Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35402) > Seite 92 nach 591
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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MRF6S23100HR5 | NXP USA Inc. |
 Description: RF MOSFET LDMOS 28V NI780Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.4GHz Power - Output: 20W Gain: 15.4dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 1 A |
Produkt ist nicht verfügbar |
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MRF6S9045NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 10W Gain: 22.7dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 350 mA |
Produkt ist nicht verfügbar |
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MRF6S9060MR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270-2 Frequency: 880MHz Power - Output: 14W Gain: 21.4dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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MRF6S9060NBR1 | NXP USA Inc. |
Description: FET RF 68V 880MHZ TO-272-2 Packaging: Tape & Reel (TR) Package / Case: TO-272BC Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 14W Gain: 21.4dB Technology: LDMOS Supplier Device Package: TO-272-2 Part Status: Obsolete Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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MRF6S9060NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 14W Gain: 21.4dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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MRF6S9130HR3 | NXP USA Inc. |
Description: FET RF 68V 880MHZ NI-780 |
Produkt ist nicht verfügbar |
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MRF6S9130HR5 | NXP USA Inc. |
Description: FET RF 68V 880MHZ NI-780 |
Produkt ist nicht verfügbar |
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MRF6S9160HSR5 | NXP USA Inc. |
Description: FET RF 68V 880MHZ NI-780S |
Produkt ist nicht verfügbar |
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MRFG35003M6R5 | NXP USA Inc. |
Description: FET RF 8V 3.55GHZ 1.5-PLD |
Produkt ist nicht verfügbar |
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| MRFG35003M6T1 | NXP USA Inc. |
Description: FET RF 8V 3.55GHZ 1.5-PLD |
Produkt ist nicht verfügbar |
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MRFG35003MT1 | NXP USA Inc. |
Description: FET RF 15V 3.55GHZ 1.5-PLD |
Produkt ist nicht verfügbar |
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MRFG35005MR5 | NXP USA Inc. |
Description: FET RF 15V 3.55GHZ 1.5PLD |
Produkt ist nicht verfügbar |
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MRFG35005MT1 | NXP USA Inc. |
Description: FET RF 15V 3.55GHZ 1.5PLD |
Produkt ist nicht verfügbar |
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MRFG35010MT1 | NXP USA Inc. |
Description: RF MOSFET PHEMT FET 12V PLD-1.5 Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Mounting Type: Surface Mount Frequency: 3.55GHz Power - Output: 9W Gain: 10dB Technology: pHEMT FET Supplier Device Package: PLD-1.5 Voltage - Rated: 15 V Voltage - Test: 12 V Current - Test: 180 mA |
Produkt ist nicht verfügbar |
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| MRFG35030R5 | NXP USA Inc. |
Description: FET RF 15V 3.55GHZ HF-600 Packaging: Tape & Reel (TR) Package / Case: HF-600 Frequency: 3.55GHz Power - Output: 3W Gain: 12dB Technology: pHEMT FET Voltage - Rated: 15 V Voltage - Test: 12 V Current - Test: 650 mA |
Produkt ist nicht verfügbar |
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MSC7110VM1000 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA |
Produkt ist nicht verfügbar |
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MSC7112VM1000 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA |
Produkt ist nicht verfügbar |
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MSC7113VM1000 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA |
Produkt ist nicht verfügbar |
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MSC7115VM1000 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA |
Produkt ist nicht verfügbar |
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MSC7116VM1000 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Interface: Host Interface, I2C, UART Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (8kB) On-Chip RAM: 400kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 266MHz Supplier Device Package: 400-LFBGA (17x17) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MSC8122MP8000 | NXP USA Inc. |
Description: DSP 16BIT 500MHZ MULTI 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: DSI, Ethernet, RS-232 Type: SC140 Core Operating Temperature: 0°C ~ 90°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 500MHz Supplier Device Package: 431-FCPBGA (20x20) |
Produkt ist nicht verfügbar |
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MSC8122TMP6400 | NXP USA Inc. |
Description: DSP 16BIT 400MHZ MULTI 431FCBGA |
Produkt ist nicht verfügbar |
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MSC8122TMP6400V | NXP USA Inc. |
Description: DSP 16BIT 400MHZ MULTI 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: DSI, Ethernet, RS-232 Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Clock Rate: 400MHz Supplier Device Package: 431-FCPBGA (20x20) |
Produkt ist nicht verfügbar |
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MSC8126MP8000 | NXP USA Inc. |
Description: DSP 16BIT 500MHZ MULTI 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: DSI, Ethernet, RS-232 Type: SC140 Core Operating Temperature: 0°C ~ 90°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 500MHz Supplier Device Package: 431-FCPBGA (20x20) |
