Produkte > BGM
| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis ohne MwSt | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGM 1032N7 E6327 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 | auf Bestellung 9143 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM 1032N7 E6327 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 | auf Bestellung 9143 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM 1032N7 E6327 | Infineon Technologies | RF Front End RF SILICON MMIC | auf Bestellung 21 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM 1033N7 E6327 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 | auf Bestellung 11366 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM 1033N7 E6327 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 | auf Bestellung 11366 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM 1034N7 E6327 | Infineon Technologies | Description: IC AMP MMIC RF 17.0DB TSNP-7 | auf Bestellung 15000 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM 1034N7 E6327 | Infineon Technologies | Description: IC AMP MMIC RF 17.0DB TSNP-7 | auf Bestellung 16330 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM 1034N7 E6327 | Infineon Technologies | Description: IC AMP MMIC RF 17.0DB TSNP-7 | auf Bestellung 16295 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM 1043N7 E6327 | Infineon Technologies | RF Front End RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM 1043N7 E6327 | Infineon Technologies | GPS and GLONASS Front-End Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM 1044N7 E6327 | Infineon Technologies | SP000979276 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM 1143N9 E6327 | Infineon Technologies | Front-End Module for Global Navigation Satellite Systems (GNSS) | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM-1 | 3M | Description: GLOVE MEDIUM | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1011 T/R | NXP Semiconductors | RF Amplifier TAPE-7 MMIC-RFSS | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1011,115 | NXP USA Inc. | Description: IC RF AMP ISM 0HZ-3GHZ 6TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1011,115 | NXP Semiconductors | RF Amplifier TAPE-7 MMIC-RFSS | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1011,115 | NXP Semiconductors | RF Amp Single MMIC Amp 6V 6-Pin TSSOP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1011,115 | NXP USA Inc. | Description: IC RF AMP ISM 0HZ-3GHZ 6TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1012 | PHI | 0650NO | auf Bestellung 3000 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM1012,115 | NXP Semiconductors | RF Amp Single MMIC Amp 4V 6-Pin TSSOP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1012,115 | NXP USA Inc. | Description: IC RF AMP ISM 0HZ-4GHZ 6TSSOP Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 4GHz RF Type: ISM Voltage - Supply: 3V ~ 4V Gain: 20.1dB Current - Supply: 14.6mA Noise Figure: 4.8dB P1dB: 9.7dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1013 | Rochester Electronics, LLC | Description: MMIC AMPLIFIER 6TSSOP | auf Bestellung 3000 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM1013 | PH | SOP6 | auf Bestellung 2850 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM1013 T/R | NXP Semiconductors | RF Wireless Misc TAPE-7 MMIC-RFSS | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1013,115 | NXP Semiconductors | RF Amp Single Broadband Amp 1GHz 5.5V 6-Pin TSSOP T/R | auf Bestellung 2326 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM1013,115 | NXP USA Inc. | Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: ISM Voltage - Supply: 5V ~ 6V Gain: 35.5dB Current - Supply: 27.5mA Noise Figure: 4.6dB ~ 4.7dB P1dB: 13dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1013,115 | NXP USA Inc. | Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: ISM Voltage - Supply: 5V ~ 6V Gain: 35.5dB Current - Supply: 27.5mA Noise Figure: 4.6dB ~ 4.7dB P1dB: 13dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1013,115 | NXP Semiconductors | RF Wireless Misc MMAMPLIFIER SOT-363 | auf Bestellung 2976 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM1013,115 | NXP Semiconductors | RF Amp Single Broadband Amp 1GHz 5.5V 6-Pin TSSOP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1014 | NXP | auf Bestellung 15000 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||||
| BGM1014 | NXP | SOT363 | auf Bestellung 15000 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM1014 | NXP | 10+ SOT-363 | auf Bestellung 27000 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM1014,115 | NXP Semiconductors | Description: MMIC AMPLIFIER 6TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1014,115 | NXP USA Inc. | Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1014,115 | NXP Semiconductors | Description: MMIC AMPLIFIER 6TSSOP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1032N7E6327XUSA1 | Infineon Technologies | LNA RF Front End 2dB 14.8dB 6-Pin TSNP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1032N7E6327XUSA1 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 Packaging: Tape & Reel (TR) Package / Case: 6-WDFN Exposed Pad Mounting Type: Surface Mount Function: GPS Front End Frequency: 1575.42MHz RF Type: GPS Supplier Device Package: PG-TSNP-7-10 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1032N7E6327XUSA1 | Infineon Technologies | LNA RF Front End 2dB 14.8dB 6-Pin TSNP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1032N7E6327XUSA1 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 Packaging: Cut Tape (CT) Package / Case: 6-WDFN Exposed Pad Mounting Type: Surface Mount Function: GPS Front End Frequency: 1575.42MHz RF Type: GPS Supplier Device Package: PG-TSNP-7-10 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1033N7E6327XUSA1 | Infineon Technologies | LNA RF Front End 1.65dB 14.8dB 6-Pin TSNP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1033N7E6327XUSA1 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 Packaging: Tape & Reel (TR) Package / Case: 6-WDFN Exposed Pad Mounting Type: Surface Mount Function: GPS Front End Frequency: 1575.42MHz RF Type: GPS Supplier Device Package: PG-TSNP-7-10 Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1033N7E6327XUSA1 | Infineon Technologies | LNA RF Front End 1.65dB 14.8dB 6-Pin TSNP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1033N7E6327XUSA1 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-7-10 Packaging: Cut Tape (CT) Package / Case: 6-WDFN Exposed Pad Mounting Type: Surface Mount Function: GPS Front End Frequency: 1575.42MHz RF Type: GPS Supplier Device Package: PG-TSNP-7-10 Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1034N7E6327XUSA1 | Infineon Technologies | Description: IC AMP MMIC RF 17.0DB TSNP-7 Packaging: Cut Tape (CT) Package / Case: 6-WDFN Exposed Pad Frequency: 1575MHz ~ 1609MHz RF Type: Galileo, GLONASS, GPS Supplier Device Package: PG-TSNP-7-10 Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1034N7E6327XUSA1 | Infineon Technologies | 2dB 17dB 6-Pin TSNP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1034N7E6327XUSA1 | Infineon Technologies | Description: IC AMP MMIC RF 17.0DB TSNP-7 Packaging: Tape & Reel (TR) Package / Case: 6-WDFN Exposed Pad Frequency: 1575MHz ~ 1609MHz RF Type: Galileo, GLONASS, GPS Supplier Device Package: PG-TSNP-7-10 Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1034N7E6327XUSA1 | Infineon Technologies | 2dB 17dB 6-Pin TSNP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1043N7E6327XUSA1 | Infineon Technologies | LNA RF Front End 1.51dB 15.1dB 6-Pin TSNP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1043N7E6327XUSA1 | Infineon Technologies | Description: IC AMP GALI 1575.42MHZ TSNP7-10 Packaging: Cut Tape (CT) Package / Case: 6-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 1575.42MHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.6V Gain: 14.6dB, 15.1dB Current - Supply: 4mA Noise Figure: 1.5dB P1dB: -6dBm Test Frequency: 1575.42MHz, 1598.06MHz ~ 1605.38MHz Supplier Device Package: TSNP-7-10 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1043N7E6327XUSA1 | Infineon Technologies | RF Front End RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1043N7E6327XUSA1 | Infineon Technologies | Description: IC AMP GALI 1575.42MHZ TSNP7-10 Packaging: Tape & Reel (TR) Package / Case: 6-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 1575.42MHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.6V Gain: 14.6dB, 15.1dB Current - Supply: 4mA Noise Figure: 1.5dB P1dB: -6dBm Test Frequency: 1575.42MHz, 1598.06MHz ~ 1605.38MHz Supplier Device Package: TSNP-7-10 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A2-V2-P1071 | Silicon Labs | Bluetooth Modules - 802.15.1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A2-V2-P1071 | Silicon Laboratories | BGM111A2-V2-P1071 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A2-V2-P1394R | Silicon Laboratories | reception and conversion of data | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V1 | Silicon Laboratories | Bluetooth v4.1 (BLE) SMART SOC 0.1152Mbps Automotive 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V1 | Silicon Labs | Description: MOD BLUE GECKO 256K FLASH 32QFN | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V1R | Silicon Labs | Description: MOD BLUE GECKO 256K FLASH 31-SMD | auf Bestellung 112 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM111A256V1R | Silicon Labs | Description: MOD BLUE GECKO 256K FLASH 31-SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V1R | Silicon Labs | Description: MOD BLUE GECKO 256K FLASH 31-SMD | auf Bestellung 112 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM111A256V1R | Silicon Labs | Bluetooth Modules (802.15.1) | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V1R | Silicon Laboratories | Bluetooth v4.1 (BLE) SMART SOC 0.1152Mbps Automotive 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM111A Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 554 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM111A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module Cut Tape | auf Bestellung 300 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM111A256V2 | Silicon Labs | Description: RX TXRX MOD BLUETOOTH CHIP SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V2 | SILICON LABS | Description: SILICON LABS - BGM111A256V2 - Blue Gecko Bluetooth® v4.2-Modul, 2.4GHz, 1MB/s, 200m tariffCode: 85176200 Empfangsempfindlichkeit: -92dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C | auf Bestellung 1549 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM111A256V21 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V21 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM111A Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 500 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM111A256V21 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V21 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 200 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM111A256V21R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 5999 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM111A256V21R | SILICON LABS | Description: SILICON LABS - BGM111A256V21R - BLUETOOTH LOW ENERGY-MODUL, V4.2, 1MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -92dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 4.2 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps Produktpalette: Blue Gecko BGM111 Series productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 960 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM111A256V21R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM111A Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 1000 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM111A256V21R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V21R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 5000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM111A256V21R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V21R | SILICON LABS | Description: SILICON LABS - BGM111A256V21R - BLUETOOTH LOW ENERGY-MODUL, V4.2, 1MBPS tariffCode: 85176200 productTraceability: Yes-Date/Lot Code rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c SVHC: No SVHC (16-Jan-2020) | auf Bestellung 960 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM111A256V2P1024 | Silicon Labs | Bluetooth Modules - 802.15.1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V2P1024 | Silicon Laboratories | BGM111A256V2P1024 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111A256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 79306 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM111A256V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM111A Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 9023 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM111A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module T/R | auf Bestellung 500 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM111A256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 79000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM111A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111E256V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM111E Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, U.FL Connector | auf Bestellung 300 