Hersteller: KLS
Verstärkungs- und Metallstangen > Abstandshalter
Внутрішня різьба: Abstandshalter
Опис: Abstandshalter Sechseck mit Innen/Au?engewinde M3/M3, h=6mm, Nylon
Відстань між платами (висота): h=6mm, M3/M3
Зовнішня різьба: M3
Матеріал: Пластик

Hersteller: Weidmüller
Description: CONN CODING ELEMENT BLACK
Packaging: Bulk
For Use With/Related Products: Omnimate RSV Series
Accessory Type: Polarizing Device (Key, Plug, Post)
Part Status: Active

Hersteller: Weidmüller
Description: TERM BLOCK HDR 10POS 90DEG 3.5MM
Packaging: Bulk
Color: Orange
Mounting Type: Through Hole
Number of Positions: 10
Pitch: 0.138" (3.50mm)
Type: Header, Male Pins, Shrouded (4 Side)
Operating Temperature: -50°C ~ 100°C
Termination Style: Solder
Current - IEC: 17A
Number of Levels: 1
Positions Per Level: 10
Header Orientation: 90°, Right Angle
Contact Mating Finish: Tin
Part Status: Active
Current - UL: 10 A
Voltage - IEC: 320 V
Voltage - UL: 300 V

Hersteller: Infineon Technologies
Description: LEVEL SHIFT SOI
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
Description: LEVEL SHIFT SOI
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified

Hersteller: National Semiconductor
Description: IC GATE NAND 1CH 8-INP 14CDIP
Packaging: Bulk
Package / Case: 14-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Inputs: 8
Supplier Device Package: 14-CDIP
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 6 mA

Hersteller: Rochester Electronics, LLC
Description: IC GATE NOR
Packaging: Bulk
Part Status: Active

Hersteller: Fairchild Semiconductor
Description: IC GATE NAND 4CH 2-INP
Packaging: Bulk
Mounting Type: Through Hole
Logic Type: NAND Gate
Number of Inputs: 2
Part Status: Active
Number of Circuits: 4

Hersteller: National Semiconductor
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Output High, Low: 1.2mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-PDIP
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 54 mA

Hersteller: National Semiconductor
Description: IC GATE NAND 4CH 2-INP 14CERDIP
Features: Open Collector
Packaging: Bulk
Package / Case: 14-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Output High, Low: 250µA, 48mA
Number of Inputs: 2
Supplier Device Package: 14-CERDIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 5V, 45pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 54 mA

Hersteller: National Semiconductor
Description: IC GATE NAND 4CH 2-INP 14DIP
Features: Open Collector
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Output High, Low: 250µA, 48mA
Number of Inputs: 2
Supplier Device Package: 14-PDIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 22ns @ 5V, 45pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 54 mA

Hersteller: National Semiconductor
Description: IC GATE NAND 4CH 2-INP 14DIP
Features: Open Collector
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Output High, Low: 250µA, 80mA
Number of Inputs: 2
Supplier Device Package: 14-PDIP
Input Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 22ns @ 5V, 45pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 54 mA

Hersteller: EPCOS - TDK Electronics
Description: KIT CHOKE POWER LINE RING CORE
Packaging: Box
Mounting Type: Through Hole
Quantity: Assorted
Kit Type: Common Mode Chokes for Power Lines
Part Status: Active

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 100QFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 55x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-TEQFP (14x14)
Part Status: Active
Number of I/O: 72
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 176QFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+/M7
Data Converters: A/D 82x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 176-TEQFP (24x24)
Part Status: Active
Number of I/O: 148
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU WIFI 69UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 69-UFBGA, WLBGA
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 448kB ROM, 240kB RAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 18.5dBm
Protocol: 802.11b/g/n
Current - Receiving: 52mA ~ 59mA
Data Rate (Max): 72Mbps
Current - Transmitting: 260mA ~ 320mA
Supplier Device Package: 69-WLBGA (4.52x2.92)
GPIO: 5
Modulation: 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK, OFDM
RF Family/Standard: WiFi
Serial Interfaces: JTAG, SPI, UART
Part Status: Not For New Designs
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU WIFI 69UFBGA
Packaging: Cut Tape (CT)
Package / Case: 69-UFBGA, WLBGA
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 448kB ROM, 240kB RAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 18.5dBm
Protocol: 802.11b/g/n
Current - Receiving: 52mA ~ 59mA
Data Rate (Max): 72Mbps
Current - Transmitting: 260mA ~ 320mA
Supplier Device Package: 69-WLBGA (4.52x2.92)
GPIO: 5
Modulation: 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK, OFDM
RF Family/Standard: WiFi
Serial Interfaces: JTAG, SPI, UART
Part Status: Not For New Designs
DigiKey Programmable: Not Verified

