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MMG3H21NT1 MMG3H21NT1 NXP USA Inc. MMG3H21NT1.pdf Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
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MRF6V10010NR4 MRF6V10010NR4 NXP USA Inc. MRF6V10010N.pdf Description: RF MOSFET LDMOS 50V PLD-1.5
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Active
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 25dB
Power - Output: 10W
Frequency: 1.09GHz
Mounting Type: Surface Mount
Package / Case: PLD-1.5
Packaging: Tape & Reel (TR)
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MRF6V2010NBR5 MRF6V2010NBR5 NXP USA Inc. MRF6V2010N.pdf Description: FET RF 110V 220MHZ TO-272-2
Package / Case: TO-272BC
Packaging: Tape & Reel (TR)
Current - Test: 30 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-272-2
Technology: LDMOS
Gain: 23.9dB
Power - Output: 10W
Frequency: 220MHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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MRF6V2300NBR5 MRF6V2300NBR5 NXP USA Inc. MRF6V2300N(B)R1.pdf Description: FET RF 110V 220MHZ TO-272-4
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MRF6VP2600HR5 MRF6VP2600HR5 NXP USA Inc. MRF6VP2600HR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 2.6 A
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 25dB
Power - Output: 125W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34704AEPR2 MC34704AEPR2 NXP USA Inc. MC34704.pdf Description: IC PWR MGMNT DC-DC MULT 56-QFN
Part Status: Obsolete
Supplier Device Package: 56-QFN-EP (7x7)
Current - Supply: 86mA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -20°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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MC34704BEPR2 MC34704BEPR2 NXP USA Inc. MC34704.pdf Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Active
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MC34727AFCR2 MC34727AFCR2 NXP USA Inc. Description: IC REG BUCK 1.2V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.2V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34727BFCR2 MC34727BFCR2 NXP USA Inc. Description: IC REG BUCK 1.8V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMG3014NT1 MMG3014NT1 NXP USA Inc. MMG3014NT1.pdf Description: IC RF AMP 4GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 4GHz
Voltage - Supply: 5V
Gain: 19.5dB
Current - Supply: 135mA
Noise Figure: 5.7dB
P1dB: 25dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
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MMG3H21NT1 MMG3H21NT1 NXP USA Inc. MMG3H21NT1.pdf Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
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MRF1513NT1 MRF1513NT1 NXP USA Inc. MRF1513N.pdf Description: RF MOSFET LDMOS 12.5V PLD-1.5
Packaging: Cut Tape (CT)
Current - Test: 50 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Part Status: Obsolete
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 15dB
Power - Output: 3W
Frequency: 520MHz
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Package / Case: PLD-1.5
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MRF6V10010NR4 MRF6V10010NR4 NXP USA Inc. MRF6V10010N.pdf Description: RF MOSFET LDMOS 50V PLD-1.5
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Active
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 25dB
Power - Output: 10W
Frequency: 1.09GHz
Mounting Type: Surface Mount
Package / Case: PLD-1.5
Packaging: Cut Tape (CT)
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MRF6V2300NBR5 MRF6V2300NBR5 NXP USA Inc. MRF6V2300N(B)R1.pdf Description: FET RF 110V 220MHZ TO-272-4
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MRF6VP2600HR5 MRF6VP2600HR5 NXP USA Inc. MRF6VP2600HR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Package / Case: NI-1230
Packaging: Cut Tape (CT)
Current - Test: 2.6 A
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 25dB
Power - Output: 125W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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MRFE6S9060NR1 MRFE6S9060NR1 NXP USA Inc. MRFE6S9060N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
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MW6S004NT1 MW6S004NT1 NXP USA Inc. MW6S004N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
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MW6S010NR1 MW6S010NR1 NXP USA Inc. MW6S010N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Not For New Designs
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
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CWA-PRO-NL CWA-PRO-NL NXP USA Inc. 950-00074.pdf Description: SOFTWARE TECH SUPPORT BUNDLE
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: 1 Year
License - User Details: Fixed Node
Media Delivery Type: USB Flash Drive
Part Status: Active
Utilized IC / Part: Code Warrior™ Software
Produkt ist nicht verfügbar
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TJA1021T/10/C,118 TJA1021T/10/C,118 NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1021T/10/C,118 TJA1021T/10/C,118 NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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NX3L1G53GT,115 NX3L1G53GT,115 NXP USA Inc. NX3L1G53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
