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SMDB24e3/TR7 SMDB24e3/TR7 Microchip Technology SMDA.pdf Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB24e3/TR7 SMDB24e3/TR7 Microchip Technology SMDA.pdf Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB24Ce3/TR7 SMDB24Ce3/TR7 Microchip Technology 132313-smda-datasheet Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB24Ce3/TR7 SMDB24Ce3/TR7 Microchip Technology 132313-smda-datasheet Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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PIC18F26Q84T-E/SS PIC18F26Q84T-E/SS Microchip Technology PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf Description: CAN-FD, 64KB FLASH, 8KB RAM, 12B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC18F26Q84-E/5N PIC18F26Q84-E/5N Microchip Technology PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf Description: CAN, 128KB FLASH, 13KB RAM, 12B
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (6x6)
Number of I/O: 25
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ATTINY44-20PU ATTINY44-20PU Microchip Technology 8006S.pdf description Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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ATTINY44V-10PU ATTINY44V-10PU Microchip Technology 8006S.pdf Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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2N3920 2N3920 Microchip Technology Description: TRANS PNP 60V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 15 W
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2N6671 2N6671 Microchip Technology Description: TRANS PNP 300V 8A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
DC Current Gain (hFE) (Min) @ Ic, Vce: 10 @ 8A, 300V
Supplier Device Package: TO-3
Current - Collector (Ic) (Max): 8 A
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 150 W
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M1.5KE68A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 58.1VWM 92VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 16.3A
Voltage - Reverse Standoff (Typ): 58.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 92V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC2010FM2-A0001T DSC2010FM2-A0001T Microchip Technology DSC2010FM2-A0001.pdf Description: MEMS OSC XO 2.25V-3.6V 14SMD
Voltage - Supply: 2.25V ~ 3.6V
Operating Temperature: -55°C ~ 125°C
Type: Clock Generator
Frequency - Max: 148.5MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes
Supplier Device Package: 14-QFN (3.2x2.5)
Differential - Input:Output: No/No
Ratio - Input:Output: 0:1
Produkt ist nicht verfügbar
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MIC38C43AYMM MIC38C43AYMM Microchip Technology MCRLS04964-1.pdf?t.download=true&u=5oefqw Description: BICMOS CURRENT-MODE PWM CONTROLL
Control Features: Frequency Control
Synchronous Rectifier: Yes
Supplier Device Package: 8-MSOP
Voltage - Supply (Vcc/Vdd): 7.6V ~ 20V
Topology: Buck, Boost, Flyback, Forward Converter
Frequency - Switching: 500kHz
Output Configuration: Positive, Isolation Capable
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Up, Step-Down, Step-Up/Step-Down
Mounting Type: Surface Mount
Output Type: Transistor Driver
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
Number of Outputs: 1
Clock Sync: No
Duty Cycle (Max): 96%
Output Phases: 1
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BZV55C39 BZV55C39 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 39V DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 39 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
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MCP3551T-E/SN MCP3551T-E/SN Microchip Technology 20001950F.pdf Description: IC ADC 22BIT 8-SOIC
Number of A/D Converters: 1
Architecture: Sigma-Delta
Supplier Device Package: 8-SOIC
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 14
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External
Data Interface: SPI
Configuration: ADC
Number of Bits: 22
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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MCP3551T-E/SN MCP3551T-E/SN Microchip Technology 20001950F.pdf Description: IC ADC 22BIT 8-SOIC
Number of A/D Converters: 1
Architecture: Sigma-Delta
Supplier Device Package: 8-SOIC
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 14
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External
Data Interface: SPI
Configuration: ADC
Number of Bits: 22
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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PIC16F17576-I/MP PIC16F17576-I/MP Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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PIC16F17576-I/P PIC16F17576-I/P Microchip Technology PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
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PIC16F17576-I/PT PIC16F17576-I/PT Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576T-I/MP PIC16F17576T-I/MP Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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PIC16F17576T-I/PT PIC16F17576T-I/PT Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576-E/MP PIC16F17576-E/MP Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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PIC16F17576-E/PT PIC16F17576-E/PT Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576-E/P PIC16F17576-E/P Microchip Technology Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
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2N5115 2N5115 Microchip Technology 124387-lds-0006 Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 60 mA @ 15 V
