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DSC1103CL1-125.0000T DSC1103CL1-125.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC 125MHZ LVDS 50PPM 3.2X2
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1103CL1-125.0000 DSC1103CL1-125.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 125.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSA1223CL1-125M0000VAO DSA1223CL1-125M0000VAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.5V, 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSA1223CL1-125M0000TVAO DSA1223CL1-125M0000TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.5V, 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
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ATMEGA168PA-CCUR ATMEGA168PA-CCUR Microchip Technology ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf Description: IC MCU 8BIT 16KB FLASH 32UFBGA
Packaging: Cut Tape (CT)
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
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MASMCJ7.0A MASMCJ7.0A Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 7VWM 12VC DO214AB
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 12V
Voltage - Breakdown (Min): 7.78V
Unidirectional Channels: 1
Supplier Device Package: DO-214AB (SMCJ)
Voltage - Reverse Standoff (Typ): 7V
Current - Peak Pulse (10/1000µs): 125A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
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MASMCJ9.0CA MASMCJ9.0CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ9.0CAe3 MASMCJ9.0CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SM16LC05e3/TR13 SM16LC05e3/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 5VWM 11VC 16SO
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 11V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 8
Supplier Device Package: 16-SO
Voltage - Reverse Standoff (Typ): 5V
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Capacitance @ Frequency: 25pF @ 1MHz
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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SM16LC05e3/TR13 SM16LC05e3/TR13 Microchip Technology SM16LC.pdf Description: TVS DIODE 5VWM 11VC 16SO
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 11V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 8
Supplier Device Package: 16-SO
Voltage - Reverse Standoff (Typ): 5V
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Capacitance @ Frequency: 25pF @ 1MHz
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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100+11.83 EUR
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PIC16F13113-I/MF PIC16F13113-I/MF Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 8VDFN
Number of I/O: 5
Supplier Device Package: 8-DFN (3x3)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tube
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PIC16F13114-I/MF PIC16F13114-I/MF Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
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PIC16F13144-I/P PIC16F13144-I/P Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
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PIC16F13143-E/P PIC16F13143-E/P Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
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PIC16F13115-I/MF PIC16F13115-I/MF Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 14KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
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PIC16F13123-I/SL PIC16F13123-I/SL Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Program Memory Type: FLASH
Number of I/O: 11
Supplier Device Package: 14-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Processor: PIC
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PIC16F13123-I/ST PIC16F13123-I/ST Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 14TSSOP
Number of I/O: 11
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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PIC16F13124-I/SL PIC16F13124-I/SL Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 14SOIC
Number of I/O: 11
Supplier Device Package: 14-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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PIC16F13124-I/ST PIC16F13124-I/ST Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13125-I/SL PIC16F13125-I/SL Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13125-I/ST PIC16F13125-I/ST Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13143-I/REB PIC16F13143-I/REB Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
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PIC16F13143-I/SS PIC16F13143-I/SS Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
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PIC16F13144-I/SS PIC16F13144-I/SS Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
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PIC16F13144-I/REB PIC16F13144-I/REB Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
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PIC16F13143-I/SO PIC16F13143-I/SO Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 3.5KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
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PIC16F13144-I/SO PIC16F13144-I/SO Microchip Technology PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
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PIC32MZ0512EFF100T-E/GJX PIC32MZ0512EFF100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 78
Grade: Automotive
Supplier Device Package: 100-TFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: MIPS32® M-Class
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tape & Reel (TR)
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PIC32MZ0512EFF100T-E/GJX PIC32MZ0512EFF100T-E/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 78
Grade: Automotive
Supplier Device Package: 100-TFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: MIPS32® M-Class
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