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NX3V1G66GM,115 NX3V1G66GM,115 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3V1T66GM,115 NX3V1T66GM,115 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3V1T66GM,115 NX3V1T66GM,115 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3L1G3157GM,115 NX3L1G3157GM,115 NXP USA Inc. NX3L1G3157.pdf Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
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NX3L2G66GT,115 NX3L2G66GT,115 NXP USA Inc. NX3L2G66.pdf Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
Produkt ist nicht verfügbar
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1322XUSB 1322XUSB NXP USA Inc. MC13224V_Rev1.3.pdf description Description: KIT USB 1322X
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4 (ZigBee®)
Frequency: 2.4GHz
For Use With/Related Products: MC1322x
Packaging: Box
Produkt ist nicht verfügbar
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1322XDSK-DBG 1322XDSK-DBG NXP USA Inc. ZigBee_Tech_Sum_Rev10.pdf description Description: KIT DEVELOPER STARTER 1322X
Utilized IC / Part: MC1322x
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4 (ZigBee®)
Frequency: 2.4GHz
For Use With/Related Products: MC1322x
Packaging: Box
Produkt ist nicht verfügbar
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1322XNSK-DBG 1322XNSK-DBG NXP USA Inc. ZigBee_Tech_Sum_Rev10.pdf Description: KIT NETWORK STARTER 1322X
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DEMO908AP64E DEMO908AP64E NXP USA Inc. Description: MC68HC908AP EVAL BRD
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MMA7331LT MMA7331LT NXP USA Inc. MMA7331L.pdf Description: ACCELEROMETER 4-9G ANALOG 14LGA
Features: Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
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MC9S08DN16ACLF MC9S08DN16ACLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DN16AMLF MC9S08DN16AMLF NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DN32AMLC MC9S08DN32AMLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DV16ACLC MC9S08DV16ACLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DV16ACLF MC9S08DV16ACLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DV32ACLC MC9S08DV32ACLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
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MC9S08DV32ACLF MC9S08DV32ACLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DV32AMLF MC9S08DV32AMLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
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MC9S08DV32AMLH MC9S08DV32AMLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: CANbus, I2C, LINbus, SCI, SPI
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MC9S08DZ16ACLC MC9S08DZ16ACLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DZ16ACLF MC9S08DZ16ACLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC9S08DZ32ACLC MC9S08DZ32ACLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Number of I/O: 25
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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MC9S08DZ32ACLF MC9S08DZ32ACLF NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DZ32AMLH MC9S08DZ32AMLH NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Number of I/O: 53
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC9S08DZ60ACLC MC9S08DZ60ACLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08DZ60ACLF MC9S08DZ60ACLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC9S08DZ60ACLH MC9S08DZ60ACLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Connectivity: CANbus, I2C, LINbus, SCI, SPI
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MC9S08DZ60AMLC MC9S08DZ60AMLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
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MC9S08DZ60AMLF MC9S08DZ60AMLF NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DZ60AMLH MC9S08DZ60AMLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
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IP4281CZ10,115 IP4281CZ10,115 NXP USA Inc. IP4281CZ10.pdf Description: TVS DIODE 8VC 10XSONU
Power Line Protection: Yes
Voltage - Clamping (Max) @ Ipp: 8V (Typ)
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 4
Supplier Device Package: 10-XSONU (2.5x1)
Applications: HDMI
Operating Temperature: -40°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 10-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LM75BD,118 LM75BD,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
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LM75BD,118 LM75BD,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
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LPC2103FHN48,551 LPC2103FHN48,551 NXP USA Inc. LPC2101_02_03.pdf Description: IC MCU 16/32B 32KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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LPC2158FBD100,551 LPC2158FBD100,551 NXP USA Inc. LPC2157_2158.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC3130FET180,551 LPC3130FET180,551 NXP USA Inc. LPC3130_31.pdf Description: IC MCU 16/32BIT ROMLESS 180TFBGA
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P89LPC9321FA,112 P89LPC9321FA,112 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
DigiKey Programmable: Verified
Number of I/O: 26
Supplier Device Package: 28-PLCC (11.48x11.48)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 28-LCC (J-Lead)
Packaging: Tube
