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ATSAMD20J16A-CUT ATSAMD20J16A-CUT Microchip Technology SAM-D20-Family-Data-Sheet-DS60001504.pdf Description: IC MCU 32BIT 64KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD20J16A-CUT ATSAMD20J16A-CUT Microchip Technology SAM-D20-Family-Data-Sheet-DS60001504.pdf Description: IC MCU 32BIT 64KB FLASH 64UFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCP1501T-30E/SN MCP1501T-30E/SN Microchip Technology MCP1501-Data-Sheet-DS20005474F.pdf Description: IC VREF SERIES 0.1% 8SOIC
Packaging: Tape & Reel (TR)
Tolerance: ±0.1%
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Temperature Coefficient: 50ppm/°C
Output Type: Fixed
Mounting Type: Surface Mount
Voltage - Input: 3.2V ~ 5.5V
Reference Type: Series
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 3V
Current - Output: 20 mA
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MCP1501T-30E/SN MCP1501T-30E/SN Microchip Technology MCP1501-Data-Sheet-DS20005474F.pdf Description: IC VREF SERIES 0.1% 8SOIC
Packaging: Cut Tape (CT)
Tolerance: ±0.1%
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Temperature Coefficient: 50ppm/°C
Output Type: Fixed
Mounting Type: Surface Mount
Voltage - Input: 3.2V ~ 5.5V
Reference Type: Series
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 3V
Current - Output: 20 mA
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DSC1001AI2-032.7680 DSC1001AI2-032.7680 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 32.7680MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-DFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 MHz
Base Resonator: MEMS
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10+2.02 EUR
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ATTINY26-16PC ATTINY26-16PC Microchip Technology 1477S.pdf Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CDLL4107/TR CDLL4107/TR Microchip Technology 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf Description: DIODE ZENER 13V 500MW DO213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Produkt ist nicht verfügbar
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DSC6013HI2B-250K000 DSC6013HI2B-250K000 Microchip Technology DSC6XXXSellSheet.pdf Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6013HI2B-250K000T DSC6013HI2B-250K000T Microchip Technology DSC6XXXSellSheet.pdf Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA6011BA3B-250K000VAO DSA6011BA3B-250K000VAO Microchip Technology DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf Description: MEMS OSC, AUTO, LVCMOS, 0.25MHZ,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA6011BA3B-250K000TVAO DSA6011BA3B-250K000TVAO Microchip Technology DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf Description: MEMS OSC, AUTO, LVCMOS, 0.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PM5395-BGI Microchip Technology pm5395-bgi-microchip-technology-37636244#datasheet Description: CRSU 4x2488 Quad Clock Recovery
Packaging: Bulk
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JANTXV1N5523BUR-1 JANTXV1N5523BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 5.1V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 26 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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DSC1121CM1-040.0000 DSC1121CM1-040.0000 Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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DSC1121CM1-040.0000T DSC1121CM1-040.0000T Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JANTXV1N4626DUR-1 JANTXV1N4626DUR-1 Microchip Technology 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf Description: DIODE ZENER 5.6V 500MW DO213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 1400 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 4 V
Qualification: MIL-PRF-19500/435
Produkt ist nicht verfügbar
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MRH25N45T1SR Microchip Technology 00005137A.pdf Description: RH MOSFET 250V TO-254AA
Packaging: Bulk
Produkt ist nicht verfügbar
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ADM00924 ADM00924 Microchip Technology trion-selector-guide-v2.6.pdf Description: EVAL BOARD FOR HV56020, HV56022
Packaging: Bulk
Function: Motor Controller/Driver, Haptic/Vibration
Type: Power Management
Contents: Board(s)
Utilized IC / Part: HV56020, HV56022
Primary Attributes: 2.7V ~ 5.5V Supply
Secondary Attributes: Graphical User Interface (GUI)
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ADM00795 ADM00795 Microchip Technology HV2903-Analog-Switch-Evaluation-Board-User's-Guide-DS50002582B.pdf Description: EVAL BOARD FOR HV2903
Packaging: Bulk
Function: Analog Switch
Type: Interface
Contents: Board(s)
Utilized IC / Part: HV2903
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EV34G23A EV34G23A Microchip Technology HV2925-User-Guide-DS50003617.pdf Description: EVAL BOARD FOR HV2925
Packaging: Bulk
Function: Analog Switch
Type: Interface
Contents: Board(s)
Utilized IC / Part: HV2925
Primary Attributes: 64-Channel
Secondary Attributes: On-Board LEDs, Test Points
Embedded: No
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DSC6111HI1B-012.0000 DSC6111HI1B-012.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111HI1B-012.0000T DSC6111HI1B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-012.0000 DSC6001HI2B-012.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC 1612 25PPM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI1A-012.0000T DSC6001JI1A-012.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI1A-012.0000T DSC6101JI1A-012.0000T Microchip Technology 20005624B.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI2A-012.0000T DSC6001JI2A-012.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6013JI2A-012.0000T DSC6013JI2A-012.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI1B-012.0000T DSC6101JI1B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI3B-012.0000T DSC6011JI3B-012.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI2B-012.0000T DSC6101JI2B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6111JE1B-012.0000T DSC6111JE1B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI3B-012.0000T DSC6111JI3B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6011JI1B-012.0000T DSC6011JI1B-012.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC ULTTA LOW POWET LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JE2B-012.0000T DSC6001JE2B-012.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6111JI2B-012.0000T DSC6111JI2B-012.0000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
