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DSC1211DA2-C0032T DSC1211DA2-C0032T Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
Produkt ist nicht verfügbar
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DSC1211CI2-C0028T DSC1211CI2-C0028T Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: MEMS OSC (FS), HIGH PERFORMANCE,
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (3.2x2.5)
Produkt ist nicht verfügbar
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DSC1211DA2-C0032 DSC1211DA2-C0032 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: MEMS OSC SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
Produkt ist nicht verfügbar
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DSC1211BE3-C0031T DSC1211BE3-C0031T Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-CDFN (5x3.2)
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DSC1211BE3-C0031 DSC1211BE3-C0031 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: MEMS OSC SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-CDFN (5x3.2)
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DSC1211NE3-C0021T DSC1211NE3-C0021T Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: MEMS OSC (FS), HIGH PERFORMANCE,
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (7x5)
Produkt ist nicht verfügbar
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DSC1211NI3-C0018T DSC1211NI3-C0018T Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (7x5)
Produkt ist nicht verfügbar
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DSC1211NA3-C0024T DSC1211NA3-C0024T Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (7x5)
Produkt ist nicht verfügbar
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JANTX1N969B-1 JANTX1N969B-1 Microchip Technology 125314-lds-0287-datasheet Description: DIODE ZENER 22V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 17 V
Qualification: MIL-PRF-19500/117
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JANTX1N4125C-1 JANTX1N4125C-1 Microchip Technology 129734-lds-0245-2-datasheet Description: DIODE ZENER 47V 500MW DO35
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 250 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 35.8 V
Qualification: MIL-PRF-19500/435
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JAN1N4125CUR-1 Microchip Technology 5801-lds-0245-datasheet Description: DIODE ZENER 47V DO213AA
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 250 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 35.8 V
Qualification: MIL-PRF-19500/435
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DSC6001AA3B-PROGT Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tape & Reel (TR)
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DSC6001AA3B-PROGT Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Cut Tape (CT)
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DSC6101AA3B-PROGT Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tape & Reel (TR)
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DSC6101AA3B-PROGT Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Cut Tape (CT)
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DSC6003AA3B-PROGT DSC6003AA3B-PROGT Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 4-DFN (7x5)
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DSC6003AA3B-PROGT DSC6003AA3B-PROGT Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 4-DFN (7x5)
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DSC6101AA3B-PROG Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tube
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DSC6001AA3B-PROG DSC6001AA3B-PROG Microchip Technology Description: MEMS OSC, BLANK, LVCMOS, 20PPM,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 2 kHz ~ 80 MHz
Base Resonator: MEMS
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DSC6003AA3B-PROG DSC6003AA3B-PROG Microchip Technology Description: MEMS OSC, BLANK, LVCMOS, 20PPM,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 2 kHz ~ 80 MHz
Base Resonator: MEMS
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MAPLAD15KP17CAe3 MAPLAD15KP17CAe3 Microchip Technology 9522-mplad15kp-datasheet Description: TVS DIODE 17VWM 27.6VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 543A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 18.9V
Voltage - Clamping (Max) @ Ipp: 27.6V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PD39210C-022419 Microchip Technology Description: MCU FOR PD392XX FAMILY, BASED PD
Packaging: Tray
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DSC1123AI2-200.0000T DSC1123AI2-200.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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DSC1123CI2-200.0000T DSC1123CI2-200.0000T Microchip Technology DSC1%2C8yyy_Top_Marking_Spec.pdf Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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DSC1123CI2-200.0000T DSC1123CI2-200.0000T Microchip Technology DSC1%2C8yyy_Top_Marking_Spec.pdf Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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DSC1121BI2-200.0000T DSC1121BI2-200.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 200.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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JANTX1N6779 JANTX1N6779 Microchip Technology Description: DIODE GEN PURP 600V 15A TO257
Packaging: Bulk
Package / Case: TO-257-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Capacitance @ Vr, F: 300pF @ 5V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: TO-257
Operating Temperature - Junction: 150°C (Max)
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A
Current - Reverse Leakage @ Vr: 10 µA @ 480 V
Qualification: MIL-PRF-19500/647
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MSMLG5.0Ae3 Microchip Technology 10563-msml-datasheet Description: TVS DIODE 5VWM 9.2VC SMLG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 326A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: SMLG (DO-215AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLG58A/TR Microchip Technology 10563-msml-datasheet Description: TVS DIODE 58VWM 93.6VC SMLG
Packaging: Tape & Reel (TR)
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 32A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: SMLG (DO-215AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.4V
Voltage - Clamping (Max) @ Ipp: 93.6V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLG100A MSMLG100A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 100VWM 162VC SMLG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 18.6A
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: DO-215AB (SMLG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 111V
Voltage - Clamping (Max) @ Ipp: 162V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MP6KE10A MP6KE10A Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 8.55VWM 14.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 41A
Voltage - Reverse Standoff (Typ): 8.55V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.5V
