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ATSAME53J18A-AUT-EFP ATSAME53J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J18A-MUT-EFP ATSAME53J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
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ATSAME53J18A-MUT-EFP ATSAME53J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J19A-MUT-EFP ATSAME53J19A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J19A-MUT-EFP ATSAME53J19A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53N19A-AUT-EFP ATSAME53N19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53N19A-AUT-EFP ATSAME53N19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP ATSAME53J20A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP ATSAME53J20A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC6003JI3B-032K768T DSC6003JI3B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JL3B-032K768T DSC6101JL3B-032K768T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI3B-032K768T DSC6001JI3B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003HI3B-010.0000 Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003HI3B-010.0000T Microchip Technology Description: MEMS CMOS OSC
Base Resonator: MEMS
Frequency: 10 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Produkt ist nicht verfügbar
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DSC6003HI3B-027.0000 Microchip Technology Description: MEMS CMOS OSC
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Base Resonator: MEMS
Frequency: 27 MHz
Absolute Pull Range (APR): ±20ppm
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Produkt ist nicht verfügbar
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DSC6003HI3B-027.0000T Microchip Technology Description: MEMS CMOS OSC
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Base Resonator: MEMS
Frequency: 27 MHz
Absolute Pull Range (APR): ±20ppm
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Produkt ist nicht verfügbar
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DSC6003HI3B-032K768T Microchip Technology Description: MEMS CMOS OSC
Base Resonator: MEMS
Frequency: 32.768 kHz
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Produkt ist nicht verfügbar
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DSC6011HI1A-013.5600T DSC6011HI1A-013.5600T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011HI1A-013.5600T DSC6011HI1A-013.5600T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
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9+2.43 EUR
10+2.38 EUR
50+2.34 EUR
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DSC6011ME2A-016.0000 DSC6011ME2A-016.0000 Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC6013MI1A-000.0000T DSC6013MI1A-000.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
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DSC6013MI1A-000.0000T DSC6013MI1A-000.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
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DSC6001HI2B-024.0000 DSC6001HI2B-024.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC 1612 25PPM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 24 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101ML3B-027.0000 DSC6101ML3B-027.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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11+2.01 EUR
50+1.98 EUR
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DSC6301CI2CA-036.0000T Microchip Technology 20005808A.pdf Description: MEMS OSC XO 36.0000MHZ LVCMOS
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 36 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 3mA (Typ)
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
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DSC6301CI2CA-036.0000T Microchip Technology 20005808A.pdf Description: MEMS OSC XO 36.0000MHZ LVCMOS
Base Resonator: MEMS
Frequency: 36 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 3mA (Typ)
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
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DSC6003MA3B-032K768T DSC6003MA3B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC 2016 20PPM
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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AT49f4096A-70TC AT49f4096A-70TC Microchip Technology AT49F4096A_Rev2000.pdf Description: IC FLASH 4MBIT PARALLEL 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 50µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
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PM8650A1-FEI PM8650A1-FEI Microchip Technology 00003534.pdf Description: NVME2108HC, W/ THINNER Z HEIGHT
Packaging: Tray
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Controller Type: NVMe Controller
Supplier Device Package: Module
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M1.5KE6.8A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 5.8VWM 10.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 143A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC1123CL1-287.0000T DSC1123CL1-287.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1103AL1-287.0000T DSC1103AL1-287.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1123CL1-287.0000 DSC1123CL1-287.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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DSC1103AL1-287.0000 DSC1103AL1-287.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
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MTCH1060T-I/REB MTCH1060T-I/REB Microchip Technology MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
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MTCH1060T-I/REB MTCH1060T-I/REB Microchip Technology MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
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MTCH1030-E/ST MTCH1030-E/ST Microchip Technology MTCH1030-DataSheet-DS40002457.pdf Description: 3 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 3
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MTCH1060-E/REB MTCH1060-E/REB Microchip Technology MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
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MIC9130BM MIC9130BM Microchip Technology mic9130.pdf Description: IC REG CTRLR TELECOM 1OUT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-SOIC
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MIC9130BQS MIC9130BQS Microchip Technology mic9130.pdf Description: IC REG CTRLR TELECOM 1OUT 16QSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-QSOP
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MIC9130YQS MIC9130YQS Microchip Technology mic9130.pdf Description: IC REG CTRLR TELECOM 1OUT 16QSOP
Packaging: Tube
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-QSOP
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MP6KE75A MP6KE75A Microchip Technology rf01007_rb.pdf Description: TVS DIODE 64.1VWM 103VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 64.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC16F17554-I/STX PIC16F17554-I/STX Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
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PIC16F17554-I/SS PIC16F17554-I/SS Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17555-I/STX PIC16F17555-I/STX Microchip Technology PIC16F17576-Family-Product-Brief-DS40002538.pdf Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
