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SMBJ5361B/TR13 SMBJ5361B/TR13 Microchip Technology 124875-lds-0246-2-datasheet Description: DIODE ZENER 27V 5W SMBJ
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-214AA (SMBJ)
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 1 A
Current - Reverse Leakage @ Vr: 500 nA @ 20.6 V
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MASMBJ5361B/TR MASMBJ5361B/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-214AA (SMBJ)
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 1 A
Current - Reverse Leakage @ Vr: 500 nA @ 20.6 V
Produkt ist nicht verfügbar
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MASMBJ5361B MASMBJ5361B Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-214AA (SMBJ)
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 1 A
Current - Reverse Leakage @ Vr: 500 nA @ 20.6 V
Produkt ist nicht verfügbar
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23AA02M-I/SN 23AA02M-I/SN Microchip Technology 23AA02M-23LCV02M-2-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006861.pdf Description: IC SRAM 2MBIT SPI/QUAD 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-SOIC
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 256K x 8
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23AA02M-I/ST 23AA02M-I/ST Microchip Technology 23AA02M-23LCV02M-2-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006861.pdf Description: IC SRAM 2MBIT SPI/QUAD 8TSSOP
Packaging: Tube
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-TSSOP
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 256K x 8
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23AA02M-I/P 23AA02M-I/P Microchip Technology 23AA02M-23LCV02M-2-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006861.pdf Description: IC SRAM 2MBIT SPI/QUAD 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-PDIP
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 256K x 8
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23AA04M-I/SN 23AA04M-I/SN Microchip Technology 23AA04M-23LCV04M-4-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006862.pdf Description: IC SRAM 4MBIT SPI/QUAD 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-SOIC
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 512K x 8
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VT-804-EAE-106A-19M2000000 Microchip Technology VT-804.pdf Description: TCXO +3.3 VDC +/-10% CMOS -40C T
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC16F15344T-I/ML PIC16F15344T-I/ML Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
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PIC16F15344T-I/ML PIC16F15344T-I/ML Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
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PIC16F15344T-E/SS PIC16F15344T-E/SS Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 18
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PIC16F15344T-E/SS PIC16F15344T-E/SS Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 18
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PIC16F15344-E/ML PIC16F15344-E/ML Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
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PIC16F15344T-E/GZ PIC16F15344T-E/GZ Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20UFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-UQFN (4x4)
Number of I/O: 18
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PIC16F15344T-E/GZ PIC16F15344T-E/GZ Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20UFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-UQFN (4x4)
Number of I/O: 18
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PIC16F15344T-E/SO PIC16F15344T-E/SO Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
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PIC16F15344T-E/SO PIC16F15344T-E/SO Microchip Technology PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
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PIC16F15344-I/ML Microchip Technology Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
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DSC1101AE1-011.0000 DSC1101AE1-011.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 11.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11 MHz
Base Resonator: MEMS
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DSC1101CE1-011.2896 DSC1101CE1-011.2896 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 11.2896MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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JANTX1N753AUR-1 Microchip Technology 131822-lds-0288-1-datasheet Description: DIODE ZENER 6.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/127
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Jantx2N6990 Microchip Technology 6138-2n6989-datasheet Description: TRANS 4NPN 50V 0.8A
Packaging: Bulk
Package / Case: 14-Flatpack
Mounting Type: Surface Mount
Transistor Type: 4 NPN (Quad)
Operating Temperature: -65°C ~ 200°C (TJ)
Power - Max: 400mW
Current - Collector (Ic) (Max): 800mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: 14-Flatpack
Grade: Military
Qualification: MIL-PRF-19500/559
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OSC-1B0-10M0000000 Microchip Technology osc_series.pdf Description: OSC-1B0-10M0000000
Packaging: Tape & Reel (TR)
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OSC-1B2-14M4000000 Microchip Technology Description: OSC-1B2-14M4000000
Packaging: Tape & Reel (TR)
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OSC-1B2-25M0000000 Microchip Technology osc_series.pdf Description: OSC-1B2-25M0000000
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DZ-1385/TR Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Bulk
Produkt ist nicht verfügbar
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2N4234 2N4234 Microchip Technology Description: TRANS PNP 40V 0.001A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 250mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 1 W
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2N4238 2N4238 Microchip Technology 6074-2n4237-datasheet Description: NPN TRANSISTOR
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 500mA, 1V
Supplier Device Package: TO-39
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
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2N4234L 2N4234L Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 1 W
