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74HC173DB112 74HC173DB112 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SNGL 4BIT 16SSOP
Number of Bits per Element: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Supplier Device Package: 16-SSOP
Input Capacitance: 3.5 pF
Clock Frequency: 95 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 7.8mA, 7.8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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MRF1550NT1,528 NXP USA Inc. FSCLS04574-1.pdf?t.download=true&u=5oefqw Description: RF POWER FIELD-EFFECT TRANSISTOR
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MPC8271ZQTIEA557 MPC8271ZQTIEA557 NXP USA Inc. MPC8272EC.pdf Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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PUMD17/ZL115 NXP USA Inc. PEMD17_PUMD17.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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BF824235 BF824235 NXP USA Inc. BF824.pdf Description: NOW NEXPERIA SMALL SIGNAL BIP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW-Q100118 NXP USA Inc. 74LVC14A_Q100.pdf Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14ABQ-Q100115 NXP USA Inc. 74LVC14A_Q100.pdf Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14APW/S999118 NXP USA Inc. 74LVC14A.pdf Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14APW/C2118 74LVC14APW/C2118 NXP USA Inc. PHGLS24066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 6-INP 14TSSOP
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/AU118 74LVC14APW/AU118 NXP USA Inc. PHGLS24066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/S505118 74LVC14APW/S505118 NXP USA Inc. 74LVC14A.pdf Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/S400118 74LVC14APW/S400118 NXP USA Inc. 74LVC14A.pdf Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 1.05V ~ 2V
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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BGU7008,115 BGU7008,115 NXP USA Inc. BGU7008.pdf Description: IC AMP GALILEO 1575.42MHZ 6XSON
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.559GHz ~ 1.61GHz
P1dB: -14dBm
Noise Figure: 1.2dB
Current - Supply: 12.8mA
Gain: 19.5dB
Voltage - Supply: 1.5V ~ 2.85V
RF Type: Galileo, GLONASS, GPS
Frequency: 1575.42MHz
Mounting Type: Surface Mount
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100+1.69 EUR
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500+1.54 EUR
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LPC1111FHN33/103551 LPC1111FHN33/103551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111JHN33/103551 LPC1111JHN33/103551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111FHN33/202551 LPC1111FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
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LPC1111FHN33/101551 LPC1111FHN33/101551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Produkt ist nicht verfügbar
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LPC1112LVFHN24/003151 LPC1112LVFHN24/003151 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 24HVQFN
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LPC1111FHN33/201,5 LPC1111FHN33/201,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1112FHN33/202551 LPC1112FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
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LPC1112JHN33/203551 LPC1112JHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112FHI33/203551 LPC1112FHI33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
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LPC1113FHN33/203551 LPC1113FHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
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LPC1113FHN33/202551 LPC1113FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
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LPC1113FHN33/203,5 LPC1113FHN33/203,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
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LPC1114LVFHN24/103151 LPC1114LVFHN24/103151 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
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LPC1113JHN33/203551 LPC1113JHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1112FHN33/201551 LPC1112FHN33/201551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
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LPC1112LVFHI33/103 LPC1112LVFHI33/103 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 27
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
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167+3.32 EUR
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LPC1113FHN33/303551 LPC1113FHN33/303551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
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LPC1112LVFHI33/103551 LPC1112LVFHI33/103551 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Core Processor: ARM® Cortex®-M0
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LPC1114FHN33/203551 LPC1114FHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/202551 LPC1114FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Packaging: Bulk
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LPC1113FHN33/301551 LPC1113FHN33/301551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
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LPC1113FBD48/303151 LPC1113FBD48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 48LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/303 LPC1114FHN33/303 NXP USA Inc. PHGLS29589-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S10FET100551 NXP USA Inc. PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 100TFBGA
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LPC54606J256ET100551 LPC54606J256ET100551 NXP USA Inc. PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4370FET100551 LPC4370FET100551 NXP USA Inc. PHGLS29822-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
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LPC43S70FET100551 NXP USA Inc. PHGL-S-A0001691352-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
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LPC1812JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1813JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1823JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1815JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 180MHz
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LPC1833JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1817JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4313JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1827JET100551 LPC1827JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4323JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1837JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC18S37JET100551 NXP USA Inc. PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4333JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC4325JET100551 LPC4325JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC4327JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4337JET100551 LPC4337JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
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LPC43S37JET100551 NXP USA Inc. PHGL-S-A0001691376-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC43S67JET100551 NXP USA Inc. PHGL-S-A0001691607-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 154K x 8
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LPC54606J512ET100551 LPC54606J512ET100551 NXP USA Inc. PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC4367JET100551 NXP USA Inc. PHGL-S-A0001691629-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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BAW56SRA147 NXP USA Inc. BAW56QA.pdf Description: BAW56 - QUAD HIGH-SPEED SWITCHIN
Packaging: Bulk
Part Status: Active
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74HC173DB112 74HC_HCT173.pdf
74HC173DB112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16SSOP
Number of Bits per Element: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Supplier Device Package: 16-SSOP
Input Capacitance: 3.5 pF
Clock Frequency: 95 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 7.8mA, 7.8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 1092 Stücke:
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AnzahlPrivatkunde
1092+0.68 EUR
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MRF1550NT1,528 FSCLS04574-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
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MPC8271ZQTIEA557 MPC8272EC.pdf
MPC8271ZQTIEA557
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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PUMD17/ZL115 PEMD17_PUMD17.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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BF824235 BF824.pdf
BF824235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIP
Part Status: Active
Packaging: Bulk
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74LVC14APW-Q100118 74LVC14A_Q100.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14ABQ-Q100115 74LVC14A_Q100.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14APW/S999118 74LVC14A.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14APW/C2118 PHGLS24066-1.pdf?t.download=true&u=5oefqw
74LVC14APW/C2118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 6-INP 14TSSOP
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/AU118 PHGLS24066-1.pdf?t.download=true&u=5oefqw
74LVC14APW/AU118
Hersteller: NXP USA Inc.
