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FS32K116BRT0MFMT FS32K116BRT0MFMT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Produkt ist nicht verfügbar
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FS32K116LFT0MFMT FS32K116LFT0MFMT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Produkt ist nicht verfügbar
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LPC11A02UK,118 LPC11A02UK,118 NXP USA Inc. LPC11AXX.pdf Description: IC MCU 32BIT 16KB FLASH 20WLCSP
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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LPC11A02UK,118 LPC11A02UK,118 NXP USA Inc. LPC11AXX.pdf Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
Produkt ist nicht verfügbar
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74ALVC125PW-Q100118 74ALVC125PW-Q100118 NXP USA Inc. 74ALVC125_Q100.pdf Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
auf Bestellung 1790 Stücke:
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1790+0.36 EUR
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TDF8554J/N3,112 NXP USA Inc. Description: IC AUDIO POWER AMP DBS37P
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Through Hole
Output Type: 4-Channel (Quad)
Package / Case: 37-SIP Formed Leads
Packaging: Tray
Part Status: Obsolete
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
Produkt ist nicht verfügbar
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74HC153PW-Q100118 74HC153PW-Q100118 NXP USA Inc. 74HC_HCT153_Q100.pdf Description: 74HC153 - 4 LINE MUX
Part Status: Active
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Qualification: AEC-Q100
Grade: Automotive
Packaging: Bulk
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1481+0.38 EUR
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KITPF5020FRDMEVM KITPF5020FRDMEVM NXP USA Inc. KITPF5020FRDMEVM.pdf Description: EVAL BOARD FOR PF5020
Contents: Board(s)
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: PF5020
Packaging: Bulk
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PDTA144EU/ZL115 PDTA144EU/ZL115 NXP USA Inc. PDTA144E_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
auf Bestellung 6000 Stücke:
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6000+0.096 EUR
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74AHCT259PW,118 74AHCT259PW,118 NXP USA Inc. 74AHC(T)259.pdf Description: IC 8BIT ADDRESSBLE LATCH 16TSSOP
Mounting Type: Surface Mount
Output Type: Standard
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 16-TSSOP
Delay Time - Propagation: 4.1ns
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type, Addressable
Circuit: 1:8
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784+0.73 EUR
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HEF4040BT-Q100118 HEF4040BT-Q100118 NXP USA Inc. HEF4040B_Q100.pdf Description: BINARY COUNTER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PDZ5.6B/ZL115 NXP USA Inc. PHGLS19616-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
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74LVC125APW/S999118 74LVC125APW/S999118 NXP USA Inc. 74LVC125A.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVC125APW/AU118 74LVC125APW/AU118 NXP USA Inc. PHGLS27062-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC126APW/AU118 74LVC126APW/AU118 NXP USA Inc. PHGLS29627-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Obsolete
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2959+0.19 EUR
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74LVC126APW/C4118 74LVC126APW/C4118 NXP USA Inc. PHGLS29627-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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BFU630F,115 BFU630F,115 NXP USA Inc. BFU630F.pdf Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB ~ 22.5dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
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10+2.31 EUR
15+1.44 EUR
100+0.94 EUR
500+0.74 EUR
1000+0.67 EUR
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BC857AQA147 NXP USA Inc. BC857XQA_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74HC158D/C118 74HC158D/C118 NXP USA Inc. 74HC158.pdf Description: 74HC158 2 LINE MUX
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Produkt ist nicht verfügbar
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OT409135 NXP USA Inc. Description: NOW WEEN - OT409 - TBC - SC-73
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NVT2010BS,118 NVT2010BS,118 NXP USA Inc. PHGLS29355-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLATOR BIDIR VOLT 24HVQFN
auf Bestellung 998 Stücke:
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PXLS60220AES NXP USA Inc. Description: XTRINSIC 1 AXIS ACCELEROMETER
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 74 Stücke
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PXLS60311AES NXP USA Inc. Description: XTRINSIC 2 AXIS LOW/LOW XY ACCEL
Packaging: Tray
Produkt ist nicht verfügbar
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PXLS60333AES NXP USA Inc. Description: XTRINSIC 2 AXIS HIGH/HIGH XY ACC
Packaging: Tray
Produkt ist nicht verfügbar
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PXLS60422AES NXP USA Inc. Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL
Produkt ist nicht verfügbar
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PXLS63322AES NXP USA Inc. Description: XTRINSIC 2 AXIS MED/MED XY ACCEL
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PXLS63333AES NXP USA Inc. Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI
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PXLS63433AES NXP USA Inc. Description: PSI5 PROTOCOL 2 AXIS HIGH/HIGH
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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PXLS80333AES NXP USA Inc. Description: 2 AXIS HI/HI XY
Produkt ist nicht verfügbar
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LPC5514JBD64E LPC5514JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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3+10.31 EUR
10+7.88 EUR
50+6.9 EUR
100+6.59 EUR
160+6.43 EUR
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LPC55S14JBD64E LPC55S14JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5516JBD64E LPC5516JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 177 Stücke:
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2+11.96 EUR
10+9.17 EUR
50+8.07 EUR
100+7.72 EUR
160+7.52 EUR
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LPC55S16JBD64E LPC55S16JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
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2+14.74 EUR
10+11.59 EUR
160+9.59 EUR
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LPC5526JBD100K LPC5526JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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4+6.72 EUR
10+6.63 EUR
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LPC5516JEV98E LPC5516JEV98E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+13.57 EUR
10+10.45 EUR
25+9.66 EUR
80+8.92 EUR
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LPC55S66JBD64K LPC55S66JBD64K NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 244 Stücke:
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2+12.67 EUR
10+9.76 EUR
25+9.03 EUR
100+8.22 EUR
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LPC55S26JEV98K LPC55S26JEV98K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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4+6.85 EUR
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LPC55S28JBD64K LPC55S28JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2020 Stücke:
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50+11.04 EUR
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500+9.83 EUR
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LPC55S28JBD100K LPC55S28JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+15.41 EUR
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80+10.25 EUR
230+9.7 EUR
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LPC55S16JEV98E LPC55S16JEV98E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC5528JBD100K LPC5528JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC5512JBD100E LPC5512JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S14JBD100E LPC55S14JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC5516JBD100E LPC5516JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S16JBD100E LPC55S16JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC5512JBD64E LPC5512JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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LPC5514JBD100E LPC5514JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
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LPC55S66JEV98K LPC55S66JEV98K NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHV/N208Q/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF4000EL/101S500Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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SAF4000EL/101S504Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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PDTC143XQA147 PDTC143XQA147 NXP USA Inc. PDTC143X_123J_143Z_114YQA_SER.pdf Description: TRANS PREBIAS
Part Status: Active
Packaging: Bulk
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Qualification: AEC-Q101
Resistor - Emitter Base (R2): 10 kOhms
Resistor - Base (R1): 4.7 kOhms
Frequency - Transition: 230 MHz
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Produkt ist nicht verfügbar
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PDTC143EQA147 NXP USA Inc. PDTC143_114_124_144EQA_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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OM15080-QN9090 OM15080-QN9090 NXP USA Inc. QN9090(T)QN9030(T).pdf Description: QN9090 BLE SOC DEV KIT
Utilized IC / Part: QN9090
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: QN9090
Packaging: Bulk
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S9S08DZ60F2MLHR S9S08DZ60F2MLHR NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Produkt ist nicht verfügbar
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74HCT573N/C4112 NXP USA Inc. PHGL-S-A0001574510-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, HCT SERIES, 8-BIT
Part Status: Active
Supplier Device Package: 20-DIP
Delay Time - Propagation: 17ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Through Hole
Output Type: Tri-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1059TKJ TJA1059TKJ NXP USA Inc. TJA1059.pdf Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
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TJA1059TKJ TJA1059TKJ NXP USA Inc. TJA1059.pdf Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 17851 Stücke:
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4+6.53 EUR
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25+4.51 EUR
100+4.06 EUR
250+3.84 EUR
500+3.81 EUR
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FS32K146HRT0VLQR FS32K146HRT0VLQR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
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74LVC2G17GW/S400125 74LVC2G17GW/S400125 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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FS32K116BRT0MFMT S32K1xx.pdf
FS32K116BRT0MFMT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Produkt ist nicht verfügbar
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FS32K116LFT0MFMT S32K1xx.pdf
FS32K116LFT0MFMT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
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LPC11A02UK,118 LPC11AXX.pdf
LPC11A02UK,118
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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LPC11A02UK,118 LPC11AXX.pdf
LPC11A02UK,118
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
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74ALVC125PW-Q100118 74ALVC125_Q100.pdf
74ALVC125PW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
auf Bestellung 1790 Stücke:
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AnzahlPrivatkunde
1790+0.36 EUR
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TDF8554J/N3,112
Hersteller: NXP USA Inc.
Description: IC AUDIO POWER AMP DBS37P
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Through Hole
Output Type: 4-Channel (Quad)
Package / Case: 37-SIP Formed Leads
Packaging: Tray
Part Status: Obsolete
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
Produkt ist nicht verfügbar
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74HC153PW-Q100118 74HC_HCT153_Q100.pdf
74HC153PW-Q100118
Hersteller: NXP USA Inc.
