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JANTXV1N3893A JANTXV1N3893A Microchip Technology 8956-lds-0143-pdf.pdf Description: DIODE STANDARD 400V 20A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Capacitance @ Vr, F: 115pF @ 10V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 38 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Qualification: MIL-PRF-19500/304
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JANTXV1N3893AR JANTXV1N3893AR Microchip Technology 8956-lds-0143-pdf.pdf Description: DIODE STD REV 400V 20A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard, Reverse Polarity
Capacitance @ Vr, F: 115pF @ 10V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 38 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Qualification: MIL-PRF-19500/304
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DSPIC33CK64MC102T-I/M6 DSPIC33CK64MC102T-I/M6 Microchip Technology dsPIC33CK64MC105-Family-Data-Sheet-DS70005399D.pdf Description: IC MCU 16BIT 64KB FLASH 28UQFN
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 11x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 28-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 21
Grade: Automotive
Supplier Device Package: 28-UQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
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2306000-R 2306000-R Microchip Technology 00003916.pdf Description: ACK-E-MINISAS-HDX4-MINISAS-HDX4-
Packaging: Bulk
For Use With/Related Products: SmartRAID 3200 RAID Adapters
Accessory Type: Cable
Specifications: SAS/SATA Connectivity
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MIC2033-08AYM6-TR MIC2033-08AYM6-TR Microchip Technology MIC2033-High-Accuracy-High-Side-Fixed-Current-Limit-Power-Switch-20005539A.pdf Description: IC PWR SWITCH P-CHAN 1:1 SOT23-6
Features: Slew Rate Controlled, Status Flag
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: High Side
Rds On (Typ): 75mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 800mA
Ratio - Input:Output: 1:1
Supplier Device Package: SOT-23-6
Fault Protection: Current Limiting (Fixed), Over Temperature, UVLO
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1N3308A 1N3308A Microchip Technology 1N3305-50B-RB-1N4549-56B-RB.pdf Description: DIODE ZENER 9.1V 50W DO5
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 0.5 Ohms
Supplier Device Package: DO-5
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.1 V
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JAN1N6166AUS JAN1N6166AUS Microchip Technology Description: TVS DIODE 76VWM 137.6VC SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.9A
Voltage - Reverse Standoff (Typ): 76V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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1N755A 1N755A Microchip Technology 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf Description: DIODE ZENER 7.5V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 5 V
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1N5828 1N5828 Microchip Technology 1n5826.pdf Description: DIODE SCHOTTKY 40V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -55°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 870 mV @ 40 A
Current - Reverse Leakage @ Vr: 10 mA @ 20 V
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1N5826 1N5826 Microchip Technology 5866-1n5826-datasheet Description: DIODE SCHOTTKY 20V 15A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -55°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 670 mV @ 40 A
Current - Reverse Leakage @ Vr: 2 mA @ 20 V
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ATSENSE101A-SUR ATSENSE101A-SUR Microchip Technology DS60001524A.pdf Description: IC AFE 3 CHAN 24BIT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Voltage - Supply, Analog: 2.7V ~ 2.9V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
Number of Channels: 3
Power (Watts): 2.5 mW
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1N750A 1N750A Microchip Technology 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf Description: DIODE ZENER 4.7V 500MW DO204AH
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 19 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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1N750DUR-1 1N750DUR-1 Microchip Technology 131822-lds-0288-1.pdf Description: VOLTAGE REGULATOR
Packaging: Bulk
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 400 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 15 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
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MX573EBH125M000-TR Microchip Technology MX573EBH125M000.pdf Description: XTAL OSC XO 125.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.375V ~ 3.63V
Current - Supply (Max): 95mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 125 MHz
Base Resonator: Crystal
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MX575ABH100M000-TR Microchip Technology MX575ABH100M000.pdf Description: XTAL OSC XO 100.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.375V ~ 3.63V
Current - Supply (Max): 95mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 100 MHz
Base Resonator: Crystal