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2N4236L 2N4236L Microchip Technology Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1 W
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2N4236 2N4236 Microchip Technology 132571-lds-0319-datasheet Description: TRANS PNP 80V 1A TO39
Packaging: Tube
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 250mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1 W
Produkt ist nicht verfügbar
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SBT3035C SBT3035C Microchip Technology coc-100.pdf Description: DIODE ARR SCHOTT 45V 30A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 45 V
Current - Reverse Leakage @ Vr: 1.5 mA @ 35 V
Produkt ist nicht verfügbar
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SBT3035 Microchip Technology Description: DIODE ARR SCHOTT 35V 30A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 35 V
Voltage - Forward (Vf) (Max) @ If: 700 mV @ 30 A
Current - Reverse Leakage @ Vr: 1.5 mA @ 35 V
Produkt ist nicht verfügbar
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SBT3035A Microchip Technology Description: DIODE ARR SCHOTT 45V 30A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 45 V
Current - Reverse Leakage @ Vr: 1.5 mA @ 35 V
Produkt ist nicht verfügbar
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FLASHPRO4 FLASHPRO4 Microchip Technology index.php?option=com_docman&task=doc_download&gid=130804 Description: PROGRAMMER FLASH FPGA
Packaging: Bulk
For Use With/Related Products: FPGA
Type: Programmer
Contents: Board(s), Cable(s)
Utilized IC / Part: FPGA
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DSC6011HE1A-018.4320T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 18.4320MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 18.432 MHz
Base Resonator: MEMS
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SY75603ATWL-TR SY75603ATWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Number of Circuits: 1
Frequency - Max: 250 MHz
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SY75603ATWL-TR SY75603ATWL-TR Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Number of Circuits: 1
Frequency - Max: 250 MHz
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JANTXV1N3045C-1 JANTXV1N3045C-1 Microchip Technology 125225-lds-0285-datasheet Description: DIODE ZENER 110V 1W DO41
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AL, DO041, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 110 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 83.6 V
Qualification: MIL-PRF-19500/115
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PIC32MX170F512LT-I/PT PIC32MX170F512LT-I/PT Microchip Technology PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 48x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
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PIC32MX170F512LT-I/PT PIC32MX170F512LT-I/PT Microchip Technology PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 48x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
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PIC32MX174F256D-V/PT PIC32MX174F256D-V/PT Microchip Technology PIC32MX1XX2XX_XLP_Family_Datasheet_DS60001404E.pdf Description: IC MCU 32BIT 256KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 13x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Grade: Automotive
Number of I/O: 34
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC32MM0064GPL020T-I/ML PIC32MM0064GPL020T-I/ML Microchip Technology PIC32MM0064GPL036-Family-Data-Sheet-DS60001324C.pdf Description: IC MCU 32BIT 64KB FLASH 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 11x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT
Peripherals: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
DigiKey Programmable: Not Verified
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JANTX1N5811US JANTX1N5811US Microchip Technology LDS-0168-1%2C+1N5807US-1N5809US-1N5811US%28URS%29%2C+MIL-PRF-19500-477.pdf Description: DIODE STANDARD 150V 3A B SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
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ZL40292LDF1 ZL40292LDF1 Microchip Technology 1244045-zl40292-datasheet Description: 20-OUTPUT DB2000Q BUFFER
Packaging: Tape & Reel (TR)
Package / Case: 72-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Clock
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 72-QFN (10x10)
Number of Circuits: 1
Frequency - Max: 250 MHz
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ZL40292LDF1 ZL40292LDF1 Microchip Technology 1244045-zl40292-datasheet Description: 20-OUTPUT DB2000Q BUFFER
Packaging: Cut Tape (CT)
Package / Case: 72-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Clock
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 72-QFN (10x10)
Number of Circuits: 1
Frequency - Max: 250 MHz
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R4240F Microchip Technology 8550-coe-44-datasheet Description: DIODE GP REV 400V 125A DO205AA
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 125A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
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R4240TS Microchip Technology 8550-coe-44-datasheet Description: DIODE GP REV 400V 125A DO205AA
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 125A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
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R4240 Microchip Technology Description: DIODE GP REV 400V 125A DO205AA
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 125A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
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1N5259BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
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1N5259BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
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1N5259B-1 1N5259B-1 Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
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1N5259B/TR 1N5259B/TR Microchip Technology 1N5221%20-%201N5281B.pdf Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
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1N5259 1N5259 Microchip Technology 1N5225-1N5267%20N0187%20REV.B.pdf Description: VOLTAGE REGULATOR
Tolerance: ±20%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 29 V
