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ICPB2005-1-110I ICPB2005-1-110I Microchip Technology ICPB2005.pdf Description: DC-12 GHZ 25W DISCRETE GAN HEMT
Current - Test: 250 mA
Voltage - Test: 28 V
Voltage - Rated: 28 V
Supplier Device Package: Die
Technology: GaN HEMT
Gain: 9.5dB
Power - Output: 25W
Frequency: 12GHz
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Package / Case: Die
Packaging: Box
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ICPB2002-1-110I ICPB2002-1-110I Microchip Technology ICPB2002.pdf Description: DC-12 GHZ 12W DISCRETE GAN HEMT
Power - Output: 12W
Frequency: 12GHz
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Package / Case: Die
Packaging: Bulk
Current - Test: 125 mA
Voltage - Test: 28 V
Voltage - Rated: 28 V
Supplier Device Package: Die
Technology: GaN HEMT
Gain: 10dB
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DSC1001DL5-050.0000 DSC1001DL5-050.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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DSC1001DL5-125.0000 DSC1001DL5-125.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1001DL5-026.0000 DSC1001DL5-026.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
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DSC1001DL5-016.0000 DSC1001DL5-016.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001DL5-004.0000 DSC1001DL5-004.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 4 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 8mA
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DSC1001DL5-033.3330 DSC1001DL5-033.3330 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 33.3330MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 33.333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 10.5mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
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DSC1001DL5-048.0000 DSC1001DL5-048.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 48.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 48 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 10.5mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
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DSC1001DL5-040.0000 DSC1001DL5-040.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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MSMCJ110CA/TR MSMCJ110CA/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 110VWM 177VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 110V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 122V
Voltage - Clamping (Max) @ Ipp: 177V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ110CA/TR MSMCJ110CA/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 110VWM 177VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 110V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 122V
Voltage - Clamping (Max) @ Ipp: 177V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSA1201CA3-120M0000TVAO DSA1201CA3-120M0000TVAO Microchip Technology DSA12x1-High-Performance-CMOS-MEMS-Oscillator-for-Automotive-DS20006385.pdf Description: MEMS OSC, AUTO, LVCMOS, 120MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 120 MHz
Base Resonator: MEMS
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DSA1201CA3-120M0000VAO DSA1201CA3-120M0000VAO Microchip Technology DSA12x1-High-Performance-CMOS-MEMS-Oscillator-for-Automotive-DS20006385.pdf Description: MEMS OSC, AUTO, LVCMOS, 120MHZ,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 120 MHz
Base Resonator: MEMS
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MSMLJ6.0CA/TR MSMLJ6.0CA/TR Microchip Technology msmlg5_j5_series_datasheet_revd.pdf Description: TVS DIODE 6VWM 10.3VC DO214AB
Current - Peak Pulse (10/1000µs): 291.3A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 3000W (3kW)
Voltage - Clamping (Max) @ Ipp: 10.3V
Voltage - Breakdown (Min): 6.67V
Bidirectional Channels: 1
Supplier Device Package: DO-214AB (SMLJ)
Voltage - Reverse Standoff (Typ): 6V
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DSC613RI3A-01VAT DSC613RI3A-01VAT Microchip Technology DSC613-Three-Output-Ultra-Low-Power-MEMS-Clock-Generator-DS20006024.pdf Description: 3-OUTPUT MEMS CLOCK GEN, 33.3333
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes
Supplier Device Package: 6-VFLGA (2.5x2)
Differential - Input:Output: No/No
Ratio - Input:Output: 1:3
Voltage - Supply: 1.71V ~ 1.89V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Clock Generator
Frequency - Max: 100MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 6-VFLGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M1.5KE36A M1.5KE36A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 30.8VWM 49.9VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 30A
Voltage - Reverse Standoff (Typ): 30.8V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 34.2V
Voltage - Clamping (Max) @ Ipp: 49.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MCP6006T-E/OTVAO MCP6006T-E/OTVAO Microchip Technology MCP6006-6R-6U-7-9-Data-Sheet-20006411B.pdf Description: SINGLE, 1MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 50µA
Slew Rate: 1.9V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: SOT-23-5
Number of Circuits: 1
Current - Output / Channel: 30 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
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MIC1551YM5-TR MIC1551YM5-TR Microchip Technology MIC1551-53-IttyBitty-RC-Type-555-Timer-Oscillator-DS20006985.pdf Description: IC OSC SNGL TIMER 500KHZ SC-74A
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 18V
Supplier Device Package: SOT-23-5
Current - Supply: 350 µA
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MIC1551YM5-TR MIC1551YM5-TR Microchip Technology MIC1551-53-IttyBitty-RC-Type-555-Timer-Oscillator-DS20006985.pdf Description: IC OSC SNGL TIMER 500KHZ SC-74A
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 18V
Supplier Device Package: SOT-23-5
Current - Supply: 350 µA
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ATTINY3217-MZ-VAO ATTINY3217-MZ-VAO Microchip Technology ATtiny3216-17-Auto-DataSheet-DS40002212A.pdf Description: 125C, GREEN, 16MHZ, QFN24 WETTAB
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 24x10b; D/A 3x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Grade: Automotive
Number of I/O: 22
Qualification: AEC-Q100
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ATTINY3217-MB-VAO ATTINY3217-MB-VAO Microchip Technology ATtiny3216-17-Auto-DataSheet-DS40002212A.pdf Description: 105C, GREEN, 20MHZ, QFN24 WETTAB
Qualification: AEC-Q100
Number of I/O: 22
Grade: Automotive
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b; D/A 3x8b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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LAN9381-I/6XX LAN9381-I/6XX Microchip Technology Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9382-I/6XX LAN9382-I/6XX Microchip Technology LAN938x+databrief+00003296B.pdf Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9383-I/6XX LAN9383-I/6XX Microchip Technology LAN938x+databrief+00003296B.pdf Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9384-I/6XX LAN9384-I/6XX Microchip Technology LAN938x+databrief+00003296B.pdf Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9381T-I/6XX LAN9381T-I/6XX Microchip Technology Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tape & Reel (TR)
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9383T-I/6XX LAN9383T-I/6XX Microchip Technology LAN938x+databrief+00003296B.pdf Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Supplier Device Package: 128-TQFP-EP (14x14)
Standards: IEEE 802.3
Protocol: Ethernet
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: RGMII, SGMII
Function: Switch
Package / Case: 128-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
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LAN9382T-I/6XX LAN9382T-I/6XX Microchip Technology LAN938x+databrief+00003296B.pdf Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Supplier Device Package: 128-TQFP-EP (14x14)
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Protocol: Ethernet
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: RGMII, SGMII
Function: Switch
Package / Case: 128-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
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LAN9384T-I/6XX LAN9384T-I/6XX Microchip Technology LAN938x+databrief+00003296B.pdf Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Package / Case: 128-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 128-TQFP-EP (14x14)
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Protocol: Ethernet
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: SGMII
Function: Switch
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PIC24FJ256GA705T-I/PT PIC24FJ256GA705T-I/PT Microchip Technology PIC24FJ256GA705-Family-Data-Sheet-DS30010118E.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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PIC24FJ256GA705T-I/PT PIC24FJ256GA705T-I/PT Microchip Technology PIC24FJ256GA705-Family-Data-Sheet-DS30010118E.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MSMCJ54CA/TR MSMCJ54CA/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ54CAE3/TR MSMCJ54CAE3/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ54CA MASMCJ54CA Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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MASMCJ54CAe3 MASMCJ54CAe3 Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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MCP1825ST-3302E/DBVAO MCP1825ST-3302E/DBVAO Microchip Technology 22056b.pdf Description: IC REG LIN 3.3V 500MA SOT-223-3
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
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MCP1825ST-3302E/DBVAO MCP1825ST-3302E/DBVAO Microchip Technology 22056b.pdf Description: IC REG LIN 3.3V 500MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
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31+0.69 EUR
37+0.57 EUR
100+0.56 EUR
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MCP1825ST-3302E/EBVAO MCP1825ST-3302E/EBVAO Microchip Technology 22056b.pdf Description: IC REG LINEAR 3.3V 500MA DDPAK-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: DDPAK-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
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MCP1825ST-3302E/EBVAO MCP1825ST-3302E/EBVAO Microchip Technology 22056b.pdf Description: IC REG LINEAR 3.3V 500MA DDPAK-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: DDPAK-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
