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PDZ27BGW115 PDZ27BGW115 NXP USA Inc. PDZ-GW_SER.pdf Description: PDZ27B - VOLTAGE REGULATOR DIODE
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BAW56/LF1235 BAW56/LF1235 NXP USA Inc. BAW56.pdf Description: DIODE
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 90 V
Operating Temperature - Junction: 150°C
Supplier Device Package: SOT23-3 (TO-236)
Current - Average Rectified (Io) (per Diode): 215mA
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
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S9S08EL32F1VTL S9S08EL32F1VTL NXP USA Inc. MC9S08EL32AD.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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S9S08EL32F1VTLR S9S08EL32F1VTLR NXP USA Inc. MC9S08EL32AD.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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S912XEG128J2VAL S912XEG128J2VAL NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
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A7001CUHN1/T1AAKEL NXP USA Inc. 568_A700x.pdf Description: AU10TICS
Packaging: Tray
DigiKey Programmable: Not Verified
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A7001CGHN1/T1AGAEL A7001CGHN1/T1AGAEL NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
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A7001CGHN1/T1AGBEL A7001CGHN1/T1AGBEL NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
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A7001CGHN1/T1AGBWJ A7001CGHN1/T1AGBWJ NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
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BZX384-C11 BZX384-C11 NXP USA Inc. BZX384_SER.pdf Description: BZX384 SERIES - VOLTAGE REGULATO
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74HC175PW112 74HC175PW112 NXP USA Inc. 74HC_HCT175.pdf Description: IC FF D-TYPE SNGL 4BIT 16TSSOP
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Number of Bits per Element: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Supplier Device Package: 16-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 89 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
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S9S12ZVL32F0MLFR S9S12ZVL32F0MLFR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
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LS1046ASE8T1A,557 LS1046ASE8T1A,557 NXP USA Inc. LS1026A_LS1046A.pdf Description: QORIQ LS 4XA72 64BIT ARM
Packaging: Tray
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (3), 1GbE (8)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 32-Bit, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, I2S, SPI, UART
Part Status: Active
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MC33PF8100EAES MC33PF8100EAES NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT LS1046A
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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S32G-VNP-RDB2 S32G-VNP-RDB2 NXP USA Inc. SG32VNPRDB2FS.pdf Description: S32G REF DESIGN VEHICLE NETWORK
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Single Board Computers (SBC)
Utilized IC / Part: SJA1110, TJA1102, TJA1102S, TJA1043, TJA1463, VR5510
Operating System: FreeRTOS, Linux
Part Status: Active
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SJA1124BHG/0Z SJA1124BHG/0Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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SJA1124BHG/0Z SJA1124BHG/0Z NXP USA Inc. SJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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S32G-VNP-GLDBOX S32G-VNP-GLDBOX NXP USA Inc. Description: EVAL BOARD FOR S32G2
Packaging: Bulk
Function: Networking
Type: Reference Design
Contents: Board(s)
Utilized IC / Part: S32G2, SJA1110, TJA1102-TJA1102S, TJA1043, TJA1463VR5510
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
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BC857BQA147 NXP USA Inc. BC857XQA_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PEMI4QFN/HM,132 PEMI4QFN/HM,132 NXP USA Inc. PHGLS23117-1.pdf?t.download=true&u=5oefqw Description: DATA LINE FILTER
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PEMI8QFN/HM,132 PEMI8QFN/HM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/16PF SMD
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
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LPC1549JBD48151 LPC1549JBD48151 NXP USA Inc. LPC15XX.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
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LPC2919FBD144/01551 LPC2919FBD144/01551 NXP USA Inc. LPC2917_19_01.pdf Description: IC MCU 16/32B 768KB FLSH 144LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Number of I/O: 108
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b
Core Processor: ARM9®
Program Memory Type: FLASH
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LPC2917FBD144/01551 LPC2917FBD144/01551 NXP USA Inc. LPC2917_19_01.pdf Description: IC MCU 16/32B 512KB FLSH 144LQFP
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LPC2210FBD144/01K LPC2210FBD144/01K NXP USA Inc. LPC2210_2220.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 76
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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74HC14PW/AU118 74HC14PW/AU118 NXP USA Inc. PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 1-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 6
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 5.2mA, 7.8mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC3240FET296/01K LPC3240FET296/01K NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC3250FET296/01K LPC3250FET296/01K NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b SAR