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1N5259A/TR 1N5259A/TR Microchip Technology 1N5221%20-%201N5281B.pdf Description: VOLTAGE REGULATOR
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 29 V
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VCC1-1304-106M250000 Microchip Technology 1243793-vcc1 Description: VCC1-1304-106M250000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 106.25 MHz
Base Resonator: Crystal
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1N6642USE3 1N6642USE3 Microchip Technology 5895-1n6638-42-43us-datasheet Description: DIODE GP 75V 300MA B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 75 V
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1N5550USe3 1N5550USe3 Microchip Technology 10966-sa7-43-datasheet Description: DIODE GEN PURP 200V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
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DSC6101CI2B-070.0000T DSC6101CI2B-070.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 70 MHz
Base Resonator: MEMS
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DSC6101CI2B-070.0000 DSC6101CI2B-070.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 70.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 70 MHz
Base Resonator: MEMS
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SMBJ5361B/TR13 124875-lds-0246-2-datasheet
SMBJ5361B/TR13
Hersteller: Microchip Technology
Description: DIODE ZENER 27V 5W SMBJ
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-214AA (SMBJ)
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 1 A
Current - Reverse Leakage @ Vr: 500 nA @ 20.6 V
Produkt ist nicht verfügbar
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MASMBJ5361B/TR
MASMBJ5361B/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-214AA (SMBJ)
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 1 A
Current - Reverse Leakage @ Vr: 500 nA @ 20.6 V
Produkt ist nicht verfügbar
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MASMBJ5361B
MASMBJ5361B
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-214AA (SMBJ)
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 1 A
Current - Reverse Leakage @ Vr: 500 nA @ 20.6 V
Produkt ist nicht verfügbar
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23AA02M-I/SN 23AA02M-23LCV02M-2-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006861.pdf
23AA02M-I/SN
Hersteller: Microchip Technology
Description: IC SRAM 2MBIT SPI/QUAD 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-SOIC
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 256K x 8
auf Bestellung 389 Stücke:
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Anzahl Preis
4+4.68 EUR
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23AA02M-I/ST 23AA02M-23LCV02M-2-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006861.pdf
23AA02M-I/ST
Hersteller: Microchip Technology
Description: IC SRAM 2MBIT SPI/QUAD 8TSSOP
Packaging: Tube
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-TSSOP
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 256K x 8
auf Bestellung 153 Stücke:
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Anzahl Preis
4+4.8 EUR
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23AA02M-I/P 23AA02M-23LCV02M-2-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006861.pdf
23AA02M-I/P
Hersteller: Microchip Technology
Description: IC SRAM 2MBIT SPI/QUAD 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-PDIP
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 256K x 8
auf Bestellung 92 Stücke:
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Anzahl Preis
4+5.12 EUR
25+4.95 EUR
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23AA04M-I/SN 23AA04M-23LCV04M-4-Mbit-SPI-SDI-SQI-143-Mhz-Serial-RAM-DS20006862.pdf
23AA04M-I/SN
Hersteller: Microchip Technology
Description: IC SRAM 4MBIT SPI/QUAD 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Technology: SRAM - Synchronous
Clock Frequency: 143 MHz
Memory Format: SRAM
Supplier Device Package: 8-SOIC
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 512K x 8
auf Bestellung 164 Stücke:
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Anzahl Preis
3+6.09 EUR
25+5.87 EUR
100+5.64 EUR
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VT-804-EAE-106A-19M2000000 VT-804.pdf
Hersteller: Microchip Technology
Description: TCXO +3.3 VDC +/-10% CMOS -40C T
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC16F15344T-I/ML PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
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PIC16F15344T-I/ML PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
auf Bestellung 3284 Stücke:
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Anzahl Preis
10+1.83 EUR
25+1.67 EUR
100+1.53 EUR
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PIC16F15344T-E/SS PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 18
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1600+1.59 EUR
Mindestbestellmenge: 1600
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PIC16F15344T-E/SS PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 18
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.92 EUR
25+1.75 EUR
100+1.59 EUR
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PIC16F15344-E/ML PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344-E/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
auf Bestellung 637 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.95 EUR
25+1.8 EUR
100+1.61 EUR
Mindestbestellmenge: 10
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PIC16F15344T-E/GZ PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-E/GZ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20UFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-UQFN (4x4)
Number of I/O: 18
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Anzahl Preis
3300+1.66 EUR
Mindestbestellmenge: 3300
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PIC16F15344T-E/GZ PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-E/GZ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20UFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-UQFN (4x4)
Number of I/O: 18
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+1.99 EUR
25+1.83 EUR
100+1.66 EUR
Mindestbestellmenge: 9
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PIC16F15344T-E/SO PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-E/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1600+1.76 EUR
