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DSA1223DL2-156M2500VAO DSA1223DL2-156M2500VAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTO, LVDS, 156.25MHZ,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1103DL2-156.2500TVAO DSA1103DL2-156.2500TVAO Microchip Technology DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-20005891A.pdf Description: MEMS OSCILLATOR SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1103DL2-156.2500TVAO DSA1103DL2-156.2500TVAO Microchip Technology DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-20005891A.pdf Description: MEMS OSCILLATOR SMD
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1003DL2-100.0000 DSC1003DL2-100.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 100.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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DSC1103DL2-156.2500 DSC1103DL2-156.2500 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 156.2500MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1223DL2-100M0000VAO DSA1223DL2-100M0000VAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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MAP6KE62CA MAP6KE62CA Microchip Technology rf01007_rb.pdf Description: TVS DIODE 53VWM 85VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.1A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: T-18
Bidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAP6KE62CAe3 MAP6KE62CAe3 Microchip Technology rf01007_rb.pdf Description: TVS DIODE 53VWM 85VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.1A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: T-18
Bidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N3313B 1N3313B Microchip Technology 1N3305-50B-RB-1N4549-56B-RB.pdf Description: DIODE ZENER 14V 50W DO5
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 1.2 Ohms
Supplier Device Package: DO-5
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 11.4 V
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MCP6486T-E/OTVAO MCP6486T-E/OTVAO Microchip Technology MCP6486-Family-Data-Sheet-DS20006679.pdf Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA
Slew Rate: 20V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 50 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
Qualification: AEC-Q100
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MCP6487T-E/MSVAO MCP6487T-E/MSVAO Microchip Technology MCP6486-Family-Data-Sheet-DS20006679.pdf Description: DUAL, 10MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA (x2 Channels)
Slew Rate: 20V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-MSOP
Grade: Automotive
Number of Circuits: 2
Current - Output / Channel: 50 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
Qualification: AEC-Q100
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MCP6487T-E/MSVAO MCP6487T-E/MSVAO Microchip Technology MCP6486-Family-Data-Sheet-DS20006679.pdf Description: DUAL, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA (x2 Channels)
Slew Rate: 20V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-MSOP
Grade: Automotive
Number of Circuits: 2
Current - Output / Channel: 50 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
Qualification: AEC-Q100
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PIC32MZ2048EFG144T-I/PL PIC32MZ2048EFG144T-I/PL Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 48x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ2048EFG144T-I/PL PIC32MZ2048EFG144T-I/PL Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 48x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
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MCP40D17T-502E/LTY MCP40D17T-502E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002152.pdf Description: IC DIG POT 5K SC-70-6
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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1N5261 1N5261 Microchip Technology LDS-0232.pdf Description: DIODE ZENER 47V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 34 V
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1N5261BUR-1/TR 1N5261BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: DIODE ZENER 47V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
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1N5261BUR-1/TR 1N5261BUR-1/TR Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: DIODE ZENER 47V 500MW DO213AA
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
Produkt ist nicht verfügbar
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PIC32CK1025GC01064-I/LZX PIC32CK1025GC01064-I/LZX Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33,1024KBFLASH,256KBRAM,120MHZ
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
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PIC32CK1025GC01144-I/HQB PIC32CK1025GC01144-I/HQB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: ENET AND CAN, CM33,1024KBFLASH,2
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 108
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PIC32CK1025SG01100-I/4SB PIC32CK1025SG01100-I/4SB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
Produkt ist nicht verfügbar
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PIC32CK1025SG01064-I/LZX PIC32CK1025SG01064-I/LZX Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
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PIC32CK1025SG01064-I/3ZB PIC32CK1025SG01064-I/3ZB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 47
Produkt ist nicht verfügbar
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PIC32CK1025SG01144-E/4KB PIC32CK1025SG01144-E/4KB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: MATCHES PIC32CK2051SG01144-E/4KB