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MP6KE8.2A MP6KE8.2A Microchip Technology rf01007_rb.pdf Description: TVS DIODE 7.02VWM 12.1VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 50A
Voltage - Reverse Standoff (Typ): 7.02V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.79V
Voltage - Clamping (Max) @ Ipp: 12.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1522JI2A-33M33333T DSC1522JI2A-33M33333T Microchip Technology DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf Description: MEMS OSC, LOW JITTER, 33.33333MH
Type: XO (Standard)
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Strip
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Base Resonator: MEMS
Frequency: 33.33333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VLGA (2.5x2)
Current - Supply (Max): 7.5mA
Voltage - Supply: 2.25V ~ 3.63V
Produkt ist nicht verfügbar
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DSC1522JI2A-33M33333 DSC1522JI2A-33M33333 Microchip Technology DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf Description: MEMS OSC XO 33.33333MHZ LVCMOS
Current - Supply (Max): 7.5mA
Base Resonator: MEMS
Frequency: 33.33333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VLGA (2.5x2)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Strip
Produkt ist nicht verfügbar
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ATA6847T-5050E/NHX ATA6847T-5050E/NHX Microchip Technology Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5050E/NHX ATA6847T-5050E/NHX Microchip Technology Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-3333E/NHX ATA6847T-3333E/NHX Microchip Technology Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-3333E/NHX ATA6847T-3333E/NHX Microchip Technology Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5033E/NHX ATA6847T-5033E/NHX Microchip Technology Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5033E/NHX ATA6847T-5033E/NHX Microchip Technology Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 40-VQFN (5x5)
Technology: NMOS
Applications: General Purpose
Voltage - Supply: 3V ~ 42V
Output Configuration: Half Bridge (3)
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: PWM, SPI
Function: Controller - Speed
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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DSC1001CI5-004.9152T DSC1001CI5-004.9152T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.9152MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 4.9152 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (3.2x2.5)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
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10+5.4 EUR
50+5.32 EUR
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PIC24FJ256GA610-E/PT PIC24FJ256GA610-E/PT Microchip Technology Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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62CA2 62CA2 Microchip Technology Module_Adapter_Boards_Web.pdf Description: EVAL BOARD FOR 2ASC-12A1HP
Utilized IC / Part: 2ASC-12A1HP
Contents: Board(s)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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ATTINY406-MF ATTINY406-MF Microchip Technology ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf Description: 20MHZ, 4KB, VQFN20, EXT 125C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
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25+1.19 EUR
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ATTINY406-MN ATTINY406-MN Microchip Technology ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf Description: 20MHZ, 4KB, VQFN20, IND 105C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
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MIC184YM-TR MIC184YM-TR Microchip Technology MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf Description: SENSOR DIGITAL -55C-125C 8SOIC
Features: Output Switch, Shutdown Mode, Standby Mode
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-SOIC
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
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MIC184YM-TR MIC184YM-TR Microchip Technology MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf Description: SENSOR DIGITAL -55C-125C 8SOIC
Sensing Temperature - Remote: -55°C ~ 125°C
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 8-SOIC
Resolution: 9 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Shutdown Mode, Standby Mode
Packaging: Cut Tape (CT)
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MIC184BMM MIC184BMM Microchip Technology MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf Description: SENSOR DIGITAL -55C-125C 8MSOP
Sensing Temperature - Remote: -55°C ~ 125°C
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 8-MSOP
Resolution: 9 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Features: Output Switch, Shutdown Mode, Standby Mode
Packaging: Bulk
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LT-1084 Microchip Technology Description: 6.4V .5MA +/- .1% ROUND-END TEMP
Packaging: Bulk
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2295000-R Microchip Technology Description: 16 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 16
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2N4091UB/TR 2N4091UB/TR Microchip Technology Description: JFET N-CH 40V 3UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
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MQ2N4091 MQ2N4091 Microchip Technology Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
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MX2N4091 MX2N4091 Microchip Technology Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Qualification: MIL-PRF-19500/431
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MV2N4091 MV2N4091 Microchip Technology Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Qualification: MIL-PRF-19500/431
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MQ2N4091UB MQ2N4091UB Microchip Technology Description: JFET N-CH 40V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
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MQ2N4091UB/TR MQ2N4091UB/TR Microchip Technology Description: JFET N-CH 40V UB
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
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MX2N4091UB MX2N4091UB Microchip Technology Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
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MX2N4091UB/TR MX2N4091UB/TR Microchip Technology Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
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MV2N4091UB MV2N4091UB Microchip Technology Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
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MV2N4091UB/TR MV2N4091UB/TR Microchip Technology Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
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ATMXT3072M1HC-ARVAO Microchip Technology Description: 3072 NODE TS IC TQFP144
Packaging: Tape & Reel (TR)
Touchscreen: 2 Wire Capacitive
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ATMXT3072M1E-AVAO Microchip Technology Description: 3072 NODE TS IC TQFP144
Packaging: Tray
Touchscreen: 2 Wire Capacitive
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DSC1103CL1-125.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL1-125.0000T
Hersteller: Microchip Technology
Description: MEMS OSC 125MHZ LVDS 50PPM 3.2X2
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1103CL1-125.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL1-125.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSA1223CL1-125M0000VAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223CL1-125M0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.5V, 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tube
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DSA1223CL1-125M0000TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223CL1-125M0000TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 125MHZ, LV
Base Resonator: MEMS
Frequency: 125 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.5V, 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Tape & Reel (TR)
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ATMEGA168PA-CCUR ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf
ATMEGA168PA-CCUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 32UFBGA
Packaging: Cut Tape (CT)
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
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MASMCJ7.0A 10561-msmc-datasheet
MASMCJ7.0A
Hersteller: Microchip Technology
Description: TVS DIODE 7VWM 12VC DO214AB
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 12V
Voltage - Breakdown (Min): 7.78V
Unidirectional Channels: 1
Supplier Device Package: DO-214AB (SMCJ)
Voltage - Reverse Standoff (Typ): 7V
Current - Peak Pulse (10/1000µs): 125A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Produkt ist nicht verfügbar
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MASMCJ9.0CA 10561-msmc-datasheet
MASMCJ9.0CA
Hersteller: Microchip Technology
Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ9.0CAe3 10561-msmc-datasheet
MASMCJ9.0CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 9VWM 15.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 97.4A
Voltage - Reverse Standoff (Typ): 9V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 15.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SM16LC05e3/TR13 SM16LC.pdf
SM16LC05e3/TR13
Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 11VC 16SO
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 11V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 8
Supplier Device Package: 16-SO
Voltage - Reverse Standoff (Typ): 5V
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Capacitance @ Frequency: 25pF @ 1MHz
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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SM16LC05e3/TR13 SM16LC.pdf
SM16LC05e3/TR13
Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 11VC 16SO
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 11V
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 8
Supplier Device Package: 16-SO
Voltage - Reverse Standoff (Typ): 5V
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Capacitance @ Frequency: 25pF @ 1MHz
Applications: General Purpose
Operating Temperature: -55°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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PIC16F13113-I/MF PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13113-I/MF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8VDFN
Number of I/O: 5
Supplier Device Package: 8-DFN (3x3)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tube
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18+1.19 EUR
25+1.11 EUR
100+1 EUR
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PIC16F13114-I/MF PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13114-I/MF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
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18+1.18 EUR
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PIC16F13144-I/P PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
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PIC16F13143-E/P PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
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PIC16F13115-I/MF PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13115-I/MF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 8VDFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 10x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Number of I/O: 5
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PIC16F13123-I/SL PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13123-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14SOIC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Program Memory Type: FLASH
Number of I/O: 11
Supplier Device Package: 14-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Processor: PIC
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PIC16F13123-I/ST PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13123-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14TSSOP
Number of I/O: 11
