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PIC18F44Q71T-I/MP PIC18F44Q71T-I/MP Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: IC MCU 8BIT 16KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 37
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PIC18F54Q71T-I/PT PIC18F54Q71T-I/PT Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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PIC18F54Q71T-I/PT PIC18F54Q71T-I/PT Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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PIC18F55Q71T-I/PT PIC18F55Q71T-I/PT Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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PIC18F55Q71T-I/PT PIC18F55Q71T-I/PT Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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PIC18F55Q71T-I/6LX PIC18F55Q71T-I/6LX Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: 32KB FLASH, 2KB RAM, 2X OPA, 12-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
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PIC18F55Q71T-I/6LX PIC18F55Q71T-I/6LX Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: 32KB FLASH, 2KB RAM, 2X OPA, 12-
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
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PIC18F46Q71T-I/MP PIC18F46Q71T-I/MP Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: IC MCU 8BIT 64KB FLASH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 37
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PIC18F46Q71T-I/MP PIC18F46Q71T-I/MP Microchip Technology PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf Description: IC MCU 8BIT 64KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 37
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EV11S96A EV11S96A Microchip Technology Description: EVB-LAN9354-RMII
Packaging: Box
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: LAN9354
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MIC5255-2.85YML-TR MIC5255-2.85YML-TR Microchip Technology MIC5255.pdf Description: IC REG LINEAR 2.85V 150MA 6MLF
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 150 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 6-DFN (2x2)
Voltage - Output (Min/Fixed): 2.85V
Control Features: Enable
PSRR: 60dB ~ 50dB (10Hz ~ 10kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Over Temperature, Under Voltage Lockout (UVLO)
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MIC5255-2.85YML-TR MIC5255-2.85YML-TR Microchip Technology MIC5255.pdf Description: IC REG LINEAR 2.85V 150MA 6MLF
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 150 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 6-DFN (2x2)
Voltage - Output (Min/Fixed): 2.85V
Control Features: Enable
PSRR: 60dB ~ 50dB (10Hz ~ 10kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Over Temperature, Under Voltage Lockout (UVLO)
Produkt ist nicht verfügbar
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25LC010AT-E/SN 25LC010AT-E/SN Microchip Technology 21832H.pdf Description: IC EEPROM 1KBIT SPI 10MHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
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25LC010AT-E/SN 25LC010AT-E/SN Microchip Technology 21832H.pdf Description: IC EEPROM 1KBIT SPI 10MHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
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25LC010AT-E/OT 25LC010AT-E/OT Microchip Technology 21832H.pdf Description: IC EEPROM 1KBIT SPI SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-6
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
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25LC010AT-E/OT 25LC010AT-E/OT Microchip Technology 21832H.pdf Description: IC EEPROM 1KBIT SPI SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-6
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
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JANHCA1N5543B JANHCA1N5543B Microchip Technology 14809-military-qualified-die-chip Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-35
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 22.4 V
Qualification: MIL-PRF-19500/437
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JANHCA1N968B JANHCA1N968B Microchip Technology 14809-military-qualified-die-chip Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-7 (DO-204AA)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 15.2 V
Qualification: MIL-PRF-19500/117
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JANHCA1N4581A JANHCA1N4581A Microchip Technology 14809-military-qualified-die-chip Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/452
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JANHCA1N4117 Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 150 Ohms
Supplier Device Package: DO-7 (DO-204AA)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 19 V
Qualification: MIL-PRF-19500/435
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JANHCA1N4582A JANHCA1N4582A Microchip Technology 14809-military-qualified-die-chip Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/452
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JANHCA1N4583A JANHCA1N4583A Microchip Technology 14809-military-qualified-die-chip Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/452
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USB7050T-I/KDX USB7050T-I/KDX Microchip Technology Description: 4 PORT USB3.1 GEN1 - PD UPSTREAM
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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USB7050T-I/KDX USB7050T-I/KDX Microchip Technology Description: 4 PORT USB3.1 GEN1 - PD UPSTREAM
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MSMCG10CA MSMCG10CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 10VWM 17VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JANTX1N5528CUR-1 Microchip Technology 8860-lds-0037-datasheet Description: DIODE ZENER 8.2V 500MW DO213AA
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 7.5 V
Qualification: MIL-PRF-19500/437
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1N3494R Microchip Technology S%2CR35PF.pdf Description: DIODE STANDARD REV 300V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 300 V
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1N3494 Microchip Technology S%2CR35PF.pdf Description: DIODE STANDARD 300V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 300 V