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM111E256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111E256V2 | SILICON LABS | Description: SILICON LABS - BGM111E256V2 - BLUETOOTH LOW ENERGY-MODUL, V4.2, 200M tariffCode: 85176200 Empfangsempfindlichkeit: -92dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth 4.2 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 85 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM111E256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111E256V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.484GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA ~ 24.6mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART, USART DigiKey Programmable: Not Verified | auf Bestellung 295 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM111E256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111E256V2R | Silicon Labs | Description: RX TXRX MOD BLUETOOTH CHIP SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM111E256V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM111E Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, U.FL Connector | auf Bestellung 3000 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM111E256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A2-V2-P1158 | Silicon Laboratories | BGM113A2-V2-P1158^SILICONLAB | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A2-V2-P1395 | Silicon Laboratories | reception and conversion of data | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A2-V2-P1446 | Silicon Laboratories | reception and conversion of data | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A2-V2-P1446R | Silicon Laboratories | reception and conversion of data | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A2-V2-P1550 | Silicon Laboratories | reception and conversion of data | auf Bestellung 100 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A2-V2-P1550 | Silicon Laboratories | reception and conversion of data | auf Bestellung 100 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A2-V2-PZ034 | Silicon Laboratories | BGM113A2-V2-PZ034 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V1 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Sensitivity: -93dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.1 Current - Receiving: 8.7mA Current - Transmitting: 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V1 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 36-SMD Module Sensitivity: -93dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.1 Current - Receiving: 8.7mA Current - Transmitting: 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V2 | Silicon Laboratories | Bluetooth Smart Module; 2.4GHz; 1Mbps; -93dBm; SPI/UART/GPIO/I2C; Flash 256kB; RAM 32kB; 1,85V~3,8V; -40°C~85°C; 15,73x9,15x1,9mm; BGM113A256V2 Silicon Lab RF BGM113A256V2 Anzahl je Verpackung: 2 Stücke | auf Bestellung 2 Stücke: Lieferzeit 7-14 Tag (e) |
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| BGM113A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin Cut Tape | auf Bestellung 200 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 36-SMD Module Sensitivity: -93dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.1 Current - Receiving: 8.7mA Current - Transmitting: 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1748 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM113A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 5606 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM113A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin Cut Tape | auf Bestellung 200 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM113A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin Cut Tape | auf Bestellung 200 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V2 | Silicon Laboratories | Bluetooth Smart Module; 2.4GHz; 1Mbps; -93dBm; SPI/UART/GPIO/I2C; Flash 256kB; RAM 32kB; 1,85V~3,8V; -40°C~85°C; 15,73x9,15x1,9mm; BGM113A256V2 Silicon Lab RF BGM113A256V2 Anzahl je Verpackung: 2 Stücke | auf Bestellung 4 Stücke: Lieferzeit 7-14 Tag (e) |
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| BGM113A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin Cut Tape | auf Bestellung 3630 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V2 | SILICON LABS | Description: SILICON LABS - BGM113A256V2 - Bluetooth 4.2-Modul, 1.85V-3.8V Versorgungsspannung, -92dBm Empfindlichkeit tariffCode: 85176200 productTraceability: No rohsCompliant: YES Versorgungsspannung, min.: 1.85V euEccn: NLR Signalbereich, max.: -m hazardous: false rohsPhthalatesCompliant: YES Betriebstemperatur, min.: -40°C Übertragungsrate: -Mbps Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C usEccn: 5A992.c Empfangsempfindlichkeit: -92dBm SVHC: No SVHC (27-Jun-2018) | auf Bestellung 6096 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM113A256V21 | SILICON LABS | Description: SILICON LABS - BGM113A256V21 - BLUETOOTH LOW ENERGY-MODUL, V4.2, 1MBPS tariffCode: 85176200 productTraceability: No rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: TBA usEccn: 5A992.c SVHC: No SVHC (16-Jan-2020) | auf Bestellung 74 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM113A256V21 | Silicon Laboratories | BGM113 Blue Gecko Bluetooth | auf Bestellung 100 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM113A256V21 | SILICON LABS | Description: SILICON LABS - BGM113A256V21 - BLUETOOTH LOW ENERGY-MODUL, V4.2, 1MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -92dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 4.2 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 50m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps Produktpalette: Wireless Gecko BGM113 Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 74 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM113A256V21 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V21 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 36-SMD Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.484GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.85V ~ 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA ~ 24.6mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 100 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM113A256V21 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V21 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 199 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM113A256V21R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V T/R | auf Bestellung 2000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V21R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V21R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 36-SMD Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.484GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.85V ~ 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA ~ 24.6mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 2000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM113A256V21R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 5990 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM113A256V21R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V T/R | auf Bestellung 2000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V21R | Silicon Laboratories | BGM113 Blue Gecko Bluetooth | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V21R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.484GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.85V ~ 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA ~ 24.6mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 2775 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM113A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin T/R | auf Bestellung 700 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Sensitivity: -93dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.1 Current - Receiving: 8.7mA Current - Transmitting: 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 29338 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM113A256V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 18705 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM113A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM113A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin T/R | auf Bestellung 5000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 36-SMD Module Sensitivity: -93dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.1 Current - Receiving: 8.7mA Current - Transmitting: 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG RF Family/Standard: Bluetooth Serial Interfaces: SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 28000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM113A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin T/R | auf Bestellung 5000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM113A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 36-Pin T/R | auf Bestellung 700 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM11S12F256GA-BG2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | auf Bestellung 260 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM11S12F256GA-BG2 | Silicon Labs | Description: RX TXRX MOD BLUETOOTH CHIP SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM11S12F256GA-V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 2dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 5475 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM11S12F256GA-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM11S Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 1088 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM11S12F256GA-V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM11S12F256GA-V2 BT | Silicon Laboratories | Bluetooth 4.2 LE Module based on the EFR32BG chip; Built in antenna; I2C/SPI/UART/USART; 256kB FLASH; 32kB RAM; Po 3dBm; Si -90dBm; 6,5x6,5x1,4mm; 1,85V~3.8V; -40°C ~ 85°C; BGM11S12F256GA-V2 RF BGM11S12f256ga-v2 Anzahl je Verpackung: 2 Stücke | auf Bestellung 2 Stücke: Lieferzeit 7-14 Tag (e) |
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| BGM11S12F256GA-V2R | SILICON LABS | Description: SILICON LABS - BGM11S12F256GA-V2R - BLUETOOTH LOW ENERGY-MODUL, V4.2, 1MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -90dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 4.2 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 1790 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM11S12F256GA-V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM11S Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 970 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM11S12F256GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 2dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 16762 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM11S12F256GA-V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM11S12F256GA-V2R | SILICON LABS | Description: SILICON LABS - BGM11S12F256GA-V2R - BLUETOOTH LOW ENERGY-MODUL, V4.2, 1MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -90dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 4.2 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 1790 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM11S12F256GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 2dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 15000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM11S22F256GA-V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 4384 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM11S22F256GA-V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | auf Bestellung 960 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM11S22F256GA-V2 | SILICON LABS | Description: SILICON LABS - BGM11S22F256GA-V2 - Bluetooth 4.2, Gecko SiP/Modul, 1.85-3.8V Versorgung, 200m Reichweite, 1MB/s, -90dBm Empfindlichkeit tariffCode: 85176200 Empfangsempfindlichkeit: -90dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth 4.2 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps Produktpalette: Blue Gecko Bluetooth BGM11S Series productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (12-Jan-2017) | auf Bestellung 260 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM11S22F256GA-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM11S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 210 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM11S22F256GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 4600 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM11S22F256GA-V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM11S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 5155 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM11S22F256GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 8.7mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 3000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM11S22F256GA-V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM11S22F256GA-V2R | Silicon Laboratories | Bluetooth SIP Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1 | Silicon Labs | Bluetooth Modules (802.15.1) | auf Bestellung 80 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM121A256V1 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1 | Silicon Labs | Description: RF TXRX MOD BLUETOOTH CHIP SMD Packaging: Tray Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.6V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1R | Silicon