Hersteller: Analog Devices Inc.
Description: EVAL BOARD FOR ICOUPLER SMD
Packaging: Bulk
Utilized IC / Part: 16-QSOP, 16-SOIC
Supplied Contents: Unpopulated (Bare) Board(s)
Embedded: No
Part Status: Active

Hersteller: Infineon Technologies
NOR Flash Parallel 3V/3.3V 128M-bit 8M x 16 110ns Automotive 64-Pin Fortified BGA T/R

Hersteller: TE Application Tooling
Description: APPL,HDM 5SMPO130F180F T
Packaging: Bulk
For Use With/Related Products: Terminals
Tool Type: Applicator - HDM for Bench Press
Part Status: Active
Tool Method: Automated
Tool Type Feature: Terminator
Ratcheting: No Ratchet

Hersteller: TE Application Tooling
Description: APPL,HDM 5SMPR130F180F K
Packaging: Bulk
Part Status: Active
For Use With/Related Products: Terminals
Tool Type: Applicator - HDM for Bench Press
Tool Method: Pneumatic
Tool Type Feature: Terminator
Ratcheting: No Ratchet

Hersteller: Delphi Connection Systems
Connectors Copper Thin

Hersteller: Weidmuller
Connector Accessories Coding Element Straight Box

Hersteller: Schroff
Side panel type H for stainless Steel gaskets

Hersteller: WAGO Innovative
Conn Modular Terminal Block F 1 POS Solder Thru-Hole 24A CAGE CLAMP® Box

Hersteller: WAGO Corporation
Description: STACKABLE PCB TERMINAL BLOCK; PU
Features: Push Button Actuated
Packaging: Box
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 12-28 AWG
Mating Orientation: 45° (135°) Angle with Board
Positions Per Level: 1
Wire Termination: Screwless - Push Button Clamp
Part Status: Active
Current: 15 A
Number of Levels: 1
Voltage: 300 V

Hersteller: WAGO Corporation
Description: STACKABLE PCB TERMINAL BLOCK FIN
Packaging: Box
Features: Push Button Actuated
Color: Gray
Mounting Type: Through Hole
Wire Gauge: 12-28 AWG
Mating Orientation: 45° (135°) Angle with Board
Positions Per Level: 1
Wire Termination: Screwless - Push Button Clamp
Part Status: Active
Current: 15 A
Number of Levels: 1
Voltage: 300 V

Hersteller: WAGO Innovative
Stackable PCB terminal block Push-button 2.5 mm2 Pin spacing 5/5.08 mm 1-pole suitable for Ex-e applications CAGE CLAMP commoning option

Hersteller: SICK, Inc.
Description: ABSOLUTE ENCODER
Packaging: Bulk
Output Type: Commutation
Mounting Type: Flange Mount
Orientation: User Selectable
Termination Style: Connector
Encoder Type: Absolute
Detent: No
Actuator Type: Shaft
Built in Switch: No

Hersteller: Vishay Beyschlag/Draloric/BC Components
Description: CAP ALUM 33000UF 20% 10V SNAP
Tolerance: ±20%
Packaging: Tape & Box (TB)
Package / Case: Radial, Can - Snap-In - 3 Lead
Size / Dimension: 1.181" Dia (30.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Applications: Audio
Lead Spacing: 0.394" (10.00mm)
ESR (Equivalent Series Resistance): 32mOhm @ 100Hz
Lifetime @ Temp.: 12000 Hrs @ 85°C
Height - Seated (Max): 1.654" (42.00mm)
Part Status: Active
Capacitance: 33000 µF
Voltage - Rated: 10 V
Impedance: 28 mOhms
Ripple Current @ Low Frequency: 4.58 A @ 100 Hz

Hersteller: HARTING
Description: CONN HOOD SIDE ENTRY SZ48B PG42
Packaging: Bulk
Connector Type: Hood
Size / Dimension: 5.197" L x 3.543" W x 3.839" H (132.00mm x 90.00mm x 97.50mm)
Style: Side Entry
Thread Size: PG42
Operating Temperature: -40°C ~ 125°C
Size: 48B
Ingress Protection: IP65 - Dust Tight, Water Resistant
Lock Location: Locking Clip (1) on Base Bottom
Housing Material: Aluminum, Die Cast
Housing Color: Gray
Housing Finish: Powder Coated
Part Status: Active

Hersteller: Infineon Technologies
SP005567435

Hersteller: Infineon Technologies
LEVEL SHIFT SOI

Hersteller: Infineon Technologies
Description: 160 V HIGH SIDE, LOW SIDE SOI GA
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 18V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 160 V
Supplier Device Package: PG-VSON-10-5
Rise / Fall Time (Typ): 25ns, 15ns
Channel Type: Independent
Driven Configuration: High-Side and Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 2A, 4A