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MCP1825S-2502E/DBVAO MCP1825S-2502E/DBVAO Microchip Technology 22056b.pdf Description: 500MA, LOW-VOLTAGE, LOW IQ AUTOM
Packaging: Tube
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 2.5V
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.21V @ 500mA
Protection Features: Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
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MCP1825T-3302E/DCVAO MCP1825T-3302E/DCVAO Microchip Technology 22056b.pdf Description: IC REG LIN 3.3V 500MA SOT-223-5
Packaging: Tape & Reel (TR)
Package / Case: SOT-223-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-5
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
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MCP1825T-3302E/DCVAO MCP1825T-3302E/DCVAO Microchip Technology 22056b.pdf Description: IC REG LIN 3.3V 500MA SOT-223-5
Packaging: Cut Tape (CT)
Package / Case: SOT-223-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-5
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
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25+0.83 EUR
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UF110SM/TR UF110SM/TR Microchip Technology 000092603.pdf Description: DIODE STANDARD 100V 1A DO213AB
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Capacitance @ Vr, F: 70pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 1 A
Current - Reverse Leakage @ Vr: 100 µA @ 100 V
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UF110SM UF110SM Microchip Technology 000092603.pdf Description: DIODE STANDARD 100V 1A DO213AB
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Capacitance @ Vr, F: 70pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 1 A
Current - Reverse Leakage @ Vr: 100 µA @ 100 V
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DSC1001DI2-012.2576T DSC1001DI2-012.2576T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.2576 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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LAN8671C2T-E/U3B LAN8671C2T-E/U3B Microchip Technology LAN8670-1-2-Data-Sheet-60001573.pdf Description: 10BASE-T1S PHY WITH RMII
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 24-VQFN (4x4)
Receiver Hysteresis: 230 mV
Duplex: Full, Half
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LAN8671C2T-E/U3B LAN8671C2T-E/U3B Microchip Technology LAN8670-1-2-Data-Sheet-60001573.pdf Description: 10BASE-T1S PHY WITH RMII
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 24-VQFN (4x4)
Receiver Hysteresis: 230 mV
Duplex: Full, Half
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AVR64DA48-E/6LXVAO AVR64DA48-E/6LXVAO Microchip Technology AVR64DA28-32-48-64-DataSheet-DS40002233.pdf Description: 64KB, 8KB RAM, 48P, 24MHZ, 12B A
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Qualification: AEC-Q100
Number of I/O: 41
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 18x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
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AVR64DA48-E/PTVAO AVR64DA48-E/PTVAO Microchip Technology AVR64DA28-32-48-64-DataSheet-DS40002233.pdf Description: 64KB, 8KB RAM, 48P, 24MHZ, 12B A
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 41
Grade: Automotive
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 18x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
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AVR64DD32-E/RXBVAO AVR64DD32-E/RXBVAO Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: 64KB, 8KB RAM, 32P, 24MHZ, MVIO,
Qualification: AEC-Q100
Number of I/O: 26
Grade: Automotive
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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8+2.81 EUR
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M1.5KE12A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 10.22VWM 16.7VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 90A
Voltage - Reverse Standoff (Typ): 10.22V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 11.4V
Voltage - Clamping (Max) @ Ipp: 16.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MCP16301T-450E/CHVAO MCP16301T-450E/CHVAO Microchip Technology MCP16301-Family-Data-Sheet-DS20005004E.pdf Description: IC REG BUCK ADJ 600MA SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 30V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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MCP16301T-450E/CHVAO MCP16301T-450E/CHVAO Microchip Technology MCP16301-Family-Data-Sheet-DS20005004E.pdf Description: IC REG BUCK ADJ 600MA SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 30V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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MCP16301HT-E/CHVAO MCP16301HT-E/CHVAO Microchip Technology MCP16301-Family-Data-Sheet-DS20005004E.pdf Description: 36V ASYNCHRONOUS BUCK VOLTAGE RE
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4.7V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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MCP16301HT-E/CHVAO MCP16301HT-E/CHVAO Microchip Technology MCP16301-Family-Data-Sheet-DS20005004E.pdf Description: 36V ASYNCHRONOUS BUCK VOLTAGE RE
