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MPF5023AMBA0ES MPF5023AMBA0ES NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
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3+9.2 EUR
10+7 EUR
25+6.46 EUR
100+5.85 EUR
490+5.4 EUR
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74HC138DB118 74HC138DB118 NXP USA Inc. 74HC_HCT138.pdf Description: NOW NEXPERIA 74HC138DB - DECODER
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Produkt ist nicht verfügbar
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LPC54608J512BD208K LPC54608J512BD208K NXP USA Inc. LPC546XX.pdf Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 171
DigiKey Programmable: Not Verified
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10+19.66 EUR
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108+16.81 EUR
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74AVCM162836DGG118 74AVCM162836DGG118 NXP USA Inc. PHGLS16274-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
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74AVCM162836DGG112 74AVCM162836DGG112 NXP USA Inc. PHGLS16274-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
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74AVCM162834DGG112 74AVCM162834DGG112 NXP USA Inc. PHGLS16274-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
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74AVCM162834DGG11 74AVCM162834DGG11 NXP USA Inc. PHGLS16274-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
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MPF7100BMBA0ES MPF7100BMBA0ES NXP USA Inc. PF7100.pdf Description: PF7100 PMIC OTP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
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BZX84-C6V8215 BZX84-C6V8215 NXP USA Inc. BZX84_SER.pdf Description: NOW NEXPERIA BZX84-C6V8 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN5150HXMP PTN5150HXMP NXP USA Inc. PTN5150.pdf Description: IC USB HOST CTLR 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
Part Status: Active
DigiKey Programmable: Not Verified
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10+2.4 EUR
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250+1.82 EUR
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BAT54/LF1R BAT54/LF1R NXP USA Inc. Description: DIODE SCHOTTKY TO-236AB
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LPC43S50FET256551 LPC43S50FET256551 NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
Produkt ist nicht verfügbar
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MIMXRT1062CVJ5B MIMXRT1062CVJ5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+28.3 EUR
10+22.36 EUR
25+20.88 EUR
189+18.69 EUR
378+18.18 EUR
567+17.93 EUR
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MIMXRT1062DVJ6B MIMXRT1062DVJ6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+26.05 EUR
10+20.53 EUR
25+19.15 EUR
189+17.11 EUR
378+16.65 EUR
567+16.41 EUR
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74ABT04PW,118 74ABT04PW,118 NXP USA Inc. 74ABT04.pdf Description: IC INVERTER 6CH 6-INP 14TSSOP
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PCF7936AA/3851/C/6122 NXP USA Inc. NXP_75016809.pdf?t.download=true&u=ovmfp3 Description: IMMO TAGS
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MC908GZ32MFUE-NXP MC908GZ32MFUE-NXP NXP USA Inc. FSCL-S-A0001072420-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8 BIT, HC08/S08
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
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24+25.32 EUR
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LPC11E14FBD64/401,551 LPC11E14FBD64/401,551 NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
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LD6806TD/13P,125 LD6806TD/13P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.3V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6806TD/23P,125 LD6806TD/23P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.3V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6836TD/13P,125 LD6836TD/13P,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.3V 300MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6836TD13P125 LD6836TD13P125 NXP USA Inc. PHGLS25657-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR FIXED LDO REG
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Part Status: Active
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
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74HC173DB112 74HC173DB112 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SNGL 4BIT 16SSOP
Number of Bits per Element: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Supplier Device Package: 16-SSOP
Input Capacitance: 3.5 pF
Clock Frequency: 95 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 7.8mA, 7.8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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MRF1550NT1,528 NXP USA Inc. FSCLS04574-1.pdf?t.download=true&u=5oefqw Description: RF POWER FIELD-EFFECT TRANSISTOR
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MPC8271ZQTIEA557 MPC8271ZQTIEA557 NXP USA Inc. MPC8272EC.pdf Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
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PUMD17/ZL115 NXP USA Inc. PEMD17_PUMD17.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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BF824235 BF824235 NXP USA Inc. BF824.pdf Description: NOW NEXPERIA SMALL SIGNAL BIP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW-Q100118 NXP USA Inc. 74LVC14A_Q100.pdf Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14ABQ-Q100115 NXP USA Inc. 74LVC14A_Q100.pdf Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14APW/S999118 NXP USA Inc. 74LVC14A.pdf Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVC14APW/C2118 74LVC14APW/C2118 NXP USA Inc. PHGLS24066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 6-INP 14TSSOP
