Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36625) > Seite 400 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
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LPC1778FBD208K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
auf Bestellung 165 Stücke: Lieferzeit 10-14 Tag (e) |
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JN517X-XK030598 | NXP USA Inc. | Description: GENERIC NODE EXPANSION KIT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
| PTVS18VZ1USK,315 | NXP USA Inc. |
Description: PTVS18VZ1 - TRANSIENT VOLTAGE SU |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5514 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||
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BAT54/DG,215 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
auf Bestellung 111000 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 12500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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S9S08RN32W1VLFR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFPPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
| OM13514UL | NXP USA Inc. |
Description: PCF85363 EVALUATION BOARD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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MIMX8MN5DVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGASecurity Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Graphics Acceleration: Yes RAM Controllers: DDR3L, DDR4, LPDDR4 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 4 Core, 64-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: GbE Supplier Device Package: 306-TFBGA (11x11) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 306-TFBGA Packaging: Tray Part Status: Active Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN5CVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGAEthernet: GbE Supplier Device Package: 306-TFBGA (11x11) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TJ) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 306-TFBGA Packaging: Tray Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART Part Status: Active Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Graphics Acceleration: Yes RAM Controllers: DDR3L, DDR4, LPDDR4 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 4 Core, 64-Bit USB: USB 2.0 OTG + PHY (1) |
auf Bestellung 103 Stücke: Lieferzeit 10-14 Tag (e) |
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8MNANOD3L-EVK | NXP USA Inc. |
Description: I.MX 8M NANO ULTRALITE EVAL KITCore Processor: ARM® Cortex®-A53, Cortex®-M7 Contents: Board(s), Cable(s), Power Supply Type: MPU Mounting Type: Fixed Packaging: Bulk Part Status: Active Operating System: Linux Utilized IC / Part: i.MX 8M Nano Board Type: Single Board Computers (SBC) |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TJR1442ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONQualification: AEC-Q100 Grade: Automotive Duplex: Half Receiver Hysteresis: 50 mV Supplier Device Package: 8-HVSON (3x3) Protocol: CANbus Data Rate: 5Mbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 175°C (TJ) Type: Transceiver Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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S912XEQ512F1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFPOperating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tray Number of I/O: 59 Part Status: Active Supplier Device Package: 80-QFP (14x14) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SPC5605BF1VLU6 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 176LQFPDigiKey Programmable: Not Verified Number of I/O: 149 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 29x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 768KB (768K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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SPC5605BF1VLU6R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 176LQFPDigiKey Programmable: Not Verified Number of I/O: 149 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 29x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 768KB (768K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MVR5510AMMA6ESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 QMPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MVR5510AMMA6ES | NXP USA Inc. |
Description: IC PMIC VR5510 QMPart Status: Active Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray Qualification: AEC-Q100 Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MCF51AC128CCLKE557 | NXP USA Inc. |
Description: MCF51AC 32-BIT MCU, COLDFIRE V1Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Bulk Number of I/O: 69 Part Status: Active Supplier Device Package: 80-LQFP (14x14) Peripherals: LVD, PWM, WDT Connectivity: I²C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 24x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: External DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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BYV410X-600127 | NXP USA Inc. | Description: NOW WEEN - BYV410X-600 - ULTRAFA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MC33879TEK | NXP USA Inc. |
Description: SWITCH, CONGIFURABLE 8 CHANNELS, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MC33889DPEGR2518 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, CAN, 2X 5.0V/Packaging: Bulk Part Status: Active |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33879APEKR2518 | NXP USA Inc. |
Description: SWITCH, CONGIFURABLE 8 CHANNELS, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MC33879APEK574 | NXP USA Inc. |
Description: SWITCH, CONGIFURABLE 8 CHANNELS, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| MC33880PEG574 | NXP USA Inc. |
Description: BRUSH DC MOTOR CONTROLLER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 78 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||
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S912XDP512J1VAG | NXP USA Inc. | Description: IC MCU 16BIT 512KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
| 74LVC3G17DC132 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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74LVC3G17DP-Q100125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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74LVC3G04DP-Q100125 | NXP USA Inc. |
Description: INVERTER, LVC/LCX/Z SERIES |
auf Bestellung 83333 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 1839 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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74LVC3G04GN,115 | NXP USA Inc. |
Description: IC INVERTER 3CH 3-INP 8XSON |
auf Bestellung 84980 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC3G04GD,125-NXP | NXP USA Inc. | Description: FUNC, 1 INPUT, CMOS, PDSO8 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1786 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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74LVC3G04GD | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC3G04GD - INVER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1603 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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LPC11A14JBD48/30QL | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFPCore Size: 32-Bit Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M0 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (32K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V |
auf Bestellung 7087 Stücke: Lieferzeit 10-14 Tag (e) |