Labs | Description: RF TXRX MOD BLUETOOTH CHIP SMD Packaging: Cut Tape (CT) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART Part Status: Discontinued at Digi-Key | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1R | Silicon Labs | Description: RF TXRX MOD BLUETOOTH CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART Part Status: Discontinued at Digi-Key | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V1R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V2 | SILICON LABS | Description: SILICON LABS - BGM121A256V2 - Bluetooth 4.2, Gecko SiP/Modul, 1.85-3.8V Versorgung, 200m Reichweite, 1MB/s, -90dBm Empfindlichkeit tariffCode: 85176200 Empfangsempfindlichkeit: -90dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C | auf Bestellung 769 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM121A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin Tray | auf Bestellung 260 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM121A256V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 274 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM121A256V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM121 Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 742 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM121A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin T/R | auf Bestellung 4000 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM121A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121A256V2R | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tape & Reel (TR) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 12000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM121A256V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM121 Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 14049 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM121A256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin T/R | auf Bestellung 4000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM121A256V2R | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Cut Tape (CT) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 13660 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM121N256V1 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1 | Silicon Labs | Description: RF TXRX MOD BLUETOOTH CHIP SMD Packaging: Tray Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1 | Silicon Labs | Bluetooth Modules (802.15.1) | auf Bestellung 232 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM121N256V1R | Silicon Labs | Description: RF TXRX MOD BLUETOOTH CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | auf Bestellung 811 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM121N256V1R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | auf Bestellung 811 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM121N256V1R | Silicon Labs | Bluetooth Modules (802.15.1) | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1R | Silicon Labs | Description: RF TXRX MOD BLUETOOTH CHIP SMD Packaging: Cut Tape (CT) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V1R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 1Mbps 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM121 Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin | auf Bestellung 1300 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM121N256V2 | Silicon Labs | Description: RF TXRX MOD BLUETOOTH CAST SMD Packaging: Tray Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Antenna Not Included, Castellation Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, SPI, UART Part Status: Active | auf Bestellung 1296 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM121N256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin Tray | auf Bestellung 260 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM121N256V2R | Silicon Labs | Description: RF TXRX MODULE BT CAST SMD Packaging: Cut Tape (CT) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Antenna Not Included, Castellation Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1750 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM121N256V2R | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM121N256V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM121 Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin | auf Bestellung 1000 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM121N256V2R | Silicon Labs | Description: RF TXRX MODULE BT CAST SMD Packaging: Tape & Reel (TR) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Antenna Not Included, Castellation Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM121P1545GA | Silicon Laboratories | BGM121P1545GA | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123A256V1 | Silicon Labs | Description: RX TXRX MOD BLUETOOTH CHIP SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123A256V1 | Silicon Labs | Bluetooth Modules (802.15.1) | auf Bestellung 1 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM123A256V1R | Silicon Labs | Bluetooth Modules (802.15.1) | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123A256V2 | SILICON LABS | Description: SILICON LABS - BGM123A256V2 - Blue Gecko Bluetooth® v4.2-Modul, 2.4GHz, 1MB/s, 200m, interne Antenne, +3dBm tariffCode: 85176200 Empfangsempfindlichkeit: -90dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C | auf Bestellung 233 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM123A256V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 1314 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM123A256V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 5312 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM123A256V2 | Silicon Laboratories | Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin Tray | auf Bestellung 300 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM123A256V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 18904 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM123A256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 5000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM123A256V2R | SILICON LABS | Description: SILICON LABS - BGM123A256V2R - Bluetooth 4.2-Modul, 1.85V-3.8V Versorgungsspannung, 200m Reichweite, 1MB/s, -90dBm Empfindlichkeit tariffCode: 85423990 Empfangsempfindlichkeit: -90dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C | auf Bestellung 1883 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM123A256V2R | Silicon Laboratories | Blue Gecko Bluetooth SiP Module | auf Bestellung 3000 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM123A256V2R | SILICON LABS | Description: SILICON LABS - BGM123A256V2R - Bluetooth 4.2-Modul, 1.85V-3.8V Versorgungsspannung, 200m Reichweite, 1MB/s, -90dBm Empfindlichkeit tariffCode: 85423990 Empfangsempfindlichkeit: -90dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c Signalbereich, max.: 200m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.85V euEccn: NLR Übertragungsrate: 1Mbps productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C | auf Bestellung 1883 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM123A256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 5493 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM123N256V1 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123N256V1 | Silicon Labs | Bluetooth Modules - 802.15.1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123N256V1R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 759 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM123N256V1R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 56-SMD Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 9mA Current - Transmitting: 8.2mA Antenna Type: Integrated, Chip Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123N256V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.483GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 6.2mA Current - Transmitting: 8.8mA ~ 9.4mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART, USART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123N256V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123N256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.483GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 6.2mA Current - Transmitting: 8.8mA ~ 9.4mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART, USART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123N256V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -90dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.483GHz Memory Size: 256kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.85V ~ 3.8V Power - Output: 8dBm Data Rate: 1Mbps Protocol: Bluetooth v4.2 Current - Receiving: 6.2mA Current - Transmitting: 8.8mA ~ 9.4mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, SPI, UART, USART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM123N256V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM12LBA9E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM12LBA9E6327XTSA1 | Infineon Technologies | Description: RX TXRX MODULE BLUETOOTH SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13GBA9E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13GBA9E6327XTSA1 | Infineon Technologies | Description: MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13GBA9E6327XTSA1 | Infineon Technologies | BGM13GBA9E6327XTSA1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13HBA9E6327XTSA1 | Infineon Technologies | Description: MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13HBA9E6327XTSA1 | Infineon Technologies | SP2T Low Noise Amplifier Multiplexer | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13HBA9E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GA-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 662 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13P22F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 4 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GA-V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1514 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P22F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 7000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GA-V2 | SILICON LABS | Description: SILICON LABS - BGM13P22F512GA-V2 - Bluetooth 5.0-Modul, 1.8V-3.8V Versorgungsspannung, 2MB/s, -91.2dBm Empfindlichkeit tariffCode: 85176200 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: -m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (17-Dec-2015) | auf Bestellung 682 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 7000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GA-V2R | SILICON LABS | Description: SILICON LABS - BGM13P22F512GA-V2R - Bluetooth LE 5.0, 5.1-Modul, 1.8V-3.8V Versorgung, 600m Reichweite, 2MB/s, -91.2dBm Empfindlichkeit tariffCode: 85423990 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c Signalbereich, max.: 600m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C | auf Bestellung 980 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GA-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | auf Bestellung 24000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 93400 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P22F512GA-V2R | SILICON LABS | Description: SILICON LABS - BGM13P22F512GA-V2R - Bluetooth LE 5.0, 5.1-Modul, 1.8V-3.8V Versorgung, 600m Reichweite, 2MB/s, -91.2dBm Empfindlichkeit tariffCode: 85423990 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES usEccn: 5A992.c Signalbereich, max.: 600m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C | auf Bestellung 980 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GA-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GA-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GA-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | auf Bestellung 24000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GA-V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 15180 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13P22F512GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 94143 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P22F512GE-V2 | SILICON LABS | Description: SILICON LABS - BGM13P22F512GE-V2 - Bluetooth LE 5.0, 5.1-Modul, 1.8V-3.8V Versorgung, 600m Reichweite, 2MB/s, -91.2dBm Empfindlichkeit tariffCode: 85423990 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0, 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 600m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (15-Jan-2019) | auf Bestellung 484 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GE-V2 Produktcode: 167403 | Modulare Elemente > IC Radiomodule | Produkt ist nicht verfügbar | ||||||||||||||||||