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/AU118 74LVC14APW/AU118 NXP USA Inc. PHGLS24066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/S505118 74LVC14APW/S505118 NXP USA Inc. 74LVC14A.pdf Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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74LVC14APW/S400118 74LVC14APW/S400118 NXP USA Inc. 74LVC14A.pdf Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 1.05V ~ 2V
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
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BGU7008,115 BGU7008,115 NXP USA Inc. BGU7008.pdf Description: IC AMP GALILEO 1575.42MHZ 6XSON
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.559GHz ~ 1.61GHz
P1dB: -14dBm
Noise Figure: 1.2dB
Current - Supply: 12.8mA
Gain: 19.5dB
Voltage - Supply: 1.5V ~ 2.85V
RF Type: Galileo, GLONASS, GPS
Frequency: 1575.42MHz
Mounting Type: Surface Mount
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11+1.96 EUR
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100+1.69 EUR
250+1.61 EUR
500+1.54 EUR
1000+1.48 EUR
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LPC1111FHN33/103551 LPC1111FHN33/103551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111JHN33/103551 LPC1111JHN33/103551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111FHN33/202551 LPC1111FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1111FHN33/101551 LPC1111FHN33/101551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 35 Stücke
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LPC1112LVFHN24/003151 LPC1112LVFHN24/003151 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1111FHN33/201,5 LPC1111FHN33/201,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5 Stücke
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LPC1112FHN33/202551 LPC1112FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Produkt ist nicht verfügbar
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LPC1112JHN33/203551 LPC1112JHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1112FHI33/203551 LPC1112FHI33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
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LPC1113FHN33/203551 LPC1113FHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1113FHN33/202551 LPC1113FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1113FHN33/203,5 LPC1113FHN33/203,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
auf Bestellung 275 Stücke:
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167+3.59 EUR
Mindestbestellmenge: 167 Stücke
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LPC1114LVFHN24/103151 LPC1114LVFHN24/103151 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1113JHN33/203551 LPC1113JHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1112FHN33/201551 LPC1112FHN33/201551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112LVFHI33/103 LPC1112LVFHI33/103 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 27
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 2137 Stücke:
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167+3.32 EUR
Mindestbestellmenge: 167 Stücke
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LPC1113FHN33/303551 LPC1113FHN33/303551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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LPC1112LVFHI33/103551 LPC1112LVFHI33/103551 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1114FHN33/203551 LPC1114FHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/202551 LPC1114FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1113FHN33/301551 LPC1113FHN33/301551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1113FBD48/303151 LPC1113FBD48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 48LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/303 LPC1114FHN33/303 NXP USA Inc. PHGLS29589-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S10FET100551 NXP USA Inc. PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 100TFBGA
auf Bestellung 520 Stücke:
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 Mindestbestellmenge: 61 Stücke
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LPC54606J256ET100551 LPC54606J256ET100551 NXP USA Inc. PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPF5023AMBA0ES PF5023.pdf
MPF5023AMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
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AnzahlPrivatkunde
3+9.2 EUR
10+7 EUR
25+6.46 EUR
100+5.85 EUR
490+5.4 EUR
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74HC138DB118 74HC_HCT138.pdf
74HC138DB118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC138DB - DECODER
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Produkt ist nicht verfügbar
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LPC54608J512BD208K LPC546XX.pdf
LPC54608J512BD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 171
DigiKey Programmable: Not Verified
auf Bestellung 296 Stücke:
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AnzahlPrivatkunde
1+24.99 EUR
10+19.66 EUR
36+17.9 EUR
108+16.81 EUR
252+16.18 EUR
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74AVCM162836DGG118 PHGLS16274-1.pdf?t.download=true&u=5oefqw
74AVCM162836DGG118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
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AnzahlPrivatkunde
284+2.03 EUR
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74AVCM162836DGG112 PHGLS16274-1.pdf?t.download=true&u=5oefqw
74AVCM162836DGG112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
auf Bestellung 1750 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
284+2.03 EUR
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74AVCM162834DGG112 PHGLS16274-1.pdf?t.download=true&u=5oefqw