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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PIC16F13124-I/SL PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13124-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14SOIC
Number of I/O: 11
Supplier Device Package: 14-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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PIC16F13124-I/ST PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13124-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
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PIC16F13125-I/SL PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13125-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
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PIC16F13125-I/ST PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13125-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
Produkt ist nicht verfügbar
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PIC16F13143-I/REB PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-I/REB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
Produkt ist nicht verfügbar
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PIC16F13143-I/SS PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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PIC16F13144-I/SS PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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PIC16F13144-I/REB PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/REB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 17
Produkt ist nicht verfügbar
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PIC16F13143-I/SO PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13143-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (3.5K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
Produkt ist nicht verfügbar
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PIC16F13144-I/SO PIC16F13145-Family-Microcontroller-Data-Sheet-DS40002519.pdf
PIC16F13144-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
Produkt ist nicht verfügbar
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PIC32MZ0512EFF100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf
PIC32MZ0512EFF100T-E/GJX
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 78
Grade: Automotive
Supplier Device Package: 100-TFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: MIPS32® M-Class
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32MZ0512EFF100T-E/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf
PIC32MZ0512EFF100T-E/GJX
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 78
Grade: Automotive
Supplier Device Package: 100-TFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: MIPS32® M-Class
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MP6KE8.2A rf01007_rb.pdf
MP6KE8.2A
Hersteller: Microchip Technology
Description: TVS DIODE 7.02VWM 12.1VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 50A
Voltage - Reverse Standoff (Typ): 7.02V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.79V
Voltage - Clamping (Max) @ Ipp: 12.1V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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DSC1522JI2A-33M33333T DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf
DSC1522JI2A-33M33333T
Hersteller: Microchip Technology
Description: MEMS OSC, LOW JITTER, 33.33333MH
Type: XO (Standard)
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Strip
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Base Resonator: MEMS
Frequency: 33.33333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VLGA (2.5x2)
Current - Supply (Max): 7.5mA
Voltage - Supply: 2.25V ~ 3.63V
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DSC1522JI2A-33M33333 DSC150x-DSC152x-Low-Power-Low-Jitter-MEMS-Oscillators-DS20006516A.pdf
DSC1522JI2A-33M33333
Hersteller: Microchip Technology
Description: MEMS OSC XO 33.33333MHZ LVCMOS
Current - Supply (Max): 7.5mA
Base Resonator: MEMS
Frequency: 33.33333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VLGA (2.5x2)
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Strip
Produkt ist nicht verfügbar
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ATA6847T-5050E/NHX Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf
ATA6847T-5050E/NHX
Hersteller: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
Produkt ist nicht verfügbar
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ATA6847T-5050E/NHX Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf
ATA6847T-5050E/NHX
Hersteller: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 5V
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-3333E/NHX Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf
ATA6847T-3333E/NHX
Hersteller: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-3333E/NHX Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf
ATA6847T-3333E/NHX
Hersteller: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER WITH 3.
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
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ATA6847T-5033E/NHX Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf
ATA6847T-5033E/NHX
Hersteller: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 3V ~ 42V
Applications: General Purpose
Technology: NMOS
Supplier Device Package: 40-VQFN (5x5)
Motor Type - AC, DC: Brushless DC (BLDC)
Produkt ist nicht verfügbar
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ATA6847T-5033E/NHX Three-Phase-Brushless-Motor-Gate-Driver-SBC-Data-Sheet-DS20006940.pdf
ATA6847T-5033E/NHX
Hersteller: Microchip Technology
Description: 42V 3-PHASE MOTOR DRIVER 5V/3.3V
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 40-VQFN (5x5)
Technology: NMOS
Applications: General Purpose
Voltage - Supply: 3V ~ 42V
Output Configuration: Half Bridge (3)
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: PWM, SPI
Function: Controller - Speed
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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8+2.68 EUR
