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S9S12ZVL16F0CLF S9S12ZVL16F0CLF NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S9S12ZVL32F0VLFR S9S12ZVL32F0VLFR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
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S9S12ZVL8F0CLF S9S12ZVL8F0CLF NXP USA Inc. MC9S12ZVLRM.pdf Description: IC MCU 16BIT 8KB FLASH 48LQFP
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S9S12ZVLS1F0VFMR S9S12ZVLS1F0VFMR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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S9S12ZVLS3F0CFM S9S12ZVLS3F0CFM NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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SAC57D54HCVLTR NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 208LQFP
Package / Case: 208-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-A5/M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.3M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz, 160MHz, 320MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
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SCIMX6X3EVK10ABR SCIMX6X3EVK10ABR NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
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SFR4310E1MAE40 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 40MHZ
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SFR4310E1MAE40R NXP USA Inc. Description: IC INTERFACE SPECIALIZED 40MHZ
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SJA1105ELY SJA1105ELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Part Status: Active
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
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SJA1105TELY SJA1105TELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Tape & Reel (TR)
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SL3S1204FUD2/BG1A NXP USA Inc. Description: IC RFID TRANSP 860-960MHZ WAFER
Supplier Device Package: Wafer
Standards: EPC
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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SLN-IOT-GPI SLN-IOT-GPI NXP USA Inc. MODIOTFRAMEWORKFS.pdf Description: SLN-IOT-GPI
Utilized IC / Part: i.MX 6UltraLite
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Obsolete
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Type: Gateway
For Use With/Related Products: i.MX 6UltraLite
Packaging: Bulk
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SLRC61003HNE SLRC61003HNE NXP USA Inc. SLRC610.pdf Description: IC RFID TRANSP 27.12MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 27.12MHz
Interface: I2C, SPI, UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 5.5V
Standards: EPC, ISO 15693, ISO 18000, NFC
Supplier Device Package: 32-HVQFN (5x5)
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980+7.08 EUR
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SM912F634DV2AE SM912F634DV2AE NXP USA Inc. SM912F634DS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 3
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 15x10b
Core Processor: S12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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SM912F634DV2AER2 SM912F634DV2AER2 NXP USA Inc. SM912F634DS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 3
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 15x10b
Core Processor: S12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SP5742PFK1AKLQ5R SP5742PFK1AKLQ5R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 135°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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SP5742PFK1AMLQ8R SP5742PFK1AMLQ8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
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SP5742PFK1AMLQ9R SP5742PFK1AMLQ9R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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SP5743PFK1AMLQ9R SP5743PFK1AMLQ9R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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SP5744BBK1AMMH2R SP5744BBK1AMMH2R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 100BGA
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SP5744CBK1AVKU6R SP5744CBK1AVKU6R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
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SP5744PFK1AMLQ9R SP5744PFK1AMLQ9R NXP USA Inc. MPC5744P.pdf Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
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SP5745BBK1AMMH2R SP5745BBK1AMMH2R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
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SP5745BFK1AVKU2R SP5745BFK1AVKU2R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
DigiKey Programmable: Not Verified
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SP5745BFK1AVMH2R SP5745BFK1AVMH2R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I²S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
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SP5745CBK1AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 256MAPBGA
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SP5745CBK1AVMH6R SP5745CBK1AVMH6R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
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SP5745CFK1AMKU6R SP5745CFK1AMKU6R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 176LQFP
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SP5746BFK1AVKU2R SP5746BFK1AVKU2R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SP5746BFK1AVMH6R SP5746BFK1AVMH6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SP5746BK1AMKU2R SP5746BK1AMKU2R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SP5746BSK1AMKU2R SP5746BSK1AMKU2R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SP5746CBK1AMKU6R SP5746CBK1AMKU6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SP5746CBK1AMMJ6R SP5746CBK1AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