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WILCS02IC-I/ZZX WILCS02IC-I/ZZX Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: WI-FI LINK CONTROLLER SOC, 802.1
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.412GHz ~ 2.472GHz
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 80mA ~ 86mA
Data Rate (Max): 54Mbps
Current - Transmitting: 216mA ~ 279mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 13
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
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WINCS02IC-V/ZZX WINCS02IC-V/ZZX Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: WI-FI NETWORK CONTROLLER SOC V,
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 7
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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WINCS02IC-I/ZZX WINCS02IC-I/ZZX Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: WI-FI NETWORK CONTROLLER SOC, 80
Packaging: Tray
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WILCS02IC-V/ZZX WILCS02IC-V/ZZX Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: WI-FI LINK CONTROLLER SOC V, 802
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 10
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
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WINCS02PE-I/100 WINCS02PE-I/100 Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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WILCS02PE-I/100 WILCS02PE-I/100 Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
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WINCS02UE-I/100 WINCS02UE-I/100 Microchip Technology WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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WILCS02UE-I/100 WILCS02UE-I/100 Microchip Technology WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
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1N5239B 1N5239B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 9.1V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
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DSC1001BE1-012.0000 DSC1001BE1-012.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC1001CE1-012.0000 DSC1001CE1-012.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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JANTX1N6156 Microchip Technology 1N6138_1N6173A.pdf Description: TVS DIODE 29.7VWM 56.28V AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 26.6A
Voltage - Reverse Standoff (Typ): 29.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 35.25V
Voltage - Clamping (Max) @ Ipp: 56.28V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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ATTINY15L-1PI ATTINY15L-1PI Microchip Technology doc1187.pdf description Description: IC MCU 8BIT 1KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 1.6MHz
Program Memory Size: 1KB (512 x 16)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MAPLAD30KP85A MAPLAD30KP85A Microchip Technology mplad30kp.pdf Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 216A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ATSAME53J18A-AUT-EFP ATSAME53J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-AUT-EFP ATSAME53J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP ATSAME53J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP ATSAME53J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J19A-MUT-EFP ATSAME53J19A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J19A-MUT-EFP ATSAME53J19A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53N19A-AUT-EFP ATSAME53N19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53N19A-AUT-EFP ATSAME53N19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP ATSAME53J20A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP ATSAME53J20A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC6003JI3B-032K768T DSC6003JI3B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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ATSAMD20J16A-CUT SAM-D20-Family-Data-Sheet-DS60001504.pdf
ATSAMD20J16A-CUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD20J16A-CUT SAM-D20-Family-Data-Sheet-DS60001504.pdf
ATSAMD20J16A-CUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64UFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCP1501T-30E/SN MCP1501-Data-Sheet-DS20005474F.pdf
MCP1501T-30E/SN
Hersteller: Microchip Technology
Description: IC VREF SERIES 0.1% 8SOIC
Packaging: Tape & Reel (TR)
Tolerance: ±0.1%
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Temperature Coefficient: 50ppm/°C
Output Type: Fixed
Mounting Type: Surface Mount
Voltage - Input: 3.2V ~ 5.5V
Reference Type: Series
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 3V
Current - Output: 20 mA
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Anzahl Preis
3300+0.91 EUR
Mindestbestellmenge: 3300
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MCP1501T-30E/SN MCP1501-Data-Sheet-DS20005474F.pdf
MCP1501T-30E/SN
Hersteller: Microchip Technology
Description: IC VREF SERIES 0.1% 8SOIC
Packaging: Cut Tape (CT)
Tolerance: ±0.1%
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Temperature Coefficient: 50ppm/°C
Output Type: Fixed
Mounting Type: Surface Mount
Voltage - Input: 3.2V ~ 5.5V
Reference Type: Series
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA
Supplier Device Package: 8-SOIC
Voltage - Output (Min/Fixed): 3V
Current - Output: 20 mA
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15+1.21 EUR
25+1.01 EUR
100+0.91 EUR
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DSC1001AI2-032.7680 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AI2-032.7680
Hersteller: Microchip Technology