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 105
Produkt ist nicht verfügbar
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PIC32CK1025SG01064-I/LZX-SL3 PIC32CK1025SG01064-I/LZX-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
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PIC32CK1025GC01100-E/4SB PIC32CK1025GC01100-E/4SB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33,1024KBFLASH,256KBRAM,120MHZ
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
Produkt ist nicht verfügbar
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PIC32CK1025GC01064-E/LZX PIC32CK1025GC01064-E/LZX Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33,1024KBFLASH,256KBRAM,120MHZ
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
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PIC32CK1025SG01100-E/4SB PIC32CK1025SG01100-E/4SB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
Produkt ist nicht verfügbar
 Mindestbestellmenge: 180 Stücke
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PIC32CK1025SG01064-E/LZX PIC32CK1025SG01064-E/LZX Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
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PIC32CK1025GC01064-E/3ZB PIC32CK1025GC01064-E/3ZB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 47
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
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PIC32CK1025SG01144-I/HQB-SL3 PIC32CK1025SG01144-I/HQB-SL3 Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: ENET AND CAN, CM33,1024KBFLASH,2
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 108
Produkt ist nicht verfügbar
 Mindestbestellmenge: 240 Stücke
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PIC32CK1025SG01064-E/3ZB PIC32CK1025SG01064-E/3ZB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 47
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
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PIC32CK1025GC01144-E/4KB PIC32CK1025GC01144-E/4KB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: MATCHES PIC32CK2051GC01144-E/4KB
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 105
Produkt ist nicht verfügbar
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PIC32CK1025GC01144-E/HQB PIC32CK1025GC01144-E/HQB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: MATCHES PIC32CK2051GC01144-E/HQB
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 105
Produkt ist nicht verfügbar
 Mindestbestellmenge: 240 Stücke
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PIC32CK1025SG01144-E/HQB PIC32CK1025SG01144-E/HQB Microchip Technology PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf Description: MATCHES PIC32CK2051SG01144-E/HQB
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 105
Produkt ist nicht verfügbar
 Mindestbestellmenge: 240 Stücke
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MSMBJ64A MSMBJ64A Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 64VWM 103VC DO214AA
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AA (SMBJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MSMCJ43A MSMCJ43A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 43VWM 69.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.6A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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LM2576-12BT LM2576-12BT Microchip Technology lm2576.pdf Description: IC REG BUCK 12V 3A TO220-5
Packaging: Bulk
Package / Case: TO-220-5
Output Type: Fixed
Mounting Type: Through Hole
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-220-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Produkt ist nicht verfügbar
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LM2576-12BU LM2576-12BU Microchip Technology lm2576.pdf Description: IC REG BUCK 12V 3A TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Produkt ist nicht verfügbar
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LM2576-12BU TR LM2576-12BU TR Microchip Technology lm2576.pdf Description: IC REG BUCK 12V 3A TO263-5
Packaging: Tape & Reel (TR)
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Produkt ist nicht verfügbar
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PIC32MX250F128BT-I/SS PIC32MX250F128BT-I/SS Microchip Technology PIC32MX1XX2XX%20283644-PIN_Datasheet_DS60001168L.pdf Description: IC MCU 32BIT 128KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 9x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32MX250F128BT-I/SS PIC32MX250F128BT-I/SS Microchip Technology PIC32MX1XX2XX%20283644-PIN_Datasheet_DS60001168L.pdf Description: IC MCU 32BIT 128KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 9x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F17125-E/P PIC16F17125-E/P Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: IC MCU 8BIT 14KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 11
DigiKey Programmable: Not Verified
auf Bestellung 347 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.52 EUR
25+3.23 EUR
100+2.93 EUR
Mindestbestellmenge: 5 Stücke
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PIC16F17125-E/ST PIC16F17125-E/ST Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
DigiKey Programmable: Not Verified
auf Bestellung 632 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.41 EUR
25+1.29 EUR
100+1.17 EUR
Mindestbestellmenge: 13 Stücke
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PIC16F17125-E/7N PIC16F17125-E/7N Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: IC MCU 8BIT 14KB FLASH 16VQFN
Packaging: Tube
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-VQFN (4x4)
Number of I/O: 11
DigiKey Programmable: Not Verified
auf Bestellung 723 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.48 EUR
25+1.36 EUR
100+1.23 EUR
Mindestbestellmenge: 12 Stücke
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PIC16F17125T-I/SL PIC16F17125T-I/SL Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
DigiKey Programmable: Not Verified
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PIC16F17125T-I/ST PIC16F17125T-I/ST Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F17125T-I/7N PIC16F17125T-I/7N Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: IC MCU 8BIT 14KB FLASH 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-VQFN (4x4)
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCP2003BT-E/MF MCP2003BT-E/MF Microchip Technology 2000546C3.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-DFN (3x3)
Duplex: Half
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MCP2003BT-E/MF MCP2003BT-E/MF Microchip Technology 2000546C3.pdf Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-DFN (3x3)
Duplex: Half
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VCC6-VCE-100M000000 Microchip Technology VCC6-April-2020.pdf Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATMEGA164P-20PQ ATMEGA164P-20PQ Microchip Technology ATmega164P-324P-644P-Data-Sheet-40002071A.pdf Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA164PV-10PQ ATMEGA164PV-10PQ Microchip Technology ATmega164P-324P-644P-Data-Sheet-40002071A.pdf Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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MSC060SMA070SDT/R MSC060SMA070SDT/R Microchip Technology MSC060SMA070SD-SiC-MOSFET-Datasheet.pdf Description: MOSFET SIC 700 V 60 MOHM TO-263-
Packaging: Tape & Reel (TR)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 20A, 20V
Power Dissipation (Max): 240W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-263-7
Drive Voltage (Max Rds On, Min Rds On): 18V, 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 700 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 1160 pF @ 700 V
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MSC060SMA070SDT/R MSC060SMA070SDT/R Microchip Technology MSC060SMA070SD-SiC-MOSFET-Datasheet.pdf Description: MOSFET SIC 700 V 60 MOHM TO-263-
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 20A, 20V
Power Dissipation (Max): 240W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-263-7
Drive Voltage (Max Rds On, Min Rds On): 18V, 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 700 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 1160 pF @ 700 V
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VERYVERILOG VERYVERILOG Microchip Technology miniFPGA-Datasheet.pdf Description: VERYVERILOG MINI FPGA KIT
Packaging: Bulk
Kit Type: FPGA
Utilized IC / Part: PIC16F13145-I/P
Main Purpose: Education
Interconnect System: veryVerilog
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LM2576BT LM2576BT Microchip Technology lm2576.pdf Description: IC REG BUCK ADJ 3A TO220-5
Packaging: Tube
Package / Case: TO-220-5
Output Type: Adjustable
Mounting Type: Through Hole
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-220-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
Produkt ist nicht verfügbar
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DSA1123CA3-125.0000VAO DSA1123CA3-125.0000VAO Microchip Technology DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-DS20005891.pdf Description: MEMS OSC., AUTOMOTIVE, -40-125C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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AT91SAM7S64C-AU-999 AT91SAM7S64C-AU-999 Microchip Technology 6175s.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MCP33141D-025-E/MS MCP33141D-025-E/MS Microchip Technology MCP33151X-14X-025-Data-Sheet-DS20007079.pdf Description: IC ADC 12BIT 10-MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: ADC
Data Interface: 3-Wire Serial, SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.7V ~ 1.9V
Voltage - Supply, Digital: 1.7V ~ 5.5V
Sampling Rate (Per Second): 250k
Input Type: Differential
Number of Inputs: 2
Supplier Device Package: 10-MSOP
Architecture: SAR
Ratio - S/H:ADC: 0:1
Grade: Automotive
Number of A/D Converters: 1
Qualification: AEC-Q100
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DSA1223DL2-156M2500VAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223DL2-156M2500VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVDS, 156.25MHZ,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1103DL2-156.2500TVAO DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-20005891A.pdf
DSA1103DL2-156.2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1103DL2-156.2500TVAO DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-20005891A.pdf
DSA1103DL2-156.2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR SMD
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1003DL2-100.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1003DL2-100.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 100.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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DSC1103DL2-156.2500 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103DL2-156.2500
Hersteller: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1223DL2-100M0000VAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf
DSA1223DL2-100M0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MAP6KE62CA rf01007_rb.pdf
MAP6KE62CA
Hersteller: Microchip Technology
Description: TVS DIODE 53VWM 85VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.1A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: T-18
Bidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MAP6KE62CAe3 rf01007_rb.pdf
MAP6KE62CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 53VWM 85VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.1A
Voltage - Reverse Standoff (Typ): 53V
Supplier Device Package: T-18
Bidirectional Channels: 1
Voltage - Breakdown (Min): 58.9V
Voltage - Clamping (Max) @ Ipp: 85V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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1N3313B 1N3305-50B-RB-1N4549-56B-RB.pdf
1N3313B
Hersteller: Microchip Technology
Description: DIODE ZENER 14V 50W DO5
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 1.2 Ohms
Supplier Device Package: DO-5
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 11.4 V
Produkt ist nicht verfügbar
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MCP6486T-E/OTVAO MCP6486-Family-Data-Sheet-DS20006679.pdf
MCP6486T-E/OTVAO
Hersteller: Microchip Technology
Description: SINGLE, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA
Slew Rate: 20V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 50 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
Qualification: AEC-Q100
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36+0.49 EUR
43+0.42 EUR
100+0.41 EUR
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MCP6487T-E/MSVAO MCP6486-Family-Data-Sheet-DS20006679.pdf
MCP6487T-E/MSVAO
Hersteller: Microchip Technology
Description: DUAL, 10MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA (x2 Channels)
Slew Rate: 20V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-MSOP
Grade: Automotive
Number of Circuits: 2
Current - Output / Channel: 50 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
Qualification: AEC-Q100
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2500+0.52 EUR
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MCP6487T-E/MSVAO MCP6486-Family-Data-Sheet-DS20006679.pdf
MCP6487T-E/MSVAO
Hersteller: Microchip Technology
Description: DUAL, 10MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 550µA (x2 Channels)
Slew Rate: 20V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-MSOP
Grade: Automotive
Number of Circuits: 2
Current - Output / Channel: 50 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
Qualification: AEC-Q100
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26+0.69 EUR
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PIC32MZ2048EFG144T-I/PL PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf
PIC32MZ2048EFG144T-I/PL
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 48x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
700+20.79 EUR
Mindestbestellmenge: 700 Stücke
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PIC32MZ2048EFG144T-I/PL PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Data-Sheet-DS60001320H.pdf
PIC32MZ2048EFG144T-I/PL
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 48x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+25.06 EUR
25+24.4 EUR
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MCP40D17T-502E/LTY MCP4017-18-19-Data-Sheet-DS20002152.pdf
MCP40D17T-502E/LTY
Hersteller: Microchip Technology
Description: IC DIG POT 5K SC-70-6
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
auf Bestellung 2633 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
18+1.02 EUR
25+0.85 EUR
Mindestbestellmenge: 18 Stücke
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1N5261 LDS-0232.pdf
1N5261
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 34 V
Produkt ist nicht verfügbar
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1N5261BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
1N5261BUR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
Produkt ist nicht verfügbar
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1N5261BUR-1/TR 1N5221BUR-1%20thru%201N5281BUR-1.pdf
1N5261BUR-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW DO213AA
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
Produkt ist nicht verfügbar
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PIC32CK1025GC01064-I/LZX PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01064-I/LZX
Hersteller: Microchip Technology
Description: CM33,1024KBFLASH,256KBRAM,120MHZ
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.81 EUR
Mindestbestellmenge: 4 Stücke
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PIC32CK1025GC01144-I/HQB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01144-I/HQB
Hersteller: Microchip Technology
Description: ENET AND CAN, CM33,1024KBFLASH,2
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 108
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.32 EUR
Mindestbestellmenge: 3 Stücke
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PIC32CK1025SG01100-I/4SB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01100-I/4SB
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
Produkt ist nicht verfügbar
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PIC32CK1025SG01064-I/LZX PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01064-I/LZX
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
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PIC32CK1025SG01064-I/3ZB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01064-I/3ZB
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 47
Produkt ist nicht verfügbar
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PIC32CK1025SG01144-E/4KB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01144-E/4KB
Hersteller: Microchip Technology
Description: MATCHES PIC32CK2051SG01144-E/4KB
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 105
Produkt ist nicht verfügbar
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PIC32CK1025SG01064-I/LZX-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01064-I/LZX-SL3
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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PIC32CK1025GC01100-E/4SB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01100-E/4SB
Hersteller: Microchip Technology
Description: CM33,1024KBFLASH,256KBRAM,120MHZ
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
Produkt ist nicht verfügbar
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PIC32CK1025GC01064-E/LZX PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01064-E/LZX
Hersteller: Microchip Technology
Description: CM33,1024KBFLASH,256KBRAM,120MHZ
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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PIC32CK1025SG01100-E/4SB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01100-E/4SB
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 69
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
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PIC32CK1025SG01064-E/LZX PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01064-E/LZX
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 47
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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PIC32CK1025GC01064-E/3ZB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01064-E/3ZB
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 47
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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PIC32CK1025SG01144-I/HQB-SL3 PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01144-I/HQB-SL3
Hersteller: Microchip Technology
Description: ENET AND CAN, CM33,1024KBFLASH,2
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 15x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 108
Produkt ist nicht verfügbar
Mindestbestellmenge: 240 Stücke
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PIC32CK1025SG01064-E/3ZB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01064-E/3ZB
Hersteller: Microchip Technology
Description: CM33WHSMSECURITY,1024KBFLASH,256
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 47
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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PIC32CK1025GC01144-E/4KB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01144-E/4KB
Hersteller: Microchip Technology
Description: MATCHES PIC32CK2051GC01144-E/4KB
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 144-TQFP (16x16)
Number of I/O: 105
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
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PIC32CK1025GC01144-E/HQB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025GC01144-E/HQB
Hersteller: Microchip Technology
Description: MATCHES PIC32CK2051GC01144-E/HQB
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 105
Produkt ist nicht verfügbar
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PIC32CK1025SG01144-E/HQB PIC32CK-SG01-SG00-GC01-GC00-Family-Data-Sheet-DS60001795.pdf
PIC32CK1025SG01144-E/HQB
Hersteller: Microchip Technology
Description: MATCHES PIC32CK2051SG01144-E/HQB
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TBGA (10x10)
Number of I/O: 105
Produkt ist nicht verfügbar
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MSMBJ64A RF01000+%283%29.pdf
MSMBJ64A
Hersteller: Microchip Technology
Description: TVS DIODE 64VWM 103VC DO214AA
Packaging: Bulk
Package / Case: DO-214AA, SMB
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AA (SMBJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MSMCJ43A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ43A
Hersteller: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.6A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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LM2576-12BT lm2576.pdf
LM2576-12BT
Hersteller: Microchip Technology
Description: IC REG BUCK 12V 3A TO220-5
Packaging: Bulk
Package / Case: TO-220-5
Output Type: Fixed
Mounting Type: Through Hole
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-220-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Produkt ist nicht verfügbar
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LM2576-12BU lm2576.pdf
LM2576-12BU
Hersteller: Microchip Technology
Description: IC REG BUCK 12V 3A TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Produkt ist nicht verfügbar
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LM2576-12BU TR lm2576.pdf
LM2576-12BU TR
Hersteller: Microchip Technology
Description: IC REG BUCK 12V 3A TO263-5
Packaging: Tape & Reel (TR)
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Produkt ist nicht verfügbar
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PIC32MX250F128BT-I/SS PIC32MX1XX2XX%20283644-PIN_Datasheet_DS60001168L.pdf
PIC32MX250F128BT-I/SS
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 9x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32MX250F128BT-I/SS PIC32MX1XX2XX%20283644-PIN_Datasheet_DS60001168L.pdf
PIC32MX250F128BT-I/SS
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M4K™
Data Converters: A/D 9x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F17125-E/P PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17125-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 11
DigiKey Programmable: Not Verified
auf Bestellung 347 Stücke:
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AnzahlPreis
5+3.52 EUR
25+3.23 EUR
100+2.93 EUR