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PIC16F17554-I/SO Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17555-I/SS PIC16F17555-I/SS Microchip Technology PIC16F17554-55-74-75.pdf Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
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PIC16F17555-I/SO PIC16F17555-I/SO Microchip Technology PIC16F17576-Family-Product-Brief-DS40002538.pdf Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
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PIC16F17556-I/STX PIC16F17556-I/STX Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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PIC16F17556-I/SS PIC16F17556-I/SS Microchip Technology PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F17556-I/SO Microchip Technology PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
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100+2 EUR
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PIC16F17554-I/SP PIC16F17554-I/SP Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
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PIC16F17555-I/SP PIC16F17555-I/SP Microchip Technology PIC16F17576-Family-Product-Brief-DS40002538.pdf Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
auf Bestellung 395 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.67 EUR
25+3.36 EUR
100+3.05 EUR
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PIC16F17556-I/SP PIC16F17556-I/SP Microchip Technology PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
auf Bestellung 331 Stücke:
Lieferzeit 10-14 Tag (e)
6+4.05 EUR
25+3.7 EUR
100+3.36 EUR
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PIC16F17554T-I/STX PIC16F17554T-I/STX Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554T-I/SS PIC16F17554T-I/SS Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17555T-I/STX PIC16F17555T-I/STX Microchip Technology Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554T-I/SO Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554-E/STX PIC16F17554-E/STX Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554-E/SS PIC16F17554-E/SS Microchip Technology Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
Produkt ist nicht verfügbar
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ATSAME53J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J19A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J19A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J19A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J19A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53N19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N19A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53N19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N19A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC6003JI3B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI3B-032K768T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JL3B-032K768T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JL3B-032K768T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JI3B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001JI3B-032K768T
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003HI3B-010.0000
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC6003HI3B-010.0000T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Base Resonator: MEMS
Frequency: 10 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Produkt ist nicht verfügbar
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DSC6003HI3B-027.0000
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Base Resonator: MEMS
Frequency: 27 MHz
Absolute Pull Range (APR): ±20ppm
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Produkt ist nicht verfügbar
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DSC6003HI3B-027.0000T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Base Resonator: MEMS
Frequency: 27 MHz
Absolute Pull Range (APR): ±20ppm
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Produkt ist nicht verfügbar
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DSC6003HI3B-032K768T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Base Resonator: MEMS
Frequency: 32.768 kHz
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Produkt ist nicht verfügbar
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DSC6011HI1A-013.5600T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6011HI1A-013.5600T
Hersteller: Microchip Technology
Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011HI1A-013.5600T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6011HI1A-013.5600T
Hersteller: Microchip Technology
Description: MEMS OSC XO 13.5600MHZ CMOS SMD
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 13.56 MHz
Base Resonator: MEMS
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10+2.38 EUR
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DSC6011ME2A-016.0000 DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6011ME2A-016.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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9+2.37 EUR
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DSC6013MI1A-000.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6013MI1A-000.0000T
Hersteller: Microchip Technology
Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
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DSC6013MI1A-000.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6013MI1A-000.0000T
Hersteller: Microchip Technology
Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±50ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
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DSC6001HI2B-024.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HI2B-024.0000
Hersteller: Microchip Technology
Description: MEMS OSC 1612 25PPM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 24 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101ML3B-027.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101ML3B-027.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 27 MHz
Base Resonator: MEMS
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11+2.01 EUR
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DSC6301CI2CA-036.0000T 20005808A.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 36.0000MHZ LVCMOS
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 36 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 3mA (Typ)
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Produkt ist nicht verfügbar
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DSC6301CI2CA-036.0000T 20005808A.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 36.0000MHZ LVCMOS
Base Resonator: MEMS
Frequency: 36 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 3mA (Typ)
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-SMD, No Lead
Packaging: Cut Tape (CT)
auf Bestellung 929 Stücke:
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9+2.34 EUR
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DSC6003MA3B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-032K768T
Hersteller: Microchip Technology
Description: MEMS OSC 2016 20PPM
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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AT49f4096A-70TC AT49F4096A_Rev2000.pdf