| BGM13P22F512GE-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GE-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 300 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GE-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector | auf Bestellung 993 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13P22F512GE-V2 | Silicon Labs | Description: RF TXRX MODULE BT U.FL SMD Packaging: Strip Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Antenna Not Included, U.FL Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 240 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P22F512GE-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GE-V2 | SILICON LABS | Description: SILICON LABS - BGM13P22F512GE-V2 - Bluetooth LE 5.0, 5.1-Modul, 1.8V-3.8V Versorgung, 600m Reichweite, 2MB/s, -91.2dBm Empfindlichkeit tariffCode: 85423990 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0, 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: 600m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (15-Jan-2019) | auf Bestellung 484 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P22F512GE-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 300 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GE-V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector | auf Bestellung 1990 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13P22F512GE-V2R | Silicon Labs | Description: RF TXRX MODULE BT U.FL SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Antenna Not Included, U.FL Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I²C, I²S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 2000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P22F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | auf Bestellung 811 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GE-V2R | Silicon Labs | Description: RF TXRX MODULE BT U.FL SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Antenna Not Included, U.FL Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I²C, I²S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 2855 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P22F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | auf Bestellung 811 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P22F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P22F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GA-V1 | Silicon Laboratories | BGM13P32F512GA-V1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GA-V1R | Silicon Laboratories | BGM13P32F512GA-V1R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 2500 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P32F512GA-V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 19dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 810 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P32F512GA-V2 | SILICON LABS | Description: SILICON LABS - BGM13P32F512GA-V2 - BLUETOOTH LOW ENERGY-MODUL, V5.0, 2MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: -m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 882 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P32F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GA-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 266 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13P32F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GA-V2 | SILICON LABS | Description: SILICON LABS - BGM13P32F512GA-V2 - BLUETOOTH LOW ENERGY-MODUL, V5.0, 2MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: -m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 882 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P32F512GA-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | auf Bestellung 2500 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P32F512GA-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GA-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 Module, 512kB Flash, +17dbm | auf Bestellung 4000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P32F512GA-V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 714 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13P32F512GA-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 Module, 512kB Flash, +17dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GA-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 Module, 512kB Flash, +17dbm | auf Bestellung 780 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P32F512GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 19dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 10318 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P32F512GA-V2R | SILICON LABS | Description: SILICON LABS - BGM13P32F512GA-V2R - BLUETOOTH LOW ENERGY-MODUL, V5.0, 2MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Blue Gecko BGM13P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 545 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P32F512GA-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 Module, 512kB Flash, +17dbm | auf Bestellung 780 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13P32F512GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 19dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 10000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P32F512GA-V2R | SILICON LABS | Description: SILICON LABS - BGM13P32F512GA-V2R - BLUETOOTH LOW ENERGY-MODUL, V5.0, 2MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Blue Gecko BGM13P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 545 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P32F512GE-V1R | Silicon Laboratories | BGM13P32F512GE-V1R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GE-V2 | Silicon Labs | Description: RF TXRX MODULE BT U.FL SMD Packaging: Strip Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 19dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Antenna Not Included, U.FL Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I²C, I²S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 224 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P32F512GE-V2 | SILICON LABS | Description: SILICON LABS - BGM13P32F512GE-V2 - BLUETOOTH LOW ENERGY-MODUL, V5.0, 2MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Blue Gecko BGM13P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 8 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P32F512GE-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GE-V2 | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GE-V2 | SILICON LABS | Description: SILICON LABS - BGM13P32F512GE-V2 - BLUETOOTH LOW ENERGY-MODUL, V5.0, 2MBPS tariffCode: 85176200 Empfangsempfindlichkeit: -91.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Blue Gecko BGM13P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 8 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13P32F512GE-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector | auf Bestellung 1515 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13P32F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GE-V2R | Silicon Labs | Description: RF TXRX MODULE BT U.FL SMD Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 19dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Antenna Not Included, U.FL Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I²C, I²S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 999 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13P32F512GE-V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector | auf Bestellung 4000 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM13P32F512GE-V2R | Silicon Laboratories | Bluetooth v5.0 (BLE) SMART SOC IoT 2Mbps 3.3V 31-Pin T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13P32F512GE-V2R | Silicon Labs | Description: RF TXRX MODULE BT U.FL SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -94.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 19dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.9mA Current - Transmitting: 9.5mA Antenna Type: Antenna Not Included, U.FL Utilized IC / Part: EFR32BG Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I²C, I²S, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V2 | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V2 | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V2 | Silicon Labs | Bluetooth Modules (802.15.1) BGM13S22F512G Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of Dep | auf Bestellung 164 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM13S22F512GA-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S22F512G Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of Dep | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 495 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S22F512GA-V3 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.4mA ~ 11.5mA Current - Transmitting: 8.9mA ~ 122.7mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1675 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13S22F512GA-V3 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 4198 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13S22F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 780 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S22F512GA-V3 | SILICON LABS | Description: SILICON LABS - BGM13S22F512GA-V3 - Bluetooth-Modul, BLE 5.0, 2MB/s, 1.8V bis 3.8V, -90.2dBm, -40°C bis 85°C tariffCode: 84733020 Empfangsempfindlichkeit: -90.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 260 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13S22F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 430 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S22F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 495 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S22F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 780 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S22F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V3R | SILICON LABS | Description: SILICON LABS - BGM13S22F512GA-V3R - BLUETOOTH-MODUL, V5.0, 2MBPS tariffCode: 84733020 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 1832 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13S22F512GA-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V3R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GA-V3R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 9396 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13S22F512GA-V3R | SILICON LABS | Description: SILICON LABS - BGM13S22F512GA-V3R - BLUETOOTH MODULE, V5.0, 2MBPS tariffCode: 84733020 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (16-Jan-2020) | auf Bestellung 1832 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13S22F512GA-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V2 | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V2 | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tray Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM13S22F512GN-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S22F512GN Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of De | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V2 | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm, External Antenna | auf Bestellung 73 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S22F512GN-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +8dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V2R | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V2R | Silicon Labs | Bluetooth Modules (802.15.1) BGM13S22F512GN Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of De | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V3 | SILICON LABS | Description: SILICON LABS - BGM13S22F512GN-V3 - Bluetooth-Modul, BLE 5.0, 2MB/s, 1.8V bis 3.8V, -90.2dBm, -40°C bis 85°C tariffCode: 84733020 productTraceability: No rohsCompliant: YES Versorgungsspannung, min.: 1.8V euEccn: NLR Signalbereich, max.: -m hazardous: false rohsPhthalatesCompliant: TBA Betriebstemperatur, min.: -40°C Übertragungsrate: 2Mbps Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C usEccn: 5A992.c Empfangsempfindlichkeit: -90.2dBm | auf Bestellung 110 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13S22F512GN-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 70 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S22F512GN-V3 | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tray Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.4mA ~ 11.5mA Current - Transmitting: 8.9mA ~ 122.7mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V3 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin | auf Bestellung 980 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13S22F512GN-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 70 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13S22F512GN-V3R | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tape & Reel (TR) Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V3R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S22F512GN-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 18dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V2 | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V2 | Silicon Labs | Bluetooth Modules (802.15.1) BGM11S22F256GA Blue Gecko Bluetooth SiP Module, The World's Smallest, Fully Certified Bluetooth Modu | auf Bestellung 1148 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM13S32F512GA-V2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 18dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V2R | Silicon Labs | Bluetooth Modules (802.15.1) EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V2TR | Silicon Laboratories | BGM13S32F512GA-V2TR | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V3 | SILICON LABS | Description: SILICON LABS - BGM13S32F512GA-V3 - Bluetooth-Modul, BLE 5.0, 2MB/s, 1.8V bis 3.8V, -90.2dBm, -40°C bis 85°C tariffCode: 84733020 productTraceability: No rohsCompliant: YES Versorgungsspannung, min.: 1.8V euEccn: NLR hazardous: false rohsPhthalatesCompliant: TBA Übertragungsrate: 2Mbps usEccn: 5A992.c Empfangsempfindlichkeit: -90.2dBm | auf Bestellung 435 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13S32F512GA-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 90 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S32F512GA-V3 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 19dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 9.4mA ~ 11.5mA Current - Transmitting: 8.9mA ~ 122.7mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, I2S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 4862 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13S32F512GA-V3 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 6013 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13S32F512GA-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 16000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S32F512GA-V3R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 18dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GA-V3R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna | auf Bestellung 1747 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13S32F512GA-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | auf Bestellung 16000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM13S32F512GA-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S32F512GN Bluetooth Module Bluetooth 5 LE, Bluetooth 5.1 Angle of Arrival (AoA) and Angle of De | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2 | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2 | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2 | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tray Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 18dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2R | Silicon Laboratories | EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2R | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -90.2dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 18dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V2R | Silicon Labs | Bluetooth Modules (802.15.1) EFR32BG13 Bluetooth 5.0 SiP Module, 512kB Flash, +18dbm, External Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V3 | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tray Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 18dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 3120 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM13S32F512GN-V3 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin | auf Bestellung 1443 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM13S32F512GN-V3 | SILICON LABS | Description: SILICON LABS - BGM13S32F512GN-V3 - Bluetooth-Modul, BLE 5.0, 2Mbit/s, -90.2dBm, 1.8 bis 3.8V Versorgungsspannung, -40°C bis 85°C tariffCode: 85176200 Empfangsempfindlichkeit: -90.2dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.0 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: PW Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (14-Jun-2023) | auf Bestellung 1300 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM13S32F512GN-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V3 | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V3R | Silicon Laboratories | SiP module solution for Bluetooth 5 connectivity | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V3R | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tape & Reel (TR) Package / Case: 51-SMD Module Sensitivity: -102.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 18dBm Data Rate: 2Mbps Protocol: Bluetooth v5.0 Current - Receiving: 10.5mA Current - Transmitting: 8.9mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG13 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, I²S, IrDA, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM13S32F512GN-V3R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, RF Pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM14HBA12E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1500 | Schneider Electric | Schneider Electric APC Gaming Back-UPS, 10 outlet, 1500VA, Pure Sinewave, 120V | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM1500B | Schneider Electric | Schneider Electric APC Gaming Back-UPS, 10 outlet, 1500VA, Pure Sinewave, 120V, Black | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15HA12E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | auf Bestellung 145 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM15HA12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 2.3GHZ-2.7GHZ 12ATSLP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15HA12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 2.3GHZ-2.7GHZ 12ATSLP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15LA12E6327XTSA1 | Infineon Technologies | Multiplexer 12-Pin ATSLP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15LA12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 700MHZ-1GHZ 12ATSLP Packaging: Cut Tape (CT) Package / Case: 12-UFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 700MHz ~ 1GHz RF Type: LTE, W-CDMA Voltage - Supply: 2.2V ~ 3.3V Gain: 17.3dB Current - Supply: 4.9mA Noise Figure: 1.1dB P1dB: -8dBm Test Frequency: 925MHz ~ 960MHz Supplier Device Package: ATSLP-12-3 Part Status: Last Time Buy | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15LA12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 700MHZ-1GHZ 12ATSLP Packaging: Tape & Reel (TR) Package / Case: 12-UFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 700MHz ~ 1GHz RF Type: LTE, W-CDMA Voltage - Supply: 2.2V ~ 3.3V Gain: 17.3dB Current - Supply: 4.9mA Noise Figure: 1.1dB P1dB: -8dBm Test Frequency: 925MHz ~ 960MHz Supplier Device Package: ATSLP-12-3 Part Status: Last Time Buy | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15LA12E6327XTSA1 | Infineon Technologies | Multiplexer 12-Pin ATSLP EP T/R | auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM15LA12E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | auf Bestellung 4160 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM15LBA12E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15LBA12E6327XTSA1 | Infineon Technologies | BGM15LBA12E6327XTSA1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15LBA12E6327XTSA1 | Infineon Technologies | Description: RX TXRX MODULE BLUETOOTH SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15MA12E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | auf Bestellung 4648 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM15MA12E6327XTSA1 | Infineon Technologies | Multiplexer 12-Pin ATSLP EP T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15MA12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 1.7GHZ-2.2GHZ 12ATSLP Packaging: Bulk Package / Case: 12-UFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.7GHz ~ 2.2GHz RF Type: LTE, W-CDMA Voltage - Supply: 2.2V ~ 3.3V Gain: 17dB Current - Supply: 4.9mA Noise Figure: 1.8dB P1dB: -8dBm Test Frequency: 2.11GHz ~ 2.17GHz Supplier Device Package: ATSLP-12-3 Part Status: Obsolete | auf Bestellung 252000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM15MA12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 1.7GHZ-2.2GHZ 12ATSLP Packaging: Cut Tape (CT) Package / Case: 12-UFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.7GHz ~ 2.2GHz RF Type: LTE, W-CDMA Voltage - Supply: 2.2V ~ 3.3V Gain: 17dB Current - Supply: 4.9mA Noise Figure: 1.8dB P1dB: -8dBm Test Frequency: 2.11GHz ~ 2.17GHz Supplier Device Package: ATSLP-12-3 Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM15MA12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 1.7GHZ-2.2GHZ 12ATSLP Packaging: Tape & Reel (TR) Package / Case: 12-UFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.7GHz ~ 2.2GHz RF Type: LTE, W-CDMA Voltage - Supply: 2.2V ~ 3.3V Gain: 17dB Current - Supply: 4.9mA Noise Figure: 1.8dB P1dB: -8dBm Test Frequency: 2.11GHz ~ 2.17GHz Supplier Device Package: ATSLP-12-3 Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM17LBA15E6327XTSA1 | Infineon Technologies | Description: MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM17LBA15E6327XTSA1 | Infineon Technologies | RF Amplifier MULTI CHIP MODULES | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM17LBA15E6327XTSA1 | Infineon Technologies | BGM17LBA15E6327XTSA1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210L022JIF2 | Silicon Labs | Description: RF TXRX MODULE BT PCB TRACE SMD Packaging: Strip Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210L022JIF2R | Silicon Labs | Description: RF TXRX MODULE BT PCB TRACE SMD Packaging: Tape & Reel (TR) Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210L022JNF2 | Silicon Laboratories | Blue Gecko Bluetooth Lighting Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210L022JNF2 | Silicon Labs | Description: RX TXRX MODULE BT PCB TRC SMD | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210L022JNF2R | Silicon Labs | Description: RF TXRX MODULE BT PCB TRC SMD Packaging: Cut Tape (CT) Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210L022JNF2R | Silicon Labs | Description: RF TXRX MODULE BT PCB TRC SMD Packaging: Tape & Reel (TR) Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART Part Status: Active | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210LA22JIF2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna | auf Bestellung 41 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210LA22JIF2 | SILICON LABS | Description: SILICON LABS - BGM210LA22JIF2 - Bluetooth-Modul, BLE 5.1, 2MB/s, 1.8V bis 3.8V, -93.9dBm, -40°C bis 125°C tariffCode: 84733020 Empfangsempfindlichkeit: -93.9dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210LA22JIF2 | Silicon Labs | Description: BGM210L WIRELESS GECKO BLUETOOTH Packaging: Strip Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART | auf Bestellung 98 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210LA22JIF2 | SILICON LABS | Description: SILICON LABS - BGM210LA22JIF2 - Bluetooth-Modul, BLE 5.1, 2MB/s, 1.8V bis 3.8V, -93.9dBm, -40°C bis 125°C tariffCode: 84733020 Empfangsempfindlichkeit: -93.9dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 1 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210LA22JIF2R | Silicon Laboratories | BGM210L Blue Gecko Lighting module, +12 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, PCB trace antenna, Certified, Reel | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210LA22JIF2R | Silicon Labs | Description: BGM210L WIRELESS GECKO BLUETOOTH Packaging: Tape & Reel (TR) Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: 2GFSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, JTAG, PWM, SPI, UART, USART | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210LA22JIF2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210LA22JNF2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, Built-in Antenna | auf Bestellung 398 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210LA22JNF2 | Silicon Labs | Description: BGM210L WIRELESS GECKO BLUETOOTH Packaging: Strip Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART | auf Bestellung 100 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210LA22JNF2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, Built-in Antenna | auf Bestellung 1047 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210LA22JNF2R | Silicon Labs | Description: BGM210L WIRELESS GECKO BLUETOOTH Packaging: Cut Tape (CT) Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART | auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210LA22JNF2R | Silicon Labs | Description: BGM210L WIRELESS GECKO BLUETOOTH Packaging: Tape & Reel (TR) Package / Case: 18-SMD Module Sensitivity: -104.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 12.5dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 70mA Antenna Type: PCB Trace Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART | auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210LA22JNF2R | Silicon Laboratories | BGM210L Blue Gecko Lighting module, +12 dBm, 2.4 GHz, 1024 kB Flash, -40 to 105 C, PCB trace antenna, Certified, Reel | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P022JIA2 | Silicon Laboratories | BGM210P Blue Gecko module, +10 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P022JIA2 | Silicon Laboratories | BGM210P Blue Gecko module, +10 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | auf Bestellung 90 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM210P022JIA2 | Silicon Labs | Bluetooth Modules (802.15.1) Blue Gecko PCB module, +10 dBm, 2.4 GHz, 1 MB, Flash, -40 to 125 C, built-in antenna, certified. | auf Bestellung 219 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM210P022JIA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P022JIA2R | Silicon Labs | Bluetooth Modules (802.15.1) Blue Gecko PCB module, +10 dBm, 2.4 GHz, 1 MB, Flash, -40 to 125 C, built-in antenna, certified. | auf Bestellung 2918 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM210P022JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 16.1mA ~ 34.1mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P022JIA2R | Silicon Laboratories | BGM210P Blue Gecko module, +10 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P022JIA2R | Silicon Laboratories | BGM210P Blue Gecko module, +10 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P022JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 16.1mA ~ 34.1mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P022JIA2R | Silicon Laboratories | BGM210P Blue Gecko module, +10 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2 | Silicon Laboratories | BGM210P Blue Gecko module, +20 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2 | Silicon Laboratories | BGM210P Blue Gecko module, +20 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2 | Silicon Labs | Bluetooth Modules (802.15.1) Blue Gecko PCB module, +20 dBm, 2.4 GHz, 1 MB, Flash, -40 to 125 C, built-in antenna, certified. | auf Bestellung 200 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM210P032JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2R | Silicon Laboratories | BGM210P Blue Gecko module, +20 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2R | Silicon Labs | Bluetooth Modules (802.15.1) Blue Gecko PCB module, +20 dBm, 2.4 GHz, 1 MB, Flash, -40 to 125 C, built-in antenna, certified. | auf Bestellung 2139 Stücke: Lieferzeit 14-28 Tag (e) | |||||||||||||||||