Mindestbestellmenge: 1600
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PIC16F15344T-E/SO PIC16F-LF-1532444-Data-Sheet-DS40001889C.pdf
PIC16F15344T-E/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.15 EUR
25+1.96 EUR
100+1.76 EUR
Mindestbestellmenge: 9
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PIC16F15344-I/ML
Hersteller: Microchip Technology
Description: 7KB, 512 B RAM, 4XPWMS, COMPARAT
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (4K x 14)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 17x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 18
Produkt ist nicht verfügbar
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DSC1101AE1-011.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101AE1-011.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 11.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1101CE1-011.2896 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101CE1-011.2896
Hersteller: Microchip Technology
Description: MEMS OSC XO 11.2896MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JANTX1N753AUR-1 131822-lds-0288-1-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 6.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/127
Produkt ist nicht verfügbar
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Jantx2N6990 6138-2n6989-datasheet
Hersteller: Microchip Technology
Description: TRANS 4NPN 50V 0.8A
Packaging: Bulk
Package / Case: 14-Flatpack
Mounting Type: Surface Mount
Transistor Type: 4 NPN (Quad)
Operating Temperature: -65°C ~ 200°C (TJ)
Power - Max: 400mW
Current - Collector (Ic) (Max): 800mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: 14-Flatpack
Grade: Military
Qualification: MIL-PRF-19500/559
Produkt ist nicht verfügbar
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OSC-1B0-10M0000000 osc_series.pdf
Hersteller: Microchip Technology
Description: OSC-1B0-10M0000000
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OSC-1B2-14M4000000
Hersteller: Microchip Technology
Description: OSC-1B2-14M4000000
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OSC-1B2-25M0000000 osc_series.pdf
Hersteller: Microchip Technology
Description: OSC-1B2-25M0000000
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DZ-1385/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Produkt ist nicht verfügbar
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2N4234
2N4234
Hersteller: Microchip Technology
Description: TRANS PNP 40V 0.001A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 250mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 1 W
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2N4238 6074-2n4237-datasheet
2N4238
Hersteller: Microchip Technology
Description: NPN TRANSISTOR
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 500mA, 1V
Supplier Device Package: TO-39
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1 W
Produkt ist nicht verfügbar
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2N4234L
2N4234L
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 1 W
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2N4236L
2N4236L
Hersteller: Microchip Technology
Description: POWER BJT
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1 W
Produkt ist nicht verfügbar
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2N4236 132571-lds-0319-datasheet
2N4236
Hersteller: Microchip Technology
Description: TRANS PNP 80V 1A TO39
Packaging: Tube
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 250mA, 1V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1 W
Produkt ist nicht verfügbar
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SBT3035C coc-100.pdf
SBT3035C
Hersteller: Microchip Technology
Description: DIODE ARR SCHOTT 45V 30A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 45 V
Current - Reverse Leakage @ Vr: 1.5 mA @ 35 V
Produkt ist nicht verfügbar
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SBT3035
Hersteller: Microchip Technology
Description: DIODE ARR SCHOTT 35V 30A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 35 V
Voltage - Forward (Vf) (Max) @ If: 700 mV @ 30 A
Current - Reverse Leakage @ Vr: 1.5 mA @ 35 V
Produkt ist nicht verfügbar
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SBT3035A
Hersteller: Microchip Technology
Description: DIODE ARR SCHOTT 45V 30A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-204AA (TO-3)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 45 V
Current - Reverse Leakage @ Vr: 1.5 mA @ 35 V
Produkt ist nicht verfügbar
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FLASHPRO4 index.php?option=com_docman&task=doc_download&gid=130804
FLASHPRO4
Hersteller: Microchip Technology
Description: PROGRAMMER FLASH FPGA
Packaging: Bulk
For Use With/Related Products: FPGA
Type: Programmer
Contents: Board(s), Cable(s)
Utilized IC / Part: FPGA
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DSC6011HE1A-018.4320T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 18.4320MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 18.432 MHz
Base Resonator: MEMS
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Anzahl Preis
1000+1.62 EUR
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SY75603ATWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75603ATWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Number of Circuits: 1
Frequency - Max: 250 MHz
Produkt ist nicht verfügbar
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SY75603ATWL-TR SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75603ATWL-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Number of Circuits: 1
Frequency - Max: 250 MHz
auf Bestellung 3068 Stücke:
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16+1.14 EUR
25+0.95 EUR
100+0.92 EUR
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JANTXV1N3045C-1 125225-lds-0285-datasheet
JANTXV1N3045C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 110V 1W DO41
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AL, DO041, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 110 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: DO-41
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 83.6 V
Qualification: MIL-PRF-19500/115
Produkt ist nicht verfügbar
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PIC32MX170F512LT-I/PT PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf
PIC32MX170F512LT-I/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 48x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
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Anzahl Preis
1200+10.32 EUR
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PIC32MX170F512LT-I/PT PIC32MX1XX2XX5XX%2064100-PIN_Family_60001290F.pdf
PIC32MX170F512LT-I/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 48x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
auf Bestellung 2390 Stücke:
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Anzahl Preis
2+12.43 EUR
25+11.41 EUR
100+10.32 EUR
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PIC32MX174F256D-V/PT PIC32MX1XX2XX_XLP_Family_Datasheet_DS60001404E.pdf
PIC32MX174F256D-V/PT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 13x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Grade: Automotive
Number of I/O: 34
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 160 Stücke:
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Anzahl Preis
2+10.08 EUR
25+9.23 EUR
100+8.39 EUR
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PIC32MM0064GPL020T-I/ML PIC32MM0064GPL036-Family-Data-Sheet-DS60001324C.pdf
PIC32MM0064GPL020T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 11x10/12b; D/A 1x5b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT
Peripherals: Brown-out Detect/Reset, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JANTX1N5811US LDS-0168-1%2C+1N5807US-1N5809US-1N5811US%28URS%29%2C+MIL-PRF-19500-477.pdf
JANTX1N5811US
Hersteller: Microchip Technology
Description: DIODE STANDARD 150V 3A B SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Qualification: MIL-PRF-19500/477
auf Bestellung 190 Stücke:
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Anzahl Preis
2+12.21 EUR
100+11.34 EUR
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ZL40292LDF1 1244045-zl40292-datasheet
ZL40292LDF1
Hersteller: Microchip Technology
Description: 20-OUTPUT DB2000Q BUFFER
Packaging: Tape & Reel (TR)
Package / Case: 72-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Clock
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 72-QFN (10x10)
Number of Circuits: 1
Frequency - Max: 250 MHz
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ZL40292LDF1 1244045-zl40292-datasheet
ZL40292LDF1
Hersteller: Microchip Technology
Description: 20-OUTPUT DB2000Q BUFFER
Packaging: Cut Tape (CT)
Package / Case: 72-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LP-HCSL
Frequency - Max: 250MHz
Type: Fanout Buffer (Distribution)
Input: Clock
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Main Purpose: PCI Express (PCIe)
Ratio - Input:Output: 1:20
Differential - Input:Output: Yes/Yes
Supplier Device Package: 72-QFN (10x10)
Number of Circuits: 1
Frequency - Max: 250 MHz
auf Bestellung 2676 Stücke:
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Anzahl Preis
5+3.59 EUR
25+2.99 EUR
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R4240F 8550-coe-44-datasheet
Hersteller: Microchip Technology
Description: DIODE GP REV 400V 125A DO205AA
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 125A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
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R4240TS 8550-coe-44-datasheet
Hersteller: Microchip Technology
Description: DIODE GP REV 400V 125A DO205AA
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 125A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
Produkt ist nicht verfügbar
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R4240
Hersteller: Microchip Technology
Description: DIODE GP REV 400V 125A DO205AA
Packaging: Bulk
Package / Case: DO-205AA, DO-8, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 125A
Supplier Device Package: DO-205AA (DO-8)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 A
Current - Reverse Leakage @ Vr: 50 µA @ 400 V
Produkt ist nicht verfügbar
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1N5259BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
Produkt ist nicht verfügbar
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1N5259BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
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1N5259B-1
1N5259B-1
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
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1N5259B/TR 1N5221%20-%201N5281B.pdf
1N5259B/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 30 V
Produkt ist nicht verfügbar
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1N5259 1N5225-1N5267%20N0187%20REV.B.pdf
1N5259
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±20%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 29 V
Produkt ist nicht verfügbar
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1N5259A/TR 1N5221%20-%201N5281B.pdf
1N5259A/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 29 V
Produkt ist nicht verfügbar
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VCC1-1304-106M250000 1243793-vcc1
Hersteller: Microchip Technology
Description: VCC1-1304-106M250000
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 106.25 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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1N6642USE3 5895-1n6638-42-43us-datasheet
1N6642USE3
Hersteller: Microchip Technology
Description: DIODE GP 75V 300MA B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 5 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 300mA
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 75 V
Produkt ist nicht verfügbar
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1N5550USe3 10966-sa7-43-datasheet
1N5550USe3
Hersteller: Microchip Technology
Description: DIODE GEN PURP 200V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
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DSC6101CI2B-070.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101CI2B-070.0000T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 70 MHz
Base Resonator: MEMS
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DSC6101CI2B-070.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101CI2B-070.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 70.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 70 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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