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4.7V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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WFI32E02UE-I WFI32E02UE-I Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: IC RF TXRX+MCU BLE
Packaging: Tray
Package / Case: 87-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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WFI32E03PE-I WFI32E03PE-I Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: 54PAD WI-FI SOC MODULE,802.11 B/
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash, 512kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: PCB Trace
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: Ethernet, GPIO, I2C, I2S, JTAG, SPI, UART, USB
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WFI32E03UE-I WFI32E03UE-I Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: 54PAD WI-FI SOC MODULE,802.11 B/
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash, 512kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: Ethernet, GPIO, I2C, I2S, JTAG, SPI, UART, USB
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WFI32E04UE-I WFI32E04UE-I Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: 87-PAD WI-FI SOC MODULE,802.11 B
Packaging: Tray
Package / Case: 87-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash, 512kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, MSK, OFDM
RF Family/Standard: WiFi
Serial Interfaces: ADC, CAN, GPIO, I2S, JTAG, SPI, UART
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ICPB2005-1-110I ICPB2005.pdf
ICPB2005-1-110I
Hersteller: Microchip Technology
Description: DC-12 GHZ 25W DISCRETE GAN HEMT
Current - Test: 250 mA
Voltage - Test: 28 V
Voltage - Rated: 28 V
Supplier Device Package: Die
Technology: GaN HEMT
Gain: 9.5dB
Power - Output: 25W
Frequency: 12GHz
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Package / Case: Die
Packaging: Box
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ICPB2002-1-110I ICPB2002.pdf
ICPB2002-1-110I
Hersteller: Microchip Technology
Description: DC-12 GHZ 12W DISCRETE GAN HEMT
Power - Output: 12W
Frequency: 12GHz
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Package / Case: Die
Packaging: Bulk
Current - Test: 125 mA
Voltage - Test: 28 V
Voltage - Rated: 28 V
Supplier Device Package: Die
Technology: GaN HEMT
Gain: 10dB
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DSC1001DL5-050.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-050.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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DSC1001DL5-125.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-125.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1001DL5-026.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
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DSC1001DL5-016.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-016.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001DL5-004.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-004.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 4 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 8mA
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DSC1001DL5-033.3330 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-033.3330
Hersteller: Microchip Technology
Description: MEMS OSC XO 33.3330MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 33.333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 10.5mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
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DSC1001DL5-048.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-048.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 48.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 48 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 10.5mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
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DSC1001DL5-040.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-040.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
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MSMCJ110CA/TR rf01001_rev_b_final-pd-000307351.pdf
MSMCJ110CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 110VWM 177VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 110V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 122V
Voltage - Clamping (Max) @ Ipp: 177V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ110CA/TR rf01001_rev_b_final-pd-000307351.pdf
MSMCJ110CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 110VWM 177VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 110V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 122V
Voltage - Clamping (Max) @ Ipp: 177V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSA1201CA3-120M0000TVAO DSA12x1-High-Performance-CMOS-MEMS-Oscillator-for-Automotive-DS20006385.pdf
DSA1201CA3-120M0000TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVCMOS, 120MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 120 MHz
Base Resonator: MEMS
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DSA1201CA3-120M0000VAO DSA12x1-High-Performance-CMOS-MEMS-Oscillator-for-Automotive-DS20006385.pdf
DSA1201CA3-120M0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVCMOS, 120MHZ,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 120 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MSMLJ6.0CA/TR msmlg5_j5_series_datasheet_revd.pdf
