6+3.33 EUR
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ATTINY44A-PU ATtiny24A-44A-84A-DataSheet-DS40002269A.pdf
ATTINY44A-PU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
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8+2.38 EUR
25+2.17 EUR
100+1.97 EUR
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AT89LV52-12PI AT89LV52.pdf
AT89LV52-12PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT89LV51-12PI AT89LV51.pdf
AT89LV51-12PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N5809 123509-lds-0168-datasheet
1N5809
Hersteller: Microchip Technology
Description: DIODE STANDARD 100V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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2+10.98 EUR
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1N5804 11055-sd40a-datasheet
1N5804
Hersteller: Microchip Technology
Description: DIODE GEN PURP 100V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
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3+8.57 EUR
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MNS2N3700UB/TR
MNS2N3700UB/TR
Hersteller: Microchip Technology
Description: MNS2N3700UB
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
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Anzahl Preis
100+19.42 EUR
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MNS2N3700UB/TR
MNS2N3700UB/TR
Hersteller: Microchip Technology
Description: MNS2N3700UB
Packaging: Cut Tape (CT)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
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1+20.91 EUR
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ATTINY24A-MMHR 8183S.pdf
ATTINY24A-MMHR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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6000+1.39 EUR
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ATTINY24A-MMHR 8183S.pdf
ATTINY24A-MMHR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 15994 Stücke:
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Anzahl Preis
11+1.67 EUR
25+1.56 EUR
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DSA400-3333Q0172KL2VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0078KL1TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0172KL1VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0001KL1TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4441Q0170KL1TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-1111Q0169KL2VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0171KL1TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0001KL2VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-3333Q0172KL2TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0001KL1VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA400-4444Q0167KL1VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-4444Q0001KL2TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-3333Q0078KL2VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-3333Q0172KL1TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-4444Q0167KL2TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-3333Q0001KL2TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-3333Q0078KL2TVAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-1111Q0169KL1VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DSA400-3333Q0171KL1VAO DSA400-Configurable-Four-Output-Low-Jitter-Clock-Generator-for-Automotive-DS20006356A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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