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LPC5526JBD100K LPC5526JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 387 Stücke:
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10+6.63 EUR
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LPC5516JEV98E LPC5516JEV98E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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10+10.45 EUR
25+9.66 EUR
80+8.92 EUR
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LPC55S66JBD64K LPC55S66JBD64K NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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LPC55S26JEV98K LPC55S26JEV98K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S28JBD64K LPC55S28JBD64K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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10+12.52 EUR
25+11.61 EUR
100+10.61 EUR
250+10.14 EUR
800+9.69 EUR
1600+9.48 EUR
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LPC55S28JBD100K LPC55S28JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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10+11.94 EUR
24+11.1 EUR
80+10.25 EUR
230+9.7 EUR
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LPC55S16JEV98E LPC55S16JEV98E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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100+8.82 EUR
260+8.4 EUR
520+8.15 EUR
1040+7.96 EUR
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LPC5528JBD100K LPC5528JBD100K NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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80+7.65 EUR
230+7.6 EUR
450+7.59 EUR
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LPC5512JBD100E LPC5512JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S14JBD100E LPC55S14JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC5516JBD100E LPC5516JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S16JBD100E LPC55S16JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC5512JBD64E LPC5512JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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LPC5514JBD100E LPC5514JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
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LPC55S66JEV98K LPC55S66JEV98K NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHV/N208Q/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF4000EL/101S500Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
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SAF4000EL/101S504Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PDTC143XQA147 PDTC143XQA147 NXP USA Inc. PDTC143X_123J_143Z_114YQA_SER.pdf Description: TRANS PREBIAS
Part Status: Active
Packaging: Bulk
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Qualification: AEC-Q101
Resistor - Emitter Base (R2): 10 kOhms
Resistor - Base (R1): 4.7 kOhms
Frequency - Transition: 230 MHz
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Produkt ist nicht verfügbar
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PDTC143EQA147 NXP USA Inc. PDTC143_114_124_144EQA_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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OM15080-QN9090 OM15080-QN9090 NXP USA Inc. QN9090(T)QN9030(T).pdf Description: QN9090 BLE SOC DEV KIT
Utilized IC / Part: QN9090
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: QN9090
Packaging: Bulk
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S9S08DZ60F2MLHR S9S08DZ60F2MLHR NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Produkt ist nicht verfügbar
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74HCT573N/C4112 NXP USA Inc. PHGL-S-A0001574510-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, HCT SERIES, 8-BIT
Part Status: Active
Supplier Device Package: 20-DIP
Delay Time - Propagation: 17ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Through Hole
Output Type: Tri-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1059TKJ TJA1059TKJ NXP USA Inc. TJA1059.pdf Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
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TJA1059TKJ TJA1059TKJ NXP USA Inc. TJA1059.pdf Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
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4+5.63 EUR
10+4.21 EUR
25+3.87 EUR
100+3.47 EUR
250+3.28 EUR
500+3.24 EUR
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FS32K146HRT0VLQR FS32K146HRT0VLQR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
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74LVC2G17GW/S400125 74LVC2G17GW/S400125 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC2G17GW/S911125 74LVC2G17GW/S911125 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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74LVC2G17GW132 74LVC2G17GW132 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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74LVC2G17GW-Q100125 74LVC2G17GW-Q100125 NXP USA Inc. 74LVC2G17_Q100.pdf Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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74LVC2G17GV-Q100125 74LVC2G17GV-Q100125 NXP USA Inc. 74LVC2G17_Q100.pdf Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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PEMI2STD/CM,115 PEMI2STD/CM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/16PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 20Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Bulk
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PEMI2QFN/CM,115 PEMI2QFN/CM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/16PF SMD
Number of Channels: 2
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Package / Case: 6-XFDFN
Packaging: Bulk
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74HC32PW/AU118 74HC32PW/AU118 NXP USA Inc. 74HC_HCT32.pdf Description: IC GATE OR 4CH 2-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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74HC32PW/S400118 74HC32PW/S400118 NXP USA Inc. 74HC_HCT32.pdf Description: IC GATE OR 4CH 2-INP 14TSSOP