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SP5746CBK1AVKU6R SP5746CBK1AVKU6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SP5746CHK1AMKU6R SP5746CHK1AMKU6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SP5746CHK1AMMH6R SP5746CHK1AMMH6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
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SP5746CHK1AMMJ6R SP5746CHK1AMMJ6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
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SP5746CHK1AVKU6R SP5746CHK1AVKU6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SP5746CSK1AMKU6R SP5746CSK1AMKU6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
DigiKey Programmable: Not Verified
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SP5746CSK1AMMH6R SP5746CSK1AMMH6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SP5746CSK1AMMJ6R SP5746CSK1AMMJ6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
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SP5747CBK0AVKU6R SP5747CBK0AVKU6R NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SP5748CSK0ACKU2R SP5748CSK0ACKU2R NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SP5748GBK0AMMJ6R SP5748GBK0AMMJ6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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SP5748GHK0AMKU6R SP5748GHK0AMKU6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SPC5123YVY400B SPC5123YVY400B NXP USA Inc. MPC5121E.pdf Description: IC MCU 32BIT ROMLESS 516FPBGA
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 516-PBGA (27x27)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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SPC5514EAMLQ66 SPC5514EAMLQ66 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
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SPC5517EAVMG80 SPC5517EAVMG80 NXP USA Inc. Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Active
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
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SPC5554MVR132 SPC5554MVR132 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Part Status: Not For New Designs
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
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SPC5566MVR132R SPC5566MVR132R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Number of I/O: 256
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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SPC5566MZP132 SPC5566MZP132 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Number of I/O: 256
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Package / Case: 416-BBGA
Packaging: Tray
Speed: 132MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
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SPC5566MZP80 SPC5566MZP80 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
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SPC5566MZP80R SPC5566MZP80R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
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SPC5601DF1VLH4R SPC5601DF1VLH4R NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: e200z0h
EEPROM Size: 4K x 16
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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SPC5601PEF0VLH6R SPC5601PEF0VLH6R NXP USA Inc. MPC5604P.pdf Description: IC MCU 32BIT 192KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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SPC5602BAVLL6R SPC5602BAVLL6R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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SPC5602BAVLQ4 SPC5602BAVLQ4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5602BAVLQ4R SPC5602BAVLQ4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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S9S12ZVL16F0CLF S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL16F0CLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S9S12ZVL32F0VLFR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL32F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
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S9S12ZVL8F0CLF MC9S12ZVLRM.pdf
S9S12ZVL8F0CLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 8KB FLASH 48LQFP
Produkt ist nicht verfügbar
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S9S12ZVLS1F0VFMR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVLS1F0VFMR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12ZVLS3F0CFM S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVLS3F0CFM
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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SAC57D54HCVLTR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 208LQFP
Package / Case: 208-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-A5/M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.3M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz, 160MHz, 320MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SCIMX6X3EVK10ABR
SCIMX6X3EVK10ABR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SFR4310E1MAE40
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 40MHZ
Produkt ist nicht verfügbar
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SFR4310E1MAE40R
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 40MHZ
Produkt ist nicht verfügbar
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SJA1105ELY SJA1105.pdf
SJA1105ELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Part Status: Active
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
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1000+7.48 EUR
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SJA1105TELY SJA1105.pdf
SJA1105TELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Tape & Reel (TR)
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1000+10.64 EUR
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SL3S1204FUD2/BG1A
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ WAFER
Supplier Device Package: Wafer
Standards: EPC
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 860MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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SLN-IOT-GPI MODIOTFRAMEWORKFS.pdf
SLN-IOT-GPI
Hersteller: NXP USA Inc.