Produkt ist nicht verfügbar |
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MSC8126TMP6400 | NXP USA Inc. |
Description: DSP 16BIT 400MHZ MULTI 431FCBGA |
Produkt ist nicht verfügbar |
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MW4IC2230GMBR1 | NXP USA Inc. |
Description: IC AMP CELL 1.6-2.4GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Gull Wing Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 2.4GHz RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Gain: 31dB Current - Supply: 60mA Supplier Device Package: TO-272 WB-16 GULL |
Produkt ist nicht verfügbar |
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MW4IC2230GMBR5 | NXP USA Inc. |
Description: IC AMP CELL 1.6-2.4GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Gull Wing Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 2.4GHz RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Gain: 31dB Current - Supply: 60mA Supplier Device Package: TO-272 WB-16 GULL |
Produkt ist nicht verfügbar |
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MW4IC2230MBR1 | NXP USA Inc. |
Description: IC AMP CELL 1.6-2.4GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 2.4GHz RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Gain: 31dB Current - Supply: 60mA Supplier Device Package: TO-272 WB-16 |
Produkt ist nicht verfügbar |
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MW4IC915GNBR1 | NXP USA Inc. |
Description: IC RF AMP CEL 750MHZ-1GHZ TO272 |
Produkt ist nicht verfügbar |
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MW5IC970NBR1 | NXP USA Inc. |
Description: IC AMP GPS 800MHZ-900MHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 800MHz ~ 900MHz RF Type: General Purpose Voltage - Supply: 28V Gain: 30dB Current - Supply: 80mA Supplier Device Package: TO-272 WB-16 Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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| MW6IC2015GNBR1 | NXP USA Inc. |
Description: IC AMP CEL 1.8GHZ-1.99GHZ TO272 |
Produkt ist nicht verfügbar |
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MW6IC2015NBR1 | NXP USA Inc. |
Description: IC AMP CEL 1.8GHZ-1.99GHZ TO272 |
Produkt ist nicht verfügbar |
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MW6S004NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5 Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Mounting Type: Surface Mount Frequency: 1.96GHz Power - Output: 4W Gain: 18dB Technology: LDMOS Supplier Device Package: PLD-1.5 Part Status: Active Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 50 mA |
Produkt ist nicht verfügbar |
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MW6S010GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 10W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Active Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 125 mA |
Produkt ist nicht verfügbar |
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MW6S010MR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270-2 Frequency: 960MHz Power - Output: 10W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 125 mA |
Produkt ist nicht verfügbar |
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MW6S010NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 10W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Not For New Designs Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 125 mA |
Produkt ist nicht verfügbar |
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XC56309VF100AR2 | NXP USA Inc. |
Description: IC DSP 24BIT 100MHZ 196-MABGA Packaging: Tape & Reel (TR) Package / Case: 196-LBGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 196-LBGA (15x15) |
Produkt ist nicht verfügbar |
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XC68HC58EGA | NXP USA Inc. | Description: IC MCU 28SOIC |
Produkt ist nicht verfügbar |
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XC68HC58EGAR2 | NXP USA Inc. | Description: IC MCU 28SOIC |
Produkt ist nicht verfügbar |
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XC68HC58EIA | NXP USA Inc. |
Description: IC MCU 28PLCC Packaging: Tube Package / Case: 28-LCC (J-Lead) Mounting Type: Surface Mount Supplier Device Package: 28-PLCC (11.51x11.51) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC68HC58EIAR | NXP USA Inc. |
Description: IC MCU 28PLCC Packaging: Tape & Reel (TR) Package / Case: 28-LCC (J-Lead) Mounting Type: Surface Mount Supplier Device Package: 28-PLCC (11.51x11.51) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XPC823CZT66B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC823EVR66B2 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC823EVR75B2 | NXP USA Inc. |
Description: IC MPU MPC8XX 75MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC823ZT66B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC823ZT75B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 75MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC823ZT81B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 81MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC8260CZUIFBC | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ 480TBGA |
Produkt ist nicht verfügbar |
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XPC8260ZUIHBC | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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XPC850CZT66BU | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DECZT50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DEVR50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DEZT50BUR2 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DEZT66BU | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DEZT66BUR2 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DEZT80BU | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DSLCZT50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850DSLZT50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850SRCZT50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