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P89LPC9321FDH,518 P89LPC9321FDH,518 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 26
Part Status: Obsolete
Supplier Device Package: 28-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
DigiKey Programmable: Not Verified
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MMG3H21NT1 MMG3H21NT1.pdf
MMG3H21NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
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1000+4.9 EUR
2000+4.72 EUR
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MRF6V10010NR4 MRF6V10010N.pdf
MRF6V10010NR4
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V PLD-1.5
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Active
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 25dB
Power - Output: 10W
Frequency: 1.09GHz
Mounting Type: Surface Mount
Package / Case: PLD-1.5
Packaging: Tape & Reel (TR)
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MRF6V2010NBR5 MRF6V2010N.pdf
MRF6V2010NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-2
Package / Case: TO-272BC
Packaging: Tape & Reel (TR)
Current - Test: 30 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-272-2
Technology: LDMOS
Gain: 23.9dB
Power - Output: 10W
Frequency: 220MHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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MRF6V2300NBR5 MRF6V2300N(B)R1.pdf
MRF6V2300NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
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MRF6VP2600HR5 MRF6VP2600HR6.pdf
MRF6VP2600HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 2.6 A
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 25dB
Power - Output: 125W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34704AEPR2 MC34704.pdf
MC34704AEPR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMNT DC-DC MULT 56-QFN
Part Status: Obsolete
Supplier Device Package: 56-QFN-EP (7x7)
Current - Supply: 86mA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -20°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC34704BEPR2 MC34704.pdf
MC34704BEPR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Active
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2+20 EUR
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25+14.54 EUR
100+13.34 EUR
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MC34727AFCR2
MC34727AFCR2
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.2V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.2V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34727BFCR2
MC34727BFCR2
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.8V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMG3014NT1 MMG3014NT1.pdf
MMG3014NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 4GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 4GHz
Voltage - Supply: 5V
Gain: 19.5dB
Current - Supply: 135mA
Noise Figure: 5.7dB
P1dB: 25dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
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3+8.48 EUR
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MMG3H21NT1 MMG3H21NT1.pdf
MMG3H21NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
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3+7.44 EUR
10+6.43 EUR
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MRF1513NT1 MRF1513N.pdf
MRF1513NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5
Packaging: Cut Tape (CT)
Current - Test: 50 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Part Status: Obsolete
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 15dB
Power - Output: 3W
Frequency: 520MHz
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Package / Case: PLD-1.5
Produkt ist nicht verfügbar
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MRF6V10010NR4 MRF6V10010N.pdf
MRF6V10010NR4
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V PLD-1.5
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Active
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 25dB
Power - Output: 10W
Frequency: 1.09GHz
Mounting Type: Surface Mount
Package / Case: PLD-1.5
Packaging: Cut Tape (CT)
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1+216.9 EUR
10+182.2 EUR
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MRF6V2300NBR5 MRF6V2300N(B)R1.pdf
MRF6V2300NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
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MRF6VP2600HR5 MRF6VP2600HR6.pdf
MRF6VP2600HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Package / Case: NI-1230
Packaging: Cut Tape (CT)
Current - Test: 2.6 A
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 25dB
Power - Output: 125W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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MRFE6S9060NR1 MRFE6S9060N.pdf
MRFE6S9060NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
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10+147.35 EUR
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MW6S004NT1 MW6S004N.pdf
MW6S004NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
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1+45.14 EUR
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MW6S010NR1 MW6S010N.pdf
MW6S010NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Not For New Designs
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
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CWA-PRO-NL 950-00074.pdf
CWA-PRO-NL
Hersteller: NXP USA Inc.