Description: IC INVERTER
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
auf Bestellung 12115 Stücke:
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3328+0.17 EUR
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74LVC14APW/S505118 74LVC14A.pdf
74LVC14APW/S505118
Hersteller: NXP USA Inc.
Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/S400118 74LVC14A.pdf
74LVC14APW/S400118
Hersteller: NXP USA Inc.
Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 1.05V ~ 2V
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
auf Bestellung 7500 Stücke:
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AnzahlPrivatkunde
3328+0.17 EUR
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BGU7008,115 BGU7008.pdf
BGU7008,115
Hersteller: NXP USA Inc.
Description: IC AMP GALILEO 1575.42MHZ 6XSON
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.559GHz ~ 1.61GHz
P1dB: -14dBm
Noise Figure: 1.2dB
Current - Supply: 12.8mA
Gain: 19.5dB
Voltage - Supply: 1.5V ~ 2.85V
RF Type: Galileo, GLONASS, GPS
Frequency: 1575.42MHz
Mounting Type: Surface Mount
auf Bestellung 5357 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.28 EUR
11+1.96 EUR
25+1.84 EUR
100+1.69 EUR
250+1.61 EUR
500+1.54 EUR
1000+1.48 EUR
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LPC1111FHN33/103551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/103551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111JHN33/103551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111JHN33/103551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1111FHN33/101551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/101551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 35 Stücke
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LPC1112LVFHN24/003151 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1112LVFHN24/003151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1111FHN33/201,5 UM10398.pdf
LPC1111FHN33/201,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
LPC1112FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1112JHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112JHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1112FHI33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHI33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1113FHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1113FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1113FHN33/203,5 UM10398.pdf
LPC1113FHN33/203,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
auf Bestellung 275 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
167+3.59 EUR
Mindestbestellmenge: 167 Stücke
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LPC1114LVFHN24/103151 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1113JHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113JHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1112FHN33/201551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHN33/201551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112LVFHI33/103 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHI33/103
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 27
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 2137 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
167+3.32 EUR
Mindestbestellmenge: 167 Stücke
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LPC1113FHN33/303551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1112LVFHI33/103551 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHI33/103551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1114FHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1114FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1113FHN33/301551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/301551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1113FBD48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FBD48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/303 PHGLS29589-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S10FET100551 PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 61 Stücke
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LPC54606J256ET100551 PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw
LPC54606J256ET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4370FET100551 PHGLS29822-1.pdf?t.download=true&u=5oefqw
LPC4370FET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Produkt ist nicht verfügbar
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LPC43S70FET100551 PHGL-S-A0001691352-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1812JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 37 Stücke
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LPC1813JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 38 Stücke
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LPC1823JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 34 Stücke
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LPC1815JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 180MHz
Produkt ist nicht verfügbar
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LPC1833JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 33 Stücke
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LPC1817JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
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LPC4313JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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28+23.68 EUR
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LPC1827JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1827JET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4323JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1837JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC18S37JET100551 PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4333JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC4325JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4325JET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
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LPC4327JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4337JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4337JET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC43S37JET100551 PHGL-S-A0001691376-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC43S67JET100551 PHGL-S-A0001691607-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 154K x 8
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LPC54606J512ET100551 PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw
LPC54606J512ET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC4367JET100551 PHGL-S-A0001691629-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
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BAW56SRA147 BAW56QA.pdf
Hersteller: NXP USA Inc.
Description: BAW56 - QUAD HIGH-SPEED SWITCHIN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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