Produkt ist nicht verfügbar |
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XPC850SRZT50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
Produkt ist nicht verfügbar |
| MRF6S23100HR5 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz
Power - Output: 20W
Gain: 15.4dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz
Power - Output: 20W
Gain: 15.4dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
| MRF6S9045NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 350 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
| MRF6S9060MR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Frequency: 880MHz
Power - Output: 14W
Gain: 21.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Frequency: 880MHz
Power - Output: 14W
Gain: 21.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
| MRF6S9060NBR1 |
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Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ TO-272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.4dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 68V 880MHZ TO-272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.4dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
| MRF6S9060NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
| MRF6S9130HR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ NI-780
Description: FET RF 68V 880MHZ NI-780
Produkt ist nicht verfügbar
| MRF6S9130HR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ NI-780
Description: FET RF 68V 880MHZ NI-780
Produkt ist nicht verfügbar
| MRF6S9160HSR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ NI-780S
Description: FET RF 68V 880MHZ NI-780S
Produkt ist nicht verfügbar
| MRFG35003M6R5 |
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Hersteller: NXP USA Inc.
Description: FET RF 8V 3.55GHZ 1.5-PLD
Description: FET RF 8V 3.55GHZ 1.5-PLD
Produkt ist nicht verfügbar
| MRFG35003M6T1 |
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Hersteller: NXP USA Inc.
Description: FET RF 8V 3.55GHZ 1.5-PLD
Description: FET RF 8V 3.55GHZ 1.5-PLD
Produkt ist nicht verfügbar
| MRFG35003MT1 |
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Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ 1.5-PLD
Description: FET RF 15V 3.55GHZ 1.5-PLD
Produkt ist nicht verfügbar
| MRFG35005MR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ 1.5PLD
Description: FET RF 15V 3.55GHZ 1.5PLD
Produkt ist nicht verfügbar
| MRFG35005MT1 |
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Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ 1.5PLD
Description: FET RF 15V 3.55GHZ 1.5PLD
Produkt ist nicht verfügbar
| MRFG35010MT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 9W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 180 mA
Description: RF MOSFET PHEMT FET 12V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 9W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 180 mA
Produkt ist nicht verfügbar
| MRFG35030R5 |
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ HF-600
Packaging: Tape & Reel (TR)
Package / Case: HF-600
Frequency: 3.55GHz
Power - Output: 3W
Gain: 12dB
Technology: pHEMT FET
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 650 mA
Description: FET RF 15V 3.55GHZ HF-600
Packaging: Tape & Reel (TR)
Package / Case: HF-600
Frequency: 3.55GHz
Power - Output: 3W
Gain: 12dB
Technology: pHEMT FET
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 650 mA
Produkt ist nicht verfügbar
| MSC7110VM1000 |
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Hersteller: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Produkt ist nicht verfügbar
| MSC7112VM1000 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Produkt ist nicht verfügbar
| MSC7113VM1000 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Produkt ist nicht verfügbar
| MSC7115VM1000 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Produkt ist nicht verfügbar
| MSC7116VM1000 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I2C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
Part Status: Obsolete
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I2C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MSC8122MP8000 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT 500MHZ MULTI 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Description: DSP 16BIT 500MHZ MULTI 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Produkt ist nicht verfügbar
| MSC8122TMP6400 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT 400MHZ MULTI 431FCBGA
Description: DSP 16BIT 400MHZ MULTI 431FCBGA
Produkt ist nicht verfügbar
| MSC8122TMP6400V |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT 400MHZ MULTI 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 400MHz
Supplier Device Package: 431-FCPBGA (20x20)
Description: DSP 16BIT 400MHZ MULTI 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 400MHz
Supplier Device Package: 431-FCPBGA (20x20)
Produkt ist nicht verfügbar
| MSC8126MP8000 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT 500MHZ MULTI 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Description: DSP 16BIT 500MHZ MULTI 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Produkt ist nicht verfügbar
| MSC8126TMP6400 |
|
Hersteller: NXP USA Inc.