Voltage - Clamping (Max) @ Ipp: 14.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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2N5338 2N5338 Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 6 W
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LXP1002-23-4/TR LXP1002-23-4/TR Microchip Technology 9457-lxp1000-sot23-series-datasheet Description: SI PIN NON HERMETIC PLASTIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.32pF @ 50V, 1MHz
Resistance @ If, F: 4Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23-3
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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LXP1002-23-4/TR LXP1002-23-4/TR Microchip Technology 9457-lxp1000-sot23-series-datasheet Description: SI PIN NON HERMETIC PLASTIC SMT
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.32pF @ 50V, 1MHz
Resistance @ If, F: 4Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23-3
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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JANTX2N2222AL JANTX2N2222AL Microchip Technology Description: TRANS NPN 50V 0.8A TO-218
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-218
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
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JANKCBR2N2222A JANKCBR2N2222A Microchip Technology Description: TRANS NPN 50V 0.8A TO18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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JANKCBF2N2222A JANKCBF2N2222A Microchip Technology Description: TRANS NPN 50V 0.8A TO18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MVR2N2222AUB MVR2N2222AUB Microchip Technology Description: TRANS NPN 50V 0.8A TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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PIC16F15324T-E/SL PIC16F15324T-E/SL Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 12
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PIC16F15324T-E/SL PIC16F15324T-E/SL Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 12
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10+1.80 EUR
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PIC16F15324T-E/ST PIC16F15324T-E/ST Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
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PIC16F15324T-E/ST PIC16F15324T-E/ST Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
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MXP4KE100Ae3 MXP4KE100Ae3 Microchip Technology 9517-mp4ke-pdf Description: TVS DIODE 85.5VWM 137VC DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 2.9A
Voltage - Reverse Standoff (Typ): 85.5V
Supplier Device Package: DO-204AL (DO-41)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 400W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG60A MSMBG60A Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMBG60CA MSMBG60CA Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG60CA MASMBG60CA Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG60CAe3 MASMBG60CAe3 Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG60A MASMBG60A Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMBG60Ae3 MASMBG60Ae3 Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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BR230D-78A2-12V-014L Microchip Technology Description: 4PDT 10 AMP SUPRESSED RELAY QPL,
Packaging: Bulk
Mounting Type: Chassis Mount
Coil Voltage: 12VDC
Operating Temperature: -70°C ~ 125°C
Termination Style: Plug In
Relay Type: General Purpose
Coil Current: 153.8 mA
Coil Type: Non Latching
Contact Form: 4PDT (4 Form C)
Contact Rating (Current): 10 A
Switching Voltage: 208VAC, 28VDC - Max
Must Release Voltage: 3.5 VDC
Must Operate Voltage: 9 VDC
Operate Time: 15 ms
Release Time: 15 ms
Load - Max Switching: 2080VA, 280W
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MX1N8221US Microchip Technology Description: LOW CAPACITANCE TVS
Packaging: Bulk
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CD5313 CD5313 Microchip Technology 8373-cd5283-cd5314-datasheet Description: DIODE CUR REG 100V 4.73MA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 4.73mA
Voltage - Limiting (Max): 2.75V
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CDS5538BUR-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
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CDS5538BUR-1 Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
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PIC16F18154T-I/STX PIC16F18154T-I/STX Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
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PIC16F18154T-I/STX PIC16F18154T-I/STX Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
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PIC16F18154T-I/SS PIC16F18154T-I/SS Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: IC MCU 8BIT 7KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F18154T-I/SS PIC16F18154T-I/SS Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: IC MCU 8BIT 7KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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9+2.15 EUR
25+1.98 EUR
100+1.82 EUR
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PIC16F18154-I/SO PIC16F18154-I/SO Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
auf Bestellung 540 Stücke:
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25+2.10 EUR
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PIC16F18154T-I/SO PIC16F18154T-I/SO Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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1600+1.93 EUR
Mindestbestellmenge: 1600
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DSC1211DA2-C0032T DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211DA2-C0032T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
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DSC1211CI2-C0028T DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211CI2-C0028T
Hersteller: Microchip Technology
Description: MEMS OSC (FS), HIGH PERFORMANCE,
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (3.2x2.5)
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DSC1211DA2-C0032 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211DA2-C0032
Hersteller: Microchip Technology
Description: MEMS OSC SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
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DSC1211BE3-C0031T DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211BE3-C0031T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-CDFN (5x3.2)
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DSC1211BE3-C0031 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211BE3-C0031
Hersteller: Microchip Technology
Description: MEMS OSC SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-CDFN (5x3.2)
Produkt ist nicht verfügbar
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DSC1211NE3-C0021T DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211NE3-C0021T