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PIC16F17125-E/ST PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17125-E/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
DigiKey Programmable: Not Verified
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AnzahlPreis
13+1.41 EUR
25+1.29 EUR
100+1.17 EUR
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PIC16F17125-E/7N PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17125-E/7N
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 16VQFN
Packaging: Tube
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-VQFN (4x4)
Number of I/O: 11
DigiKey Programmable: Not Verified
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AnzahlPreis
12+1.48 EUR
25+1.36 EUR
100+1.23 EUR
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PIC16F17125T-I/SL PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17125T-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F17125T-I/ST PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17125T-I/ST
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC16F17125T-I/7N PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17125T-I/7N
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-VQFN (4x4)
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCP2003BT-E/MF 2000546C3.pdf
MCP2003BT-E/MF
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-DFN (3x3)
Duplex: Half
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AnzahlPreis
3300+1.08 EUR
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MCP2003BT-E/MF 2000546C3.pdf
MCP2003BT-E/MF
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-DFN (3x3)
Duplex: Half
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AnzahlPreis
13+1.43 EUR
25+1.21 EUR
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VCC6-VCE-100M000000 VCC6-April-2020.pdf
Hersteller: Microchip Technology
Description: DIFFERENTIAL XO +2.5 VDC +/-5% L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATMEGA164P-20PQ ATmega164P-324P-644P-Data-Sheet-40002071A.pdf
ATMEGA164P-20PQ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATMEGA164PV-10PQ ATmega164P-324P-644P-Data-Sheet-40002071A.pdf
ATMEGA164PV-10PQ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MSC060SMA070SDT/R MSC060SMA070SD-SiC-MOSFET-Datasheet.pdf
MSC060SMA070SDT/R
Hersteller: Microchip Technology
Description: MOSFET SIC 700 V 60 MOHM TO-263-
Packaging: Tape & Reel (TR)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 20A, 20V
Power Dissipation (Max): 240W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-263-7
Drive Voltage (Max Rds On, Min Rds On): 18V, 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 700 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 1160 pF @ 700 V
Produkt ist nicht verfügbar
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MSC060SMA070SDT/R MSC060SMA070SD-SiC-MOSFET-Datasheet.pdf
MSC060SMA070SDT/R
Hersteller: Microchip Technology
Description: MOSFET SIC 700 V 60 MOHM TO-263-
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
Rds On (Max) @ Id, Vgs: 75mOhm @ 20A, 20V
Power Dissipation (Max): 240W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-263-7
Drive Voltage (Max Rds On, Min Rds On): 18V, 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 700 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 1160 pF @ 700 V
auf Bestellung 651 Stücke:
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AnzahlPreis
2+9.8 EUR
25+9.03 EUR
100+8.97 EUR
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VERYVERILOG miniFPGA-Datasheet.pdf
VERYVERILOG
Hersteller: Microchip Technology
Description: VERYVERILOG MINI FPGA KIT
Packaging: Bulk
Kit Type: FPGA
Utilized IC / Part: PIC16F13145-I/P
Main Purpose: Education
Interconnect System: veryVerilog
auf Bestellung 710 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+19.91 EUR
10+19.87 EUR
25+19.85 EUR
100+19.82 EUR
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LM2576BT lm2576.pdf
LM2576BT
Hersteller: Microchip Technology
Description: IC REG BUCK ADJ 3A TO220-5
Packaging: Tube
Package / Case: TO-220-5
Output Type: Adjustable
Mounting Type: Through Hole
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-220-5
Synchronous Rectifier: No
Voltage - Output (Max): 37V
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 1.23V
Produkt ist nicht verfügbar
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DSA1123CA3-125.0000VAO DSA1103-23-Low-Jitter-Precision-LVDS-Oscillator-for-Automotive-DS20005891.pdf
DSA1123CA3-125.0000VAO
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-125C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
auf Bestellung 440 Stücke:
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AnzahlPreis
6+3.43 EUR
25+2.87 EUR
100+2.77 EUR
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AT91SAM7S64C-AU-999 6175s.pdf
AT91SAM7S64C-AU-999
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Verified
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MCP33141D-025-E/MS MCP33151X-14X-025-Data-Sheet-DS20007079.pdf
MCP33141D-025-E/MS
Hersteller: Microchip Technology
Description: IC ADC 12BIT 10-MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: ADC
Data Interface: 3-Wire Serial, SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.7V ~ 1.9V
Voltage - Supply, Digital: 1.7V ~ 5.5V
Sampling Rate (Per Second): 250k
Input Type: Differential
Number of Inputs: 2
Supplier Device Package: 10-MSOP
Architecture: SAR
Ratio - S/H:ADC: 0:1
Grade: Automotive
Number of A/D Converters: 1
Qualification: AEC-Q100
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
10+1.94 EUR
25+1.63 EUR
100+1.48 EUR
Mindestbestellmenge: 10 Stücke
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