Technische Details 0430450410 Molex
Description: CONN HEADER SMD R/A 4POS 3MM, Pitch - Mating: 0.118" (3.00mm), Insulation Color: Black, Contact Material: Brass Alloy, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Male Pin, Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 4, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): Varies by Wire Gauge, Voltage Rating: 600V, Connector Type: Header, Features: Solder Retention, Packaging: Tape & Reel (TR), Row Spacing - Mating: 0.118" (3.00mm), Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.290" (7.37mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold.
Weitere Produktangebote 0430450410 nach Preis ab 2.26 EUR bis 6.91 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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0430450410 | Molex |
 Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 667 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450410 | Molex |
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 667 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450410 | Molex |
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 9000 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450410 | Molex |
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 9000 Stücke: Lieferzeit 14-21 Tag (e) |
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 |
0430450410 | Molex |
Description: CONN HEADER SMD R/A 4POS 3MM Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 4 Mounting Type: Surface Mount, Right Angle Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 600V Connector Type: Header Features: Solder Retention Packaging: Tape & Reel (TR) Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Mating: Gold |
auf Bestellung 2400 Stücke: Lieferzeit 10-14 Tag (e) |
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0430450410 | Molex |
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 1800 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450410 | Molex |
Description: CONN HEADER SMD R/A 4POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 2524 Stücke: Lieferzeit 10-14 Tag (e) |
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| 0430450410 |
|
Hersteller: Molex
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 667 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 61+ | 2.9 EUR |
| 62+ | 2.74 EUR |
| 100+ | 2.65 EUR |
| 250+ | 2.58 EUR |
| 500+ | 2.51 EUR |
| 0430450410 |
|
Hersteller: Molex
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 667 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 61+ | 2.9 EUR |
| 62+ | 2.64 EUR |
| 100+ | 2.51 EUR |
| 250+ | 2.38 EUR |
| 500+ | 2.26 EUR |
| 0430450410 |
|
Hersteller: Molex
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 9000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1800+ | 3.55 EUR |
| 3600+ | 3.18 EUR |
| 9000+ | 3.03 EUR |
| 0430450410 |
|
Hersteller: Molex
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 9000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1800+ | 3.56 EUR |
| 3600+ | 3.26 EUR |
| 9000+ | 3.15 EUR |
| 0430450410 |
|
Hersteller: Molex
Description: CONN HEADER SMD R/A 4POS 3MM
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 4
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.290" (7.37mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Description: CONN HEADER SMD R/A 4POS 3MM
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 4
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.290" (7.37mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 4.32 EUR |
| 400+ | 4.06 EUR |
| 600+ | 3.92 EUR |
| 1000+ | 3.75 EUR |
| 1400+ | 3.67 EUR |
| 0430450410 |
|
Hersteller: Molex
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 4Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 1800 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1800+ | 4.55 EUR |
| 0430450410 |
|
Hersteller: Molex
Description: CONN HEADER SMD R/A 4POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD R/A 4POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 2524 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.91 EUR |
| 10+ | 5.63 EUR |
| 100+ | 4.59 EUR |