Hersteller: Microchip Technology
Description: MEMS OSC (FS), HIGH PERFORMANCE,
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (7x5)
Produkt ist nicht verfügbar
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DSC1211NI3-C0018T DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211NI3-C0018T
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (7x5)
Produkt ist nicht verfügbar
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DSC1211NA3-C0024T DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1211NA3-C0024T
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Output: CMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Height: 0.035" (0.90mm)
Current - Supply (Max): 27mA (Typ)
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (7x5)
Produkt ist nicht verfügbar
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JANTX1N969B-1 125314-lds-0287-datasheet
JANTX1N969B-1
Hersteller: Microchip Technology
Description: DIODE ZENER 22V 500MW DO35
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 17 V
Qualification: MIL-PRF-19500/117
Produkt ist nicht verfügbar
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JANTX1N4125C-1 129734-lds-0245-2-datasheet
JANTX1N4125C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW DO35
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 250 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 35.8 V
Qualification: MIL-PRF-19500/435
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JAN1N4125CUR-1 5801-lds-0245-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 47V DO213AA
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 250 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 35.8 V
Qualification: MIL-PRF-19500/435
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DSC6001AA3B-PROGT DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+2.19 EUR
Mindestbestellmenge: 1000
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DSC6001AA3B-PROGT DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Cut Tape (CT)
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Anzahl Preis
7+2.73 EUR
25+2.28 EUR
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DSC6101AA3B-PROGT DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tape & Reel (TR)
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Anzahl Preis
1000+2.19 EUR
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DSC6101AA3B-PROGT DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Cut Tape (CT)
auf Bestellung 1000 Stücke:
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Anzahl Preis
7+2.73 EUR
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DSC6003AA3B-PROGT DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6003AA3B-PROGT
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 4-DFN (7x5)
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Anzahl Preis
1000+2.19 EUR
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DSC6003AA3B-PROGT DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6003AA3B-PROGT
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 4-DFN (7x5)
auf Bestellung 1000 Stücke:
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Anzahl Preis
7+2.73 EUR
25+2.27 EUR
100+2.19 EUR
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DSC6101AA3B-PROG DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
Hersteller: Microchip Technology
Description: ONE-TIME-PROGRAMMABLE ULTRA-LOW
Packaging: Tube
Produkt ist nicht verfügbar
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DSC6001AA3B-PROG
DSC6001AA3B-PROG
Hersteller: Microchip Technology
Description: MEMS OSC, BLANK, LVCMOS, 20PPM,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 2 kHz ~ 80 MHz
Base Resonator: MEMS
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DSC6003AA3B-PROG
DSC6003AA3B-PROG
Hersteller: Microchip Technology
Description: MEMS OSC, BLANK, LVCMOS, 20PPM,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 2 kHz ~ 80 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MAPLAD15KP17CAe3 9522-mplad15kp-datasheet
MAPLAD15KP17CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 17VWM 27.6VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 543A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 18.9V
Voltage - Clamping (Max) @ Ipp: 27.6V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PD39210C-022419
Hersteller: Microchip Technology
Description: MCU FOR PD392XX FAMILY, BASED PD
Packaging: Tray
Produkt ist nicht verfügbar
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DSC1123AI2-200.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123AI2-200.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
auf Bestellung 3627 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.92 EUR
10+6.58 EUR
50+6.23 EUR
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DSC1123CI2-200.0000T DSC1%2C8yyy_Top_Marking_Spec.pdf
DSC1123CI2-200.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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DSC1123CI2-200.0000T DSC1%2C8yyy_Top_Marking_Spec.pdf
DSC1123CI2-200.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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DSC1121BI2-200.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121BI2-200.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JANTX1N6779
JANTX1N6779
Hersteller: Microchip Technology
Description: DIODE GEN PURP 600V 15A TO257
Packaging: Bulk
Package / Case: TO-257-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Capacitance @ Vr, F: 300pF @ 5V, 1MHz
Current - Average Rectified (Io): 15A
Supplier Device Package: TO-257
Operating Temperature - Junction: 150°C (Max)
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A
Current - Reverse Leakage @ Vr: 10 µA @ 480 V
Qualification: MIL-PRF-19500/647
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+790.19 EUR
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MSMLG5.0Ae3 10563-msml-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 9.2VC SMLG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 326A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: SMLG (DO-215AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLG58A/TR 10563-msml-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 58VWM 93.6VC SMLG
Packaging: Tape & Reel (TR)
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 32A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: SMLG (DO-215AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.4V
Voltage - Clamping (Max) @ Ipp: 93.6V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLG100A 10563-msml-datasheet
MSMLG100A
Hersteller: Microchip Technology
Description: TVS DIODE 100VWM 162VC SMLG
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 18.6A
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: DO-215AB (SMLG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 111V
Voltage - Clamping (Max) @ Ipp: 162V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MP6KE10A 9518-mp6ke-pdf
MP6KE10A
Hersteller: Microchip Technology