74AVCM162834DGG112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 1750 Stücke:
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AnzahlPrivatkunde
192+3.01 EUR
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74AVCM162834DGG11 PHGLS16274-1.pdf?t.download=true&u=5oefqw
74AVCM162834DGG11
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 380 Stücke:
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AnzahlPrivatkunde
228+2.43 EUR
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MPF7100BMBA0ES PF7100.pdf
MPF7100BMBA0ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC OTP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 151 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.01 EUR
10+13.23 EUR
25+12.29 EUR
100+11.26 EUR
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BZX84-C6V8215 BZX84_SER.pdf
BZX84-C6V8215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-C6V8 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN5150HXMP PTN5150.pdf
PTN5150HXMP
Hersteller: NXP USA Inc.
Description: IC USB HOST CTLR 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
Part Status: Active
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
7+3.27 EUR
10+2.4 EUR
25+2.18 EUR
100+1.94 EUR
250+1.82 EUR
500+1.76 EUR
1000+1.75 EUR
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BAT54/LF1R
BAT54/LF1R
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY TO-236AB
Produkt ist nicht verfügbar
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LPC43S50FET256551 LPC43S50_30_20.pdf
LPC43S50FET256551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
Produkt ist nicht verfügbar
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MIMXRT1062CVJ5B IMXRT1060IEC.pdf
MIMXRT1062CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+28.3 EUR
10+22.36 EUR
25+20.88 EUR
189+18.69 EUR
378+18.18 EUR
567+17.93 EUR
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MIMXRT1062DVJ6B IMXRT1060CEC.pdf
MIMXRT1062DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1066 Stücke:
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1+26.05 EUR
10+20.53 EUR
25+19.15 EUR
189+17.11 EUR
378+16.65 EUR
567+16.41 EUR
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74ABT04PW,118 74ABT04.pdf
74ABT04PW,118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 6-INP 14TSSOP
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PCF7936AA/3851/C/6122 NXP_75016809.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: IMMO TAGS
Produkt ist nicht verfügbar
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MC908GZ32MFUE-NXP FSCL-S-A0001072420-1.pdf?t.download=true&u=5oefqw
MC908GZ32MFUE-NXP
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
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24+25.32 EUR
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LPC11E14FBD64/401,551 LPC11E1X.pdf
LPC11E14FBD64/401,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
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LD6806TD/13P,125 LD6806_Series.pdf
LD6806TD/13P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.3V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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2959+0.2 EUR
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LD6806TD/23P,125 LD6806_Series.pdf
LD6806TD/23P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.3V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
auf Bestellung 27000 Stücke:
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2959+0.19 EUR
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LD6836TD/13P,125 LD6836.pdf
LD6836TD/13P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.3V 300MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
auf Bestellung 33000 Stücke:
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2664+0.21 EUR
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LD6836TD13P125 PHGLS25657-1.pdf?t.download=true&u=5oefqw
LD6836TD13P125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR FIXED LDO REG
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Part Status: Active
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
auf Bestellung 2664 Stücke:
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1902+0.31 EUR
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74HC173DB112 74HC_HCT173.pdf
74HC173DB112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16SSOP
Number of Bits per Element: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Supplier Device Package: 16-SSOP
Input Capacitance: 3.5 pF
Clock Frequency: 95 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 7.8mA, 7.8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 1092 Stücke:
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1092+0.68 EUR
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MRF1550NT1,528 FSCLS04574-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Produkt ist nicht verfügbar
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MPC8271ZQTIEA557 MPC8272EC.pdf
MPC8271ZQTIEA557
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Produkt ist nicht verfügbar
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PUMD17/ZL115 PEMD17_PUMD17.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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BF824235 BF824.pdf
BF824235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW-Q100118 74LVC14A_Q100.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14ABQ-Q100115 74LVC14A_Q100.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW/S999118 74LVC14A.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW/C2118 PHGLS24066-1.pdf?t.download=true&u=5oefqw
74LVC14APW/C2118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 6-INP 14TSSOP
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW/AU118 PHGLS24066-1.pdf?t.download=true&u=5oefqw
74LVC14APW/AU118
Hersteller: NXP USA Inc.