Description: DSP 16BIT 400MHZ MULTI 431FCBGA
Description: DSP 16BIT 400MHZ MULTI 431FCBGA
Produkt ist nicht verfügbar
| MW4IC2230GMBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Produkt ist nicht verfügbar
| MW4IC2230GMBR5 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Produkt ist nicht verfügbar
| MW4IC2230MBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16
Produkt ist nicht verfügbar
| MW4IC915GNBR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP CEL 750MHZ-1GHZ TO272
Description: IC RF AMP CEL 750MHZ-1GHZ TO272
Produkt ist nicht verfügbar
| MW5IC970NBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 800MHZ-900MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 800MHz ~ 900MHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30dB
Current - Supply: 80mA
Supplier Device Package: TO-272 WB-16
Part Status: Not For New Designs
Description: IC AMP GPS 800MHZ-900MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 800MHz ~ 900MHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30dB
Current - Supply: 80mA
Supplier Device Package: TO-272 WB-16
Part Status: Not For New Designs
Produkt ist nicht verfügbar
| MW6IC2015GNBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CEL 1.8GHZ-1.99GHZ TO272
Description: IC AMP CEL 1.8GHZ-1.99GHZ TO272
Produkt ist nicht verfügbar
| MW6IC2015NBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CEL 1.8GHZ-1.99GHZ TO272
Description: IC AMP CEL 1.8GHZ-1.99GHZ TO272
Produkt ist nicht verfügbar
| MW6S004NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
Produkt ist nicht verfügbar
| MW6S010GNR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
| MW6S010MR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
| MW6S010NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Not For New Designs
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Not For New Designs
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
| XC56309VF100AR2 |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-MABGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Description: IC DSP 24BIT 100MHZ 196-MABGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Produkt ist nicht verfügbar
| XC68HC58EIA |
Hersteller: NXP USA Inc.
Description: IC MCU 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Supplier Device Package: 28-PLCC (11.51x11.51)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC MCU 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Supplier Device Package: 28-PLCC (11.51x11.51)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC68HC58EIAR |
Hersteller: NXP USA Inc.
Description: IC MCU 28PLCC
Packaging: Tape & Reel (TR)
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Supplier Device Package: 28-PLCC (11.51x11.51)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC MCU 28PLCC
Packaging: Tape & Reel (TR)
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Supplier Device Package: 28-PLCC (11.51x11.51)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XPC823CZT66B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
| XPC823EVR66B2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
| XPC823EVR75B2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 75MHZ 256BGA
Description: IC MPU MPC8XX 75MHZ 256BGA
Produkt ist nicht verfügbar
| XPC823ZT66B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
| XPC823ZT75B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 75MHZ 256BGA
Description: IC MPU MPC8XX 75MHZ 256BGA
Produkt ist nicht verfügbar
| XPC823ZT81B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 81MHZ 256BGA
Description: IC MPU MPC8XX 81MHZ 256BGA
Produkt ist nicht verfügbar
| XPC8260CZUIFBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 480TBGA
Description: IC MPU MPC82XX 200MHZ 480TBGA
Produkt ist nicht verfügbar
| XPC8260ZUIHBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC82XX 200MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| XPC850CZT66BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DECZT50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DEVR50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DEZT50BUR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DEZT66BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DEZT66BUR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DEZT80BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Description: IC MPU MPC8XX 80MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DSLCZT50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850DSLZT50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850SRCZT50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
Produkt ist nicht verfügbar
| XPC850SRZT50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
Produkt ist nicht verfügbar