PIC32CZ2051CA70100-I/XEB Microchip Technology
Hersteller: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Number of I/O: 75
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b SAR
Core Processor: ARM® Cortex®-M7F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP Exposed Pad
Packaging: Tray
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Technische Details PIC32CZ2051CA70100-I/XEB Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E, Number of I/O: 75, Supplier Device Package: 100-TQFP (14x14), Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 10x12b SAR, Core Processor: ARM® Cortex®-M7F, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 512K x 8, Program Memory Size: 2MB (2M x 8), Speed: 300MHz, Mounting Type: Surface Mount, Package / Case: 100-TQFP Exposed Pad, Packaging: Tray.