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NX3DV642GU,115 NX3DV642GU,115 NXP USA Inc. NX3DV642.pdf Description: IC SWITCH TPDT DIFF XQFN24
Packaging: Tape & Reel (TR)
Features: Break-Before-Make
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
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NX3L2267GM-Q100X NX3L2267GM-Q100X NXP USA Inc. NX3L2267-Q100.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Qualification: AEC-Q100
Grade: Automotive
Number of Circuits: 2
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 90mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 37pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-XQFN (1.55x2)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Packaging: Tape & Reel (TR)
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NX3L2267GU-Q100X NX3L2267GU-Q100X NXP USA Inc. NX3L2267-Q100.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Qualification: AEC-Q100
Grade: Automotive
Number of Circuits: 2
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 90mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 37pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-XQFN (1.4x1.8)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Packaging: Tape & Reel (TR)
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NX3L4051HR-Q100X NX3L4051HR-Q100X NXP USA Inc. NX3L4051-Q100.pdf Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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PCA9617ATPZ PCA9617ATPZ NXP USA Inc. PCA9617A.pdf Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
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PMF87EN,115 PMF87EN,115 NXP USA Inc. PMF87EN.pdf Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Tape & Reel (TR)
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 275mW (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
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PMN22XN,115 PMN22XN,115 NXP USA Inc. PMN22XN.pdf Description: MOSFET N-CH 30V 5.7A 6TSOP
Input Capacitance (Ciss) (Max) @ Vds: 585 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±12V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 545mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 5.7A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
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PMPB20UN,115 PMPB20UN,115 NXP USA Inc. PMPB20UN.pdf Description: MOSFET N-CH 20V 6.6A 6DFN
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 6-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: 6-DFN2020MD (2x2)
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Rds On (Max) @ Id, Vgs: 25mOhm @ 6.6A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 6.6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 7.1 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
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PMT200EN,115 PMT200EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 1.8A SOT223
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
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PMT760EN,115 PMT760EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 900MA SOT223
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 800mW (Ta), 6.2W (Tc)
Rds On (Max) @ Id, Vgs: 950mOhm @ 800mA, 10V
Current - Continuous Drain (Id) @ 25°C: 900mA (Ta)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 160 pF @ 80 V
Gate Charge (Qg) (Max) @ Vgs: 3 nC @ 10 V
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PQJ7911AHN/C0C,515 NXP USA Inc. Description: IC TXRX ISM/SRD VAND 32HVQFN
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SA58635UK,027 NXP USA Inc. SA58635.pdf Description: IC AMP CLASS G STER 25MW 16WLCSP
Supplier Device Package: 16-WLCSP (1.7x1.7)
Max Output Power x Channels @ Load: 25mW x 2 @ 32Ohm
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class G
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 16-UFBGA, WLCSP
Features: Depop, I2C, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Packaging: Tape & Reel (TR)
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SL3S4011FHK,125 SL3S4011FHK,125 NXP USA Inc. SL3S4011_4021.pdf Description: IC RFID TRANSP 860-960MHZ 8XQFN
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SL3S4021FHKH SL3S4021FHKH NXP USA Inc. Description: IC RFID TRANSP 860-960MHZ 8XQFN
Part Status: Active
Supplier Device Package: 8-XQFN (1.6x1.6)
Standards: ISO 18000-6
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Interface: I²C
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 8-XFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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ASC3112HVK ASC3112HVK NXP USA Inc. ASC3101_3112_Br.pdf Description: IC RF TXRX+MCU AISG 144LQFP
Part Status: Obsolete
Serial Interfaces: I²C, SPI, UART
RF Family/Standard: AISG
Modulation: OOK
GPIO: 44
Supplier Device Package: 144-HLQFP (20x20)
Data Rate (Max): 38.4kbps
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.3V
Type: TxRx + MCU
Memory Size: 256kB Flash, 16kB SRAM
Frequency: 2.176GHz, 4.352GHz, 6.528GHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tray
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ASC8848AETE ASC8848AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
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ASC8848AETK ASC8848AETK NXP USA Inc. Description: IC VIDEO PROCESSOR ADV 484TFBGA
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ASC8850AETE ASC8850AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 484-TFBGA (15x15)
Core Processor: ARM9®