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JANTX2N2907AUBC/TR Microchip Technology Description: SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
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BZV55C15 BZV55C15 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 15V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 15 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
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1PMT4100E3/TR7 1PMT4100E3/TR7 Microchip Technology 1PMT4099-1PMT4135e3_1PMT4614-1PMT4627e3.pdf Description: DIODE ZENER 7.5V 1W DO216
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-216
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 5.7 V
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1PMT4100E3/TR7 1PMT4100E3/TR7 Microchip Technology 1PMT4099-1PMT4135e3_1PMT4614-1PMT4627e3.pdf Description: DIODE ZENER 7.5V 1W DO216
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-216
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 5.7 V
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MX1N4742AG Microchip Technology Description: VOLTAGE REGULATOR _ DO-41
Packaging: Bulk
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MX1N4742AG/TR Microchip Technology Description: VOLTAGE REGULATOR _ DO-41
Packaging: Strip
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ZL30792LFG7 ZL30792LFG7 Microchip Technology ZL30792%20product%20brief%20082219.pdf Description: IC SYNCHRONIZER ETHERNET 80VFLGA
Packaging: Tray
Package / Case: 80-VFLGA
Mounting Type: Surface Mount
Output: CMOS, HCSL, HSTL, LVDS, LVPECL
Frequency - Max: 1.045GHz
Input: CMOS
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 3.3V
Main Purpose: Ethernet, SONET/SDH
Ratio - Input:Output: 5:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 80-LGA (11x11)
PLL: Yes
Number of Circuits: 2
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ZL30794LFG7 ZL30794LFG7 Microchip Technology Description: IC CLOCK GENERATOR 80-VFLGA
Packaging: Tray
Package / Case: 80-VFLGA
Mounting Type: Surface Mount
Frequency - Max: 1Hz
Differential - Input:Output: No/No
Supplier Device Package: 80-LGA (11x11)
PLL: No
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TMIK025 Microchip Technology Description: DIGIPOT CLICK MCP4161
Packaging: Bulk
Function: Digital Potentiometer
Type: Data Acquisition
Contents: Board(s)
Utilized IC / Part: MCP4161
Platform: mikroBUS™ Click™
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MSCSM70XM19CTYZBNMG MSCSM70XM19CTYZBNMG Microchip Technology MSCSM70XM19CTYZBNMG-SiC-MOSFET-module.pdf Description: PM-MOSFET-SIC-SBD-NHPD
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Type: MOSFET
Configuration: 3 Phase
Voltage - Isolation: 4000Vrms
Current: 110 A
Voltage: 650 V
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CD-MSCSM70XM19CTYZBNMG Microchip Technology Integrated-Actuation-Solution-CD-MSCSM70XM19CTYZBNMG-DS00005146.pdf Description: ST-MOSFET-SIC-SBD-6HPD
Packaging: Bulk
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JANTX1N3023CUR-1 JANTX1N3023CUR-1 Microchip Technology 1N3016BUR-1-1N3045BUR-1.pdf Description: DIODE ZENER 13V 1W DO213AB
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Qualification: MIL-PRF-19500/115
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MM7150I-AB1 MM7150I-AB1 Microchip Technology 00001888B.pdf Description: IMU ACCEL/GYRO/MAG 3-AXIS I2C
Packaging: Tray
Package / Case: 16-SMD Module
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 9 Axis
Supplier Device Package: Module
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MCP2518FD-E/SLVAO MCP2518FD-E/SLVAO Microchip Technology External-CAN-FD-Controller-with-SPI-Interface-DS20006027B.pdf Description: STAND-ALONE LOW POWER CAN FD CON
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 20mA
Protocol: CAN
Standards: CAN 2.0
Supplier Device Package: 14-SOIC
Grade: Automotive
Qualification: AEC-Q100
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SMDA24C-5e3/TR7 SMDA24C-5e3/TR7 Microchip Technology SMDA03C-24C-5.pdf Description: TVS DIODE 24VWM 55VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 35pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 5
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
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SMDA24C-5e3/TR7 SMDA24C-5e3/TR7 Microchip Technology SMDA03C-24C-5.pdf Description: TVS DIODE 24VWM 55VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 35pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 5
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
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DSA1221DA1-16M66600VAO DSA1221DA1-16M66600VAO Microchip Technology DSA12x1-High-Performance-CMOS-MEMS-Oscillator-for-Automotive-DS20006385A.pdf Description: MEMS OSC, AUTOMOTIVE, LOW JITTER
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Frequency: 16.666 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (2.5x2)
Current - Supply (Max): 27mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 125°C
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DSA1223DA1-100M0000VAO DSA1223DA1-100M0000VAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTO, LVDS, 100MHZ, 50