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Produkt ist nicht verfügbar
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SAF5000EL/V100K NXP USA Inc. Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
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MF1PLUS8031DA8/03, NXP USA Inc. Description: CLHW
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PMBT4403/S911215 PMBT4403/S911215 NXP USA Inc. PHGL-S-A0000711722-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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2N7002/S711215 2N7002/S711215 NXP USA Inc. 1PS74SB23.pdf Description: N-CHANNEL SMALL SIGNAL MOSFET
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HEF4014BT-Q100118 HEF4014BT-Q100118 NXP USA Inc. HEF4014B_Q100.pdf Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/DG/B2115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/MI135 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/DG/B4115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/MI115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
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BAV99W/DG/B3115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Produkt ist nicht verfügbar
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PCAL9555AHF,128 PCAL9555AHF,128 NXP USA Inc. PCAL9555A.pdf Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9704PW/Q900J PCA9704PW/Q900J NXP USA Inc. PCA9704.pdf Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9704PW/Q900J PCA9704PW/Q900J NXP USA Inc. PCA9704.pdf Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PCAL6408AHKX PCAL6408AHKX NXP USA Inc. PCAL6408A.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16XQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-XQFN (1.8x2.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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BZX84-C2V7/DG/B2215 BZX84-C2V7/DG/B2215 NXP USA Inc. BZX84_SER.pdf Description: DIODE ZENER
Part Status: Active
Packaging: Bulk
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Operating Temperature: -65°C ~ 150°C (TJ)
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MPC8548ECVJAUJD MPC8548ECVJAUJD NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AUP2G3407GW125 NXP USA Inc. 74AUP2G3407.pdf Description: IC BUFFER NON-INVERT 3.6V SOT363
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: SOT-363
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74AUP2G3407GM125 NXP USA Inc. 74AUP2G3407.pdf Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP3G3404GD125 74AUP3G3404GD125 NXP USA Inc. 74AUP3G3404.pdf Description: IC BUF/INV 3-CIR 3-IN 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
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74AUP3G3404DC125 74AUP3G3404DC125 NXP USA Inc. 74AUP3G3404.pdf Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-VSSOP
Part Status: Active
Number of Circuits: 3
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UBA2037TS/N1,118 UBA2037TS/N1,118 NXP USA Inc. UBA2037.pdf Description: IC HID LAMP CNTRL 100KHZ 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Frequency: 100kHz
Type: HID Lamp Controller
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 10.5V ~ 13.5V
Supplier Device Package: 28-SSOP
Dimming: No
Current - Supply: 500 µA
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74ALVC74PW/S400118 NXP USA Inc. PHGLS11697-1.pdf?t.download=true&u=5oefqw Description: D FLIP-FLOP, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 425 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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PCA9411AUKZ PCA9411AUKZ NXP USA Inc. PCA9411.pdf Description: IC REG BOOST 5.25V 500MA 9WLCSP
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 500mA
Function: Step-Up
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 9-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Part Status: Active
Voltage - Output (Min/Fixed): 5.25V
Voltage - Input (Min): 2.5V
Synchronous Rectifier: Yes
Supplier Device Package: 9-WLCSP (1.24x1.24)
Topology: Boost
Voltage - Input (Max): 5.25V
Frequency - Switching: 3MHz
Output Configuration: Positive
Produkt ist nicht verfügbar
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74CBTLV3257DS-Q100118 74CBTLV3257DS-Q100118 NXP USA Inc. 74CBTLV3257.pdf Description: MUX AND DEMUX/DECODER
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA1708DB1168UL NXP USA Inc. UM10727.pdf Description: EVAL BOARD FOR TEA1708
Packaging: Bulk
Function: Capacitor Discharger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1708
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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LPC5526JBD100K LPC55S2x_LPC552x.pdf
LPC5526JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC5516JEV98E LPC55S1x_LPC551x_DS.pdf
LPC5516JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+13.57 EUR
10+10.45 EUR
25+9.66 EUR
80+8.92 EUR
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LPC55S66JBD64K LPC55S6x.pdf
LPC55S66JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 244 Stücke:
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2+12.67 EUR
10+9.76 EUR
25+9.03 EUR
100+8.22 EUR
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LPC55S26JEV98K LPC55S2x_LPC552x.pdf
LPC55S26JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC55S28JBD64K LPC55S2x_LPC552x.pdf
LPC55S28JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2030 Stücke:
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2+16.12 EUR
10+12.52 EUR
25+11.61 EUR
100+10.61 EUR
250+10.14 EUR
800+9.69 EUR
1600+9.48 EUR
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LPC55S28JBD100K LPC55S2x_LPC552x.pdf
LPC55S28JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 353 Stücke:
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2+15.41 EUR
10+11.94 EUR
24+11.1 EUR
80+10.25 EUR
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LPC55S16JEV98E LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+13.53 EUR
10+10.44 EUR
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100+8.82 EUR
260+8.4 EUR
520+8.15 EUR
1040+7.96 EUR
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LPC5528JBD100K LPC55S2x_LPC552x.pdf
LPC5528JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 716 Stücke:
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2+11.29 EUR
10+8.01 EUR
24+7.84 EUR
80+7.65 EUR
230+7.6 EUR
450+7.59 EUR
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LPC5512JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5512JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S14JBD100E LPC55S1x_LPC551x_DS.pdf
LPC55S14JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
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2+14.53 EUR
10+11.42 EUR
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LPC5516JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5516JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 219 Stücke:
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2+11.71 EUR
10+8.98 EUR
24+8.33 EUR
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LPC55S16JBD100E LPC55S1x_LPC551x_DS.pdf
LPC55S16JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
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AnzahlPrivatkunde
2+16.98 EUR
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LPC5512JBD64E LPC55S1x_LPC551x_DS.pdf
LPC5512JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 18 Stücke:
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3+8.04 EUR
10+6.08 EUR
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LPC5514JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5514JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 84 Stücke:
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2+13.4 EUR
10+10.53 EUR
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LPC55S66JEV98K LPC55S6x.pdf
LPC55S66JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 98-VFBGA (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SAF775CHV/N208Q/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SAF4000EL/101S500Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
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SAF4000EL/101S504Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PDTC143XQA147 PDTC143X_123J_143Z_114YQA_SER.pdf
PDTC143XQA147
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Part Status: Active
Packaging: Bulk
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Qualification: AEC-Q101
Resistor - Emitter Base (R2): 10 kOhms
Resistor - Base (R1): 4.7 kOhms
Frequency - Transition: 230 MHz
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Produkt ist nicht verfügbar
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PDTC143EQA147 PDTC143_114_124_144EQA_SER.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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OM15080-QN9090 QN9090(T)QN9030(T).pdf
OM15080-QN9090
Hersteller: NXP USA Inc.
Description: QN9090 BLE SOC DEV KIT
Utilized IC / Part: QN9090
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: QN9090
Packaging: Bulk
auf Bestellung 4 Stücke:
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1+63.93 EUR
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S9S08DZ60F2MLHR
S9S08DZ60F2MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Produkt ist nicht verfügbar
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74HCT573N/C4112 PHGL-S-A0001574510-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: BUS DRIVER, HCT SERIES, 8-BIT
Part Status: Active
Supplier Device Package: 20-DIP
Delay Time - Propagation: 17ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Through Hole
Output Type: Tri-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1059TKJ TJA1059.pdf
TJA1059TKJ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 6000 Stücke:
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AnzahlPrivatkunde
6000+2.98 EUR
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TJA1059TKJ TJA1059.pdf
TJA1059TKJ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 17981 Stücke:
Lieferzeit 10-14 Tag (e)
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4+5.63 EUR
10+4.21 EUR
25+3.87 EUR
100+3.47 EUR
250+3.28 EUR
500+3.24 EUR
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FS32K146HRT0VLQR S32K1xx.pdf
FS32K146HRT0VLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G17GW/S400125 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GW/S400125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC2G17GW/S911125 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GW/S911125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC2G17GW132 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GW132
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC2G17GW-Q100125 74LVC2G17_Q100.pdf
74LVC2G17GW-Q100125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC2G17GV-Q100125 74LVC2G17_Q100.pdf
74LVC2G17GV-Q100125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PEMI2STD/CM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/16PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 20Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Bulk
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PEMI2QFN/CM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/CM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/16PF SMD
Number of Channels: 2
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Package / Case: 6-XFDFN
Packaging: Bulk
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74HC32PW/AU118 74HC_HCT32.pdf
74HC32PW/AU118
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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74HC32PW/S400118 74HC_HCT32.pdf
74HC32PW/S400118
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14TSSOP
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Produkt ist nicht verfügbar
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SAF5000EL/V100K
Hersteller: NXP USA Inc.
Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
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MF1PLUS8031DA8/03,
Hersteller: NXP USA Inc.
Description: CLHW
Produkt ist nicht verfügbar
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PMBT4403/S911215 PHGL-S-A0000711722-1.pdf?t.download=true&u=5oefqw
PMBT4403/S911215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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15000+0.038 EUR
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2N7002/S711215 1PS74SB23.pdf
2N7002/S711215
Hersteller: NXP USA Inc.
Description: N-CHANNEL SMALL SIGNAL MOSFET
Produkt ist nicht verfügbar
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HEF4014BT-Q100118 HEF4014B_Q100.pdf
HEF4014BT-Q100118
Hersteller: NXP USA Inc.
Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/DG/B2115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/MI135 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/DG/B4115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Produkt ist nicht verfügbar
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BAV99W/MI115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Produkt ist nicht verfügbar
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BAV99W/DG/B3115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Supplier Device Package: SOT-323
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 100 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Produkt ist nicht verfügbar
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PCAL9555AHF,128 PCAL9555A.pdf
PCAL9555AHF,128
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 9652 Stücke:
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7+3.36 EUR
10+2.45 EUR
25+2.23 EUR
100+1.99 EUR
250+1.87 EUR
500+1.8 EUR
1000+1.76 EUR
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PCA9704PW/Q900J PCA9704.pdf
PCA9704PW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9704PW/Q900J PCA9704.pdf
PCA9704PW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 622 Stücke:
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3+8.84 EUR
10+6.71 EUR
25+6.18 EUR
100+5.59 EUR
250+5.32 EUR
500+5.22 EUR
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PCAL6408AHKX PCAL6408A.pdf
PCAL6408AHKX
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16XQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-XQFN (1.8x2.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 21849 Stücke:
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10+2.14 EUR
14+1.54 EUR
25+1.39 EUR
100+1.23 EUR
250+1.15 EUR
500+1.11 EUR
1000+1.06 EUR
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BZX84-C2V7/DG/B2215 BZX84_SER.pdf
BZX84-C2V7/DG/B2215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Part Status: Active
Packaging: Bulk
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Operating Temperature: -65°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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MPC8548ECVJAUJD MPC8548EEC.pdf
MPC8548ECVJAUJD
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AUP2G3407GW125 74AUP2G3407.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V SOT363
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: SOT-363
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74AUP2G3407GM125 74AUP2G3407.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP3G3404GD125 74AUP3G3404.pdf
74AUP3G3404GD125
Hersteller: NXP USA Inc.
Description: IC BUF/INV 3-CIR 3-IN 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
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333+1.65 EUR
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74AUP3G3404DC125 74AUP3G3404.pdf
74AUP3G3404DC125
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-VSSOP
Part Status: Active
Number of Circuits: 3
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666+0.89 EUR
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UBA2037TS/N1,118 UBA2037.pdf
UBA2037TS/N1,118
Hersteller: NXP USA Inc.
Description: IC HID LAMP CNTRL 100KHZ 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Frequency: 100kHz
Type: HID Lamp Controller
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 10.5V ~ 13.5V
Supplier Device Package: 28-SSOP
Dimming: No
Current - Supply: 500 µA
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182+3.28 EUR
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74ALVC74PW/S400118 PHGLS11697-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 425 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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PCA9411AUKZ PCA9411.pdf
PCA9411AUKZ
Hersteller: NXP USA Inc.
Description: IC REG BOOST 5.25V 500MA 9WLCSP
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 500mA
Function: Step-Up
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 9-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Part Status: Active
Voltage - Output (Min/Fixed): 5.25V
Voltage - Input (Min): 2.5V
Synchronous Rectifier: Yes
Supplier Device Package: 9-WLCSP (1.24x1.24)
Topology: Boost
Voltage - Input (Max): 5.25V
Frequency - Switching: 3MHz
Output Configuration: Positive
Produkt ist nicht verfügbar
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74CBTLV3257DS-Q100118 74CBTLV3257.pdf
74CBTLV3257DS-Q100118
Hersteller: NXP USA Inc.
Description: MUX AND DEMUX/DECODER
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA1708DB1168UL UM10727.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1708
Packaging: Bulk
Function: Capacitor Discharger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1708
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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