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110-83-318-41-001151 Preci-Dip Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, No Center Bar
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2376 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-005101 110-83-318-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2376 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1980 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-105161 Preci-Dip Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161 Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1980 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-105191 Preci-Dip Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Produkt ist nicht verfügbar
Mindestbestellmenge: 2200 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-605101 110-83-318-41-605101 Preci-Dip Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101 Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 2376 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-801101 Preci-Dip Default.aspx?c=14&i=970&p=257&pdf=1&dsku=110-PP-XXX-41-801101 Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2112 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-001101 110-83-320-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.38 EUR
20+3.81 EUR
100+3.4 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-001151 Preci-Dip Description: CONN IC DIP SOCKET 20POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame, No Center Bar
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 2160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-005101 110-83-320-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-105161 Preci-Dip Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-105191 Preci-Dip Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 2200 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-605101 110-83-320-41-605101 Preci-Dip Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-801101 110-83-320-41-801101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.29 EUR
20+9.14 EUR
100+8.15 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-001101 110-83-322-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 22POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1944 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-001151 Preci-Dip Description: CONN IC DIP SOCKET 22POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame, No Center Bar
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1944 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-005101 110-83-322-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1944 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1764 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-001101 110-83-324-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-001151 Preci-Dip Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, No Center Bar
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-005101 110-83-324-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-105161 Preci-Dip Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-105191 Preci-Dip Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 550 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-605101 Preci-Dip Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101 Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-01-762101 110-83-328-01-762101 Preci-Dip Default.aspx?c=14&i=1220&p=272&pdf=1&dsku=110-PP-XXX-01-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14), 16 Loaded
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1512 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-01-777101 110-83-328-01-777101 Preci-Dip Default.aspx?c=14&i=1220&p=272&pdf=1&dsku=110-PP-XXX-01-XXX101 Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14), 14 Loaded
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1512 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-001101 110-83-328-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 1251 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.1 EUR
10+6.45 EUR
100+5.69 EUR
500+4.83 EUR
1000+4.12 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-005101 110-83-328-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1512 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 196 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-105161 Preci-Dip Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161 Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1372 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-105191 Preci-Dip Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 550 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-420-41-001101 110-83-420-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-420-41-005101 110-83-420-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-420-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1008 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-001101 110-83-422-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1620 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-005101 110-83-422-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1620 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 912 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-605101 110-83-422-41-605101 Preci-Dip Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101 Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1620 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-424-41-001101 110-83-424-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-424-41-005101 110-83-424-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-424-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 816 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-428-41-001101 110-83-428-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1260 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-428-41-005101 110-83-428-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1260 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-428-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 720 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-432-41-001101 110-83-432-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1080 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-432-41-005101 110-83-432-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1080 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-432-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 624 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-610-41-001101 Preci-Dip Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 779 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-610-41-005101 110-83-610-41-005101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 697 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-001101 110-83-624-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 887 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.39 EUR
17+6.06 EUR
102+5.33 EUR
510+4.76 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-001151 Preci-Dip Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1292 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-005101 110-83-624-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1156 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-105101 Preci-Dip Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1190 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-605101 110-83-624-41-605101 Preci-Dip Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101 Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1156 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-801101 Preci-Dip Default.aspx?c=14&i=970&p=257&pdf=1&dsku=110-PP-XXX-41-801101 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1071 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-628-41-001101 110-83-628-41-001101 Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 882 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-628-41-001151 Preci-Dip Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, No Center Bar
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 882 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-628-41-005101 110-83-628-41-005101 Preci-Dip index.html Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 882 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-001151
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, No Center Bar
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2376 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2376 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1980 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-105161 Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1980 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-105191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Produkt ist nicht verfügbar
Mindestbestellmenge: 2200 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-605101 Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 2376 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-318-41-801101 Default.aspx?c=14&i=970&p=257&pdf=1&dsku=110-PP-XXX-41-801101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2112 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.38 EUR
20+3.81 EUR
100+3.4 EUR
Mindestbestellmenge: 5 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-001151
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame, No Center Bar
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 2160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-105161 Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-105191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 2200 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-605101 Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-320-41-801101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.29 EUR
20+9.14 EUR
100+8.15 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1944 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-001151
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame, No Center Bar
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1944 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1944 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-322-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1764 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-001151
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, No Center Bar
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-105161 Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-105191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 550 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-324-41-605101 Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1836 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-01-762101 Default.aspx?c=14&i=1220&p=272&pdf=1&dsku=110-PP-XXX-01-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14), 16 Loaded
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 1512 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-01-777101 Default.aspx?c=14&i=1220&p=272&pdf=1&dsku=110-PP-XXX-01-XXX101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14), 14 Loaded
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1512 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 1251 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.1 EUR
10+6.45 EUR
100+5.69 EUR
500+4.83 EUR
1000+4.12 EUR
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1512 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 196 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-105161 Default.aspx?c=14&i=1067&p=263&pdf=1&dsku=110-PP-XXX-41-105161
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1372 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-328-41-105191
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 550 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-420-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-420-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-420-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1008 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1620 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1620 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 912 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-422-41-605101 Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1620 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-424-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-424-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1530 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-424-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 816 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-428-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1260 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-428-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1260 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-428-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 720 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-432-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1080 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-432-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1080 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-432-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 624 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-610-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 779 Stücke
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110-83-610-41-005101 CATALOG-DILSOCKETS.pdf
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 697 Stücke
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110-83-624-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 887 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.39 EUR
17+6.06 EUR
102+5.33 EUR
510+4.76 EUR
Mindestbestellmenge: 3 Stücke
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110-83-624-41-001151
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1292 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1156 Stücke
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110-83-624-41-105101 Default.aspx?c=14&i=858&p=260&pdf=1&dsku=110-PP-XXX-41-105101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1190 Stücke
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110-83-624-41-605101 Default.aspx?c=14&i=957&p=256&pdf=1&dsku=110-PP-XXX-41-605101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1156 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-624-41-801101 Default.aspx?c=14&i=970&p=257&pdf=1&dsku=110-PP-XXX-41-801101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 1071 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-628-41-001101 Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 882 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-628-41-001151
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, No Center Bar
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 882 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
110-83-628-41-005101 index.html
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 882 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
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