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DSC1003CI5-020.0000T DSC1003CI5-020.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Base Resonator: MEMS
Frequency: 20 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6mA
Ratings: AEC-Q100
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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DSC1003CI5-020.0000T DSC1003CI5-020.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 20 MHz
Height - Seated (Max): 0.035" (0.90mm)
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
Current - Supply (Max): 6mA
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PIC32MX550F256HT-I/PT PIC32MX550F256HT-I/PT Microchip Technology PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: MIPS32® M4K™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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PIC32MX550F256HT-I/PT PIC32MX550F256HT-I/PT Microchip Technology PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: MIPS32® M4K™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
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DSC1001DL5-133.3330T DSC1001DL5-133.3330T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1001CL5-133.3330T DSC1001CL5-133.3330T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1001BL5-133.3330T DSC1001BL5-133.3330T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1001AL5-133.3330T DSC1001AL5-133.3330T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1103CL5-135.0000T DSC1103CL5-135.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSCILLATOR SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 135 MHz
Base Resonator: MEMS
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DSC1123DL5-135.0000T DSC1123DL5-135.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 135.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 135 MHz
Base Resonator: MEMS
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DSC1123DL5-136.5000T DSC1123DL5-136.5000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 136.5000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 136.5 MHz
Base Resonator: MEMS
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PIC18LF57K42T-I/PT PIC18LF57K42T-I/PT Microchip Technology PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf Description: IC MCU 8BIT 128KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 48-TQFP-EP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 43x12b; D/A 1x5b
Core Processor: PIC
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (64K x 16)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Cut Tape (CT)
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MCP23S17T-E/SSVAO MCP23S17T-E/SSVAO Microchip Technology MCP23017-Data-Sheet-DS20001952.pdf Description: 16-BIT INPUT/OUTPUT EXPANDER, SP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Clock Frequency: 10 MHz
Interrupt Output: Yes
Supplier Device Package: 28-SSOP
Current - Output Source/Sink: 25mA
Grade: Automotive
Qualification: AEC-Q100
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MIC2025-1FBM Microchip Technology Description: IC PWR SWITCH N-CHAN 1:1 8SOIC
Packaging: Bulk
Features: Slew Rate Controlled, Status Flag
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 90mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 8-SOIC
Fault Protection: Current Limiting (Fixed), Over Temperature, UVLO
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KVX2162-23-0/TR KVX2162-23-0/TR Microchip Technology 8792-kvx2000-kvx3000-23-datasheet Description: SI TVAR NON HERMETIC PLASTIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 26pF @ 0V, 1MHz
Q @ Vr, F: 400 @ 4V, 50MHz
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 22 V
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KVX2162-23-0/TR KVX2162-23-0/TR Microchip Technology 8792-kvx2000-kvx3000-23-datasheet Description: SI TVAR NON HERMETIC PLASTIC SMT
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 26pF @ 0V, 1MHz
Q @ Vr, F: 400 @ 4V, 50MHz
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 22 V
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AT17LV512A-10JC AT17LV512A-10JC Microchip Technology AT17LVzzzA.pdf Description: IC CONFIG SEEPROM 512K 20PLCC
DigiKey Programmable: Not Verified
Supplier Device Package: 20-PLCC (9x9)
Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C
Programmable Type: Serial EEPROM
Memory Size: 512KB
Mounting Type: Surface Mount
Package / Case: 20-LCC (J-Lead)
Packaging: Tube
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CDLL4901A Microchip Technology 8392-cdll4896-4915a-datasheet Description: DIODE ZENER
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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CDLL4901A/TR Microchip Technology 8392-cdll4896-4915a-datasheet Description: DIODE ZENER TEMP COMPENSATED
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -55°C ~ 100°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4901 Microchip Technology 8392-cdll4896-4915a-datasheet Description: DIODE ZENER
Packaging: Bulk
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
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CDLL4901/TR Microchip Technology 8392-cdll4896-4915a-datasheet Description: DIODE ZENER TEMP COMPENSATED
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -65°C ~ 100°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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M15KP58A M15KP58A Microchip Technology M15KP22A%E2%80%93MXL15KP280CA%28e3%29.pdf Description: TVS DIODE 58VWM 94VC DO204AR
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 15000W (15kW)
Voltage - Clamping (Max) @ Ipp: 94V
Voltage - Breakdown (Min): 64.4V
Unidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 58V
Current - Peak Pulse (10/1000µs): 160A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
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MXLSMCG150Ae3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 150VWM 243VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 167V
Voltage - Clamping (Max) @ Ipp: 243V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXL15KP240Ae3 MXL15KP240Ae3 Microchip Technology 9460-rf01011-m15kp-rev-e Description: TVS DIODE 240VWM 388VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 39A
Voltage - Reverse Standoff (Typ): 240V
Supplier Device Package: Case 5A (DO-204AR)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 267V