MSMLJ6.0CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 6VWM 10.3VC DO214AB
Current - Peak Pulse (10/1000µs): 291.3A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 3000W (3kW)
Voltage - Clamping (Max) @ Ipp: 10.3V
Voltage - Breakdown (Min): 6.67V
Bidirectional Channels: 1
Supplier Device Package: DO-214AB (SMLJ)
Voltage - Reverse Standoff (Typ): 6V
Produkt ist nicht verfügbar
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DSC613RI3A-01VAT DSC613-Three-Output-Ultra-Low-Power-MEMS-Clock-Generator-DS20006024.pdf
DSC613RI3A-01VAT
Hersteller: Microchip Technology
Description: 3-OUTPUT MEMS CLOCK GEN, 33.3333
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes
Supplier Device Package: 6-VFLGA (2.5x2)
Differential - Input:Output: No/No
Ratio - Input:Output: 1:3
Voltage - Supply: 1.71V ~ 1.89V, 2.97V ~ 3.63V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Clock Generator
Frequency - Max: 100MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 6-VFLGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M1.5KE36A RF01008_rE.pdf
M1.5KE36A
Hersteller: Microchip Technology
Description: TVS DIODE 30.8VWM 49.9VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 30A
Voltage - Reverse Standoff (Typ): 30.8V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 34.2V
Voltage - Clamping (Max) @ Ipp: 49.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MCP6006T-E/OTVAO MCP6006-6R-6U-7-9-Data-Sheet-20006411B.pdf
MCP6006T-E/OTVAO
Hersteller: Microchip Technology
Description: SINGLE, 1MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 50µA
Slew Rate: 1.9V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: SOT-23-5
Number of Circuits: 1
Current - Output / Channel: 30 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
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MIC1551YM5-TR MIC1551-53-IttyBitty-RC-Type-555-Timer-Oscillator-DS20006985.pdf
MIC1551YM5-TR
Hersteller: Microchip Technology
Description: IC OSC SNGL TIMER 500KHZ SC-74A
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 18V
Supplier Device Package: SOT-23-5
Current - Supply: 350 µA
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MIC1551YM5-TR MIC1551-53-IttyBitty-RC-Type-555-Timer-Oscillator-DS20006985.pdf
MIC1551YM5-TR
Hersteller: Microchip Technology
Description: IC OSC SNGL TIMER 500KHZ SC-74A
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Frequency: 500kHz
Type: 555 Type, Timer/Oscillator (Single)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 18V
Supplier Device Package: SOT-23-5
Current - Supply: 350 µA
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ATTINY3217-MZ-VAO ATtiny3216-17-Auto-DataSheet-DS40002212A.pdf
ATTINY3217-MZ-VAO
Hersteller: Microchip Technology
Description: 125C, GREEN, 16MHZ, QFN24 WETTAB
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 24x10b; D/A 3x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Grade: Automotive
Number of I/O: 22
Qualification: AEC-Q100
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ATTINY3217-MB-VAO ATtiny3216-17-Auto-DataSheet-DS40002212A.pdf
ATTINY3217-MB-VAO
Hersteller: Microchip Technology
Description: 105C, GREEN, 20MHZ, QFN24 WETTAB
Qualification: AEC-Q100
Number of I/O: 22
Grade: Automotive
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b; D/A 3x8b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LAN9381-I/6XX
LAN9381-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9382-I/6XX LAN938x+databrief+00003296B.pdf
LAN9382-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9383-I/6XX LAN938x+databrief+00003296B.pdf
LAN9383-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9384-I/6XX LAN938x+databrief+00003296B.pdf
LAN9384-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tray
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Supplier Device Package: 128-TQFP-EP (14x14)
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LAN9381T-I/6XX
LAN9381T-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Packaging: Tape & Reel (TR)
Package / Case: 128-TQFP Exposed Pad
Function: Switch
Interface: RGMII, SGMII
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: Ethernet
Standards: IEEE 802.3
Supplier Device Package: 128-TQFP-EP (14x14)
Produkt ist nicht verfügbar
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LAN9383T-I/6XX LAN938x+databrief+00003296B.pdf
LAN9383T-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Supplier Device Package: 128-TQFP-EP (14x14)
Standards: IEEE 802.3
Protocol: Ethernet
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: RGMII, SGMII
Function: Switch
Package / Case: 128-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LAN9382T-I/6XX LAN938x+databrief+00003296B.pdf
LAN9382T-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Supplier Device Package: 128-TQFP-EP (14x14)
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Protocol: Ethernet
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: RGMII, SGMII
Function: Switch
Package / Case: 128-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LAN9384T-I/6XX LAN938x+databrief+00003296B.pdf
LAN9384T-I/6XX
Hersteller: Microchip Technology
Description: 7-PORT 100BASE-T1 INDUSTRIAL SWI