Description: 74HC153 - 4 LINE MUX
Part Status: Active
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Qualification: AEC-Q100
Grade: Automotive
Packaging: Bulk
auf Bestellung 8002 Stücke:
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AnzahlPrivatkunde
1481+0.38 EUR
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KITPF5020FRDMEVM KITPF5020FRDMEVM.pdf
KITPF5020FRDMEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF5020
Contents: Board(s)
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: PF5020
Packaging: Bulk
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1+486.47 EUR
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PDTA144EU/ZL115 PDTA144E_SER.pdf
PDTA144EU/ZL115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
auf Bestellung 6000 Stücke:
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AnzahlPrivatkunde
6000+0.096 EUR
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74AHCT259PW,118 74AHC(T)259.pdf
74AHCT259PW,118
Hersteller: NXP USA Inc.
Description: IC 8BIT ADDRESSBLE LATCH 16TSSOP
Mounting Type: Surface Mount
Output Type: Standard
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 16-TSSOP
Delay Time - Propagation: 4.1ns
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type, Addressable
Circuit: 1:8
auf Bestellung 10000 Stücke:
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AnzahlPrivatkunde
784+0.73 EUR
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HEF4040BT-Q100118 HEF4040B_Q100.pdf
HEF4040BT-Q100118
Hersteller: NXP USA Inc.
Description: BINARY COUNTER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PDZ5.6B/ZL115 PHGLS19616-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIODE ZENER
auf Bestellung 156000 Stücke:
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74LVC125APW/S999118 74LVC125A.pdf
74LVC125APW/S999118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVC125APW/AU118 PHGLS27062-1.pdf?t.download=true&u=5oefqw
74LVC125APW/AU118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC126APW/AU118 PHGLS29627-1.pdf?t.download=true&u=5oefqw
74LVC126APW/AU118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Obsolete
auf Bestellung 11460 Stücke:
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AnzahlPrivatkunde
2959+0.19 EUR
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74LVC126APW/C4118 PHGLS29627-1.pdf?t.download=true&u=5oefqw
74LVC126APW/C4118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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BFU630F,115 BFU630F.pdf
BFU630F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB ~ 22.5dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
auf Bestellung 9705 Stücke:
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AnzahlPrivatkunde
10+2.31 EUR
15+1.44 EUR
100+0.94 EUR
500+0.74 EUR
1000+0.67 EUR
Mindestbestellmenge: 10 Stücke
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BC857AQA147 BC857XQA_SER.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74HC158D/C118 74HC158.pdf
74HC158D/C118
Hersteller: NXP USA Inc.
Description: 74HC158 2 LINE MUX
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Produkt ist nicht verfügbar
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OT409135
Hersteller: NXP USA Inc.
Description: NOW WEEN - OT409 - TBC - SC-73
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NVT2010BS,118 PHGLS29355-1.pdf?t.download=true&u=5oefqw
NVT2010BS,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR VOLT 24HVQFN
auf Bestellung 998 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 704 Stücke
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PXLS60220AES
Hersteller: NXP USA Inc.
Description: XTRINSIC 1 AXIS ACCELEROMETER
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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PXLS60311AES
Hersteller: NXP USA Inc.
Description: XTRINSIC 2 AXIS LOW/LOW XY ACCEL
Packaging: Tray
Produkt ist nicht verfügbar
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PXLS60333AES
Hersteller: NXP USA Inc.
Description: XTRINSIC 2 AXIS HIGH/HIGH XY ACC
Packaging: Tray
Produkt ist nicht verfügbar
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PXLS60422AES
Hersteller: NXP USA Inc.
Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL
Produkt ist nicht verfügbar
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PXLS63322AES
Hersteller: NXP USA Inc.
Description: XTRINSIC 2 AXIS MED/MED XY ACCEL
Produkt ist nicht verfügbar
Mindestbestellmenge: 74 Stücke
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PXLS63333AES
Hersteller: NXP USA Inc.
Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI
Produkt ist nicht verfügbar
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PXLS63433AES
Hersteller: NXP USA Inc.
Description: PSI5 PROTOCOL 2 AXIS HIGH/HIGH
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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PXLS80333AES
Hersteller: NXP USA Inc.