Description: MEMS OSC XO 32.7680MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-DFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 MHz
Base Resonator: MEMS
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Anzahl Preis
9+2.06 EUR
10+2.02 EUR
50+1.99 EUR
Mindestbestellmenge: 9
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ATTINY26-16PC 1477S.pdf
ATTINY26-16PC
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CDLL4107/TR 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf
CDLL4107/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Produkt ist nicht verfügbar
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DSC6013HI2B-250K000 DSC6XXXSellSheet.pdf
DSC6013HI2B-250K000
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6013HI2B-250K000T DSC6XXXSellSheet.pdf
DSC6013HI2B-250K000T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA6011BA3B-250K000VAO DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf
DSA6011BA3B-250K000VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVCMOS, 0.25MHZ,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA6011BA3B-250K000TVAO DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221A.pdf
DSA6011BA3B-250K000TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVCMOS, 0.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PM5395-BGI pm5395-bgi-microchip-technology-37636244#datasheet
Hersteller: Microchip Technology
Description: CRSU 4x2488 Quad Clock Recovery
Packaging: Bulk
auf Bestellung 384 Stücke:
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Anzahl Preis
2+240.53 EUR
Mindestbestellmenge: 2
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JANTXV1N5523BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTXV1N5523BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 5.1V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 26 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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DSC1121CM1-040.0000
DSC1121CM1-040.0000
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1121CM1-040.0000T
DSC1121CM1-040.0000T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JANTXV1N4626DUR-1 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf
JANTXV1N4626DUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 5.6V 500MW DO213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 1400 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 4 V
Qualification: MIL-PRF-19500/435
Produkt ist nicht verfügbar
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MRH25N45T1SR 00005137A.pdf
Hersteller: Microchip Technology
Description: RH MOSFET 250V TO-254AA
Packaging: Bulk
Produkt ist nicht verfügbar
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ADM00924 trion-selector-guide-v2.6.pdf
ADM00924
Hersteller: Microchip Technology
Description: EVAL BOARD FOR HV56020, HV56022
Packaging: Bulk
Function: Motor Controller/Driver, Haptic/Vibration
Type: Power Management
Contents: Board(s)
Utilized IC / Part: HV56020, HV56022
Primary Attributes: 2.7V ~ 5.5V Supply
Secondary Attributes: Graphical User Interface (GUI)
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1+205.27 EUR
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ADM00795 HV2903-Analog-Switch-Evaluation-Board-User's-Guide-DS50002582B.pdf
ADM00795
Hersteller: Microchip Technology
Description: EVAL BOARD FOR HV2903
Packaging: Bulk
Function: Analog Switch
Type: Interface
Contents: Board(s)
Utilized IC / Part: HV2903
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Anzahl Preis
1+784.89 EUR
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EV34G23A HV2925-User-Guide-DS50003617.pdf
EV34G23A
Hersteller: Microchip Technology
Description: EVAL BOARD FOR HV2925
Packaging: Bulk
Function: Analog Switch
Type: Interface
Contents: Board(s)
Utilized IC / Part: HV2925
Primary Attributes: 64-Channel
Secondary Attributes: On-Board LEDs, Test Points
Embedded: No
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Anzahl Preis
1+1220.38 EUR
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DSC6111HI1B-012.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111HI1B-012.0000
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111HI1B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111HI1B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-012.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HI2B-012.0000
Hersteller: Microchip Technology
Description: MEMS OSC 1612 25PPM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI1A-012.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6001JI1A-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI1A-012.0000T 20005624B.pdf
DSC6101JI1A-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI2A-012.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6001JI2A-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6013JI2A-012.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6013JI2A-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI1B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JI1B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI3B-012.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JI3B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI2B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JI2B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JE1B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JE1B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI3B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI3B-012.0000T
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI1B-012.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JI1B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC ULTTA LOW POWET LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JE2B-012.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001JE2B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI2B-012.0000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI2B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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WILCS02IC-I/ZZX WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02IC-I/ZZX
Hersteller: Microchip Technology
Description: WI-FI LINK CONTROLLER SOC, 802.1
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.412GHz ~ 2.472GHz