Package / Case: 128-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 128-TQFP-EP (14x14)
Standards: IEEE 802.3, 10/100 Base-T/TX PHY
Protocol: Ethernet
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: SGMII
Function: Switch
Produkt ist nicht verfügbar
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PIC24FJ256GA705T-I/PT PIC24FJ256GA705-Family-Data-Sheet-DS30010118E.pdf
PIC24FJ256GA705T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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PIC24FJ256GA705T-I/PT PIC24FJ256GA705-Family-Data-Sheet-DS30010118E.pdf
PIC24FJ256GA705T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1783 Stücke:
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6+3.94 EUR
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MSMCJ54CA/TR rf01001_rev_b_final-pd-000307351.pdf
MSMCJ54CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MSMCJ54CAE3/TR rf01001_rev_b_final-pd-000307351.pdf
MSMCJ54CAE3/TR
Hersteller: Microchip Technology
Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCJ54CA rf01001_rev_b_final-pd-000307351.pdf
MASMCJ54CA
Hersteller: Microchip Technology
Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MASMCJ54CAe3 rf01001_rev_b_final-pd-000307351.pdf
MASMCJ54CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 54VWM 87.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 17.2A
Voltage - Reverse Standoff (Typ): 54V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 60V
Voltage - Clamping (Max) @ Ipp: 87.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MCP1825ST-3302E/DBVAO 22056b.pdf
MCP1825ST-3302E/DBVAO
Hersteller: Microchip Technology
Description: IC REG LIN 3.3V 500MA SOT-223-3
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
auf Bestellung 4000 Stücke:
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4000+0.51 EUR
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MCP1825ST-3302E/DBVAO 22056b.pdf
MCP1825ST-3302E/DBVAO
Hersteller: Microchip Technology
Description: IC REG LIN 3.3V 500MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
auf Bestellung 4287 Stücke:
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31+0.69 EUR
37+0.57 EUR
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MCP1825ST-3302E/EBVAO 22056b.pdf
MCP1825ST-3302E/EBVAO
Hersteller: Microchip Technology
Description: IC REG LINEAR 3.3V 500MA DDPAK-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: DDPAK-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1825ST-3302E/EBVAO 22056b.pdf
MCP1825ST-3302E/EBVAO
Hersteller: Microchip Technology
Description: IC REG LINEAR 3.3V 500MA DDPAK-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: DDPAK-3
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1825S-2502E/DBVAO 22056b.pdf
MCP1825S-2502E/DBVAO
Hersteller: Microchip Technology
Description: 500MA, LOW-VOLTAGE, LOW IQ AUTOM
Packaging: Tube
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 2.5V
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.21V @ 500mA
Protection Features: Over Current, Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1825T-3302E/DCVAO 22056b.pdf
MCP1825T-3302E/DCVAO
Hersteller: Microchip Technology
Description: IC REG LIN 3.3V 500MA SOT-223-5
Packaging: Tape & Reel (TR)
Package / Case: SOT-223-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-5
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1825T-3302E/DCVAO 22056b.pdf
MCP1825T-3302E/DCVAO
Hersteller: Microchip Technology
Description: IC REG LIN 3.3V 500MA SOT-223-5
Packaging: Cut Tape (CT)
Package / Case: SOT-223-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-5
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Grade: Automotive
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.35V @ 500mA
Protection Features: Over Current, Over Temperature
Qualification: AEC-Q100
auf Bestellung 3983 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
25+0.83 EUR
30+0.7 EUR
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UF110SM/TR 000092603.pdf
UF110SM/TR
Hersteller: Microchip Technology
Description: DIODE STANDARD 100V 1A DO213AB
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Capacitance @ Vr, F: 70pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 1 A
Current - Reverse Leakage @ Vr: 100 µA @ 100 V
Produkt ist nicht verfügbar
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UF110SM 000092603.pdf
UF110SM
Hersteller: Microchip Technology
Description: DIODE STANDARD 100V 1A DO213AB
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Capacitance @ Vr, F: 70pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 1 A
Current - Reverse Leakage @ Vr: 100 µA @ 100 V
Produkt ist nicht verfügbar
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DSC1001DI2-012.2576T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI2-012.2576T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.2576 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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LAN8671C2T-E/U3B LAN8670-1-2-Data-Sheet-60001573.pdf
LAN8671C2T-E/U3B
Hersteller: Microchip Technology
Description: 10BASE-T1S PHY WITH RMII
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 24-VQFN (4x4)
Receiver Hysteresis: 230 mV
Duplex: Full, Half
Produkt ist nicht verfügbar