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DSC1001CI5-004.9152T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI5-004.9152T
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.9152MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 4.9152 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (3.2x2.5)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
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PIC24FJ256GA610-E/PT
PIC24FJ256GA610-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Grade: Automotive
Number of I/O: 85
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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62CA2 Module_Adapter_Boards_Web.pdf
62CA2
Hersteller: Microchip Technology
Description: EVAL BOARD FOR 2ASC-12A1HP
Utilized IC / Part: 2ASC-12A1HP
Contents: Board(s)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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ATTINY406-MF ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf
ATTINY406-MF
Hersteller: Microchip Technology
Description: 20MHZ, 4KB, VQFN20, EXT 125C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
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17+1.3 EUR
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ATTINY406-MN ATtiny202-204-402-404-406-DataSheet-DS40002318A.pdf
ATTINY406-MN
Hersteller: Microchip Technology
Description: 20MHZ, 4KB, VQFN20, IND 105C, TR
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 18
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17+1.3 EUR
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MIC184YM-TR MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf
MIC184YM-TR
Hersteller: Microchip Technology
Description: SENSOR DIGITAL -55C-125C 8SOIC
Features: Output Switch, Shutdown Mode, Standby Mode
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 9 b
Supplier Device Package: 8-SOIC
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -55°C ~ 125°C
Produkt ist nicht verfügbar
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MIC184YM-TR MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf
MIC184YM-TR
Hersteller: Microchip Technology
Description: SENSOR DIGITAL -55C-125C 8SOIC
Sensing Temperature - Remote: -55°C ~ 125°C
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 8-SOIC
Resolution: 9 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Shutdown Mode, Standby Mode
Packaging: Cut Tape (CT)
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AnzahlPrivatkunde
11+1.93 EUR
25+1.61 EUR
100+1.54 EUR
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MIC184BMM MIC184-Local-Remote-Thermal-Supervisor-DS20006457A.pdf
MIC184BMM
Hersteller: Microchip Technology
Description: SENSOR DIGITAL -55C-125C 8MSOP
Sensing Temperature - Remote: -55°C ~ 125°C
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 0°C ~ 100°C (-55°C ~ 125°C)
Supplier Device Package: 8-MSOP
Resolution: 9 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Features: Output Switch, Shutdown Mode, Standby Mode
Packaging: Bulk
Produkt ist nicht verfügbar
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LT-1084
Hersteller: Microchip Technology
Description: 6.4V .5MA +/- .1% ROUND-END TEMP
Packaging: Bulk
Produkt ist nicht verfügbar
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2295000-R
Hersteller: Microchip Technology
Description: 16 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 16
auf Bestellung 2 Stücke:
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AnzahlPrivatkunde
1+1901.76 EUR
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2N4091UB/TR
2N4091UB/TR
Hersteller: Microchip Technology
Description: JFET N-CH 40V 3UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Produkt ist nicht verfügbar
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MQ2N4091
MQ2N4091
Hersteller: Microchip Technology
Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Produkt ist nicht verfügbar
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MX2N4091
MX2N4091
Hersteller: Microchip Technology
Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Qualification: MIL-PRF-19500/431
Produkt ist nicht verfügbar
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MV2N4091
MV2N4091
Hersteller: Microchip Technology
Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Qualification: MIL-PRF-19500/431
Produkt ist nicht verfügbar
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MQ2N4091UB
MQ2N4091UB
Hersteller: Microchip Technology
Description: JFET N-CH 40V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 30 Ohms
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Produkt ist nicht verfügbar
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MQ2N4091UB/TR
MQ2N4091UB/TR
Hersteller: Microchip Technology
Description: JFET N-CH 40V UB
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MX2N4091UB
MX2N4091UB
Hersteller: Microchip Technology
Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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MX2N4091UB/TR
MX2N4091UB/TR
Hersteller: Microchip Technology
Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MV2N4091UB
MV2N4091UB
Hersteller: Microchip Technology
Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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MV2N4091UB/TR
MV2N4091UB/TR
Hersteller: Microchip Technology
Description: JFET N-CH 40V 3UB
Qualification: MIL-PRF-19500/431
Current - Drain (Idss) @ Vds (Vgs=0): 30 mA @ 20 V
Resistance - RDS(On): 30 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 20V
FET Type: N-Channel
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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ATMXT3072M1HC-ARVAO
Hersteller: Microchip Technology
Description: 3072 NODE TS IC TQFP144
Packaging: Tape & Reel (TR)
Touchscreen: 2 Wire Capacitive
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
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ATMXT3072M1E-AVAO
Hersteller: Microchip Technology
Description: 3072 NODE TS IC TQFP144
Packaging: Tray
Touchscreen: 2 Wire Capacitive
Produkt ist nicht verfügbar
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