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MKS20FN128VLH12 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 40 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Program Memory Size: 128KB (128K x 8) Core Size: 32-Bit Data Converters: A/D 1x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Speed: 120MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MKS22FN128VLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PDTD143ET215 | NXP USA Inc. | Description: NOW NEXPERIA SMALL SIGNAL BIPOLA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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TEA2016AAT/1J | NXP USA Inc. |
Description: RESONANT POWER SUPPLY WITH PFCPackaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 2.35V ~ 4.5V Applications: Digital Power Controller Supplier Device Package: 16-SO Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MCZ33903C3EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICSupplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Bulk |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905DS3EKR2,518 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3VQualification: AEC-Q101 Grade: Automotive Supplier Device Package: 32-HSOP Current - Supply: 2.8mA Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Bulk |
auf Bestellung 949 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905CD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOICSupplier Device Package: 54-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33903D5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICSupplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Bulk |
auf Bestellung 2606 Stücke: Lieferzeit 10-14 Tag (e) |
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| SA58672UK027 | NXP USA Inc. |
Description: AUDIO AMPLIFIER 3W |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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SA58637BS,118 | NXP USA Inc. |
Description: IC AMP CLSS AB STER 2.2W 20HVQFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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LPC43S20FBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| 74HC4050PW118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 16TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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MKS22FN256VLH12557 | NXP USA Inc. |
Description: KINETIS S 32-BIT MCU, ARM CORTEX |
auf Bestellung 171 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 62 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MKS20FN256VLL12557 | NXP USA Inc. |
Description: KINETIS S 32-BIT MCU, ARM CORTEX |
auf Bestellung 720 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
| PESD5V0C1USF315 | NXP USA Inc. |
Description: TVS DIODEPackaging: Bulk |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0V2BM315 | NXP USA Inc. |
Description: TVS DIODE |
auf Bestellung 1730000 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 7322 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PESD5V0C1BSF315 | NXP USA Inc. |
Description: TVS DIODE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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PESD5V0R1BSF315 | NXP USA Inc. |
Description: TVS DIODEPackaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Type: Zener Operating Temperature: -40°C ~ 125°C (TA) Applications: General Purpose Capacitance @ Frequency: 0.1pF @ 2.5GHz Current - Peak Pulse (10/1000µs): 4.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DSN0603-2 Bidirectional Channels: 1 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 5V Power Line Protection: No |
auf Bestellung 3054553 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0X2UMB315 | NXP USA Inc. |
Description: TVS DIODEPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Capacitance @ Frequency: 0.5pF @ 1MHz Current - Peak Pulse (10/1000µs): 1.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DFN1006B-3 Unidirectional Channels: 2 Voltage - Breakdown (Min): 7.5V Voltage - Clamping (Max) @ Ipp: 14V Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 2355334 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0X2UAMB315 | NXP USA Inc. |
Description: TVS DIODEPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Type: Zener Operating Temperature: 150°C (TJ) Applications: Telecom Capacitance @ Frequency: 0.8pF @ 1MHz Current - Peak Pulse (10/1000µs): 2.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DFN1006B-3 Unidirectional Channels: 1 Voltage - Breakdown (Min): 7.5V Voltage - Clamping (Max) @ Ipp: 14V Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 1401019 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC2G02DP-Q100125 | NXP USA Inc. |
Description: IC GATE NOR 2CH 2-INP 8TSSOPPackaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 8-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Grade: Automotive Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 20 µA Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC2G04GV-Q100125 | NXP USA Inc. |
Description: IC INVERT SCHMITT 2CH 2INP 6TSOPFeatures: Schmitt Trigger Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 6-TSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF Grade: Automotive Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 1 µA Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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74HC2G86DP-Q100125 | NXP USA Inc. |
Description: IC GATE XOR 2CH 2-INP 8TSSOP |
auf Bestellung 62100 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC2G66DP-Q100125 | NXP USA Inc. |
Description: 74HC2G66DP-Q100 - SPST, 2 FUNCPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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74HC2G125GD125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 8XSON |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860PCZQ50D4-NXP | NXP USA Inc. |
Description: IC MPU MPC86XX 50MHZ 357BGAGraphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (4), 10/100Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 95°C (TJ) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC855TZQ50D4-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITECAdditional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1), 10/100Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: 0°C ~ 95°C (TJ) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Bulk |
auf Bestellung 1259 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860TZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGAPackaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
auf Bestellung 154 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860DPZQ50D4557-NXP | NXP USA Inc. |
Description: IC MPU MPC86XX 50MHZ 357BGAGraphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (2), 10/100Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: 0°C ~ 95°C (TJ) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC850CZQ50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGAAdditional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10Mbps (1) Supplier Device Package: 256-PBGA (23x23) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 95°C (TA) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 256-BBGA Packaging: Bulk |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC1778FBD208K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 165 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.54 EUR |
| 10+ | 22.17 EUR |
| 25+ | 20.99 EUR |
| JN517X-XK030598 |
Hersteller: NXP USA Inc.