Core Processor: ARM9®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
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PCF7961ATT/D1AE07J NXP USA Inc. Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Produkt ist nicht verfügbar
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MC908LJ24CFQER NXP USA Inc. Description: IC MCU 8BIT 24KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
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MC908LJ24CPBE MC908LJ24CPBE NXP USA Inc. MC68HC908LJ24.pdf Description: IC MCU 8BIT 24KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
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NX3L2G66GM,125 NX3L2G66GM,125 NXP USA Inc. NX3L2G66.pdf Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2T384GM,125 NX3L2T384GM,125 NXP USA Inc. NX3L2T384.pdf Description: IC SW SPST-NCX2 750MOHM 8XQFNU
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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BB173115 BB173115 NXP USA Inc. PHGLS26255-1.pdf?t.download=true&u=5oefqw Description: VARIABLE CAPACITANCE DIODE
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PEMI1QFN/RK,315 PEMI1QFN/RK,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
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PEMI1QFN/RP,315 PEMI1QFN/RP,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
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3806+0.15 EUR
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PEMI2QFN/RT,115 PEMI2QFN/RT,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
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PEMI1QFN/RM,315 PEMI1QFN/RM,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/16PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
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PEMI4QFN/RM,132 PEMI4QFN/RM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/16PF SMD
Values: R = 100Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
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PEMI4QFN/RR,132 PEMI4QFN/RR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/21PF SMD
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 21pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
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PEMI4QFN/RP,132 PEMI4QFN/RP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/18.5PF SMD
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PEMI4QFN/RT,132 PEMI4QFN/RT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
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PEMI4QFN/RE,132 PEMI4QFN/RE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
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2959+0.2 EUR
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PEMI6QFN/RR,132 PEMI6QFN/RR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/21PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
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PEMI6QFN/RM,132 PEMI6QFN/RM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
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1902+0.31 EUR
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PEMI6QFN/RE,132 PEMI6QFN/RE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
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1902+0.31 EUR
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PEMI6QFN/RP,132 PEMI6QFN/RP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
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1902+0.31 EUR
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PEMI6QFN/RT,132 PEMI6QFN/RT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/23PF SMD
auf Bestellung 16000 Stücke:
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PEMI8QFN/RT,132 PEMI8QFN/RT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 38437 Stücke:
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1567+0.37 EUR
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PEMI8QFN/RE,132 PEMI8QFN/RE,132 NXP USA Inc. PHGLS23117-1.pdf?t.download=true&u=5oefqw Description: DATA LINE FILTER
auf Bestellung 12000 Stücke:
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74ALVT16373DL118 74ALVT16373DL118 NXP USA Inc. 74ALVT16373.pdf Description: NOW NEXPERIA 74ALVT16373DL - BUS
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RDDRONE-FMUK66 RDDRONE-FMUK66 NXP USA Inc. getting-started Description: PX4 ROBOTIC DRONE FMU
Packaging: Bulk
Configuration: Robot Components
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1550A9EP MC32PF1550A9EP NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1550A9EPR2 MC32PF1550A9EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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MCIMX6Y2CVM05AAR MCIMX6Y2CVM05AAR NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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LS1023ASE7PQB LS1023ASE7PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1017AXE7HNA LS1017AXE7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10CE MCIMX6Q5EYM10CE NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6Y2CVM05AA MCIMX6Y2CVM05AA NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
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MCIMX535DVP2C2 MCIMX535DVP2C2 NXP USA Inc. Description: IC MPU I.MX53 1.2GHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PDZ27BGW115 PDZ-GW_SER.pdf
PDZ27BGW115
Hersteller: NXP USA Inc.
Description: PDZ27B - VOLTAGE REGULATOR DIODE
Produkt ist nicht verfügbar
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BAW56/LF1235 BAW56.pdf
BAW56/LF1235
Hersteller: NXP USA Inc.
Description: DIODE
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Voltage - DC Reverse (Vr) (Max): 90 V
Operating Temperature - Junction: 150°C
Supplier Device Package: SOT23-3 (TO-236)
Current - Average Rectified (Io) (per Diode): 215mA
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Produkt ist nicht verfügbar
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S9S08EL32F1VTL MC9S08EL32AD.pdf
S9S08EL32F1VTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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S9S08EL32F1VTLR MC9S08EL32AD.pdf
S9S08EL32F1VTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEG128J2VAL
S912XEG128J2VAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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A7001CUHN1/T1AAKEL 568_A700x.pdf
Hersteller: NXP USA Inc.
Description: AU10TICS
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7001CGHN1/T1AGAEL
A7001CGHN1/T1AGAEL
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Produkt ist nicht verfügbar
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A7001CGHN1/T1AGBEL
A7001CGHN1/T1AGBEL
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Produkt ist nicht verfügbar
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A7001CGHN1/T1AGBWJ
A7001CGHN1/T1AGBWJ
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Produkt ist nicht verfügbar
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BZX384-C11 BZX384_SER.pdf
BZX384-C11
Hersteller: NXP USA Inc.
Description: BZX384 SERIES - VOLTAGE REGULATO
Produkt ist nicht verfügbar
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74HC175PW112 74HC_HCT175.pdf
74HC175PW112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16TSSOP
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Number of Bits per Element: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Supplier Device Package: 16-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 89 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
Produkt ist nicht verfügbar
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S9S12ZVL32F0MLFR S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL32F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
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LS1046ASE8T1A,557 LS1026A_LS1046A.pdf
LS1046ASE8T1A,557
Hersteller: NXP USA Inc.
Description: QORIQ LS 4XA72 64BIT ARM
Packaging: Tray
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (3), 1GbE (8)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 32-Bit, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, I2S, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MC33PF8100EAES PF8100_PF8200.pdf
MC33PF8100EAES
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT LS1046A
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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2+18.87 EUR
10+14.72 EUR
25+13.68 EUR
100+12.54 EUR
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S32G-VNP-RDB2 SG32VNPRDB2FS.pdf
S32G-VNP-RDB2
Hersteller: NXP USA Inc.
Description: S32G REF DESIGN VEHICLE NETWORK
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Single Board Computers (SBC)
Utilized IC / Part: SJA1110, TJA1102, TJA1102S, TJA1043, TJA1463, VR5510
Operating System: FreeRTOS, Linux
Part Status: Active
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SJA1124BHG/0Z SJA1124.pdf
SJA1124BHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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3000+4.15 EUR
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SJA1124BHG/0Z SJA1124.pdf
SJA1124BHG/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
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3+7.63 EUR
10+5.78 EUR
25+5.32 EUR
100+4.82 EUR
250+4.57 EUR
500+4.43 EUR
1000+4.31 EUR
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S32G-VNP-GLDBOX
S32G-VNP-GLDBOX
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32G2
Packaging: Bulk
Function: Networking
Type: Reference Design
Contents: Board(s)
Utilized IC / Part: S32G2, SJA1110, TJA1102-TJA1102S, TJA1043, TJA1463VR5510
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
Produkt ist nicht verfügbar
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BC857BQA147 BC857XQA_SER.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PEMI4QFN/HM,132 PHGLS23117-1.pdf?t.download=true&u=5oefqw
PEMI4QFN/HM,132
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
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PEMI8QFN/HM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/16PF SMD
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
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1567+0.37 EUR
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LPC1549JBD48151 LPC15XX.pdf
LPC1549JBD48151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Produkt ist nicht verfügbar
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LPC2919FBD144/01551 LPC2917_19_01.pdf
LPC2919FBD144/01551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 144LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Number of I/O: 108
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b
Core Processor: ARM9®
Program Memory Type: FLASH
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18+36.35 EUR
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LPC2917FBD144/01551 LPC2917_19_01.pdf
LPC2917FBD144/01551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 144LQFP
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LPC2210FBD144/01K LPC2210_2220.pdf
LPC2210FBD144/01K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 76
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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1+26.04 EUR
10+20.8 EUR
80+17.56 EUR
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74HC14PW/AU118 PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw
74HC14PW/AU118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 6
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 5.2mA, 7.8mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC3240FET296/01K LPC3220_30_40_50.pdf
LPC3240FET296/01K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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1+30.7 EUR
10+24.35 EUR
25+22.76 EUR
126+20.79 EUR
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504+19.68 EUR
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LPC3250FET296/01K LPC3220_30_40_50.pdf
LPC3250FET296/01K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b SAR
Core Processor: ARM9®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
auf Bestellung 222 Stücke:
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1+36.24 EUR
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PCF7961ATT/D1AE07J