Description: TVS DIODE 8.55VWM 14.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 41A
Voltage - Reverse Standoff (Typ): 8.55V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 9.5V
Voltage - Clamping (Max) @ Ipp: 14.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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2N5338
2N5338
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 6 W
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LXP1002-23-4/TR 9457-lxp1000-sot23-series-datasheet
LXP1002-23-4/TR
Hersteller: Microchip Technology
Description: SI PIN NON HERMETIC PLASTIC SMT
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.32pF @ 50V, 1MHz
Resistance @ If, F: 4Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23-3
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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LXP1002-23-4/TR 9457-lxp1000-sot23-series-datasheet
LXP1002-23-4/TR
Hersteller: Microchip Technology
Description: SI PIN NON HERMETIC PLASTIC SMT
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 0.32pF @ 50V, 1MHz
Resistance @ If, F: 4Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23-3
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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JANTX2N2222AL
JANTX2N2222AL
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A TO-218
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-218
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
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JANKCBR2N2222A
JANKCBR2N2222A
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A TO18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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JANKCBF2N2222A
JANKCBF2N2222A
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A TO18
Packaging: Tape & Reel (TR)
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MVR2N2222AUB
MVR2N2222AUB
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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PIC16F15324T-E/SL PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15324T-E/SL
Hersteller: Microchip Technology
Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 12
auf Bestellung 2600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2600+1.48 EUR
Mindestbestellmenge: 2600
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PIC16F15324T-E/SL PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15324T-E/SL
Hersteller: Microchip Technology
Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 12
auf Bestellung 2600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.80 EUR
25+1.66 EUR
100+1.48 EUR
Mindestbestellmenge: 10
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PIC16F15324T-E/ST PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15324T-E/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.61 EUR
Mindestbestellmenge: 2500
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PIC16F15324T-E/ST PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15324T-E/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 11x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.95 EUR
25+1.76 EUR
100+1.61 EUR
Mindestbestellmenge: 10
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MXP4KE100Ae3 9517-mp4ke-pdf
MXP4KE100Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 85.5VWM 137VC DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 2.9A
Voltage - Reverse Standoff (Typ): 85.5V
Supplier Device Package: DO-204AL (DO-41)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 400W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MSMBG60A RF01000+%283%29.pdf
MSMBG60A
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MSMBG60CA RF01000+%283%29.pdf
MSMBG60CA
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMBG60CA RF01000+%283%29.pdf
MASMBG60CA
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMBG60CAe3 RF01000+%283%29.pdf
MASMBG60CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMBG60A RF01000+%283%29.pdf
MASMBG60A
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMBG60Ae3 RF01000+%283%29.pdf
MASMBG60Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AA (SMBG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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BR230D-78A2-12V-014L
Hersteller: Microchip Technology
Description: 4PDT 10 AMP SUPRESSED RELAY QPL,
Packaging: Bulk
Mounting Type: Chassis Mount
Coil Voltage: 12VDC
Operating Temperature: -70°C ~ 125°C
Termination Style: Plug In
Relay Type: General Purpose
Coil Current: 153.8 mA
Coil Type: Non Latching
Contact Form: 4PDT (4 Form C)
Contact Rating (Current): 10 A
Switching Voltage: 208VAC, 28VDC - Max
Must Release Voltage: 3.5 VDC
Must Operate Voltage: 9 VDC
Operate Time: 15 ms
Release Time: 15 ms
Load - Max Switching: 2080VA, 280W
Produkt ist nicht verfügbar
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MX1N8221US
Hersteller: Microchip Technology
Description: LOW CAPACITANCE TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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CD5313 8373-cd5283-cd5314-datasheet
CD5313
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 4.73MA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 4.73mA
Voltage - Limiting (Max): 2.75V
Produkt ist nicht verfügbar
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CDS5538BUR-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDS5538BUR-1
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Produkt ist nicht verfügbar
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PIC16F18154T-I/STX PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18154T-I/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3300+1.74 EUR
Mindestbestellmenge: 3300
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PIC16F18154T-I/STX PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18154T-I/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.02 EUR
25+1.86 EUR
100+1.74 EUR
Mindestbestellmenge: 9
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PIC16F18154T-I/SS PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18154T-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F18154T-I/SS PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18154T-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
auf Bestellung 2090 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.15 EUR
25+1.98 EUR
100+1.82 EUR
Mindestbestellmenge: 9
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PIC16F18154-I/SO PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18154-I/SO
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
auf Bestellung 540 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.29 EUR
25+2.10 EUR
100+1.90 EUR
Mindestbestellmenge: 8
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PIC16F18154T-I/SO PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18154T-I/SO
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 42x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1600+1.93 EUR
Mindestbestellmenge: 1600
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