Description: IC INVERTER
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.75V ~ 1.5V
Input Logic Level - High: 1V ~ 2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
auf Bestellung 12115 Stücke:
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AnzahlPrivatkunde
3328+0.17 EUR
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74LVC14APW/S505118 74LVC14A.pdf
74LVC14APW/S505118
Hersteller: NXP USA Inc.
Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC14APW/S400118 74LVC14A.pdf
74LVC14APW/S400118
Hersteller: NXP USA Inc.
Description: IC INVERTER
Supplier Device Package: 14-TSSOP
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Current - Quiescent (Max): 40 µA
Number of Circuits: 6
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 1.05V ~ 2V
Number of Inputs: 6
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Features: Schmitt Trigger
Part Status: Active
Packaging: Bulk
auf Bestellung 7500 Stücke:
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3328+0.17 EUR
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BGU7008,115 BGU7008.pdf
BGU7008,115
Hersteller: NXP USA Inc.
Description: IC AMP GALILEO 1575.42MHZ 6XSON
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Test Frequency: 1.559GHz ~ 1.61GHz
P1dB: -14dBm
Noise Figure: 1.2dB
Current - Supply: 12.8mA
Gain: 19.5dB
Voltage - Supply: 1.5V ~ 2.85V
RF Type: Galileo, GLONASS, GPS
Frequency: 1575.42MHz
Mounting Type: Surface Mount
auf Bestellung 5357 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.28 EUR
11+1.96 EUR
25+1.84 EUR
100+1.69 EUR
250+1.61 EUR
500+1.54 EUR
1000+1.48 EUR
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LPC1111FHN33/103551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/103551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1111JHN33/103551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111JHN33/103551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1111FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1111FHN33/101551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/101551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Produkt ist nicht verfügbar
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LPC1112LVFHN24/003151 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1112LVFHN24/003151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Produkt ist nicht verfügbar
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LPC1111FHN33/201,5 UM10398.pdf
LPC1111FHN33/201,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 5 Stücke
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LPC1112FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
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LPC1112JHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112JHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112FHI33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHI33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
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LPC1113FHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1113FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1113FHN33/203,5 UM10398.pdf
LPC1113FHN33/203,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
auf Bestellung 275 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
167+3.59 EUR
Mindestbestellmenge: 167 Stücke
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LPC1114LVFHN24/103151 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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LPC1113JHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113JHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1112FHN33/201551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHN33/201551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112LVFHI33/103 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHI33/103
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 27
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 2137 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
167+3.32 EUR
Mindestbestellmenge: 167 Stücke
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LPC1113FHN33/303551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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LPC1112LVFHI33/103551 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHI33/103551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1114FHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1113FHN33/301551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/301551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1113FBD48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FBD48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/303 PHGLS29589-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S10FET100551 PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 61 Stücke
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LPC54606J256ET100551 PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw
LPC54606J256ET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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