Qualification: MIL-PRF-19500
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2N5115E3 2N5115E3 Microchip Technology 124387-lds-0006.pdf Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
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MV2N5115 MV2N5115 Microchip Technology 124387-lds-0006.pdf Description: JFET P-CH 30V TO18
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Resistance - RDS(On): 100 Ohms
Power - Max: 500 mW
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: TO-18 (TO-206AA)
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-206AA, TO-18-3 Metal Can
Packaging: Bulk
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MV2N5115UB MV2N5115UB Microchip Technology 123965-lds-0006-1.pdf Description: JFET P-CH 30V UB
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Resistance - RDS(On): 100 Ohms
Power - Max: 500 mW
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
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2N5116 2N5116 Microchip Technology 124387-lds-0006 Description: JFET P-CH 30V TO18
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 4 V @ 1 nA
Resistance - RDS(On): 175 Ohms
Power - Max: 500 mW
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: TO-18
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-206AA, TO-18-3 Metal Can
Packaging: Bulk
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2N5116UA 2N5116UA Microchip Technology 124387-lds-0006.pdf Description: JFET P-CH 30V UA
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UA
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 175 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 5 mA @ 15 V
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MV2N5116UB/TR MV2N5116UB/TR Microchip Technology 123965-lds-0006-1.pdf Description: JFET P-CH 30V UB
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Resistance - RDS(On): 175 Ohms
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 5 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 nA
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DSC6011ME1A-050.0000T DSC6011ME1A-050.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 50 MHz
Base Resonator: MEMS
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ATMEGA161L-4PI ATMEGA161L-4PI Microchip Technology doc1228.pdf Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 35
DigiKey Programmable: Not Verified
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PD77728ILQ-0111-TR PD77728ILQ-0111-TR Microchip Technology PD77728-8-Port-PoE-Manager-Controller-Data-Sheet.pdf Description: 8 PORT IEEE 802.3 BT TYPE 4, FUL
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V, 44V ~ 57V
Current - Supply: 1.5mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: No
Number of Channels: 8
Power - Max: 90 W
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PD77728ILQ-0111-TR PD77728ILQ-0111-TR Microchip Technology PD77728-8-Port-PoE-Manager-Controller-Data-Sheet.pdf Description: 8 PORT IEEE 802.3 BT TYPE 4, FUL
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V, 44V ~ 57V
Current - Supply: 1.5mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: No
Number of Channels: 8
Power - Max: 90 W
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PD-9501GO-ET/AC Microchip Technology 137444-pd-9501go-et-datasheet Description: 1-PORT AT 60W OUTDOOR ET AC INTL
Number of Ports: 1
Compliance: IEEE802.3at
Power (Watts) - Per Port: 60W
Data Rate: 10/100/1000 Mbps
Operating Temperature: -40°C ~ 65°C
Type: Midspan Injector
Voltage - Input: 100 ~ 240 VAC
Mounting Type: Desktop
Voltage - Output: 54V
Size / Dimension: 6.69" L x 5.51" W x 2.36" H (169.9mm x 140.0mm x 59.9mm)
Features: IP67
Packaging: Bulk
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JANTX1N6463US JANTX1N6463US Microchip Technology 11066-sd50a-datasheet Description: TVS DIODE 12VWM 22.6VC B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: B, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.6V
Voltage - Clamping (Max) @ Ipp: 22.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/551
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M1.5KE51A M1.5KE51A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 43.6VWM 70.1VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.4A
Voltage - Reverse Standoff (Typ): 43.6V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 48.5V
Voltage - Clamping (Max) @ Ipp: 70.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SAMA7G54D1GT-I/4UB-SL3 Microchip Technology Description: CORTEX-A7 MPU,BGA,IND TEMP,1GB D
Voltage - I/O: 1.35V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 427-TFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: EBI, I2C, SPI
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB (3)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
Supplier Device Package: 427-TFBGA (21x18)
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SAMA7G54D1G-I/4UB-SL3 Microchip Technology Description: CORTEX-A7 MPU,BGA,IND TEMP,1GB D
Additional Interfaces: EBI, I2C, SPI
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB (3)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
Supplier Device Package: 427-TFBGA (21x18)
Voltage - I/O: 1.35V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 427-TFBGA
Packaging: Tray
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ATSAME53J18A-MF ATSAME53J18A-MF Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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ATSAMW25H18-MR210PA ATSAMW25H18-MR210PA Microchip Technology Atmel-42395-SmartConnect-ATSAMW25-MR210PA_Datasheet.pdf Description: RF TXRX MOD WIFI TH SMD
Protocol: 802.11b/g/n