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LAN8671C2T-E/U3B LAN8670-1-2-Data-Sheet-60001573.pdf
LAN8671C2T-E/U3B
Hersteller: Microchip Technology
Description: 10BASE-T1S PHY WITH RMII
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 24-VQFN (4x4)
Receiver Hysteresis: 230 mV
Duplex: Full, Half
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AVR64DA48-E/6LXVAO AVR64DA28-32-48-64-DataSheet-DS40002233.pdf
AVR64DA48-E/6LXVAO
Hersteller: Microchip Technology
Description: 64KB, 8KB RAM, 48P, 24MHZ, 12B A
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Qualification: AEC-Q100
Number of I/O: 41
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 18x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Produkt ist nicht verfügbar
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AVR64DA48-E/PTVAO AVR64DA28-32-48-64-DataSheet-DS40002233.pdf
AVR64DA48-E/PTVAO
Hersteller: Microchip Technology
Description: 64KB, 8KB RAM, 48P, 24MHZ, 12B A
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 41
Grade: Automotive
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 18x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Produkt ist nicht verfügbar
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AVR64DD32-E/RXBVAO AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR64DD32-E/RXBVAO
Hersteller: Microchip Technology
Description: 64KB, 8KB RAM, 32P, 24MHZ, MVIO,
Qualification: AEC-Q100
Number of I/O: 26
Grade: Automotive
Supplier Device Package: 32-VQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 980 Stücke:
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8+2.81 EUR
25+2.56 EUR
100+2.32 EUR
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M1.5KE12A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 10.22VWM 16.7VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 90A
Voltage - Reverse Standoff (Typ): 10.22V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 11.4V
Voltage - Clamping (Max) @ Ipp: 16.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MCP16301T-450E/CHVAO MCP16301-Family-Data-Sheet-DS20005004E.pdf
MCP16301T-450E/CHVAO
Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 600MA SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 30V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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MCP16301T-450E/CHVAO MCP16301-Family-Data-Sheet-DS20005004E.pdf
MCP16301T-450E/CHVAO
Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 600MA SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 30V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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9+2.45 EUR
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MCP16301HT-E/CHVAO MCP16301-Family-Data-Sheet-DS20005004E.pdf
MCP16301HT-E/CHVAO
Hersteller: Microchip Technology
Description: 36V ASYNCHRONOUS BUCK VOLTAGE RE
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4.7V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP16301HT-E/CHVAO MCP16301-Family-Data-Sheet-DS20005004E.pdf
MCP16301HT-E/CHVAO
Hersteller: Microchip Technology
Description: 36V ASYNCHRONOUS BUCK VOLTAGE RE
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: SOT-23-6
Synchronous Rectifier: No
Voltage - Output (Max): 15V
Voltage - Input (Min): 4.7V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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9+2.57 EUR
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WFI32E02UE-I PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
WFI32E02UE-I
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU BLE
Packaging: Tray
Package / Case: 87-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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WFI32E03PE-I PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
WFI32E03PE-I
Hersteller: Microchip Technology
Description: 54PAD WI-FI SOC MODULE,802.11 B/
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash, 512kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: PCB Trace
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: Ethernet, GPIO, I2C, I2S, JTAG, SPI, UART, USB
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WFI32E03UE-I PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
WFI32E03UE-I
Hersteller: Microchip Technology
Description: 54PAD WI-FI SOC MODULE,802.11 B/
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash, 512kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: Ethernet, GPIO, I2C, I2S, JTAG, SPI, UART, USB
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2+11.94 EUR
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WFI32E04UE-I PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
WFI32E04UE-I
Hersteller: Microchip Technology
Description: 87-PAD WI-FI SOC MODULE,802.11 B
Packaging: Tray
Package / Case: 87-SMD Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash, 512kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Current - Transmitting: 169mA ~ 359mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: PIC32MZ2051W104132-I/NX
Modulation: CCK, DSSS, MSK, OFDM
RF Family/Standard: WiFi
Serial Interfaces: ADC, CAN, GPIO, I2S, JTAG, SPI, UART
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2+11.71 EUR
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