0194270105 Molex
Hersteller: MolexDescription: CONN HEADER R/A 8POS 5.84MM
Packaging: Tray
Features: Board Guide, Mounting Flange
Connector Type: Header
Mounting Type: Panel Mount, Through Hole, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Contact Type: Male Blade
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Ingress Protection: IP67 - Dust Tight, Waterproof
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.230" (5.84mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.130" (3.30mm)
Insulation Height: 1.247" (31.67mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polybutylene Terephthalate (PBT), Glass Filled
Row Spacing - Mating: 0.230" (5.84mm)
auf Bestellung 1134 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 18.18 EUR |
| 36+ | 14.12 EUR |
| 108+ | 13.07 EUR |
| 504+ | 11.72 EUR |
| 1008+ | 11.16 EUR |
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Technische Details 0194270105 Molex
Description: CONN HEADER R/A 8POS 5.84MM, Packaging: Tray, Features: Board Guide, Mounting Flange, Connector Type: Header, Mounting Type: Panel Mount, Through Hole, Right Angle, Number of Positions: 8, Number of Rows: 2, Style: Board to Cable/Wire, Contact Type: Male Blade, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Ingress Protection: IP67 - Dust Tight, Waterproof, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.230" (5.84mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.130" (3.30mm), Insulation Height: 1.247" (31.67mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polybutylene Terephthalate (PBT), Glass Filled, Row Spacing - Mating: 0.230" (5.84mm).
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