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (2.5x2)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
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ATSAM3S1BA-MU ATSAM3S1BA-MU Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 64KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MSMBG6.5CAe3 MSMBG6.5CAe3 Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLSMBG6.5CA MXLSMBG6.5CA Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AVR32SD28-I/3LW AVR32SD28-I/3LW Microchip Technology AVR32SD20-28-32-Data-Sheet-DS40002629.pdf Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 21
auf Bestellung 637 Stücke:
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AVR32SD28-I/SP AVR32SD28-I/SP Microchip Technology AVR32SD20-28-32-Data-Sheet-DS40002629.pdf Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 21
auf Bestellung 282 Stücke:
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25+3.34 EUR
100+3.02 EUR
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ATTINY202-SSZ-VAO ATTINY202-SSZ-VAO Microchip Technology Description: 16 MHZ, 2KB, SOIC8, AUTO 125C, G
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Grade: Automotive
Number of I/O: 6
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1640CT-I/MCVAO MCP1640CT-I/MCVAO Microchip Technology MCP1640-Family-Data-Sheet-DS20002234E.pdf Description: 500 KHZ, 300 MA SYN. BOOST, INPU
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 350mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 5.5V
Topology: Boost
Supplier Device Package: 8-DFN (2x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 0.35V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ATWINC3400-MR210CA144 ATWINC3400-MR210CA144 Microchip Technology IEEE-802.11-bgn-Network-Controller-with-Integrated-Bluetooth-Low-Energy-Module-Data-Sheet-70005350.pdf Description: WI-FI + BLUETOOTH LE MODULE, CH
Packaging: Tray
Package / Case: 36-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.3dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n, Bluetooth v5.0
Current - Receiving: 51.36mA ~ 63.9mA
Current - Transmitting: 79.37mA ~ 275mA
Antenna Type: Integrated, Chip
Utilized IC / Part: ATWINC3400
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
auf Bestellung 144 Stücke:
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2+9.13 EUR
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APT15DQ120D Microchip Technology Description: FRED DQ 1200 V 15 A DIE
Packaging: Bulk
Produkt ist nicht verfügbar
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APT100DQ120D Microchip Technology Description: FRED DQ 1200 V 100 A DIE
Packaging: Bulk
Produkt ist nicht verfügbar
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APT75DQ120D Microchip Technology Description: FRED DQ 1200 V 75 A DIE
Packaging: Bulk
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APT60DQ120D Microchip Technology Description: FRED DQ 1200 V 60 A DIE
Packaging: Bulk
Produkt ist nicht verfügbar
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PIC32CM1602GV00032-I/RTB PIC32CM1602GV00032-I/RTB Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
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PIC32CM1602GV00032-I/T5X PIC32CM1602GV00032-I/T5X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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PIC32CM1602GV00048-I/Y8X PIC32CM1602GV00048-I/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
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PIC32CM1602GV00048-I/U5B PIC32CM1602GV00048-I/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
auf Bestellung 1239 Stücke:
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PIC32CM1602GV00064-I/V2X PIC32CM1602GV00064-I/V2X Microchip Technology SAM-D20-Family-Data-Sheet-DS60001504.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
auf Bestellung 512 Stücke:
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14+1.28 EUR
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PIC32CM1602GV00064-I/5LX PIC32CM1602GV00064-I/5LX Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 52
auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.53 EUR
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PIC32CM1602GV00032T-I/RTB PIC32CM1602GV00032T-I/RTB Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
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PIC32CM1602GV00032-E/RTB PIC32CM1602GV00032-E/RTB Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
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PIC32CM1602GV00048T-I/U5B PIC32CM1602GV00048T-I/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
Produkt ist nicht verfügbar
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PIC32CM1602GV00048T-I/Y8X PIC32CM1602GV00048T-I/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
Produkt ist nicht verfügbar
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PIC32CM1602GV00032T-I/T5X PIC32CM1602GV00032T-I/T5X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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PIC16F15256-E/SO PIC16F15256-E/SO Microchip Technology PIC16F15256-74-75-76-Microcontroller-Data-Sheet-40002305.pdf Description: IC MCU 8BIT 28KB FLASH 28SOIC
Number of I/O: 24