Applications: Embedded Multimedia Communication, Security and Entertainment
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Packaging: Tray
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ASC8850AETK ASC8850AETK NXP USA Inc. Description: IC VIDEO PROCESSOR ADV 484TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 484-TFBGA (15x15)
Core Processor: ARM9®
Applications: Embedded Multimedia Communication, Security and Entertainment
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Packaging: Tray
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ASC8852AETE ASC8852AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
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CLRC66302HN,151 CLRC66302HN,151 NXP USA Inc. CLRC663.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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CLRC66302HN,157 CLRC66302HN,157 NXP USA Inc. CLRC663.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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LPC1113FHN33/302K LPC1113FHN33/302K NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
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LPC11E36FHN33/501E LPC11E36FHN33/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 96KB FLASH 32VQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
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LPC11E37FBD48/501E LPC11E37FBD48/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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250+7.97 EUR
500+7.75 EUR
1000+7.54 EUR
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LPC11E37FBD64/501E LPC11E37FBD64/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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LPC11E37FHI33/501E LPC11E37FHI33/501E NXP USA Inc. LPC11E3x_Draft_Rev2.3.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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LPC1785FBD208K NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
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LPC1812JBD144E LPC1812JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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LPC1812JET100E LPC1812JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
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LPC1813JBD144E LPC1813JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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LPC1813JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
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LPC1815JBD144E LPC1815JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC1815JET100E LPC1815JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC1817JBD144E LPC1817JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
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LPC1817JET100E LPC1817JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4312JBD144E LPC4312JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Core Processor: ARM® Cortex®-M4/M0
Packaging: Tray
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
DigiKey Programmable: Not Verified
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LPC4313JBD144E LPC4313JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Package / Case: 144-LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Packaging: Tray
Speed: 204MHz
Mounting Type: Surface Mount
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10+27.2 EUR
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LPC4315JBD144E LPC4315JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC4317JBD144E LPC4317JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MFRC63002HN,151 MFRC63002HN,151 NXP USA Inc. MFRC630.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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10+10.96 EUR
25+10.36 EUR
100+9.57 EUR
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MFRC63002HN,157 MFRC63002HN,157 NXP USA Inc. MFRC630.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
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MFRC63102HN,151 MFRC63102HN,151 NXP USA Inc. MFRC631.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 677 Stücke:
Lieferzeit 10-14 Tag (e)
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MFRC63102HN,157 MFRC63102HN,157 NXP USA Inc. MFRC631.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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P5DF081HNT1AD2060, P5DF081HNT1AD2060, NXP USA Inc. P5DF081_SDS.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
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SLRC61002HN,151 SLRC61002HN,151 NXP USA Inc. SLRC610.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 32-HVQFN (5x5)
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SLRC61002HN,157 SLRC61002HN,157 NXP USA Inc. SLRC610.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 15693, ISO 18000-3
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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TDA18214AHN/C1,557 TDA18214AHN/C1,557 NXP USA Inc. TDA18214_SDS.pdf Description: IC VIDEO TUNER 40HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 40-HVQFN (6x6)
Standards: DVB-T
Applications: Consumer Video
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TDA18214HN/C1,557 TDA18214HN/C1,557 NXP USA Inc. TDA18214_SDS.pdf Description: IC VIDEO TUNER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: DVB-T
Applications: Consumer Video
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Control Interface: I²C