Description: SLN-IOT-GPI
Utilized IC / Part: i.MX 6UltraLite
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Obsolete
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Type: Gateway
For Use With/Related Products: i.MX 6UltraLite
Packaging: Bulk
Produkt ist nicht verfügbar
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SLRC61003HNE SLRC610.pdf
SLRC61003HNE
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 27.12MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 27.12MHz
Interface: I2C, SPI, UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 5.5V
Standards: EPC, ISO 15693, ISO 18000, NFC
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 7990 Stücke:
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AnzahlPreis
2+10.63 EUR
10+9.21 EUR
25+8.71 EUR
100+8.04 EUR
490+7.35 EUR
980+7.08 EUR
1470+6.93 EUR
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SM912F634DV2AE SM912F634DS.pdf
SM912F634DV2AE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 3
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 15x10b
Core Processor: S12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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SM912F634DV2AER2 SM912F634DS.pdf
SM912F634DV2AER2
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 3
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 15x10b
Core Processor: S12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5742PFK1AKLQ5R
SP5742PFK1AKLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 135°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5742PFK1AMLQ8R
SP5742PFK1AMLQ8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SP5742PFK1AMLQ9R
SP5742PFK1AMLQ9R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5743PFK1AMLQ9R
SP5743PFK1AMLQ9R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5744BBK1AMMH2R
SP5744BBK1AMMH2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100BGA
Produkt ist nicht verfügbar
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SP5744CBK1AVKU6R
SP5744CBK1AVKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SP5744PFK1AMLQ9R MPC5744P.pdf
SP5744PFK1AMLQ9R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5745BBK1AMMH2R
SP5745BBK1AMMH2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5745BFK1AVKU2R
SP5745BFK1AVKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5745BFK1AVMH2R
SP5745BFK1AVMH2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I²S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5745CBK1AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
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SP5745CBK1AVMH6R
SP5745CBK1AVMH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SP5745CFK1AMKU6R
SP5745CFK1AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SP5746BFK1AVKU2R
SP5746BFK1AVKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SP5746BFK1AVMH6R
SP5746BFK1AVMH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SP5746BK1AMKU2R
SP5746BK1AMKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SP5746BSK1AMKU2R
SP5746BSK1AMKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SP5746CBK1AMKU6R
SP5746CBK1AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5746CBK1AMMJ6R
SP5746CBK1AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5746CBK1AVKU6R
SP5746CBK1AVKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5746CHK1AMKU6R
SP5746CHK1AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5746CHK1AMMH6R
SP5746CHK1AMMH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5746CHK1AMMJ6R MPC5746C.pdf
SP5746CHK1AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5746CHK1AVKU6R
SP5746CHK1AVKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SP5746CSK1AMKU6R MPC5746C.pdf
SP5746CSK1AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
DigiKey Programmable: Not Verified
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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500+30.21 EUR
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SP5746CSK1AMMH6R
SP5746CSK1AMMH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SP5746CSK1AMMJ6R MPC5746C.pdf
SP5746CSK1AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5747CBK0AVKU6R
SP5747CBK0AVKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5748CSK0ACKU2R
SP5748CSK0ACKU2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SP5748GBK0AMMJ6R MPC5746C.pdf
SP5748GBK0AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GHK0AMKU6R
SP5748GHK0AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5123YVY400B MPC5121E.pdf
SPC5123YVY400B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 516FPBGA
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 516-PBGA (27x27)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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10+112.31 EUR
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SPC5514EAMLQ66
SPC5514EAMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Produkt ist nicht verfügbar
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SPC5517EAVMG80
SPC5517EAVMG80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Active
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5554MVR132
SPC5554MVR132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Part Status: Not For New Designs
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5566MVR132R MPC5566.pdf
SPC5566MVR132R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Number of I/O: 256
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP132 MPC5566.pdf
SPC5566MZP132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Number of I/O: 256
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Package / Case: 416-BBGA
Packaging: Tray
Speed: 132MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
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AnzahlPreis
1+157.64 EUR
10+132.15 EUR
25+125.79 EUR
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SPC5566MZP80 MPC5566.pdf
SPC5566MZP80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5566MZP80R MPC5566.pdf
SPC5566MZP80R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Produkt ist nicht verfügbar
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SPC5601DF1VLH4R
SPC5601DF1VLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: e200z0h
EEPROM Size: 4K x 16
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5601PEF0VLH6R MPC5604P.pdf
SPC5601PEF0VLH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BAVLL6R
SPC5602BAVLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5602BAVLQ4
SPC5602BAVLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5602BAVLQ4R
SPC5602BAVLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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