| BGM210P032JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.1 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2R | Silicon Laboratories | BGM210P Blue Gecko module, +20 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210P032JIA2R | Silicon Laboratories | BGM210P Blue Gecko module, +20 dBm, 2.4 GHz, 1024 kB Flash, -40 to 125 C, Chip antenna or RF pin | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PA22JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PA22JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, 1.71V bis 3.8V, -94.1dBm, -40°C bis 125°C tariffCode: 84733020 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: Klasse 3 usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 504 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PA22JIA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 16.1mA ~ 34.1mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 7493 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210PA22JIA2 | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 2700 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PA22JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PA22JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, 1.71V bis 3.8V, -94.1dBm, -40°C bis 125°C tariffCode: 84733020 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: Klasse 3 usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 504 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PA22JIA2 | Silicon Laboratories | Blue Gecko Bluetooth Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PA22JIA2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in A | auf Bestellung 2764 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210PA22JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 1000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM210PA22JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 1000 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PA22JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 4283 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM210PA22JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 4283 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM210PA22JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 1000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM210PA22JIA2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in A | auf Bestellung 24927 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210PA22JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 1000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM210PA22JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | auf Bestellung 14000 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGM210PA22JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 16.1mA ~ 34.1mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210PA32JIA2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin | auf Bestellung 3201 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210PA32JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PA32JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, 1.71V bis 3.8V, -94.1dBm, -40°C bis 125°C tariffCode: 84733020 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: Klasse 3 usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 85 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PA32JIA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1077 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210PA32JIA2 | Silicon Laboratories | Blue Gecko Bluetooth Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PA32JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PA32JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, 1.71V bis 3.8V, -94.1dBm, -40°C bis 125°C tariffCode: 84733020 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: Klasse 3 usEccn: 5A992.c Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 85 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PA32JIA2 | Silicon Laboratories | Blue Gecko Bluetooth Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PA32JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PA32JIA2R | Silicon Laboratories | Blue Gecko Bluetooth Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PA32JIA2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin | auf Bestellung 2871 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210PA32JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PB22JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PB22JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, -94.1dBm, 1.71V bis 3.8V, -40°C bis 125°C tariffCode: 85176200 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: -m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 3763 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PB22JIA2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin | auf Bestellung 2350 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210PB22JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PB22JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, -94.1dBm, 1.71V bis 3.8V, -40°C bis 125°C tariffCode: 85176200 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: -m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 3763 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PB22JIA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 16.1mA ~ 34.1mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 19016 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210PB22JIA2 | Silicon Laboratories | Bluetooth v5.1 (BLE) SMART SOC 2Mbps 3V 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PB22JIA2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PB22JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 16.1mA ~ 34.1mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 3000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210PB22JIA2R | Silicon Laboratories | Bluetooth v5.1 (BLE) SMART SOC 2Mbps 3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PB22JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 16.1mA ~ 34.1mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 4575 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210PB32JIA2 | Silicon Laboratories | Bluetooth v5.1 (BLE) SMART SOC 2Mbps 3V 31-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PB32JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PB32JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, -94.1dBm, 1.71V bis 3.8V, -40°C bis 125°C tariffCode: 85176200 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: -m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 446 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PB32JIA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | auf Bestellung 102 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM210PB32JIA2 | SILICON LABS | Description: SILICON LABS - BGM210PB32JIA2 - Bluetooth-Modul, BLE 5.1, 2MB/s, -94.1dBm, 1.71V bis 3.8V, -40°C bis 125°C tariffCode: 85176200 Empfangsempfindlichkeit: -94.1dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.1 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: -m Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.71V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 125°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 446 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM210PB32JIA2 | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin | auf Bestellung 836 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210PB32JIA2R | Silicon Laboratories | Bluetooth v5.1 (BLE) SMART SOC 2Mbps 3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PB32JIA2R | Silicon Labs | Bluetooth Modules - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin | auf Bestellung 9000 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM210PB32JIA2R | Silicon Laboratories | Bluetooth v5.1 (BLE) SMART SOC 2Mbps 3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM210PB32JIA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -104.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 1MB Flash, 96kB RAM Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 9.1mA ~ 9.9mA Current - Transmitting: 59.7mA ~ 173mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG21 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220-EK4314A | Silicon Laboratories | BGM220 Bluetooth Explorer Kit | auf Bestellung 7 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220-EK4314A | Silicon Labs | Description: BGM220 EXPLORER KIT Packaging: Box For Use With/Related Products: BGM220P, EFR32BG22 Frequency: 2.4GHz Supplied Contents: Board(s) Part Status: Active | auf Bestellung 69 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220-EK4314A | Silicon Laboratories | BGM220 Bluetooth Module Explorer Kit | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220-EK4314A Produktcode: 184268 | Modulare Elemente > Programmierer und Debugging-Tools | Produkt ist nicht verfügbar | ||||||||||||||||||
| BGM220-EK4314A | SILICON LABS | Description: SILICON LABS - BGM220-EK4314A - Evaluationskit, BGM220PC22HNA, drahtlose Datenübertragung, Bluetooth Low Energy, SoC tariffCode: 84733020 Prozessorkern: BGM220PC22HNA Kit-Anwendungsbereich: Drahtlose Kommunikation productTraceability: No rohsCompliant: YES Prozessorhersteller: Silicon Laboratories Lieferumfang des Kits: Explorer-Kit BGM220PC22HNA Wireless Gecko-Modul, USB-Kabel euEccn: NLR Unterart Anwendung: Bluetooth Low Energy, SoC hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: Multicomp Pro RJ45 Adapter SVHC: No SVHC (25-Jun-2020) | auf Bestellung 937 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220-EK4314A | Silicon Labs | Bluetooth Development Tools - 802.15.1 BGM220 Explorer Kit | auf Bestellung 1631 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220PC22HNA2 | SILICON LABS | Description: SILICON LABS - BGM220PC22HNA2 - Bluetooth-Modul, BLE 5.2, 2MB/s, -98.6dBm, 1.8V bis 3.8V Versorgungsspannung, -40°C bis 105°C tariffCode: 85176200 Empfangsempfindlichkeit: -98.6dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.2 Bluetooth-Klasse: - usEccn: EAR99 Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Multicomp Pro RJ45 Adapter productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 193 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220PC22HNA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -98.9dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 32kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 426 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220PC22HNA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module Coil Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220PC22HNA2 Produktcode: 184127 | IC > IC andere | Produkt ist nicht verfügbar | ||||||||||||||||||