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA18250AHN/C1,557 TDA18250AHN/C1,557 NXP USA Inc. PHGLS28430-1.pdf?t.download=true&u=5oefqw Description: IC VIDEO TUNER 32HVQFN
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TDA18274HD/C1,557 TDA18274HD/C1,557 NXP USA Inc. Description: IC VIDEO TUNER 48HLQFN
Applications: Consumer Video
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 48-LFQFN Exposed Pad
Packaging: Tray
Control Interface: I²C
Supplier Device Package: 48-HLQFNR (7x7)
Produkt ist nicht verfügbar
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TDA18274HN/C1,557 TDA18274HN/C1,557 NXP USA Inc. Description: IC VIDEO TUNER 40HVQFN
Produkt ist nicht verfügbar
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TDA19971AHN/C1K NXP USA Inc. Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Active
Supplier Device Package: 72-HVQFN (10x10)
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Package / Case: 72-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TDA19971BHN/C1,557 NXP USA Inc. Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 72-HVQFN (10x10)
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Package / Case: 72-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TEF6635HW/V105,557 NXP USA Inc. Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Produkt ist nicht verfügbar
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TEF6638HW/V103,557 NXP USA Inc. Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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TEF6638HW/V105,557 NXP USA Inc. Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF6640HW/V101,557 NXP USA Inc. Description: RF RECEIVER AM/FM 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM
Data Interface: PCB, Surface Mount
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF6642HW/V101,557 NXP USA Inc. Description: RF RECEIVER AM/FM 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM
Data Interface: PCB, Surface Mount
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF6644HW/V101K NXP USA Inc. TEF664x_Br.pdf Description: RF RECEIVER AM/FM 64HTQFP
Produkt ist nicht verfügbar
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NX3DV642GU,115 NX3DV642.pdf
NX3DV642GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH TPDT DIFF XQFN24
Packaging: Tape & Reel (TR)
Features: Break-Before-Make
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
Produkt ist nicht verfügbar
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NX3L2267GM-Q100X NX3L2267-Q100.pdf
NX3L2267GM-Q100X
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Qualification: AEC-Q100
Grade: Automotive
Number of Circuits: 2
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 90mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 37pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-XQFN (1.55x2)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3L2267GU-Q100X NX3L2267-Q100.pdf
NX3L2267GU-Q100X
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Qualification: AEC-Q100
Grade: Automotive
Number of Circuits: 2
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 90mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 37pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-XQFN (1.4x1.8)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3L4051HR-Q100X NX3L4051-Q100.pdf
NX3L4051HR-Q100X
Hersteller: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9617ATPZ PCA9617A.pdf
PCA9617ATPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
Produkt ist nicht verfügbar
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PMF87EN,115 PMF87EN.pdf
PMF87EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Tape & Reel (TR)
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 275mW (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
Produkt ist nicht verfügbar
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PMN22XN,115 PMN22XN.pdf
PMN22XN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 5.7A 6TSOP
Input Capacitance (Ciss) (Max) @ Vds: 585 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±12V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 545mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 5.7A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMPB20UN,115 PMPB20UN.pdf
PMPB20UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 6.6A 6DFN
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 6-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: 6-DFN2020MD (2x2)
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Rds On (Max) @ Id, Vgs: 25mOhm @ 6.6A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 6.6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 7.1 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Produkt ist nicht verfügbar
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PMT200EN,115
PMT200EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 1.8A SOT223
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PMT760EN,115
PMT760EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 900MA SOT223
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 800mW (Ta), 6.2W (Tc)
Rds On (Max) @ Id, Vgs: 950mOhm @ 800mA, 10V
Current - Continuous Drain (Id) @ 25°C: 900mA (Ta)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 160 pF @ 80 V
Gate Charge (Qg) (Max) @ Vgs: 3 nC @ 10 V
Produkt ist nicht verfügbar
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PQJ7911AHN/C0C,515
Hersteller: NXP USA Inc.
Description: IC TXRX ISM/SRD VAND 32HVQFN
auf Bestellung 1500 Stücke:
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SA58635UK,027 SA58635.pdf
Hersteller: NXP USA Inc.