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 80mA ~ 86mA
Data Rate (Max): 54Mbps
Current - Transmitting: 216mA ~ 279mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 13
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
auf Bestellung 416 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.93 EUR
Mindestbestellmenge: 4
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WINCS02IC-V/ZZX WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02IC-V/ZZX
Hersteller: Microchip Technology
Description: WI-FI NETWORK CONTROLLER SOC V,
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 7
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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Anzahl Preis
4+4.93 EUR
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WINCS02IC-I/ZZX WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02IC-I/ZZX
Hersteller: Microchip Technology
Description: WI-FI NETWORK CONTROLLER SOC, 80
Packaging: Tray
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Anzahl Preis
4+4.93 EUR
Mindestbestellmenge: 4
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WILCS02IC-V/ZZX WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02IC-V/ZZX
Hersteller: Microchip Technology
Description: WI-FI LINK CONTROLLER SOC V, 802
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 94mA
Data Rate (Max): 54Mbps
Current - Transmitting: 249mA ~ 289mA
Supplier Device Package: 48-VQFN (7x7)
GPIO: 10
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, SPI, UART
auf Bestellung 416 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.2 EUR
25+6.54 EUR
100+5.94 EUR
Mindestbestellmenge: 3
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WINCS02PE-I/100 WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02PE-I/100
Hersteller: Microchip Technology
Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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Anzahl Preis
3+8.62 EUR
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WILCS02PE-I/100 WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02PE-I/100
Hersteller: Microchip Technology
Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: PCB Trace
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
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Anzahl Preis
3+8.62 EUR
Mindestbestellmenge: 3
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WINCS02UE-I/100 WINCS02-Wi-Fi-Module-Data-Sheet-DS70005577.pdf
WINCS02UE-I/100
Hersteller: Microchip Technology
Description: 28-PAD WI-FI NETWORK CONTROLLER
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 88mA ~ 98mA
Current - Transmitting: 249mA ~ 311mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: I2C, SPI, UART
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Anzahl Preis
2+8.91 EUR
Mindestbestellmenge: 2
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WILCS02UE-I/100 WILCS02IC-and-WILCS02-Family-Data-Sheet-DS70005557.pdf
WILCS02UE-I/100
Hersteller: Microchip Technology
Description: 28-PAD WI-FI LINK CONTROLLER MOD
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 216mA ~ 273mA
Antenna Type: Antenna Not Included, U.FL
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, SDIO, SPI, UART, USB
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Anzahl Preis
2+8.91 EUR
Mindestbestellmenge: 2
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1N5239B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5239B
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
Produkt ist nicht verfügbar
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DSC1001BE1-012.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE1-012.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
auf Bestellung 850 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.68 EUR
50+1.65 EUR
Mindestbestellmenge: 11
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DSC1001CE1-012.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE1-012.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
auf Bestellung 706 Stücke:
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Anzahl Preis
11+1.68 EUR
50+1.65 EUR
Mindestbestellmenge: 11
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JANTX1N6156 1N6138_1N6173A.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 29.7VWM 56.28V AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 26.6A
Voltage - Reverse Standoff (Typ): 29.7V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 35.25V
Voltage - Clamping (Max) @ Ipp: 56.28V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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ATTINY15L-1PI description doc1187.pdf
ATTINY15L-1PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 1KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 1.6MHz
Program Memory Size: 1KB (512 x 16)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MAPLAD30KP85A mplad30kp.pdf
MAPLAD30KP85A
Hersteller: Microchip Technology
Description: TVS DIODE 85VWM 137VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 216A
Voltage - Reverse Standoff (Typ): 85V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 94.4V
Voltage - Clamping (Max) @ Ipp: 137V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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ATSAME53J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAME53J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J19A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J19A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J19A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J19A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53N19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N19A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53N19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53N19A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME53J20A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME53J20A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC6003JI3B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI3B-032K768T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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