0077001217 Laird Technologies EMI
Hersteller: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.320" (8.13mm)
Operating Temperature: 121°C
Height: 0.110" (2.79mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.320" (8.13mm)
Operating Temperature: 121°C
Height: 0.110" (2.79mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
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Technische Details 0077001217 Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH, Packaging: Bulk, Material: Beryllium Copper, Length: 24.000" (609.60mm), Type: Fingerstock, Width: 0.320" (8.13mm), Operating Temperature: 121°C, Height: 0.110" (2.79mm), Attachment Method: Adhesive, Plating: Tin, Plating - Thickness: 299.21µin (7.60µm).
Weitere Produktangebote 0077001217
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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0077001217 | Hersteller : Laird Technologies |
 EMI Gaskets, Sheets, Absorbers & Shielding NOSG, STR,SnB,PSA .110x.320x.187x24 |
Produkt ist nicht verfügbar |