Description: SOFTWARE TECH SUPPORT BUNDLE
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: 1 Year
License - User Details: Fixed Node
Media Delivery Type: USB Flash Drive
Part Status: Active
Utilized IC / Part: Code Warrior™ Software
Produkt ist nicht verfügbar
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TJA1021T/10/C,118 TJA1021.pdf
TJA1021T/10/C,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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2500+1.67 EUR
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TJA1021T/10/C,118 TJA1021.pdf
TJA1021T/10/C,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3896 Stücke:
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7+3.25 EUR
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NX3L1G53GT,115 NX3L1G53.pdf
NX3L1G53GT,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3V1G66GM,115 NX3V1G66.pdf
NX3V1G66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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NX3V1T66GM,115 NX3V1T66.pdf
NX3V1T66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3V1T66GM,115 NX3V1T66.pdf
NX3V1T66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L1G3157GM,115 NX3L1G3157.pdf
NX3L1G3157GM,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L2G66GT,115 NX3L2G66.pdf
NX3L2G66GT,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
Produkt ist nicht verfügbar
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1322XUSB description MC13224V_Rev1.3.pdf
1322XUSB
Hersteller: NXP USA Inc.
Description: KIT USB 1322X
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4 (ZigBee®)
Frequency: 2.4GHz
For Use With/Related Products: MC1322x
Packaging: Box
Produkt ist nicht verfügbar
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1322XDSK-DBG description ZigBee_Tech_Sum_Rev10.pdf
1322XDSK-DBG
Hersteller: NXP USA Inc.
Description: KIT DEVELOPER STARTER 1322X
Utilized IC / Part: MC1322x
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4 (ZigBee®)
Frequency: 2.4GHz
For Use With/Related Products: MC1322x
Packaging: Box
Produkt ist nicht verfügbar
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1322XNSK-DBG ZigBee_Tech_Sum_Rev10.pdf
1322XNSK-DBG
Hersteller: NXP USA Inc.
Description: KIT NETWORK STARTER 1322X
Produkt ist nicht verfügbar
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DEMO908AP64E
DEMO908AP64E
Hersteller: NXP USA Inc.
Description: MC68HC908AP EVAL BRD
Produkt ist nicht verfügbar
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MMA7331LT MMA7331L.pdf
MMA7331LT
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Features: Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Produkt ist nicht verfügbar
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MC9S08DN16ACLF MC9S08DN60.pdf
MC9S08DN16ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16AMLF MC9S08AC60.pdf
MC9S08DN16AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN32AMLC MC9S08DN60.pdf
MC9S08DN32AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV16ACLC MC9S08DV60.pdf
MC9S08DV16ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DV16ACLF MC9S08DV60.pdf
MC9S08DV16ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV32ACLC MC9S08DV60.pdf
MC9S08DV32ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC9S08DV32ACLF MC9S08DV60.pdf
MC9S08DV32ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV32AMLF MC9S08DV60.pdf
MC9S08DV32AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Produkt ist nicht verfügbar
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MC9S08DV32AMLH MC9S08DV60.pdf
MC9S08DV32AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
Connectivity: CANbus, I2C, LINbus, SCI, SPI
auf Bestellung 646 Stücke:
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1+28.32 EUR
10+22.63 EUR
80+19.11 EUR
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MC9S08DZ16ACLC MC9S08DZ60.pdf
MC9S08DZ16ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08DZ16ACLF MC9S08DZ60.pdf
MC9S08DZ16ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 426 Stücke:
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2+16.97 EUR
10+13.61 EUR
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MC9S08DZ32ACLC MC9S08DZ60.pdf
MC9S08DZ32ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Number of I/O: 25
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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2+19.56 EUR
10+15.36 EUR
25+14.32 EUR
100+13.17 EUR
250+12.97 EUR
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MC9S08DZ32ACLF MC9S08AC60.pdf