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Produkt ist nicht verfügbar
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MC908LJ24CFQER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
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97+10.89 EUR
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MC908LJ24CPBE MC68HC908LJ24.pdf
MC908LJ24CPBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
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84+12.57 EUR
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NX3L2G66GM,125 NX3L2G66.pdf
NX3L2G66GM,125
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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888+0.68 EUR
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NX3L2T384GM,125 NX3L2T384.pdf
NX3L2T384GM,125
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XQFNU
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
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500+0.68 EUR
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BB173115 PHGLS26255-1.pdf?t.download=true&u=5oefqw
BB173115
Hersteller: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE
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PEMI1QFN/RK,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RK,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
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3806+0.15 EUR
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PEMI1QFN/RP,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RP,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
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3806+0.15 EUR
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PEMI2QFN/RT,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/RT,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
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3806+0.15 EUR
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PEMI1QFN/RM,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RM,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/16PF SMD
Number of Channels: 1
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
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3806+0.15 EUR
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PEMI4QFN/RM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/RM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/16PF SMD
Values: R = 100Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
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2959+0.2 EUR
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PEMI4QFN/RR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/RR,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/21PF SMD
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 21pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
auf Bestellung 40000 Stücke:
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AnzahlPrivatkunde
2959+0.19 EUR
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PEMI4QFN/RP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/RP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
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PEMI4QFN/RT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/RT,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
auf Bestellung 20000 Stücke:
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2959+0.2 EUR
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PEMI4QFN/RE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/RE,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
auf Bestellung 12000 Stücke:
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2959+0.2 EUR
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PEMI6QFN/RR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/RR,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/21PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1902+0.31 EUR
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PEMI6QFN/RM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/RM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1902+0.31 EUR
Mindestbestellmenge: 1902 Stücke
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PEMI6QFN/RE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/RE,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1902+0.31 EUR
Mindestbestellmenge: 1902 Stücke
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PEMI6QFN/RP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/RP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1902+0.31 EUR
Mindestbestellmenge: 1902 Stücke
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PEMI6QFN/RT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/RT,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/23PF SMD
auf Bestellung 16000 Stücke:
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2061+0.33 EUR
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PEMI8QFN/RT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/RT,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 38437 Stücke:
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1567+0.37 EUR
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PEMI8QFN/RE,132 PHGLS23117-1.pdf?t.download=true&u=5oefqw
PEMI8QFN/RE,132
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
auf Bestellung 12000 Stücke:
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74ALVT16373DL118 74ALVT16373.pdf
74ALVT16373DL118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ALVT16373DL - BUS
auf Bestellung 298 Stücke:
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RDDRONE-FMUK66 getting-started
RDDRONE-FMUK66
Hersteller: NXP USA Inc.
Description: PX4 ROBOTIC DRONE FMU
Packaging: Bulk
Configuration: Robot Components
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1550A9EP PF1550.pdf
MC32PF1550A9EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF1550A9EPR2 PF1550.pdf
MC32PF1550A9EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MCIMX6Y2CVM05AAR IMX6ULLIEC.pdf
MCIMX6Y2CVM05AAR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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LS1023ASE7PQB LS1043AFS.pdf
LS1023ASE7PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1017AXE7HNA Download?colCode=LS1027A&amp;location=null
LS1017AXE7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10CE IMX6DQIEC.pdf
MCIMX6Q5EYM10CE
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6Y2CVM05AA IMX6ULLIEC.pdf
MCIMX6Y2CVM05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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MCIMX535DVP2C2
MCIMX535DVP2C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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