AT49f4096A-70TC
Hersteller: Microchip Technology
Description: IC FLASH 4MBIT PARALLEL 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Write Cycle Time - Word, Page: 50µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PM8650A1-FEI 00003534.pdf
PM8650A1-FEI
Hersteller: Microchip Technology
Description: NVME2108HC, W/ THINNER Z HEIGHT
Packaging: Tray
Package / Case: 16-SMD Module
Mounting Type: Surface Mount
Controller Type: NVMe Controller
Supplier Device Package: Module
Produkt ist nicht verfügbar
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M1.5KE6.8A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 5.8VWM 10.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 143A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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DSC1123CL1-287.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CL1-287.0000T
Hersteller: Microchip Technology
Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1103AL1-287.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103AL1-287.0000T
Hersteller: Microchip Technology
Description: MEMS OSC LOW JITTER 287MHZ LVDS
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1123CL1-287.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CL1-287.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1103AL1-287.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103AL1-287.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 287.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 287 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MTCH1060T-I/REB MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf
MTCH1060T-I/REB
Hersteller: Microchip Technology
Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
Produkt ist nicht verfügbar
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MTCH1060T-I/REB MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf
MTCH1060T-I/REB
Hersteller: Microchip Technology
Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
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MTCH1030-E/ST MTCH1030-DataSheet-DS40002457.pdf
MTCH1030-E/ST
Hersteller: Microchip Technology
Description: 3 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Proximity Detection: Yes
LED Driver Channels: Up to 3
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12+1.82 EUR
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MTCH1060-E/REB MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf
MTCH1060-E/REB
Hersteller: Microchip Technology
Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-VQFN (3x3)
Proximity Detection: Yes
LED Driver Channels: Up to 6
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12+1.84 EUR
25+1.69 EUR
100+1.54 EUR
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MIC9130BM mic9130.pdf
MIC9130BM
Hersteller: Microchip Technology
Description: IC REG CTRLR TELECOM 1OUT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-SOIC
Produkt ist nicht verfügbar
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MIC9130BQS mic9130.pdf
MIC9130BQS
Hersteller: Microchip Technology
Description: IC REG CTRLR TELECOM 1OUT 16QSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-QSOP
Produkt ist nicht verfügbar
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MIC9130YQS mic9130.pdf
MIC9130YQS
Hersteller: Microchip Technology
Description: IC REG CTRLR TELECOM 1OUT 16QSOP
Packaging: Tube
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Voltage - Output: 4.7V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 9V ~ 18V
Operating Temperature: -40°C ~ 125°C
Applications: Controller, Telecom
Supplier Device Package: 16-QSOP
Produkt ist nicht verfügbar
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MP6KE75A rf01007_rb.pdf
MP6KE75A
Hersteller: Microchip Technology
Description: TVS DIODE 64.1VWM 103VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 64.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.3V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC16F17554-I/STX
PIC16F17554-I/STX
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554-I/SS
PIC16F17554-I/SS
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17555-I/STX PIC16F17576-Family-Product-Brief-DS40002538.pdf
PIC16F17555-I/STX
Hersteller: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.09 EUR
25+1.9 EUR
100+1.73 EUR
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PIC16F17554-I/SO
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17555-I/SS PIC16F17554-55-74-75.pdf
PIC16F17555-I/SS
Hersteller: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
auf Bestellung 672 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.15 EUR
25+1.96 EUR
100+1.78 EUR
Mindestbestellmenge: 10 Stücke
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PIC16F17555-I/SO PIC16F17576-Family-Product-Brief-DS40002538.pdf
PIC16F17555-I/SO
Hersteller: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
auf Bestellung 338 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.26 EUR
25+2.06 EUR
100+1.87 EUR
Mindestbestellmenge: 10 Stücke
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PIC16F17556-I/STX
PIC16F17556-I/STX
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
Produkt ist nicht verfügbar
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PIC16F17556-I/SS PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf
PIC16F17556-I/SS
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
auf Bestellung 331 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.31 EUR
25+2.12 EUR
100+1.9 EUR
Mindestbestellmenge: 10 Stücke
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PIC16F17556-I/SO PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
auf Bestellung 587 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.4 EUR
25+2.21 EUR
100+2 EUR
Mindestbestellmenge: 9 Stücke
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PIC16F17554-I/SP
PIC16F17554-I/SP
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17555-I/SP PIC16F17576-Family-Product-Brief-DS40002538.pdf
PIC16F17555-I/SP
Hersteller: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 24
auf Bestellung 395 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.67 EUR
25+3.36 EUR
100+3.05 EUR
Mindestbestellmenge: 6 Stücke
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PIC16F17556-I/SP PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf
PIC16F17556-I/SP
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 25
auf Bestellung 331 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+4.05 EUR
25+3.7 EUR
100+3.36 EUR
Mindestbestellmenge: 6 Stücke
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PIC16F17554T-I/STX
PIC16F17554T-I/STX
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554T-I/SS
PIC16F17554T-I/SS
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17555T-I/STX
PIC16F17555T-I/STX
Hersteller: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554T-I/SO
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554-E/STX
PIC16F17554-E/STX
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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PIC16F17554-E/SS
PIC16F17554-E/SS
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
Produkt ist nicht verfügbar
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