Description: GENERIC NODE EXPANSION KIT
Description: GENERIC NODE EXPANSION KIT
Produkt ist nicht verfügbar
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PTVS18VZ1USK,315 |
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Hersteller: NXP USA Inc.
Description: PTVS18VZ1 - TRANSIENT VOLTAGE SU
Description: PTVS18VZ1 - TRANSIENT VOLTAGE SU
Produkt ist nicht verfügbar
Mindestbestellmenge: 5514 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BAT54/DG,215 |
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Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
auf Bestellung 111000 Stücke:
Lieferzeit 10-14 Tag (e)
| S9S08RN32W1VLFR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| OM13514UL |
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Hersteller: NXP USA Inc.
Description: PCF85363 EVALUATION BOARD
Description: PCF85363 EVALUATION BOARD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MN5DVPIZAA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: GbE
Supplier Device Package: 306-TFBGA (11x11)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 306-TFBGA
Packaging: Tray
Part Status: Active
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: GbE
Supplier Device Package: 306-TFBGA (11x11)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 306-TFBGA
Packaging: Tray
Part Status: Active
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 45.11 EUR |
| 10+ | 36.25 EUR |
| 25+ | 34.05 EUR |
| MIMX8MN5CVPIZAA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Ethernet: GbE
Supplier Device Package: 306-TFBGA (11x11)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 306-TFBGA
Packaging: Tray
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 OTG + PHY (1)
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Ethernet: GbE
Supplier Device Package: 306-TFBGA (11x11)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 306-TFBGA
Packaging: Tray
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 OTG + PHY (1)
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 52.57 EUR |
| 10+ | 42.36 EUR |
| 25+ | 39.82 EUR |
| 8MNANOD3L-EVK |
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Hersteller: NXP USA Inc.
Description: I.MX 8M NANO ULTRALITE EVAL KIT
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX 8M Nano
Board Type: Single Board Computers (SBC)
Description: I.MX 8M NANO ULTRALITE EVAL KIT
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX 8M Nano
Board Type: Single Board Computers (SBC)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 845.4 EUR |
| TJR1442ATK/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Qualification: AEC-Q100
Grade: Automotive
Duplex: Half
Receiver Hysteresis: 50 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 175°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Qualification: AEC-Q100
Grade: Automotive
Duplex: Half
Receiver Hysteresis: 50 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 175°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512F1MAA |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5605BF1VLU6 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5605BF1VLU6R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MVR5510AMMA6ESR2 |
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Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC PMIC VR5510 QM
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MVR5510AMMA6ES |
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Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Description: IC PMIC VR5510 QM
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MCF51AC128CCLKE557 |
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Hersteller: NXP USA Inc.
Description: MCF51AC 32-BIT MCU, COLDFIRE V1
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Bulk
Number of I/O: 69
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
DigiKey Programmable: Not Verified
Description: MCF51AC 32-BIT MCU, COLDFIRE V1
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Bulk
Number of I/O: 69
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BYV410X-600127 |
Hersteller: NXP USA Inc.
Description: NOW WEEN - BYV410X-600 - ULTRAFA
Description: NOW WEEN - BYV410X-600 - ULTRAFA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33879TEK |
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Hersteller: NXP USA Inc.
Description: SWITCH, CONGIFURABLE 8 CHANNELS,
Description: SWITCH, CONGIFURABLE 8 CHANNELS,
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33889DPEGR2518 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, CAN, 2X 5.0V/
Packaging: Bulk
Part Status: Active
Description: SYSTEM BASIS CHIP, CAN, 2X 5.0V/
Packaging: Bulk
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 51+ | 11.67 EUR |
| MC33879APEKR2518 |
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Hersteller: NXP USA Inc.
Description: SWITCH, CONGIFURABLE 8 CHANNELS,
Description: SWITCH, CONGIFURABLE 8 CHANNELS,
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33879APEK574 |
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Hersteller: NXP USA Inc.
Description: SWITCH, CONGIFURABLE 8 CHANNELS,
Description: SWITCH, CONGIFURABLE 8 CHANNELS,
Produkt ist nicht verfügbar
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| MC33880PEG574 |
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Hersteller: NXP USA Inc.
Description: BRUSH DC MOTOR CONTROLLER
Description: BRUSH DC MOTOR CONTROLLER
Produkt ist nicht verfügbar
Mindestbestellmenge: 78 Stücke
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| S912XDP512J1VAG |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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| 74LVC3G04DP-Q100125 |
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Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Description: INVERTER, LVC/LCX/Z SERIES
auf Bestellung 83333 Stücke:
Lieferzeit 10-14 Tag (e)
| 74LVC3G04GN,115 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8XSON
Description: IC INVERTER 3CH 3-INP 8XSON
auf Bestellung 84980 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1381+ | 0.42 EUR |
| 74LVC3G04GD,125-NXP |
Hersteller: NXP USA Inc.