Description: IC AMP CLASS G STER 25MW 16WLCSP
Supplier Device Package: 16-WLCSP (1.7x1.7)
Max Output Power x Channels @ Load: 25mW x 2 @ 32Ohm
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class G
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 16-UFBGA, WLCSP
Features: Depop, I2C, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SL3S4011FHK,125 SL3S4011_4021.pdf
SL3S4011FHK,125
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 8XQFN
Produkt ist nicht verfügbar
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SL3S4021FHKH
SL3S4021FHKH
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 8XQFN
Part Status: Active
Supplier Device Package: 8-XQFN (1.6x1.6)
Standards: ISO 18000-6
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Interface: I²C
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 8-XFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ASC3112HVK ASC3101_3112_Br.pdf
ASC3112HVK
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU AISG 144LQFP
Part Status: Obsolete
Serial Interfaces: I²C, SPI, UART
RF Family/Standard: AISG
Modulation: OOK
GPIO: 44
Supplier Device Package: 144-HLQFP (20x20)
Data Rate (Max): 38.4kbps
Power - Output: 10dBm
Voltage - Supply: 1.8V ~ 3.3V
Type: TxRx + MCU
Memory Size: 256kB Flash, 16kB SRAM
Frequency: 2.176GHz, 4.352GHz, 6.528GHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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ASC8848AETE 75017379.pdf
ASC8848AETE
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
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ASC8848AETK
ASC8848AETK
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
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ASC8850AETE 75017379.pdf
ASC8850AETE
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 484-TFBGA (15x15)
Core Processor: ARM9®
Applications: Embedded Multimedia Communication, Security and Entertainment
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ASC8850AETK
ASC8850AETK
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 484-TFBGA (15x15)
Core Processor: ARM9®
Applications: Embedded Multimedia Communication, Security and Entertainment
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ASC8852AETE 75017379.pdf
ASC8852AETE
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
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CLRC66302HN,151 CLRC663.pdf
CLRC66302HN,151
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 9322 Stücke:
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AnzahlPrivatkunde
1+21.88 EUR
10+19.02 EUR
25+18.02 EUR
100+16.65 EUR
490+15.27 EUR
980+14.72 EUR
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CLRC66302HN,157 CLRC663.pdf
CLRC66302HN,157
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1113FHN33/302K LPC111X.pdf
LPC1113FHN33/302K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Produkt ist nicht verfügbar
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LPC11E36FHN33/501E LPC11E3X.pdf
LPC11E36FHN33/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 32VQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
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AnzahlPrivatkunde
3+9.87 EUR
10+5.75 EUR
25+5.69 EUR
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LPC11E37FBD48/501E LPC11E3X.pdf
LPC11E37FBD48/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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2+12.9 EUR
10+9.92 EUR
25+9.19 EUR
100+8.37 EUR
250+7.97 EUR
500+7.75 EUR
1000+7.54 EUR
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LPC11E37FBD64/501E LPC11E3X.pdf
LPC11E37FBD64/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC11E37FHI33/501E LPC11E3x_Draft_Rev2.3.pdf
LPC11E37FHI33/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1785FBD208K LPC178X_7X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Produkt ist nicht verfügbar
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LPC1812JBD144E LPC185X_3X_2X_1X.pdf
LPC1812JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1812JET100E LPC185X_3X_2X_1X.pdf
LPC1812JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
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1+24.09 EUR
10+18.98 EUR
25+17.7 EUR
100+16.29 EUR
260+15.6 EUR
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LPC1813JBD144E LPC185X_3X_2X_1X.pdf
LPC1813JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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LPC1813JET100E LPC185X_3X_2X_1X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
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LPC1815JBD144E LPC185X_3X_2X_1X.pdf
LPC1815JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1815JET100E LPC185X_3X_2X_1X.pdf
LPC1815JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1817JBD144E LPC185X_3X_2X_1X.pdf
LPC1817JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
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LPC1817JET100E LPC185X_3X_2X_1X.pdf
LPC1817JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
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LPC4312JBD144E LPC435X_3X_2X_1X.pdf
LPC4312JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Core Processor: ARM® Cortex®-M4/M0