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (28K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
auf Bestellung 1026 Stücke:
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12+1.53 EUR
25+1.39 EUR
100+1.38 EUR
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DSC1001DI1-016.3840 DSC1001DI1-016.3840 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 16.384 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
auf Bestellung 394 Stücke:
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16+1.12 EUR
50+1.1 EUR
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DSC1001DI1-016.3840T DSC1001DI1-016.3840T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16.384 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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MSMCJ160A MSMCJ160A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 160VWM 259VC DO214AB
Supplier Device Package: DO-214AB (SMCJ)
Voltage - Reverse Standoff (Typ): 160V
Current - Peak Pulse (10/1000µs): 5.8A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 259V
Voltage - Breakdown (Min): 178V
Unidirectional Channels: 1
Produkt ist nicht verfügbar
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JANTXV1N3893A 8956-lds-0143-pdf.pdf
JANTXV1N3893A
Hersteller: Microchip Technology
Description: DIODE STANDARD 400V 20A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Capacitance @ Vr, F: 115pF @ 10V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 38 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Qualification: MIL-PRF-19500/304
Produkt ist nicht verfügbar
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JANTXV1N3893AR 8956-lds-0143-pdf.pdf
JANTXV1N3893AR
Hersteller: Microchip Technology
Description: DIODE STD REV 400V 20A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard, Reverse Polarity
Capacitance @ Vr, F: 115pF @ 10V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 38 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
Qualification: MIL-PRF-19500/304
Produkt ist nicht verfügbar
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DSPIC33CK64MC102T-I/M6 dsPIC33CK64MC105-Family-Data-Sheet-DS70005399D.pdf
DSPIC33CK64MC102T-I/M6
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 28UQFN
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 11x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 28-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 21
Grade: Automotive
Supplier Device Package: 28-UQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Produkt ist nicht verfügbar
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2306000-R 00003916.pdf
2306000-R
Hersteller: Microchip Technology
Description: ACK-E-MINISAS-HDX4-MINISAS-HDX4-
Packaging: Bulk
For Use With/Related Products: SmartRAID 3200 RAID Adapters
Accessory Type: Cable
Specifications: SAS/SATA Connectivity
auf Bestellung 1 Stücke:
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AnzahlPreis
1+278.33 EUR
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MIC2033-08AYM6-TR MIC2033-High-Accuracy-High-Side-Fixed-Current-Limit-Power-Switch-20005539A.pdf
MIC2033-08AYM6-TR
Hersteller: Microchip Technology
Description: IC PWR SWITCH P-CHAN 1:1 SOT23-6
Features: Slew Rate Controlled, Status Flag
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: High Side
Rds On (Typ): 75mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 800mA
Ratio - Input:Output: 1:1
Supplier Device Package: SOT-23-6
Fault Protection: Current Limiting (Fixed), Over Temperature, UVLO
Produkt ist nicht verfügbar
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1N3308A 1N3305-50B-RB-1N4549-56B-RB.pdf
1N3308A
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 50W DO5
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 0.5 Ohms
Supplier Device Package: DO-5
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.1 V
Produkt ist nicht verfügbar
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JAN1N6166AUS
JAN1N6166AUS
Hersteller: Microchip Technology
Description: TVS DIODE 76VWM 137.6VC SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.9A
Voltage - Reverse Standoff (Typ): 76V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 95V
Voltage - Clamping (Max) @ Ipp: 137.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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1N755A 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf
1N755A
Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 5 V
Produkt ist nicht verfügbar
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1N5828 1n5826.pdf
1N5828
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 40V 15A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -55°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 870 mV @ 40 A
Current - Reverse Leakage @ Vr: 10 mA @ 20 V
Produkt ist nicht verfügbar
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1N5826 5866-1n5826-datasheet
1N5826
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 20V 15A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Current - Average Rectified (Io): 15A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -55°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 670 mV @ 40 A
Current - Reverse Leakage @ Vr: 2 mA @ 20 V
Produkt ist nicht verfügbar
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ATSENSE101A-SUR DS60001524A.pdf
ATSENSE101A-SUR
Hersteller: Microchip Technology
Description: IC AFE 3 CHAN 24BIT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Bits: 24
Voltage - Supply, Analog: 2.7V ~ 2.9V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
Number of Channels: 3
Power (Watts): 2.5 mW
auf Bestellung 9455 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
9+2.15 EUR
25+1.96 EUR
100+1.79 EUR
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1N750A 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf
1N750A
Hersteller: Microchip Technology
Description: DIODE ZENER 4.7V 500MW DO204AH
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 19 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N750DUR-1 131822-lds-0288-1.pdf
1N750DUR-1
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Bulk
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 400 mW
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 15 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±1%
Produkt ist nicht verfügbar
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MX573EBH125M000-TR MX573EBH125M000.pdf
Hersteller: Microchip Technology
Description: XTAL OSC XO 125.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.375V ~ 3.63V
Current - Supply (Max): 95mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 125 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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MX575ABH100M000-TR MX575ABH100M000.pdf
Hersteller: Microchip Technology
Description: XTAL OSC XO 100.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.375V ~ 3.63V
Current - Supply (Max): 95mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 100 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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JANTX2N2907AUBC/TR
Hersteller: Microchip Technology
Description: SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BZV55C15 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C15
Hersteller: Microchip Technology
Description: DIODE ZENER 15V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 15 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
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1PMT4100E3/TR7 1PMT4099-1PMT4135e3_1PMT4614-1PMT4627e3.pdf
1PMT4100E3/TR7
Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 1W DO216
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-216
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 5.7 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+0.65 EUR
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1PMT4100E3/TR7 1PMT4099-1PMT4135e3_1PMT4614-1PMT4627e3.pdf
1PMT4100E3/TR7
Hersteller: Microchip Technology
Description: DIODE ZENER 7.5V 1W DO216
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: DO-216
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 5.7 V
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23+0.79 EUR
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MX1N4742AG
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR _ DO-41
Packaging: Bulk
Produkt ist nicht verfügbar
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MX1N4742AG/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR _ DO-41
Packaging: Strip
Produkt ist nicht verfügbar
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ZL30792LFG7 ZL30792%20product%20brief%20082219.pdf
ZL30792LFG7
Hersteller: Microchip Technology
Description: IC SYNCHRONIZER ETHERNET 80VFLGA
Packaging: Tray
Package / Case: 80-VFLGA
Mounting Type: Surface Mount
Output: CMOS, HCSL, HSTL, LVDS, LVPECL
Frequency - Max: 1.045GHz
Input: CMOS
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V, 3.3V
Main Purpose: Ethernet, SONET/SDH
Ratio - Input:Output: 5:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 80-LGA (11x11)
PLL: Yes
Number of Circuits: 2
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1+107.4 EUR
25+89.49 EUR
100+86.44 EUR
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ZL30794LFG7
ZL30794LFG7
Hersteller: Microchip Technology
Description: IC CLOCK GENERATOR 80-VFLGA
Packaging: Tray
Package / Case: 80-VFLGA
Mounting Type: Surface Mount
Frequency - Max: 1Hz
Differential - Input:Output: No/No
Supplier Device Package: 80-LGA (11x11)
PLL: No
Produkt ist nicht verfügbar
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TMIK025
Hersteller: Microchip Technology
Description: DIGIPOT CLICK MCP4161
Packaging: Bulk
Function: Digital Potentiometer
Type: Data Acquisition
Contents: Board(s)
Utilized IC / Part: MCP4161
Platform: mikroBUS™ Click™
Produkt ist nicht verfügbar
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MSCSM70XM19CTYZBNMG MSCSM70XM19CTYZBNMG-SiC-MOSFET-module.pdf
MSCSM70XM19CTYZBNMG
Hersteller: Microchip Technology
Description: PM-MOSFET-SIC-SBD-NHPD
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Type: MOSFET
Configuration: 3 Phase
Voltage - Isolation: 4000Vrms
Current: 110 A
Voltage: 650 V
Produkt ist nicht verfügbar
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CD-MSCSM70XM19CTYZBNMG Integrated-Actuation-Solution-CD-MSCSM70XM19CTYZBNMG-DS00005146.pdf
Hersteller: Microchip Technology
Description: ST-MOSFET-SIC-SBD-6HPD
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N3023CUR-1 1N3016BUR-1-1N3045BUR-1.pdf
JANTX1N3023CUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1W DO213AB
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Qualification: MIL-PRF-19500/115
Produkt ist nicht verfügbar
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MM7150I-AB1 00001888B.pdf
MM7150I-AB1
Hersteller: Microchip Technology
Description: IMU ACCEL/GYRO/MAG 3-AXIS I2C
Packaging: Tray
Package / Case: 16-SMD Module
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 9 Axis
Supplier Device Package: Module
Produkt ist nicht verfügbar
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MCP2518FD-E/SLVAO External-CAN-FD-Controller-with-SPI-Interface-DS20006027B.pdf
MCP2518FD-E/SLVAO
Hersteller: Microchip Technology
Description: STAND-ALONE LOW POWER CAN FD CON
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 20mA
Protocol: CAN
Standards: CAN 2.0
Supplier Device Package: 14-SOIC
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SMDA24C-5e3/TR7 SMDA03C-24C-5.pdf
SMDA24C-5e3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 24VWM 55VC 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 35pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 5
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
auf Bestellung 500 Stücke:
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AnzahlPreis
500+1.8 EUR
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SMDA24C-5e3/TR7 SMDA03C-24C-5.pdf
SMDA24C-5e3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 24VWM 55VC 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 35pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 5
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 55V
Power - Peak Pulse: 300W
Power Line Protection: No
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
9+2.09 EUR
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DSA1221DA1-16M66600VAO DSA12x1-High-Performance-CMOS-MEMS-Oscillator-for-Automotive-DS20006385A.pdf
DSA1221DA1-16M66600VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, LOW JITTER
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
Base Resonator: MEMS
Frequency: 16.666 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (2.5x2)
Current - Supply (Max): 27mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 125°C
auf Bestellung 700 Stücke:
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AnzahlPreis
9+2.06 EUR
25+1.72 EUR
100+1.65 EUR
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DSA1223DA1-100M0000VAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223DA1-100M0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVDS, 100MHZ, 50
Base Resonator: MEMS
Frequency: 100 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (2.5x2)
Current - Supply (Max): 32mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 6-VDFN
Packaging: Tube
auf Bestellung 355 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
6+3.38 EUR
25+2.81 EUR
100+2.72 EUR
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ATSAM3S1BA-MU SAM3S_Series.pdf
ATSAM3S1BA-MU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MSMBG6.5CAe3 RF01000+%283%29.pdf
MSMBG6.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXLSMBG6.5CA RF01000+%283%29.pdf
MXLSMBG6.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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AVR32SD28-I/3LW AVR32SD20-28-32-Data-Sheet-DS40002629.pdf
AVR32SD28-I/3LW
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 21
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9+1.97 EUR
25+1.81 EUR
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AVR32SD28-I/SP AVR32SD20-28-32-Data-Sheet-DS40002629.pdf
AVR32SD28-I/SP
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 21
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AnzahlPreis
5+3.64 EUR
25+3.34 EUR
100+3.02 EUR
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ATTINY202-SSZ-VAO
ATTINY202-SSZ-VAO
Hersteller: Microchip Technology
Description: 16 MHZ, 2KB, SOIC8, AUTO 125C, G
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Grade: Automotive
Number of I/O: 6
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1640CT-I/MCVAO MCP1640-Family-Data-Sheet-DS20002234E.pdf
MCP1640CT-I/MCVAO
Hersteller: Microchip Technology
Description: 500 KHZ, 300 MA SYN. BOOST, INPU
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 350mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 5.5V
Topology: Boost
Supplier Device Package: 8-DFN (2x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 0.35V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ATWINC3400-MR210CA144 IEEE-802.11-bgn-Network-Controller-with-Integrated-Bluetooth-Low-Energy-Module-Data-Sheet-70005350.pdf
ATWINC3400-MR210CA144
Hersteller: Microchip Technology
Description: WI-FI + BLUETOOTH LE MODULE, CH
Packaging: Tray
Package / Case: 36-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.3dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n, Bluetooth v5.0
Current - Receiving: 51.36mA ~ 63.9mA
Current - Transmitting: 79.37mA ~ 275mA
Antenna Type: Integrated, Chip
Utilized IC / Part: ATWINC3400
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
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2+9.13 EUR
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APT15DQ120D
Hersteller: Microchip Technology
Description: FRED DQ 1200 V 15 A DIE
Packaging: Bulk
Produkt ist nicht verfügbar
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APT100DQ120D
Hersteller: Microchip Technology
Description: FRED DQ 1200 V 100 A DIE
Packaging: Bulk
Produkt ist nicht verfügbar
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APT75DQ120D
Hersteller: Microchip Technology
Description: FRED DQ 1200 V 75 A DIE
Packaging: Bulk
Produkt ist nicht verfügbar
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APT60DQ120D
Hersteller: Microchip Technology
Description: FRED DQ 1200 V 60 A DIE
Packaging: Bulk
Produkt ist nicht verfügbar
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PIC32CM1602GV00032-I/RTB PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00032-I/RTB
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
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AnzahlPreis
19+0.97 EUR
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PIC32CM1602GV00032-I/T5X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00032-I/T5X
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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21+0.84 EUR
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PIC32CM1602GV00048-I/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00048-I/Y8X
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
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AnzahlPreis
15+1.2 EUR
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PIC32CM1602GV00048-I/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00048-I/U5B
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
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AnzahlPreis
15+1.21 EUR
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PIC32CM1602GV00064-I/V2X SAM-D20-Family-Data-Sheet-DS60001504.pdf
PIC32CM1602GV00064-I/V2X
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
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AnzahlPreis
14+1.28 EUR
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PIC32CM1602GV00064-I/5LX PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00064-I/5LX
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 52
auf Bestellung 780 Stücke:
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AnzahlPreis
12+1.53 EUR
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PIC32CM1602GV00032T-I/RTB PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00032T-I/RTB
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
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PIC32CM1602GV00032-E/RTB PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00032-E/RTB
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
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PIC32CM1602GV00048T-I/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00048T-I/U5B
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
Produkt ist nicht verfügbar
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PIC32CM1602GV00048T-I/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00048T-I/Y8X
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
Produkt ist nicht verfügbar
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PIC32CM1602GV00032T-I/T5X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM1602GV00032T-I/T5X
Hersteller: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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PIC16F15256-E/SO PIC16F15256-74-75-76-Microcontroller-Data-Sheet-40002305.pdf
PIC16F15256-E/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28SOIC
Number of I/O: 24
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (28K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
auf Bestellung 1026 Stücke:
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AnzahlPreis
12+1.53 EUR
25+1.39 EUR
100+1.38 EUR
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DSC1001DI1-016.3840 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI1-016.3840
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 16.384 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
auf Bestellung 394 Stücke:
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AnzahlPreis
16+1.12 EUR
50+1.1 EUR
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DSC1001DI1-016.3840T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI1-016.3840T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16.384 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-CDFN (2.5x2)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VDFN
Packaging: Strip
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MSMCJ160A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ160A
Hersteller: Microchip Technology
Description: TVS DIODE 160VWM 259VC DO214AB
Supplier Device Package: DO-214AB (SMCJ)
Voltage - Reverse Standoff (Typ): 160V
Current - Peak Pulse (10/1000µs): 5.8A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 259V
Voltage - Breakdown (Min): 178V
Unidirectional Channels: 1
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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