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110-87-952-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
110-87-964-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
110-87-964-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-210-41-117101 114-83-210-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-304-41-117101 114-83-304-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
114-83-306-41-117101 114-83-306-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-306-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-306-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-308-41-117101 114-83-308-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
114-83-308-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
114-83-308-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-310-41-117101 114-83-310-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-310-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
114-83-310-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-312-41-117101 114-83-312-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
114-83-312-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
114-83-314-41-117101 114-83-314-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
114-83-314-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
114-83-314-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-316-41-117101 114-83-316-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
114-83-316-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
114-83-316-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-318-41-117101 114-83-318-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-318-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-318-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-320-41-117101 114-83-320-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
114-83-320-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
114-83-320-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-322-41-117101 114-83-322-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-324-41-117101 114-83-324-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-324-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-324-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-328-41-117101 114-83-328-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-328-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-328-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-420-41-117101 114-83-420-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-422-41-117101 114-83-422-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-424-41-117101 114-83-424-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-428-41-117101 114-83-428-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-432-41-117101 114-83-432-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-624-41-117101 114-83-624-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
114-83-624-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
114-83-628-41-117101 114-83-628-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-628-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-628-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-632-41-117101 114-83-632-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
114-83-632-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
114-83-632-41-134191 Preci-Dip Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-636-41-117101 114-83-636-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
114-83-640-41-117101 114-83-640-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
114-83-640-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
114-83-642-41-117101 114-83-642-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
114-83-642-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
114-83-648-41-117101 114-83-648-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
114-87-210-41-117101 114-87-210-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-87-304-41-117101 114-87-304-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-87-306-41-117101 114-87-306-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
114-87-306-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
114-87-310-41-117101 114-87-310-41-117101 Preci-Dip Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-87-310-41-134161 Preci-Dip Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161 Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
110-87-952-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
110-87-964-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
110-87-964-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-210-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-210-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-304-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-304-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
114-83-306-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-306-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-306-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-306-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-308-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-308-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
114-83-308-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
114-83-308-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-310-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-310-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-310-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
114-83-310-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-312-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-312-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
114-83-312-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
114-83-314-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-314-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
114-83-314-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
114-83-314-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-316-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-316-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
114-83-316-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
114-83-316-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-318-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-318-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-318-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-318-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-320-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-320-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
114-83-320-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
114-83-320-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-322-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-322-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-324-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-324-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-324-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-324-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-328-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-328-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-328-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-328-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-420-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-420-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-422-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-422-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-424-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-424-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-428-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-428-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-432-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-432-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-83-624-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-624-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
114-83-624-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
114-83-628-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-628-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-628-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
114-83-628-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-632-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-632-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
114-83-632-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
114-83-632-41-134191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-83-636-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-636-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
114-83-640-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-640-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
114-83-640-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
114-83-642-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-642-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
114-83-642-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
114-83-648-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-83-648-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Produkt ist nicht verfügbar
114-87-210-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-87-210-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-87-304-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-87-304-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
114-87-306-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-87-306-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
114-87-306-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
114-87-310-41-117101 Default.aspx?c=14&i=884&p=261&pdf=1&dsku=114-PP-XXX-41-117101
114-87-310-41-117101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-87-310-41-134161 Default.aspx?c=14&i=1082&p=264&pdf=1&dsku=114-PP-XXX-41-134161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
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