Voltage - Clamping (Max) @ Ipp: 388V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MIC2211-WOBML TR MIC2211-WOBML TR Microchip Technology mic2211.pdf Description: IC REG LINEAR 1.6V/2.9V 10MLF
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad, 10-MLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA, 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 2
Supplier Device Package: 10-MLF® (3x3)
Voltage - Output (Min/Fixed): 1.6V, 2.9V
Control Features: Enable
PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
Protection Features: Over Current, Over Temperature
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MIC39500-1.8WU MIC39500-1.8WU Microchip Technology MCRLS02043-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR 1.8V 5A TO263-3
Packaging: Bulk
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-3
Voltage - Output (Min/Fixed): 1.8V
Voltage Dropout (Max): 0.575V @ 5A
Protection Features: Over Current, Over Temperature, Reverse Polarity
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DSC1223CL2-148M5000T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 148.5 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
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DSC1224CL2-156M2500T DSC1224CL2-156M2500T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1224CL2-100M0000T DSC1224CL2-100M0000T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC, LOW JITTER, 100MHZ, HC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223CL2-125M0000T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC, LOW JITTER, 125MHZ, LV
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1223CL2-156M2500T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC, LOW JITTER, 156.25MHZ,
Base Resonator: MEMS
Frequency: 156.25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1223CL2-100M0000T DSC1223CL2-100M0000T Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC, LOW JITTER, 100MHZ, LV
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Packaging: Strip
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Produkt ist nicht verfügbar
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PIC18F44Q71T-I/MP PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F44Q71T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 37
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PIC18F54Q71T-I/PT PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F54Q71T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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PIC18F54Q71T-I/PT PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F54Q71T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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6+3.96 EUR
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PIC18F55Q71T-I/PT PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F55Q71T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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PIC18F55Q71T-I/PT PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F55Q71T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 44
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6+4.02 EUR
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PIC18F55Q71T-I/6LX PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F55Q71T-I/6LX
Hersteller: Microchip Technology
Description: 32KB FLASH, 2KB RAM, 2X OPA, 12-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
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PIC18F55Q71T-I/6LX PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F55Q71T-I/6LX
Hersteller: Microchip Technology
Description: 32KB FLASH, 2KB RAM, 2X OPA, 12-
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 43x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
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6+4.02 EUR
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PIC18F46Q71T-I/MP PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F46Q71T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 37
Produkt ist nicht verfügbar
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PIC18F46Q71T-I/MP PIC18F26-46-56Q71-Microcontroller-Data-Sheet-DS40002329.pdf
PIC18F46Q71T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2, 1x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 37
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6+3.61 EUR
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EV11S96A
EV11S96A
Hersteller: Microchip Technology
Description: EVB-LAN9354-RMII
Packaging: Box
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: LAN9354
Produkt ist nicht verfügbar
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MIC5255-2.85YML-TR MIC5255.pdf
MIC5255-2.85YML-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.85V 150MA 6MLF
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 150 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 6-DFN (2x2)
Voltage - Output (Min/Fixed): 2.85V
Control Features: Enable
PSRR: 60dB ~ 50dB (10Hz ~ 10kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Over Temperature, Under Voltage Lockout (UVLO)
Produkt ist nicht verfügbar
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MIC5255-2.85YML-TR MIC5255.pdf
MIC5255-2.85YML-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.85V 150MA 6MLF
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-MLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 150 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: 6-DFN (2x2)
Voltage - Output (Min/Fixed): 2.85V
Control Features: Enable
PSRR: 60dB ~ 50dB (10Hz ~ 10kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Over Temperature, Under Voltage Lockout (UVLO)
Produkt ist nicht verfügbar
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25LC010AT-E/SN 21832H.pdf
25LC010AT-E/SN
Hersteller: Microchip Technology
Description: IC EEPROM 1KBIT SPI 10MHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
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25LC010AT-E/SN 21832H.pdf
25LC010AT-E/SN
Hersteller: Microchip Technology
Description: IC EEPROM 1KBIT SPI 10MHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
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25LC010AT-E/OT 21832H.pdf
25LC010AT-E/OT
Hersteller: Microchip Technology
Description: IC EEPROM 1KBIT SPI SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-6
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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25LC010AT-E/OT 21832H.pdf