MC9S08DZ32ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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1+28.33 EUR
10+22.42 EUR
25+20.94 EUR
100+19.31 EUR
250+18.54 EUR
500+18.06 EUR
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MC9S08DZ32AMLH MC9S08AC60.pdf
MC9S08DZ32AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Number of I/O: 53
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 338 Stücke:
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1+39.92 EUR
10+31.89 EUR
25+29.89 EUR
100+27.69 EUR
250+26.64 EUR
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MC9S08DZ60ACLC MC9S08DZ60.pdf
MC9S08DZ60ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
auf Bestellung 383 Stücke:
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1+25.22 EUR
10+19.91 EUR
25+18.58 EUR
100+17.11 EUR
250+16.42 EUR
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MC9S08DZ60ACLF MC9S08DV60.pdf
MC9S08DZ60ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 5388 Stücke:
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1+25.85 EUR
10+20.42 EUR
25+19.06 EUR
100+17.56 EUR
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500+16.42 EUR
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MC9S08DZ60ACLH MC9S08DV60.pdf
MC9S08DZ60ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Connectivity: CANbus, I2C, LINbus, SCI, SPI
auf Bestellung 1969 Stücke:
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1+28.55 EUR
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100+19.46 EUR
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800+17.93 EUR
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MC9S08DZ60AMLC MC9S08DV60.pdf
MC9S08DZ60AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
auf Bestellung 273 Stücke:
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1+27.48 EUR
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25+20.31 EUR
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MC9S08DZ60AMLF MC9S08AC60.pdf
MC9S08DZ60AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1127 Stücke:
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1+42.19 EUR
10+33.76 EUR
25+31.67 EUR
100+29.35 EUR
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MC9S08DZ60AMLH MC9S08DV60.pdf
MC9S08DZ60AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
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10+23.59 EUR
25+22.05 EUR
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IP4281CZ10,115 IP4281CZ10.pdf
IP4281CZ10,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 8VC 10XSONU
Power Line Protection: Yes
Voltage - Clamping (Max) @ Ipp: 8V (Typ)
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 4
Supplier Device Package: 10-XSONU (2.5x1)
Applications: HDMI
Operating Temperature: -40°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 10-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LM75BD,118 LM75B.pdf
LM75BD,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 17500 Stücke:
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2500+0.84 EUR
5000+0.81 EUR
7500+0.8 EUR
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17500+0.76 EUR
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LM75BD,118 LM75B.pdf
LM75BD,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 19783 Stücke:
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15+1.44 EUR
17+1.26 EUR
18+1.2 EUR
25+1.12 EUR
50+1.07 EUR
100+1.02 EUR
500+0.92 EUR
1000+0.88 EUR
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LPC2103FHN48,551 LPC2101_02_03.pdf
LPC2103FHN48,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 32KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2158FBD100,551 LPC2157_2158.pdf
LPC2158FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC3130FET180,551 LPC3130_31.pdf
LPC3130FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
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P89LPC9321FA,112 P89LPC9321.pdf
P89LPC9321FA,112
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
DigiKey Programmable: Verified
Number of I/O: 26
Supplier Device Package: 28-PLCC (11.48x11.48)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 28-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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P89LPC9321FDH,518 P89LPC9321.pdf
P89LPC9321FDH,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Number of I/O: 26
Part Status: Obsolete
Supplier Device Package: 28-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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