| BGM220PC22HNA2 | SILICON LABS | Description: SILICON LABS - BGM220PC22HNA2 - Bluetooth-Modul, BLE 5.2, 2MB/s, -98.6dBm, 1.8V bis 3.8V Versorgungsspannung, -40°C bis 105°C tariffCode: 85176200 Empfangsempfindlichkeit: -98.6dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.2 Bluetooth-Klasse: - usEccn: EAR99 Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Multicomp Pro RJ45 Adapter productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 193 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220PC22HNA2 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna, 24 GPIO, 105C | auf Bestellung 3212 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220PC22HNA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module Coil Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220PC22HNA2R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna, 24 GPIO, 105C | auf Bestellung 7915 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220PC22HNA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 31-SMD Module Sensitivity: -98.9dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 32kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 23896 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220PC22HNA2R | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module T/R | auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220PC22HNA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -98.9dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 32kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 23000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220PC22HNA2R | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220PC22WGA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module Coil Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220PC22WGA2 | SILICON LABS | Description: SILICON LABS - BGM220PC22WGA2 - Bluetooth-Modul, BLE 5.2, 2MB/s, -98.6dBm, 1.8V bis 3.8V Versorgungsspannung, -40°C bis 85°C tariffCode: 85176200 Empfangsempfindlichkeit: -98.6dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.2 Bluetooth-Klasse: - usEccn: EAR99 Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 525 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220PC22WGA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module Coil Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220PC22WGA2 | SILICON LABS | Description: SILICON LABS - BGM220PC22WGA2 - Bluetooth-Modul, BLE 5.2, 2MB/s, -98.6dBm, 1.8V bis 3.8V Versorgungsspannung, -40°C bis 85°C tariffCode: 85176200 Empfangsempfindlichkeit: -98.6dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.2 Bluetooth-Klasse: - usEccn: EAR99 Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 525 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220PC22WGA2 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 8dB, PL | auf Bestellung 1194 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220PC22WGA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Strip Package / Case: 31-SMD Module Sensitivity: -98.9dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 403 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220PC22WGA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 31-SMD Module Sensitivity: -98.9dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 457 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220PC22WGA2R | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220PC22WGA2R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 8dB, PL | auf Bestellung 13587 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220PC22WGA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -98.9dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220PC22WGA2R | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 31-Pin SMD Module T/R | auf Bestellung 2000 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC12WGA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220SC12WGA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 31-SMD Module Sensitivity: -98.6dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 0dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 774 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220SC12WGA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V Tray | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220SC12WGA2 | SILICON LABS | Description: SILICON LABS - BGM220SC12WGA2 - Bluetooth-Modul, BLE 5.2, 2MB/s, -98.6dBm, 1.8V bis 3.8V Versorgungsspannung, -40°C bis 85°C tariffCode: 85176200 Empfangsempfindlichkeit: -98.6dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.2 Bluetooth-Klasse: - usEccn: EAR99 Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Multicomp Pro RJ45 Adapter productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 1369 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC12WGA2 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 38.4 MHz, 6 dBm, PLFRCO, 352kB, 32kB(RAM), Built-in antenna/RF pin, 24 GPIO, 85C | auf Bestellung 1625 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220SC12WGA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 31-SMD Module Sensitivity: -98.6dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 0dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 12500 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220SC12WGA2R | Silicon Laboratories | BGM220SC12WGA2R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220SC12WGA2R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 38.4 MHz, 6 dBm, PLFRCO, 352kB, 32kB(RAM), Built-in antenna/RF pin, 24 GPIO, 85C | auf Bestellung 39916 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220SC12WGA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 31-SMD Module Sensitivity: -98.6dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 0dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.3mA ~ 4.8mA Current - Transmitting: 4.8mA ~ 10.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 13736 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220SC12WGA2R | Silicon Laboratories | Wireless Bluetooth Sip Module, Secure Boot W Root Of Trust And Secure Loader, 38.4 MHz, 6 dBm | auf Bestellung 5000 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC22HNA2 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna/RF Pin, 24 GPIO, 105C | auf Bestellung 2970 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220SC22HNA2 | SILICON LABS | Description: SILICON LABS - BGM220SC22HNA2 - Bluetooth-Modul, V5.2, 2MB/s, -98.6dBm, 1.8V bis 3.8V, -40°C bis 105°C tariffCode: 85176200 Empfangsempfindlichkeit: -98.6dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.2 Bluetooth-Klasse: - usEccn: EAR99 Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Multicomp Pro RJ45 Adapter productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 366 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC22HNA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 44-SMD Module Sensitivity: -106.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 32kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 6dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.2mA ~ 4.8mA Current - Transmitting: 4.6mA ~ 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1505 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220SC22HNA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 44-Pin LGA Tray | auf Bestellung 75 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC22HNA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 44-SMD Module Sensitivity: -106.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 32kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 6dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.2mA ~ 4.8mA Current - Transmitting: 4.6mA ~ 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM220SC22HNA2R | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 44-Pin LGA T/R | auf Bestellung 7490 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC22HNA2R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna/RF Pin, 24 GPIO, 105C | auf Bestellung 12878 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220SC22HNA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 44-SMD Module Sensitivity: -106.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 512kB Flash, 32kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 6dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.2mA ~ 4.8mA Current - Transmitting: 4.6mA ~ 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 3780 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220SC22WGA2 | SILICON LABS | Description: SILICON LABS - BGM220SC22WGA2 - Bluetooth-Modul, V5.2, 2MB/s, -98.6dBm, 1.8V bis 3.8V, -40°C bis 85°C tariffCode: 85176200 Empfangsempfindlichkeit: -98.6dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: TBA Bluetooth-Version: Bluetooth LE 5.2 Bluetooth-Klasse: - usEccn: EAR99 Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps productTraceability: Yes-Date/Lot Code Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 85°C SVHC: No SVHC (25-Jun-2020) | auf Bestellung 806 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC22WGA2 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 6dBm, PL | auf Bestellung 9540 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220SC22WGA2 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tray Package / Case: 44-SMD Module Sensitivity: -106.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 6dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.2mA ~ 4.8mA Current - Transmitting: 4.6mA ~ 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 3940 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220SC22WGA2 | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 44-Pin LGA Tray | auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC22WGA2R | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 44-Pin LGA T/R | auf Bestellung 5000 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM220SC22WGA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 44-SMD Module Sensitivity: -106.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 6dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.2mA ~ 4.8mA Current - Transmitting: 4.6mA ~ 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 5000 Stücke: Lieferzeit 21-28 Tag (e) | |||||||||||||||||
| BGM220SC22WGA2R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 6dBm, PL | auf Bestellung 67575 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM220SC22WGA2R | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 44-SMD Module Sensitivity: -106.4dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.4835GHz Memory Size: 352kB Flash, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 6dBm Data Rate: 2Mbps Protocol: Bluetooth v5.2 Current - Receiving: 4.2mA ~ 4.8mA Current - Transmitting: 4.6mA ~ 8.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG22 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 5000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM220SC22WGA2R | Silicon Laboratories | Bluetooth v5.2 (BLE) SMART SOC IoT 2Mbps 3V 44-Pin LGA T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PA22VNA3 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.4 Current - Receiving: 4.5mA ~ 5.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified Sensitivity: -106.5dBm Current - Transmitting: 4.8mA ~ 154.8mA | auf Bestellung 28 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240PA22VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PA22VNA3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 10dBm Leistung, Sicherheit Vault Mid, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 140 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PA22VNA3 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dB | auf Bestellung 129 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PA22VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PA22VNA3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 10dBm Leistung, Sicherheit Vault Mid, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C | auf Bestellung 140 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PA22VNA3 | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PA22VNA3R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm, | auf Bestellung 2541 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PA22VNA3R | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PA32VNA3 | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PA32VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PA32VNA3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault Mid, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 186 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PA32VNA3 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dBm, | auf Bestellung 334 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PA32VNA3 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 4.5mA ~ 5.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified Sensitivity: -106.5dBm Current - Transmitting: 4.8mA ~ 154.8mA | auf Bestellung 84 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240PA32VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PA32VNA3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault Mid, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C | auf Bestellung 186 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PA32VNA3R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dBm, | auf Bestellung 5785 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PA32VNA3R | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PA32VNN3 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Sensitivity: -106.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 4.5mA ~ 5.2mA Current - Transmitting: 4.8mA ~ 154.8mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART DigiKey Programmable: Not Verified | auf Bestellung 80 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240PA32VNN3 | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PA32VNN3 | SILICON LABS | Description: SILICON LABS - BGM240PA32VNN3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault Mid, HF-Pin-Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C | auf Bestellung 195 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PA32VNN3 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dBm, | auf Bestellung 123 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PA32VNN3 | SILICON LABS | Description: SILICON LABS - BGM240PA32VNN3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault Mid, HF-Pin-Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 195 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PA32VNN3R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dBm, | auf Bestellung 2671 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PA32VNN3R | Silicon Labs | Description: RF TXRX MODULE BT PCB SECURE VA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PA32VNN3R | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PB22VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PB22VNA3 - Bluetooth-Modul BLE 5.3, 2MB/s, -95.7dBm, 10dBm Leistung, Sicherheit Vault High, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C | auf Bestellung 199 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PB22VNA3 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.4 Current - Receiving: 4.5mA ~ 5.