25LC010AT-E/OT
Hersteller: Microchip Technology
Description: IC EEPROM 1KBIT SPI SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-6
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
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20+1.09 EUR
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JANHCA1N5543B 14809-military-qualified-die-chip
JANHCA1N5543B
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-35
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 22.4 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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JANHCA1N968B 14809-military-qualified-die-chip
JANHCA1N968B
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-7 (DO-204AA)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 15.2 V
Qualification: MIL-PRF-19500/117
Produkt ist nicht verfügbar
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JANHCA1N4581A 14809-military-qualified-die-chip
JANHCA1N4581A
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/452
Produkt ist nicht verfügbar
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JANHCA1N4117
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 150 Ohms
Supplier Device Package: DO-7 (DO-204AA)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 19 V
Qualification: MIL-PRF-19500/435
Produkt ist nicht verfügbar
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JANHCA1N4582A 14809-military-qualified-die-chip
JANHCA1N4582A
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/452
Produkt ist nicht verfügbar
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JANHCA1N4583A 14809-military-qualified-die-chip
JANHCA1N4583A
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.4 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/452
Produkt ist nicht verfügbar
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USB7050T-I/KDX
USB7050T-I/KDX
Hersteller: Microchip Technology
Description: 4 PORT USB3.1 GEN1 - PD UPSTREAM
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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USB7050T-I/KDX
USB7050T-I/KDX
Hersteller: Microchip Technology
Description: 4 PORT USB3.1 GEN1 - PD UPSTREAM
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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MSMCG10CA 10561-msmc-datasheet
MSMCG10CA
Hersteller: Microchip Technology
Description: TVS DIODE 10VWM 17VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: SMCG (DO-215AB)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JANTX1N5528CUR-1 8860-lds-0037-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 8.2V 500MW DO213AA
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 7.5 V
Qualification: MIL-PRF-19500/437
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1N3494R S%2CR35PF.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD REV 300V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 300 V
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1N3494 S%2CR35PF.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD 300V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 300 V
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DSC1003CI5-020.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1003CI5-020.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Base Resonator: MEMS
Frequency: 20 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6mA
Ratings: AEC-Q100
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
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DSC1003CI5-020.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1003CI5-020.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 20 MHz
Height - Seated (Max): 0.035" (0.90mm)
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Cut Tape (CT)
Current - Supply (Max): 6mA
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PIC32MX550F256HT-I/PT PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf
PIC32MX550F256HT-I/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: MIPS32® M4K™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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PIC32MX550F256HT-I/PT PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf
PIC32MX550F256HT-I/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: MIPS32® M4K™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
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DSC1001DL5-133.3330T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-133.3330T
Hersteller: Microchip Technology
Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1001CL5-133.3330T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL5-133.3330T
Hersteller: Microchip Technology
Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1001BL5-133.3330T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-133.3330T
Hersteller: Microchip Technology
Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1001AL5-133.3330T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AL5-133.3330T
Hersteller: Microchip Technology
Description: MEMS OSC XO 133.3330MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1103CL5-135.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL5-135.0000T
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 135 MHz
Base Resonator: MEMS
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DSC1123DL5-135.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123DL5-135.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 135.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 135 MHz
Base Resonator: MEMS
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DSC1123DL5-136.5000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123DL5-136.5000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 136.5000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 136.5 MHz
Base Resonator: MEMS
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PIC18LF57K42T-I/PT PIC18(L)F26-27-45-46-47-55-56-57K42-Data-Sheet-40001919G.pdf
PIC18LF57K42T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 48-TQFP-EP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 43x12b; D/A 1x5b
Core Processor: PIC
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (64K x 16)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Cut Tape (CT)
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MCP23S17T-E/SSVAO MCP23017-Data-Sheet-DS20001952.pdf
MCP23S17T-E/SSVAO
Hersteller: Microchip Technology
Description: 16-BIT INPUT/OUTPUT EXPANDER, SP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Clock Frequency: 10 MHz
Interrupt Output: Yes
Supplier Device Package: 28-SSOP
Current - Output Source/Sink: 25mA
Grade: Automotive
Qualification: AEC-Q100
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MIC2025-1FBM
Hersteller: Microchip Technology
Description: IC PWR SWITCH N-CHAN 1:1 8SOIC
Packaging: Bulk
Features: Slew Rate Controlled, Status Flag
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 90mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 8-SOIC
Fault Protection: Current Limiting (Fixed), Over Temperature, UVLO
Produkt ist nicht verfügbar
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KVX2162-23-0/TR 8792-kvx2000-kvx3000-23-datasheet
KVX2162-23-0/TR
Hersteller: Microchip Technology
Description: SI TVAR NON HERMETIC PLASTIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 26pF @ 0V, 1MHz
Q @ Vr, F: 400 @ 4V, 50MHz
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 22 V
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KVX2162-23-0/TR 8792-kvx2000-kvx3000-23-datasheet
KVX2162-23-0/TR
Hersteller: Microchip Technology
Description: SI TVAR NON HERMETIC PLASTIC SMT
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 26pF @ 0V, 1MHz
Q @ Vr, F: 400 @ 4V, 50MHz
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 22 V
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AT17LV512A-10JC AT17LVzzzA.pdf
AT17LV512A-10JC
Hersteller: Microchip Technology
Description: IC CONFIG SEEPROM 512K 20PLCC
DigiKey Programmable: Not Verified
Supplier Device Package: 20-PLCC (9x9)
Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C
Programmable Type: Serial EEPROM
Memory Size: 512KB
Mounting Type: Surface Mount
Package / Case: 20-LCC (J-Lead)
Packaging: Tube
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CDLL4901A 8392-cdll4896-4915a-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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CDLL4901A/TR 8392-cdll4896-4915a-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -55°C ~ 100°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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CDLL4901 8392-cdll4896-4915a-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
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CDLL4901/TR 8392-cdll4896-4915a-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Current - Reverse Leakage @ Vr: 15 µA @ 8 V
Power - Max: 500 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 12.8 V
Operating Temperature: -65°C ~ 100°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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M15KP58A M15KP22A%E2%80%93MXL15KP280CA%28e3%29.pdf
M15KP58A
Hersteller: Microchip Technology
Description: TVS DIODE 58VWM 94VC DO204AR
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 15000W (15kW)
Voltage - Clamping (Max) @ Ipp: 94V
Voltage - Breakdown (Min): 64.4V
Unidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 58V
Current - Peak Pulse (10/1000µs): 160A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
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MXLSMCG150Ae3 10561-msmc-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 150VWM 243VC SMCG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 150V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 167V
Voltage - Clamping (Max) @ Ipp: 243V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXL15KP240Ae3 9460-rf01011-m15kp-rev-e
MXL15KP240Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 240VWM 388VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 39A
Voltage - Reverse Standoff (Typ): 240V
Supplier Device Package: Case 5A (DO-204AR)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 267V
Voltage - Clamping (Max) @ Ipp: 388V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MIC2211-WOBML TR mic2211.pdf
MIC2211-WOBML TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.6V/2.9V 10MLF
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad, 10-MLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA, 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 2
Supplier Device Package: 10-MLF® (3x3)
Voltage - Output (Min/Fixed): 1.6V, 2.9V
Control Features: Enable
PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
Protection Features: Over Current, Over Temperature
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MIC39500-1.8WU MCRLS02043-1.pdf?t.download=true&u=5oefqw
MIC39500-1.8WU
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.8V 5A TO263-3
Packaging: Bulk
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-3
Voltage - Output (Min/Fixed): 1.8V
Voltage Dropout (Max): 0.575V @ 5A
Protection Features: Over Current, Over Temperature, Reverse Polarity
auf Bestellung 7306 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
68+8.54 EUR
Mindestbestellmenge: 68 Stücke
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DSC1223CL2-148M5000T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
Hersteller: Microchip Technology
Description: MEMS OSC
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 148.5 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
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DSC1224CL2-156M2500T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1224CL2-156M2500T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1224CL2-100M0000T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1224CL2-100M0000T
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 100MHZ, HC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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DSC1223CL2-125M0000T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 125MHZ, LV
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1223CL2-156M2500T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 156.25MHZ,
Base Resonator: MEMS
Frequency: 156.25 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1223CL2-100M0000T DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1223CL2-100M0000T
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 100MHZ, LV
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Packaging: Strip
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 32mA (Typ)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Produkt ist nicht verfügbar
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