Description: 2 AXIS HI/HI XY
Produkt ist nicht verfügbar
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LPC5514JBD64E LPC55S1x_LPC551x_DS.pdf
LPC5514JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.31 EUR
10+7.88 EUR
50+6.9 EUR
100+6.59 EUR
160+6.43 EUR
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LPC55S14JBD64E LPC55S1x_LPC551x_DS.pdf
LPC55S14JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5516JBD64E LPC55S1x_LPC551x_DS.pdf
LPC5516JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 177 Stücke:
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AnzahlPrivatkunde
2+11.96 EUR
10+9.17 EUR
50+8.07 EUR
100+7.72 EUR
160+7.52 EUR
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LPC55S16JBD64E LPC55S1x_LPC551x_DS.pdf
LPC55S16JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 160 Stücke:
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AnzahlPrivatkunde
2+14.74 EUR
10+11.59 EUR
160+9.59 EUR
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LPC5526JBD100K LPC55S2x_LPC552x.pdf
LPC5526JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 387 Stücke:
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AnzahlPrivatkunde
4+6.72 EUR
10+6.63 EUR
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LPC5516JEV98E LPC55S1x_LPC551x_DS.pdf
LPC5516JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 248 Stücke:
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AnzahlPrivatkunde
2+13.57 EUR
10+10.45 EUR
25+9.66 EUR
80+8.92 EUR
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LPC55S66JBD64K LPC55S6x.pdf
LPC55S66JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 244 Stücke:
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AnzahlPrivatkunde
2+12.67 EUR
10+9.76 EUR
25+9.03 EUR
100+8.22 EUR
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LPC55S26JEV98K LPC55S2x_LPC552x.pdf
LPC55S26JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1112 Stücke:
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AnzahlPrivatkunde
4+6.85 EUR
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LPC55S28JBD64K LPC55S2x_LPC552x.pdf
LPC55S28JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2020 Stücke:
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AnzahlPrivatkunde
2+16.1 EUR
10+12.48 EUR
50+11.04 EUR
100+10.59 EUR
500+9.83 EUR
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LPC55S28JBD100K LPC55S2x_LPC552x.pdf
LPC55S28JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 353 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+15.41 EUR
10+11.94 EUR
24+11.1 EUR
80+10.25 EUR
230+9.7 EUR
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LPC55S16JEV98E LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 319 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.36 EUR
10+11.09 EUR
50+9.78 EUR
100+9.38 EUR
260+8.94 EUR
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LPC5528JBD100K LPC55S2x_LPC552x.pdf
LPC5528JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+11.29 EUR
10+8.01 EUR
24+7.84 EUR
80+7.65 EUR
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LPC5512JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5512JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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10+7.88 EUR
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LPC55S14JBD100E LPC55S1x_LPC551x_DS.pdf
LPC55S14JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+14.53 EUR
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LPC5516JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5516JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 257 Stücke:
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2+13.76 EUR
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LPC55S16JBD100E LPC55S1x_LPC551x_DS.pdf
LPC55S16JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
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2+16.98 EUR
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LPC5512JBD64E LPC55S1x_LPC551x_DS.pdf
LPC5512JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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3+8.04 EUR
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LPC5514JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5514JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 84 Stücke:
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2+13.4 EUR
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LPC55S66JEV98K LPC55S6x.pdf
LPC55S66JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHV/N208Q/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF4000EL/101S500Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
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SAF4000EL/101S504Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PDTC143XQA147 PDTC143X_123J_143Z_114YQA_SER.pdf
PDTC143XQA147
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Part Status: Active
Packaging: Bulk
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Qualification: AEC-Q101
Resistor - Emitter Base (R2): 10 kOhms
Resistor - Base (R1): 4.7 kOhms
Frequency - Transition: 230 MHz
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Produkt ist nicht verfügbar
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PDTC143EQA147 PDTC143_114_124_144EQA_SER.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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OM15080-QN9090 QN9090(T)QN9030(T).pdf
OM15080-QN9090
Hersteller: NXP USA Inc.
Description: QN9090 BLE SOC DEV KIT
Utilized IC / Part: QN9090
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: QN9090
Packaging: Bulk
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S9S08DZ60F2MLHR
S9S08DZ60F2MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Produkt ist nicht verfügbar
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74HCT573N/C4112 PHGL-S-A0001574510-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: BUS DRIVER, HCT SERIES, 8-BIT
Part Status: Active
Supplier Device Package: 20-DIP
Delay Time - Propagation: 17ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Through Hole
Output Type: Tri-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1059TKJ TJA1059.pdf
TJA1059TKJ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 6000 Stücke:
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6000+3.49 EUR
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TJA1059TKJ TJA1059.pdf
TJA1059TKJ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 17851 Stücke:
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4+6.53 EUR
10+4.91 EUR
25+4.51 EUR
100+4.06 EUR
250+3.84 EUR
500+3.81 EUR
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FS32K146HRT0VLQR S32K1xx.pdf
FS32K146HRT0VLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G17GW/S400125 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GW/S400125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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