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified Sensitivity: -106.5dBm Current - Transmitting: 4.8mA ~ 154.8mA | auf Bestellung 8 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240PB22VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PB22VNA3 - Bluetooth-Modul BLE 5.3, 2MB/s, -95.7dBm, 10dBm Leistung, Sicherheit Vault High, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 199 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PB22VNA3 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dB | auf Bestellung 109 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PB22VNA3R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm, | auf Bestellung 1956 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PB32VNA3 | Silicon Labs | Description: RF TXRX MODULE BT CHIP SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 4.5mA ~ 5.2mA Antenna Type: Integrated, Chip Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I²C, I²S, IrDA, JTAG, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified Sensitivity: -106.5dBm Current - Transmitting: 4.8mA ~ 154.8mA | auf Bestellung 102 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240PB32VNA3 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dBm, | auf Bestellung 349 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PB32VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PB32VNA3 - Bluetooth-Modul BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault High, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 213 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PB32VNA3 | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PB32VNA3 | SILICON LABS | Description: SILICON LABS - BGM240PB32VNA3 - Bluetooth-Modul BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault High, integrierte Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 213 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PB32VNA3R | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PB32VNA3R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dBm, | auf Bestellung 1000 Stücke: Lieferzeit 98-112 Tag (e) |
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| BGM240PB32VNN3 | SILICON LABS | Description: SILICON LABS - BGM240PB32VNN3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault High, HF-Pin-Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C | auf Bestellung 247 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PB32VNN3 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dB | auf Bestellung 144 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240PB32VNN3 | SILICON LABS | Description: SILICON LABS - BGM240PB32VNN3 - Bluetooth-Modul, BLE 5.3, 2MB/s, -95.7dBm, 20dBm Leistung, Sicherheit Vault High, HF-Pin-Antenne tariffCode: 85176200 Empfangsempfindlichkeit: -95.7dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: Wireless Gecko BGM240P Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 247 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240PB32VNN3 | Silicon Labs | Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Cut Tape (CT) Package / Case: 36-SMD Module Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 20dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 4.5mA ~ 5.2mA Antenna Type: Antenna Not Included Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I²C, I²S, IrDA, JTAG, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified Sensitivity: -106.5dBm Current - Transmitting: 4.8mA ~ 154.8mA | auf Bestellung 98 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240PB32VNN3 | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module Cut Tape | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PB32VNN3R | Silicon Labs | Description: RF TXRX MODULE BT PCB SECURE VA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PB32VNN3R | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 36-Pin SMD Module T/R | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240PB32VNN3R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth PCB module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 20 dBm, | auf Bestellung 1935 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240SA22VNA2 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm | auf Bestellung 6168 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240SA22VNA2 | SILICON LABS | Description: SILICON LABS - BGM240SA22VNA2 - Bluetooth-Modul, BLE 5.3, 2MB/s, -94.3dBm, 1.8V bis 3.8V Versorgungsspannung, -40°C bis 105°C tariffCode: 85256000 Empfangsempfindlichkeit: -94.3dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: BGM240S Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 1149 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240SA22VNA2 | Silicon Labs | Description: RF TXRX MODULE BT INT CHIP SMD Packaging: Tray Package / Case: 48-LFQFN Module, Exposed Pad Sensitivity: -105.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 5mA ~ 5.8mA Current - Transmitting: 23.4mA Antenna Type: Antenna Not Included, Integrated, Chip Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART DigiKey Programmable: Not Verified | auf Bestellung 1641 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240SA22VNA2R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dB | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM240SA22VNA2R | Silicon Laboratories | Bluetooth v5.3 (BLE) SMART SOC Class I/Class II/Class III IoT 2Mbps 3V 52-Pin QFN T/R | auf Bestellung 2500 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240SB22VNA2 | SILICON LABS | Description: SILICON LABS - BGM240SB22VNA2 - Bluetooth-Modul, BLE 5.3, 2MB/s, -94.3dBm, 1.8V bis 3.8V Versorgungsspannung, -40°C bis 105°C tariffCode: 85256000 Empfangsempfindlichkeit: -94.3dBm rohsCompliant: YES hazardous: false rohsPhthalatesCompliant: YES Bluetooth-Version: Bluetooth LE 5.3 Bluetooth-Klasse: - usEccn: 5A992.c Signalbereich, max.: - Betriebstemperatur, min.: -40°C Versorgungsspannung, min.: 1.8V euEccn: NLR Übertragungsrate: 2Mbps Produktpalette: BGM240S Series productTraceability: No Versorgungsspannung, max.: 3.8V Betriebstemperatur, max.: 105°C SVHC: No SVHC (10-Jun-2022) | auf Bestellung 984 Stücke: Lieferzeit 14-21 Tag (e) | |||||||||||||||||
| BGM240SB22VNA2 | Silicon Labs | Description: RF TXRX MODULE BT INT CHIP SMD Packaging: Tray Package / Case: 48-LFQFN Module, Exposed Pad Sensitivity: -105.1dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1.5MB Flash, 256kB RAM Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.8V Power - Output: 10dBm Data Rate: 2Mbps Protocol: Bluetooth v5.3 Current - Receiving: 5mA ~ 5.8mA Current - Transmitting: 23.4mA Antenna Type: Antenna Not Included, Integrated, Chip Utilized IC / Part: EFR32BG24 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART Part Status: Active DigiKey Programmable: Not Verified | auf Bestellung 1281 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM240SB22VNA2 | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm | auf Bestellung 4953 Stücke: Lieferzeit 14-28 Tag (e) |
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| BGM240SB22VNA2R | Silicon Labs | Bluetooth Modules - 802.15.1 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dB | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM6350HKPB | 07+ | auf Bestellung 75 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||||
| BGM681L11 E6327 | Infineon | auf Bestellung 1197 Stücke: Lieferzeit 21-28 Tag (e) | ||||||||||||||||||
| BGM681L11E6327XT | Infineon Technologies | Description: IC GPS FRONT-END 3.6V TSLP11-1 Packaging: Cut Tape (CT) Package / Case: 10-UFDFN Exposed Pad Frequency: 1575MHz RF Type: GPS Supplier Device Package: PG-TSLP-11-1 | auf Bestellung 9744 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM681L11E6327XT | Infineon Technologies | Description: IC GPS FRONT-END 3.6V TSLP11-1 Packaging: Tape & Reel (TR) Package / Case: 10-UFDFN Exposed Pad Frequency: 1575MHz RF Type: GPS Supplier Device Package: PG-TSLP-11-1 | auf Bestellung 5000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM687U50E6327XUMA1 | Infineon Technologies | LNA Bank with OutputCross-Switch for 5G | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM781N11E6327XUSA1 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-11-2 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM781N11E6327XUSA1 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-11-2 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM781N11E6327XUSA1 | Infineon Technologies | Description: MODULE GPS FRONT-END TSNP-11-2 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM781N11_BOARD | Infineon Technologies | GPS Front-End Module | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7LLHM4L12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 700MHZ-2.7GHZ TSLP12 Packaging: Bulk Package / Case: 12-XFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 700MHz ~ 2.7GHz RF Type: LTE Voltage - Supply: 1.5V ~ 3.3V Gain: 13dB Current - Supply: 4.5mA Supplier Device Package: TSLP-12-4 Part Status: Obsolete | auf Bestellung 682500 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM7LLHM4L12E6327XTSA1 | Infineon Technologies | Low Noise Amplifier | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7LLHM4L12E6327XTSA1 | Infineon Technologies | RF Amplifier RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7LLHM4L12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 700MHZ-2.7GHZ TSLP12 Packaging: Tape & Reel (TR) Package / Case: 12-XFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 700MHz ~ 2.7GHz RF Type: LTE Voltage - Supply: 1.5V ~ 3.3V Gain: 13dB Current - Supply: 4.5mA Supplier Device Package: TSLP-12-4 Part Status: Obsolete | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7LLMM4L12E6327XTSA1 | Infineon Technologies | Description: IC AMP MMIC 12ATSLP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7LLMM4L12E6327XTSA1 | Infineon Technologies | RF Amplifier RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7LMHM4L12E6327XTSA1 | Infineon Technologies | RF Amplifier RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7LMHM4L12E6327XTSA1 | Infineon Technologies | Description: IC AMP LTE 700MHZ-2.7GHZ TSLP12 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7MHLL4L12E6327XTSA1 | Infineon Technologies | BGM7MHLL4L12E6327XTSA1 | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7MHLL4L12E6327XTSA1 | Infineon Technologies | Description: IC RF AMP MMIC 12ATSLP Packaging: Tape & Reel (TR) | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7MHLL4L12E6327XTSA1 | Infineon Technologies | RF Amplifier RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7MHLL4L12E6327XTSA1 | Infineon Technologies | Description: IC RF AMP MMIC 12ATSLP Packaging: Bulk | auf Bestellung 112500 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM7MLLM4L12E6327XTSA1 | Infineon Technologies | RF Amplifier RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7MLLM4L12E6327XTSA1 | Infineon Technologies | Description: RF MMIC SUB 3 GHZ | auf Bestellung 105000 Stücke: Lieferzeit 21-28 Tag (e) |
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| BGM7MMLL4L12E6327XTSA1 | Infineon Technologies | Description: IC AMP MMIC 12ATSLP | Produkt ist nicht verfügbar | |||||||||||||||||
| BGM7MMLL4L12E6327XTSA1 | Infineon Technologies | RF Amplifier RF SILICON MMIC | Produkt ist nicht verfügbar | |||||||||||||||||
| BGMC1210E6327XUMA1 | Infineon Technologies | RF Switch ICs | auf Bestellung 5000 Stücke: Lieferzeit 379-393 Tag (e) |
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| BGMC1210E6327XUMA1 | Infineon Technologies | Description: WIRELESS INFRASTRUCTURE Packaging: Tape & Reel (TR) | Produkt ist nicht verfügbar | |||||||||||||||||
| BGMHA | VENTION | Category: USB cables and adapters Description: Cable; Jack 3.5mm socket,USB C plug; nickel plated; 0.1m; 29AWG Type of connection cable: Jack - USB Cable/adapter structure: Jack 3.5mm socket; USB C plug Contact plating: nickel plated Cable length: 0.1m Core diameter: 29AWG Anzahl je Verpackung: 1 Stücke | auf Bestellung 32 Stücke: Lieferzeit 7-14 Tag (e) |
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| BGMHA | VENTION | Category: USB cables and adapters Description: Cable; Jack 3.5mm socket,USB C plug; nickel plated; 0.1m; 29AWG Type of connection cable: Jack - USB Cable/adapter structure: Jack 3.5mm socket; USB C plug Contact plating: nickel plated Cable length: 0.1m Core diameter: 29AWG | auf Bestellung 32 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGMHF | VENTION | Category: USB cables and adapters Description: Cable; Jack 3.5mm socket,USB C plug; nickel plated; 1m; 29AWG Type of connection cable: Jack - USB Cable/adapter structure: Jack 3.5mm socket; USB C plug Contact plating: nickel plated Cable length: 1m Core diameter: 29AWG | auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
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| BGMHF | VENTION | Category: USB cables and adapters Description: Cable; Jack 3.5mm socket,USB C plug; nickel plated; 1m; 29AWG Type of connection cable: Jack - USB Cable/adapter structure: Jack 3.5mm socket; USB C plug Contact plating: nickel plated Cable length: 1m Core diameter: 29AWG Anzahl je Verpackung: 1 Stücke | auf Bestellung 5 Stücke: Lieferzeit 7-14 Tag (e) |
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| BGMSMAI | PCTEL, Inc. | Description: G, 12 FT 58/U, MALE SMA BLACK Packaging: Bulk | Produkt ist nicht verfügbar |