Hersteller: Infineon Technologies
Description: 160 V HIGH SIDE, LOW SIDE SOI GA
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 18V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 160 V
Supplier Device Package: PG-VSON-10-5
Rise / Fall Time (Typ): 25ns, 15ns
Channel Type: Independent
Driven Configuration: High-Side and Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 2A, 4A

Hersteller: Infineon Technologies
LEVEL SHIFT SOI

Hersteller: Infineon Technologies
Description: 160 V HALF BRIDGE SOI GATE DRIVE
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 18V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 160 V
Supplier Device Package: PG-VSON-10-5
Rise / Fall Time (Typ): 24ns, 12ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 2A, 4A

Hersteller: Infineon Technologies
Description: 160 V HALF BRIDGE SOI GATE DRIVE
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 18V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 160 V
Supplier Device Package: PG-VSON-10-5
Rise / Fall Time (Typ): 24ns, 12ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 2A, 4A

Hersteller: 3M
Description: CBL RIBN 16COND TWIST-PAIR 100'
Features: Zippable
Packaging: Spool
Length: 100.0' (30.48m)
Wire Gauge: 28 AWG
Shielding: Unshielded
Jacket (Insulation) Material: Poly-Vinyl Chloride (PVC)
Conductor Strand: 7 Strands / 36 AWG
Pitch: 0.050" (1.27mm)
Operating Temperature: -20°C ~ 80°C
Number of Conductors: 16 (8 Pair Twisted)
Cable Type: Flat Twisted Pair
Jacket Color: Multiple
Ribbon Thickness: 0.035" (0.89mm)
Ribbon Width: 0.800" (20.32mm)
Part Status: Obsolete
Voltage: 300 V

Hersteller: 3M (TC)
Description: TAPE FILM GOLD 3/4"X36YDS
Packaging: Bulk
Color: Gold
Length: 108' (32.9m) 36 yds
Thickness: 0.0027" (2.7 mils, 0.069mm)
Temperature Range: -100°F ~ 500°F (-73°C ~ 260°C)
Tape Type: Film
Width: 0.75" (19.05mm) 3/4"
Usage: Masking, High Temperature, Wave Soldering
Adhesive: Silicone
Backing, Carrier: Polyimide
Thickness - Adhesive: 0.0017" (1.7 mils, 0.043mm)
Thickness - Backing, Carrier: 0.0010" (1.0 mils, 0.025mm)
Part Status: Active

Hersteller: Siemens
Description: CONTACTOR S0 16A 24VAC 1NO/1NC S
Features: Auxiliary Contacts
Packaging: Box
Mounting Type: Chassis Mount, DIN Rail
Coil Voltage: 24VAC
Operating Temperature: -25°C ~ 60°C
Termination Style: Screw Terminal
Contact Form: 3PST-NO (3 Form A)
Contact Rating (Current): 17 A
Switching Voltage: 690VAC - Max
Must Operate Voltage: 19.2 VAC
Part Status: Active

Hersteller: Siemens
Description: CONFIG SW BODY PUSHBUT NON-ILLUM
Packaging: Box
Requires: Contact Block(s)
Type: Momentary
Illumination: Non-Illuminated
Actuator Type: Pushbutton, Round
(Select First, Then Apply Filters) Compatible Series: Siemens, 22mm
Panel Cutout Dimensions: 22.3mm (Round)
Part Status: Active

Hersteller: Infineon Technologies
32-bit ARM Cortex M4F FM4 Microcontroller

Hersteller: Infineon Technologies
Description: IC MCU 32BIT 800KB FLASH 100PQFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 800KB (800K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-PQFP (14x20)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V Automotive 100-Pin TEQFP EP Tray

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V Automotive 100-Pin TEQFP EP Tray

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V 100-Pin TEQFP EP T/R

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V 100-Pin TEQFP EP T/R

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 100QFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 55x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-TEQFP (14x14)
Part Status: Active
Number of I/O: 72
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V Automotive

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 100QFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 55x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-TEQFP (14x14)
Part Status: Active
Number of I/O: 72
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V 100-Pin TEQFP EP T/R

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 100QFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 55x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-TEQFP (14x14)
Part Status: Active
Number of I/O: 72
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V Automotive

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 144QFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 70x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V 144-Pin TEQFP EP T/R

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 144QFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 70x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V Tray

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 144QFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 70x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified

Hersteller: Infineon Technologies
MCU 32-bit ARM Cortex M7/ARM Cortex M0+ RISC 4416KB Flash 3.3V/5V 144-Pin TEQFP EP T/R

Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 144QFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Data Converters: A/D 70x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified