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HEF4051BTT-Q100118 HEF4051BTT-Q100118 NXP USA Inc. HEF4051B_Q100.pdf Description: SINGLE-ENDED MUX, 8 CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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HEF4051BT/S999118 HEF4051BT/S999118 NXP USA Inc. HEF4051B.pdf Description: SINGLE-ENDED MUX, 8 CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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HEF4051BTT/S411118 HEF4051BTT/S411118 NXP USA Inc. HEF4051B.pdf Description: SINGLE-ENDED MUX, 8 CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC595PW-Q100118 74AHC595PW-Q100118 NXP USA Inc. 74AHC_AHCT595_Q100.pdf Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84-C5V1/215 NXP USA Inc. Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Produkt ist nicht verfügbar
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BZX84-C5V1/DG/B3235 BZX84-C5V1/DG/B3235 NXP USA Inc. BZX84_SER.pdf Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: TO-236AB
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Produkt ist nicht verfügbar
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BZX84-C13/DG/B2215 BZX84-C13/DG/B2215 NXP USA Inc. BZX84_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
auf Bestellung 78000 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.032 EUR
Mindestbestellmenge: 15000
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BZX84-C13/DG/B3215 BZX84-C13/DG/B3215 NXP USA Inc. BZX84_SER.pdf Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 13.25 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Qualification: AEC-Q101
auf Bestellung 18000 Stücke:
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18000+0.032 EUR
Mindestbestellmenge: 18000
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NX5P3090UKZ NX5P3090UKZ NXP USA Inc. NX5P3090.pdf Description: IC PWR SWITCH 1:1 12WLCSP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.65x1.35)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
auf Bestellung 42000 Stücke:
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3000+0.86 EUR
6000+0.84 EUR
9000+0.83 EUR
15000+0.82 EUR
Mindestbestellmenge: 3000
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NX5P3090UKZ NX5P3090UKZ NXP USA Inc. NX5P3090.pdf Description: IC PWR SWITCH 1:1 12WLCSP
Features: Status Flag
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.65x1.35)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
auf Bestellung 43602 Stücke:
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10+1.8 EUR
14+1.3 EUR
25+1.18 EUR
100+1.04 EUR
250+0.97 EUR
500+0.94 EUR
1000+0.9 EUR
Mindestbestellmenge: 10
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PDTB143XU115 PDTB143XU115 NXP USA Inc. PDTB1XXXU_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 130700 Stücke:
Lieferzeit 10-14 Tag (e)
8036+0.064 EUR
Mindestbestellmenge: 8036
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PDTB143XU135 PDTB143XU135 NXP USA Inc. PDTB1XXXU_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 59424 Stücke:
Lieferzeit 10-14 Tag (e)
8036+0.064 EUR
Mindestbestellmenge: 8036
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PDTB143XT215 PDTB143XT215 NXP USA Inc. PDTB1XXXT_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
auf Bestellung 27000 Stücke:
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PDTB143EU135 PDTB143EU135 NXP USA Inc. PDTB1XXXU_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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PDTB143XQA147 PDTB143XQA147 NXP USA Inc. PDTB113Z_123Y_143XQA_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 325 mW
Frequency - Transition: 150 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
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8219+0.064 EUR
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PDTB143ET215 PDTB143ET215 NXP USA Inc. PDTB1XXXT_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 320 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PDTB143EQA147 PDTB143EQA147 NXP USA Inc. PDTB113_123_143_114EQA_SER.pdf Description: TRANS PREBIAS PNP 50V 0.5A 3DFN
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 325 mW
Frequency - Transition: 150 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Produkt ist nicht verfügbar
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FXPS7550DI4T1 FXPS7550DI4T1 NXP USA Inc. FXPS7550D4.pdf Description: SENSOR 79.77PSIA 32BIT 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount, Wettable Flank
Output: 32 b
Operating Pressure: 2.9PSI ~ 79.77PSI (20kPa ~ 550kPa)
Pressure Type: Absolute
Accuracy: ±0.51PSI (±3.5kPa)
Operating Temperature: -40°C ~ 130°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 3.1V ~ 5.25V
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Maximum Pressure: 12.62PSI (87kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXPS7550DS4T1 FXPS7550DS4T1 NXP USA Inc. FXPS7550D4.pdf Description: SENSOR 79.77PSIA 32BIT 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount, Wettable Flank
Output: 32 b
Operating Pressure: 2.9PSI ~ 79.77PSI (20kPa ~ 550kPa)
Pressure Type: Absolute
Accuracy: ±0.51PSI (±3.5kPa)
Operating Temperature: -40°C ~ 130°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 3.1V ~ 5.25V
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Maximum Pressure: 12.62PSI (87kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PEMI2QFN/HM,115 PEMI2QFN/HM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 15000 Stücke:
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3122+0.16 EUR
Mindestbestellmenge: 3122
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PCA9516APW,112 PCA9516APW,112 NXP USA Inc. PCA9516A.pdf Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
auf Bestellung 4151 Stücke:
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283+1.87 EUR
Mindestbestellmenge: 283
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BT138-800E/DG127 BT138-800E/DG127 NXP USA Inc. PHGLS28583-1.pdf?t.download=true&u=5oefqw Description: TRIAC SENS GATE 800V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 90A, 100A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Active
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 800 V
Produkt ist nicht verfügbar
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LS1021ASN7HNB LS1021ASN7HNB NXP USA Inc. LS1021AFS.pdf Description: IC MPU QORIQ 800MHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 3.0 (1) + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3L, DDR4
Display & Interface Controllers: 2D-ACE
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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S9S08RN16W2MTJR S9S08RN16W2MTJR NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
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S9S08RN16W2VLC S9S08RN16W2VLC NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MLF S9S08RN16W2MLF NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MLC S9S08RN16W2MLC NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MLFR S9S08RN16W2MLFR NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MTG S9S08RN16W2MTG NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MTJ S9S08RN16W2MTJ NXP USA Inc. S9S08RN16DS.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
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S9S08AW32E5CFGER S9S08AW32E5CFGER NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0CLKR S9S08LG32J0CLKR NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN32F2VLCR S9S08DN32F2VLCR NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW48E5CFGER S9S08AW48E5CFGER NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN48F2VLFR S9S08DN48F2VLFR NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08AW48E5VFDE S9S08AW48E5VFDE NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 48QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08DV96F2CLFR S9S08DV96F2CLFR NXP USA Inc. Description: IC MCU 8BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08AW48E5CFGE S9S08AW48E5CFGE NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08AW60E5CPUER S9S08AW60E5CPUER NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW48E5MPUER S9S08AW48E5MPUER NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08DZ60F2MLCR S9S08DZ60F2MLCR NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 32LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08AW48E5VPUE S9S08AW48E5VPUE NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08DN48F2VLF S9S08DN48F2VLF NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08AW48E5MPUE S9S08AW48E5MPUE NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S08DN32F2MLH S9S08DN32F2MLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
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S9S08DZ32F2VLF S9S08DZ32F2VLF NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
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S9S12DG12F1VFUE S9S12DG12F1VFUE NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
USB-KW38 USB-KW38 NXP USA Inc. USB-KW38_QSG.pdf Description: WIRELESS PACKET SNIFFER USB
Packaging: Bulk
For Use With/Related Products: KW38
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: KW38
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
1+120.82 EUR
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LPC1830FET180,551 LPC1830FET180,551 NXP USA Inc. LPC1850_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
auf Bestellung 179 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.61 EUR
10+11.96 EUR
25+11.75 EUR
Mindestbestellmenge: 2
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MC33910G5ACR2 MC33910G5ACR2 NXP USA Inc. MC33910.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33910G5ACR2 MC33910G5ACR2 NXP USA Inc. MC33910.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.15 EUR
10+8.21 EUR
25+7.76 EUR
100+6.72 EUR
250+6.38 EUR
500+5.72 EUR
1000+4.83 EUR
Mindestbestellmenge: 2
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MFRC52202HN1 MFRC52202HN1 NXP USA Inc. PHGL-S-A0001050489-1.pdf?t.download=true&u=5oefqw Description: IC READER 32-HVQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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OM11074598 NXP USA Inc. Description: IRD-LPC1768-DEV - INDUSTRIAL CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MPC5746R-176DS MPC5746R-176DS NXP USA Inc. MPC5746REVB176UG.pdf Description: MPC5746R EVAL BRD
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
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Z0107NA0116 Z0107NA0116 NXP USA Inc. WEEN-S-A0001703492-1.pdf?t.download=true&u=5oefqw Description: TRIAC TO92
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TEA1761T/N2/DG TEA1761T/N2/DG NXP USA Inc. TEA1761T.pdf Description: SWITCHING REGULATOR/CONTROLLER,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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HEF4030BT-Q100118 NXP USA Inc. Description: XOR GATE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAT54CW/6115 BAT54CW/6115 NXP USA Inc. PHGLS25811-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOT 30V 200MA SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC56F8006VWLR MC56F8006VWLR NXP USA Inc. MC56F8006.pdf Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPXHZ6400AC6T1,128 NXP USA Inc. FSCL-S-A0001281361-1.pdf?t.download=true&u=5oefqw Description: 20 TO 400 KPA, ABSOLUTE, INTEGRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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HEF4051BTT-Q100118 HEF4051B_Q100.pdf
HEF4051BTT-Q100118
Hersteller: NXP USA Inc.
Description: SINGLE-ENDED MUX, 8 CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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HEF4051BT/S999118 HEF4051B.pdf
HEF4051BT/S999118
Hersteller: NXP USA Inc.
Description: SINGLE-ENDED MUX, 8 CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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HEF4051BTT/S411118 HEF4051B.pdf
HEF4051BTT/S411118
Hersteller: NXP USA Inc.
Description: SINGLE-ENDED MUX, 8 CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC595PW-Q100118 74AHC_AHCT595_Q100.pdf
74AHC595PW-Q100118
Hersteller: NXP USA Inc.
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84-C5V1/215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Produkt ist nicht verfügbar
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BZX84-C5V1/DG/B3235 BZX84_SER.pdf
BZX84-C5V1/DG/B3235
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: TO-236AB
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Produkt ist nicht verfügbar
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BZX84-C13/DG/B2215 BZX84_SER.pdf
BZX84-C13/DG/B2215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
auf Bestellung 78000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.032 EUR
Mindestbestellmenge: 15000
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BZX84-C13/DG/B3215 BZX84_SER.pdf
BZX84-C13/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 13.25 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Qualification: AEC-Q101
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
18000+0.032 EUR
Mindestbestellmenge: 18000
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NX5P3090UKZ NX5P3090.pdf
NX5P3090UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.65x1.35)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
auf Bestellung 42000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.86 EUR
6000+0.84 EUR
9000+0.83 EUR
15000+0.82 EUR
Mindestbestellmenge: 3000
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NX5P3090UKZ NX5P3090.pdf
NX5P3090UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Status Flag
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 34mOhm
Input Type: Non-Inverting
Voltage - Load: 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.65x1.35)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
auf Bestellung 43602 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.8 EUR
14+1.3 EUR
25+1.18 EUR
100+1.04 EUR
250+0.97 EUR
500+0.94 EUR
1000+0.9 EUR
Mindestbestellmenge: 10
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PDTB143XU115 PDTB1XXXU_SER.pdf
PDTB143XU115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 130700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8036+0.064 EUR
Mindestbestellmenge: 8036
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PDTB143XU135 PDTB1XXXU_SER.pdf
PDTB143XU135
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 59424 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8036+0.064 EUR
Mindestbestellmenge: 8036
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PDTB143XT215 PDTB1XXXT_SER.pdf
PDTB143XT215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
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PDTB143EU135 PDTB1XXXU_SER.pdf
PDTB143EU135
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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PDTB143XQA147 PDTB113Z_123Y_143XQA_SER.pdf
PDTB143XQA147
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 325 mW
Frequency - Transition: 150 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8219+0.064 EUR
Mindestbestellmenge: 8219
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PDTB143ET215 PDTB1XXXT_SER.pdf
PDTB143ET215
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: TO-236AB
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 320 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PDTB143EQA147 PDTB113_123_143_114EQA_SER.pdf
PDTB143EQA147
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.5A 3DFN
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 325 mW
Frequency - Transition: 150 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 4.7 kOhms
Produkt ist nicht verfügbar
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FXPS7550DI4T1 FXPS7550D4.pdf
FXPS7550DI4T1
Hersteller: NXP USA Inc.
Description: SENSOR 79.77PSIA 32BIT 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount, Wettable Flank
Output: 32 b
Operating Pressure: 2.9PSI ~ 79.77PSI (20kPa ~ 550kPa)
Pressure Type: Absolute
Accuracy: ±0.51PSI (±3.5kPa)
Operating Temperature: -40°C ~ 130°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 3.1V ~ 5.25V
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Maximum Pressure: 12.62PSI (87kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXPS7550DS4T1 FXPS7550D4.pdf
FXPS7550DS4T1
Hersteller: NXP USA Inc.
Description: SENSOR 79.77PSIA 32BIT 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount, Wettable Flank
Output: 32 b
Operating Pressure: 2.9PSI ~ 79.77PSI (20kPa ~ 550kPa)
Pressure Type: Absolute
Accuracy: ±0.51PSI (±3.5kPa)
Operating Temperature: -40°C ~ 130°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 3.1V ~ 5.25V
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Maximum Pressure: 12.62PSI (87kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PEMI2QFN/HM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/HM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3122+0.16 EUR
Mindestbestellmenge: 3122
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PCA9516APW,112 PCA9516A.pdf
PCA9516APW,112
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
auf Bestellung 4151 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
283+1.87 EUR
Mindestbestellmenge: 283
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BT138-800E/DG127 PHGLS28583-1.pdf?t.download=true&u=5oefqw
BT138-800E/DG127
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 90A, 100A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Active
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 800 V
Produkt ist nicht verfügbar
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LS1021ASN7HNB LS1021AFS.pdf
LS1021ASN7HNB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 3.0 (1) + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3L, DDR4
Display & Interface Controllers: 2D-ACE
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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S9S08RN16W2MTJR S9S08RN16DS.pdf
S9S08RN16W2MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
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S9S08RN16W2VLC S9S08RN16DS.pdf
S9S08RN16W2VLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MLF S9S08RN16DS.pdf
S9S08RN16W2MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MLC S9S08RN16DS.pdf
S9S08RN16W2MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MLFR S9S08RN16DS.pdf
S9S08RN16W2MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MTG S9S08RN16DS.pdf
S9S08RN16W2MTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN16W2MTJ S9S08RN16DS.pdf
S9S08RN16W2MTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
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S9S08AW32E5CFGER
S9S08AW32E5CFGER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0CLKR MC9S08LG32.pdf
S9S08LG32J0CLKR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN32F2VLCR
S9S08DN32F2VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW48E5CFGER
S9S08AW48E5CFGER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN48F2VLFR
S9S08DN48F2VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW48E5VFDE
S9S08AW48E5VFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Produkt ist nicht verfügbar
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S9S08DV96F2CLFR
S9S08DV96F2CLFR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW48E5CFGE
S9S08AW48E5CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW60E5CPUER
S9S08AW60E5CPUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW48E5MPUER MC9S08AC16.pdf
S9S08AW48E5MPUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DZ60F2MLCR
S9S08DZ60F2MLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Produkt ist nicht verfügbar
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S9S08AW48E5VPUE
S9S08AW48E5VPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN48F2VLF
S9S08DN48F2VLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Produkt ist nicht verfügbar
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S9S08AW48E5MPUE MC9S08AC16.pdf
S9S08AW48E5MPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN32F2MLH
S9S08DN32F2MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
Produkt ist nicht verfügbar
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S9S08DZ32F2VLF
S9S08DZ32F2VLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
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S9S12DG12F1VFUE
S9S12DG12F1VFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Produkt ist nicht verfügbar
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USB-KW38 USB-KW38_QSG.pdf
USB-KW38
Hersteller: NXP USA Inc.
Description: WIRELESS PACKET SNIFFER USB
Packaging: Bulk
For Use With/Related Products: KW38
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: KW38
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+120.82 EUR
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LPC1830FET180,551 LPC1850_30_20_10.pdf
LPC1830FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
auf Bestellung 179 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.61 EUR
10+11.96 EUR
25+11.75 EUR
Mindestbestellmenge: 2
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MC33910G5ACR2 MC33910.pdf
MC33910G5ACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
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MC33910G5ACR2 MC33910.pdf
MC33910G5ACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.15 EUR
10+8.21 EUR
25+7.76 EUR
100+6.72 EUR
250+6.38 EUR
500+5.72 EUR
1000+4.83 EUR
Mindestbestellmenge: 2
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MFRC52202HN1 PHGL-S-A0001050489-1.pdf?t.download=true&u=5oefqw
MFRC52202HN1
Hersteller: NXP USA Inc.
Description: IC READER 32-HVQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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OM11074598
Hersteller: NXP USA Inc.
Description: IRD-LPC1768-DEV - INDUSTRIAL CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MPC5746R-176DS MPC5746REVB176UG.pdf
MPC5746R-176DS
Hersteller: NXP USA Inc.
Description: MPC5746R EVAL BRD
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
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Z0107NA0116 WEEN-S-A0001703492-1.pdf?t.download=true&u=5oefqw
Z0107NA0116
Hersteller: NXP USA Inc.
Description: TRIAC TO92
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1761T/N2/DG TEA1761T.pdf
TEA1761T/N2/DG
Hersteller: NXP USA Inc.
Description: SWITCHING REGULATOR/CONTROLLER,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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HEF4030BT-Q100118
Hersteller: NXP USA Inc.
Description: XOR GATE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAT54CW/6115 PHGLS25811-1.pdf?t.download=true&u=5oefqw
BAT54CW/6115
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOT 30V 200MA SOT323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC56F8006VWLR MC56F8006.pdf
MC56F8006VWLR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPXHZ6400AC6T1,128 FSCL-S-A0001281361-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: 20 TO 400 KPA, ABSOLUTE, INTEGRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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