Description: FUNC, 1 INPUT, CMOS, PDSO8
Description: FUNC, 1 INPUT, CMOS, PDSO8
Produkt ist nicht verfügbar
Mindestbestellmenge: 1786 Stücke
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| 74LVC3G04GD |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC3G04GD - INVER
Description: NOW NEXPERIA 74LVC3G04GD - INVER
Produkt ist nicht verfügbar
Mindestbestellmenge: 1603 Stücke
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| LPC11A14JBD48/30QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
auf Bestellung 7087 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 90+ | 6.02 EUR |
| MKS20FN128VLH12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Program Memory Size: 128KB (128K x 8)
Core Size: 32-Bit
Data Converters: A/D 1x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Program Memory Size: 128KB (128K x 8)
Core Size: 32-Bit
Data Converters: A/D 1x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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| MKS22FN128VLL12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| PDTD143ET215 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
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| TEA2016AAT/1J |
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Hersteller: NXP USA Inc.
Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| MCZ33903C3EKR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 68+ | 8.59 EUR |
| MCZ33905DS3EKR2,518 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: 32-HSOP
Current - Supply: 2.8mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: 32-HSOP
Current - Supply: 2.8mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 56+ | 10.33 EUR |
| MCZ33905CD5EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 53+ | 11.04 EUR |
| MCZ33903D5EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
auf Bestellung 2606 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 66+ | 8.78 EUR |
| SA58672UK027 |
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Hersteller: NXP USA Inc.
Description: AUDIO AMPLIFIER 3W
Description: AUDIO AMPLIFIER 3W
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SA58637BS,118 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LPC43S20FBD144551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC4050PW118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 16TSSOP
Description: IC BUFFER NON-INVERT 6V 16TSSOP
Produkt ist nicht verfügbar
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| MKS22FN256VLH12557 |
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Hersteller: NXP USA Inc.
Description: KINETIS S 32-BIT MCU, ARM CORTEX
Description: KINETIS S 32-BIT MCU, ARM CORTEX
auf Bestellung 171 Stücke:
Lieferzeit 10-14 Tag (e)
| MKS20FN256VLL12557 |
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Hersteller: NXP USA Inc.
Description: KINETIS S 32-BIT MCU, ARM CORTEX
Description: KINETIS S 32-BIT MCU, ARM CORTEX
auf Bestellung 720 Stücke:
Lieferzeit 10-14 Tag (e)
| PESD5V0C1USF315 |
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auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8768+ | 0.063 EUR |
| PESD5V0V2BM315 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE
Description: TVS DIODE
auf Bestellung 1730000 Stücke:
Lieferzeit 10-14 Tag (e)
| PESD5V0C1BSF315 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE
Description: TVS DIODE
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PESD5V0R1BSF315 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.1pF @ 2.5GHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 5V
Power Line Protection: No
Description: TVS DIODE
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.1pF @ 2.5GHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 5V
Power Line Protection: No
auf Bestellung 3054553 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7693+ | 0.076 EUR |
| PESD5V0X2UMB315 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Capacitance @ Frequency: 0.5pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 2
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Capacitance @ Frequency: 0.5pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 2
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 2355334 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3566+ | 0.15 EUR |
| PESD5V0X2UAMB315 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1401019 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4046+ | 0.13 EUR |
| 74HC2G02DP-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Qualification: AEC-Q100
Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1972+ | 0.29 EUR |
| 74HC2G04GV-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC2G86DP-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC GATE XOR 2CH 2-INP 8TSSOP
Description: IC GATE XOR 2CH 2-INP 8TSSOP
auf Bestellung 62100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2263+ | 0.26 EUR |
| 74HC2G66DP-Q100125 |
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Hersteller: NXP USA Inc.
Description: 74HC2G66DP-Q100 - SPST, 2 FUNC
Packaging: Bulk
Part Status: Active
Description: 74HC2G66DP-Q100 - SPST, 2 FUNC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC2G125GD125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
Description: IC BUFFER NON-INVERT 6V 8XSON
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1697+ | 0.37 EUR |
| MPC860PCZQ50D4-NXP |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Part Status: Active
Description: IC MPU MPC86XX 50MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC855TZQ50D4-NXP |
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Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Description: POWERQUICC 32 BIT POWER ARCHITEC
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
auf Bestellung 1259 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 273.68 EUR |
| MPC860TZQ50D4 |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 273.47 EUR |
| MPC860DPZQ50D4557-NXP |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Description: IC MPU MPC86XX 50MHZ 357BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (2), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
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| MPC850CZQ50BU |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Bulk
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Bulk
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 78.58 EUR |







