Packaging: Tray
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
DigiKey Programmable: Not Verified
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10+26.49 EUR
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LPC4313JBD144E LPC435X_3X_2X_1X.pdf
LPC4313JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Package / Case: 144-LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Packaging: Tray
Speed: 204MHz
Mounting Type: Surface Mount
auf Bestellung 60 Stücke:
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1+34.22 EUR
10+27.2 EUR
60+24.15 EUR
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LPC4315JBD144E LPC435X_3X_2X_1X.pdf
LPC4315JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4317JBD144E LPC435X_3X_2X_1X.pdf
LPC4317JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MFRC63002HN,151 MFRC630.pdf
MFRC63002HN,151
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1225 Stücke:
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AnzahlPrivatkunde
2+12.65 EUR
10+10.96 EUR
25+10.36 EUR
100+9.57 EUR
490+8.75 EUR
980+8.43 EUR
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MFRC63002HN,157 MFRC630.pdf
MFRC63002HN,157
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Produkt ist nicht verfügbar
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MFRC63102HN,151 MFRC631.pdf
MFRC63102HN,151
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 677 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.23 EUR
10+13.21 EUR
25+12.5 EUR
100+11.53 EUR
490+10.56 EUR
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MFRC63102HN,157 MFRC631.pdf
MFRC63102HN,157
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 14443, MIFARE
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P5DF081HNT1AD2060, P5DF081_SDS.pdf
P5DF081HNT1AD2060,
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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SLRC61002HN,151 SLRC610.pdf
SLRC61002HN,151
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 287 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.07 EUR
10+10.46 EUR
25+9.9 EUR
100+9.13 EUR
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SLRC61002HN,157 SLRC610.pdf
SLRC61002HN,157
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Standards: ISO 15693, ISO 18000-3
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -25°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TDA18214AHN/C1,557 TDA18214_SDS.pdf
TDA18214AHN/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 40HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 40-HVQFN (6x6)
Standards: DVB-T
Applications: Consumer Video
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TDA18214HN/C1,557 TDA18214_SDS.pdf
TDA18214HN/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: DVB-T
Applications: Consumer Video
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Control Interface: I²C
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA18250AHN/C1,557 PHGLS28430-1.pdf?t.download=true&u=5oefqw
TDA18250AHN/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 32HVQFN
Produkt ist nicht verfügbar
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TDA18274HD/C1,557
TDA18274HD/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 48HLQFN
Applications: Consumer Video
Voltage - Supply: 3.3V ~ 3.6V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 48-LFQFN Exposed Pad
Packaging: Tray
Control Interface: I²C
Supplier Device Package: 48-HLQFNR (7x7)
Produkt ist nicht verfügbar
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TDA18274HN/C1,557
TDA18274HN/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 40HVQFN
Produkt ist nicht verfügbar
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TDA19971AHN/C1K
Hersteller: NXP USA Inc.
Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Active
Supplier Device Package: 72-HVQFN (10x10)
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Package / Case: 72-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TDA19971BHN/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 72-HVQFN (10x10)
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Package / Case: 72-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TEF6635HW/V105,557
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Produkt ist nicht verfügbar
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TEF6638HW/V103,557
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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TEF6638HW/V105,557
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF6640HW/V101,557
Hersteller: NXP USA Inc.
Description: RF RECEIVER AM/FM 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM
Data Interface: PCB, Surface Mount
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF6642HW/V101,557
Hersteller: NXP USA Inc.
Description: RF RECEIVER AM/FM 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM
Data Interface: PCB, Surface Mount
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF6644HW/V101K TEF664x_Br.pdf
Hersteller: NXP USA Inc.
Description: RF RECEIVER AM/FM 64HTQFP
Produkt ist nicht verfügbar
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