Data Rate: 65Mbps
Power - Output: 17dBm
Voltage - Supply: 2.7V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Memory Size: 256kB Flash, 32kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95.5dBm
Package / Case: Module
Packaging: Bulk
DigiKey Programmable: Not Verified
Serial Interfaces: SPI, UART
RF Family/Standard: WiFi
Antenna Type: Integrated, Trace
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2304400-R 2304400-R Microchip Technology 00003375A.pdf Description: 4 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 4
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2293800-R Microchip Technology Description: 24 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 24
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CDLL5528D CDLL5528D Microchip Technology Description: DIODE ZENER 8.2V 500MW DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 7.5 V
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CDLL5528D/TR CDLL5528D/TR Microchip Technology Description: DIODE ZENER 8.2V 500MW DO213AA
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 7.5 V
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24CW640T-I/Q4B 24CW640T-I/Q4B Microchip Technology 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf Description: IC EEPROM 64KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 8K x 8
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24CW640T-I/Q4B 24CW640T-I/Q4B Microchip Technology 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf Description: IC EEPROM 64KBIT I2C 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 8K x 8
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24CW640-I/ST 24CW640-I/ST Microchip Technology 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf Description: IC EEPROM 64KBIT I2C 1MHZ 8TSSOP
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Memory Organization: 8K x 8
Access Time: 450 ns
Memory Interface: I2C
Write Cycle Time - Word, Page: 5ms
Supplier Device Package: 8-TSSOP
Memory Format: EEPROM
Clock Frequency: 1 MHz
Technology: EEPROM
Voltage - Supply: 1.6V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
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1n5997b 1n5997b Microchip Technology 1N5985B-1_1N6031B-1.pdf Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
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MCP42U83T-502E/ST MCP42U83T-502E/ST Microchip Technology MCP42U83-Data-Sheet-DS200069611.pdf Description: IC DIG POT 5K 14-TSSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 2
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MCP42U83T-502E/ST MCP42U83T-502E/ST Microchip Technology MCP42U83-Data-Sheet-DS200069611.pdf Description: IC DIG POT 5K 14-TSSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 2
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1N5063 Microchip Technology Description: DIODE ZENER 6.8V 3W AXIAL
Current - Reverse Leakage @ Vr: 500 µA @ 5.2 V
Power - Max: 3 W
Supplier Device Package: Axial
Impedance (Max) (Zzt): 2 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: Axial
Tolerance: ±5%
Packaging: Bulk
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1N5063SM 1N5063SM Microchip Technology Description: DIODE ZENER 6.8V 3W SQ-MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 3 W
Current - Reverse Leakage @ Vr: 500 µA @ 5.2 V
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1N4056R Microchip Technology 1N4044-1N4056.pdf Description: DIODE STD REV 1000V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
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1N4052 Microchip Technology 1N4044-1N4056.pdf Description: DIODE STANDARD 600V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
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1N4052R Microchip Technology 1N4044-1N4056.pdf Description: DIODE STD REV 600V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
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1N4051 Microchip Technology 1N4044-1N4056.pdf Description: DIODE STANDARD 500V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 500 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4055 Microchip Technology 1N4044-1N4056.pdf Description: DIODE STANDARD 900V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 900 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 900 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4051R Microchip Technology 1N4044-1N4056.pdf Description: DIODE STD REV 500V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 500 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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SMDB24e3/TR7 SMDA.pdf
SMDB24e3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB24e3/TR7 SMDA.pdf
SMDB24e3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Unidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB24Ce3/TR7 132313-smda-datasheet
SMDB24Ce3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDB24Ce3/TR7 132313-smda-datasheet
SMDB24Ce3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 24VWM 43VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 45pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 43V
Power - Peak Pulse: 300W
Power Line Protection: No
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PIC18F26Q84T-E/SS PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf
PIC18F26Q84T-E/SS
Hersteller: Microchip Technology
Description: CAN-FD, 64KB FLASH, 8KB RAM, 12B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
Produkt ist nicht verfügbar
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PIC18F26Q84-E/5N PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf
PIC18F26Q84-E/5N
Hersteller: Microchip Technology
Description: CAN, 128KB FLASH, 13KB RAM, 12B
Packaging: Tube
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 28-VQFN (6x6)
Number of I/O: 25
Produkt ist nicht verfügbar
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ATTINY44-20PU description 8006S.pdf
ATTINY44-20PU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATTINY44V-10PU 8006S.pdf
ATTINY44V-10PU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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2N3920
2N3920
Hersteller: Microchip Technology
Description: TRANS PNP 60V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 15 W
Produkt ist nicht verfügbar
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2N6671
2N6671
Hersteller: Microchip Technology
Description: TRANS PNP 300V 8A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
DC Current Gain (hFE) (Min) @ Ic, Vce: 10 @ 8A, 300V
Supplier Device Package: TO-3
Current - Collector (Ic) (Max): 8 A
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 150 W
Produkt ist nicht verfügbar
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M1.5KE68A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 58.1VWM 92VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 16.3A
Voltage - Reverse Standoff (Typ): 58.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.6V
Voltage - Clamping (Max) @ Ipp: 92V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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DSC2010FM2-A0001T DSC2010FM2-A0001.pdf
DSC2010FM2-A0001T
Hersteller: Microchip Technology
Description: MEMS OSC XO 2.25V-3.6V 14SMD
Voltage - Supply: 2.25V ~ 3.6V
Operating Temperature: -55°C ~ 125°C
Type: Clock Generator
Frequency - Max: 148.5MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes
Supplier Device Package: 14-QFN (3.2x2.5)
Differential - Input:Output: No/No
Ratio - Input:Output: 0:1
Produkt ist nicht verfügbar
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MIC38C43AYMM MCRLS04964-1.pdf?t.download=true&u=5oefqw
MIC38C43AYMM
Hersteller: Microchip Technology
Description: BICMOS CURRENT-MODE PWM CONTROLL
Control Features: Frequency Control
Synchronous Rectifier: Yes
Supplier Device Package: 8-MSOP
Voltage - Supply (Vcc/Vdd): 7.6V ~ 20V
Topology: Buck, Boost, Flyback, Forward Converter
Frequency - Switching: 500kHz
Output Configuration: Positive, Isolation Capable
Operating Temperature: -40°C ~ 85°C (TA)
Function: Step-Up, Step-Down, Step-Up/Step-Down
Mounting Type: Surface Mount
Output Type: Transistor Driver
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
Number of Outputs: 1
Clock Sync: No
Duty Cycle (Max): 96%
Output Phases: 1
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BZV55C39 8298-bzv55-c2v4-c75-datasheet
BZV55C39
Hersteller: Microchip Technology
Description: DIODE ZENER 39V DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 39 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Produkt ist nicht verfügbar
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MCP3551T-E/SN 20001950F.pdf
MCP3551T-E/SN
Hersteller: Microchip Technology
Description: IC ADC 22BIT 8-SOIC
Number of A/D Converters: 1
Architecture: Sigma-Delta
Supplier Device Package: 8-SOIC
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 14
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External
Data Interface: SPI
Configuration: ADC
Number of Bits: 22
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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MCP3551T-E/SN 20001950F.pdf
MCP3551T-E/SN
Hersteller: Microchip Technology
Description: IC ADC 22BIT 8-SOIC
Number of A/D Converters: 1
Architecture: Sigma-Delta
Supplier Device Package: 8-SOIC
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 14
Voltage - Supply, Digital: 2.7V ~ 5.5V
Voltage - Supply, Analog: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External
Data Interface: SPI
Configuration: ADC
Number of Bits: 22
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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PIC16F17576-I/MP
PIC16F17576-I/MP
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
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AnzahlPreis
7+2.55 EUR
25+2.34 EUR
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PIC16F17576-I/P PIC16F17556-76-Microcontroller-Data-Sheet-DS40002614.pdf
PIC16F17576-I/P
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
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AnzahlPreis
4+4.65 EUR
25+4.26 EUR
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PIC16F17576-I/PT
PIC16F17576-I/PT
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
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PIC16F17576T-I/MP
PIC16F17576T-I/MP
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
Produkt ist nicht verfügbar
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PIC16F17576T-I/PT
PIC16F17576T-I/PT
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
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PIC16F17576-E/MP
PIC16F17576-E/MP
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-QFN (5x5)
Number of I/O: 36
Produkt ist nicht verfügbar
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PIC16F17576-E/PT
PIC16F17576-E/PT
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
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PIC16F17576-E/P
PIC16F17576-E/P
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 12B DIFFERE
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 36
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2N5115 124387-lds-0006
2N5115
Hersteller: Microchip Technology
Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Grade: Military
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 60 mA @ 15 V
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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2N5115E3 124387-lds-0006.pdf
2N5115E3
Hersteller: Microchip Technology
Description: JFET P-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 100 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Produkt ist nicht verfügbar
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MV2N5115 124387-lds-0006.pdf
MV2N5115
Hersteller: Microchip Technology
Description: JFET P-CH 30V TO18
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Resistance - RDS(On): 100 Ohms
Power - Max: 500 mW
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: TO-18 (TO-206AA)
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-206AA, TO-18-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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MV2N5115UB 123965-lds-0006-1.pdf
MV2N5115UB
Hersteller: Microchip Technology
Description: JFET P-CH 30V UB
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 15 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 3 V @ 1 nA
Resistance - RDS(On): 100 Ohms
Power - Max: 500 mW
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 25pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5116 124387-lds-0006
2N5116
Hersteller: Microchip Technology
Description: JFET P-CH 30V TO18
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 4 V @ 1 nA
Resistance - RDS(On): 175 Ohms
Power - Max: 500 mW
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: TO-18
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-206AA, TO-18-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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2N5116UA 124387-lds-0006.pdf
2N5116UA
Hersteller: Microchip Technology
Description: JFET P-CH 30V UA
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UA
Drain to Source Voltage (Vdss): 30 V
Power - Max: 500 mW
Resistance - RDS(On): 175 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 5 mA @ 15 V
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MV2N5116UB/TR 123965-lds-0006-1.pdf
MV2N5116UB/TR
Hersteller: Microchip Technology
Description: JFET P-CH 30V UB
Drain to Source Voltage (Vdss): 30 V
Grade: Military
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 27pF @ 15V
FET Type: P-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Resistance - RDS(On): 175 Ohms
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Current - Drain (Idss) @ Vds (Vgs=0): 5 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 nA
Produkt ist nicht verfügbar
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DSC6011ME1A-050.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6011ME1A-050.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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ATMEGA161L-4PI doc1228.pdf
ATMEGA161L-4PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PD77728ILQ-0111-TR PD77728-8-Port-PoE-Manager-Controller-Data-Sheet.pdf
PD77728ILQ-0111-TR
Hersteller: Microchip Technology
Description: 8 PORT IEEE 802.3 BT TYPE 4, FUL
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V, 44V ~ 57V
Current - Supply: 1.5mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: No
Number of Channels: 8
Power - Max: 90 W
Produkt ist nicht verfügbar
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PD77728ILQ-0111-TR PD77728-8-Port-PoE-Manager-Controller-Data-Sheet.pdf
PD77728ILQ-0111-TR
Hersteller: Microchip Technology
Description: 8 PORT IEEE 802.3 BT TYPE 4, FUL
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V, 44V ~ 57V
Current - Supply: 1.5mA
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 56-QFN (8x8)
Auxiliary Sense: No
Number of Channels: 8
Power - Max: 90 W
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PD-9501GO-ET/AC 137444-pd-9501go-et-datasheet
Hersteller: Microchip Technology
Description: 1-PORT AT 60W OUTDOOR ET AC INTL
Number of Ports: 1
Compliance: IEEE802.3at
Power (Watts) - Per Port: 60W
Data Rate: 10/100/1000 Mbps
Operating Temperature: -40°C ~ 65°C
Type: Midspan Injector
Voltage - Input: 100 ~ 240 VAC
Mounting Type: Desktop
Voltage - Output: 54V
Size / Dimension: 6.69" L x 5.51" W x 2.36" H (169.9mm x 140.0mm x 59.9mm)
Features: IP67
Packaging: Bulk
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JANTX1N6463US 11066-sd50a-datasheet
JANTX1N6463US
Hersteller: Microchip Technology
Description: TVS DIODE 12VWM 22.6VC B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 125A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: B, SQ-MELF
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.6V
Voltage - Clamping (Max) @ Ipp: 22.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/551
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M1.5KE51A RF01008_rE.pdf
M1.5KE51A
Hersteller: Microchip Technology
Description: TVS DIODE 43.6VWM 70.1VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.4A
Voltage - Reverse Standoff (Typ): 43.6V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 48.5V
Voltage - Clamping (Max) @ Ipp: 70.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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SAMA7G54D1GT-I/4UB-SL3
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA,IND TEMP,1GB D
Voltage - I/O: 1.35V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 427-TFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: EBI, I2C, SPI
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB (3)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
Supplier Device Package: 427-TFBGA (21x18)
Produkt ist nicht verfügbar
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SAMA7G54D1G-I/4UB-SL3
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA,IND TEMP,1GB D
Additional Interfaces: EBI, I2C, SPI
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB (3)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
Supplier Device Package: 427-TFBGA (21x18)
Voltage - I/O: 1.35V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 427-TFBGA
Packaging: Tray
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ATSAME53J18A-MF SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-MF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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2+10.52 EUR
25+9.63 EUR
100+8.75 EUR
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ATSAMW25H18-MR210PA Atmel-42395-SmartConnect-ATSAMW25-MR210PA_Datasheet.pdf
ATSAMW25H18-MR210PA
Hersteller: Microchip Technology
Description: RF TXRX MOD WIFI TH SMD
Protocol: 802.11b/g/n
Data Rate: 65Mbps
Power - Output: 17dBm
Voltage - Supply: 2.7V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Memory Size: 256kB Flash, 32kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95.5dBm
Package / Case: Module
Packaging: Bulk
DigiKey Programmable: Not Verified
Serial Interfaces: SPI, UART
RF Family/Standard: WiFi
Antenna Type: Integrated, Trace
Produkt ist nicht verfügbar
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2304400-R 00003375A.pdf
2304400-R
Hersteller: Microchip Technology
Description: 4 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 4
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2293800-R
Hersteller: Microchip Technology
Description: 24 PORT SAS/SATA
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 24
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CDLL5528D
CDLL5528D
Hersteller: Microchip Technology
Description: DIODE ZENER 8.2V 500MW DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 7.5 V
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CDLL5528D/TR
CDLL5528D/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 8.2V 500MW DO213AA
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 7.5 V
Produkt ist nicht verfügbar
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24CW640T-I/Q4B 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf
24CW640T-I/Q4B
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 8K x 8
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24CW640T-I/Q4B 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf
24CW640T-I/Q4B
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT I2C 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 8K x 8
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24CW640-I/ST 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf
24CW640-I/ST
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT I2C 1MHZ 8TSSOP
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Memory Organization: 8K x 8
Access Time: 450 ns
Memory Interface: I2C
Write Cycle Time - Word, Page: 5ms
Supplier Device Package: 8-TSSOP
Memory Format: EEPROM
Clock Frequency: 1 MHz
Technology: EEPROM
Voltage - Supply: 1.6V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Produkt ist nicht verfügbar
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1n5997b 1N5985B-1_1N6031B-1.pdf
1n5997b
Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 7 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Produkt ist nicht verfügbar
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MCP42U83T-502E/ST MCP42U83-Data-Sheet-DS200069611.pdf
MCP42U83T-502E/ST
Hersteller: Microchip Technology
Description: IC DIG POT 5K 14-TSSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 2
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MCP42U83T-502E/ST MCP42U83-Data-Sheet-DS200069611.pdf
MCP42U83T-502E/ST
Hersteller: Microchip Technology
Description: IC DIG POT 5K 14-TSSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 2
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2+8.82 EUR
25+7.37 EUR
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1N5063
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 3W AXIAL
Current - Reverse Leakage @ Vr: 500 µA @ 5.2 V
Power - Max: 3 W
Supplier Device Package: Axial
Impedance (Max) (Zzt): 2 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5063SM
1N5063SM
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 3W SQ-MELF
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: A, SQ-MELF
Power - Max: 3 W
Current - Reverse Leakage @ Vr: 500 µA @ 5.2 V
Produkt ist nicht verfügbar
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1N4056R 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE STD REV 1000V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4052 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD 600V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4052R 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE STD REV 600V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4051 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD 500V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 500 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4055 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD 900V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 900 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 900 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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1N4051R 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE STD REV 500V 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 500 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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