Technische Details 0430450606 Molex
Description: CONN HEADER SMD R/A 6POS 3MM, Row Spacing - Mating: 0.118" (3.00mm), Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.290" (7.37mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.118" (3.00mm), Insulation Color: Black, Contact Material: Brass, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Male Pin, Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 6, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 8A, Voltage Rating: 600V, Connector Type: Header, Features: Board Lock, Packaging: Tape & Reel (TR).
Weitere Produktangebote 0430450606 nach Preis ab 1.83 EUR bis 5.21 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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0430450606 | Molex |
 Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 737 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 737 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 3600 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 800 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450606 | Molex |
Description: CONN HEADER SMD R/A 6POS 3MM Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 6 Mounting Type: Surface Mount, Right Angle Current Rating (Amps): 8A Voltage Rating: 600V Connector Type: Header Features: Board Lock Packaging: Tape & Reel (TR) |
auf Bestellung 1400 Stücke: Lieferzeit 10-14 Tag (e) |
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0430450606 | Molex |
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 1800 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450606 | Molex |
Description: CONN HEADER SMD R/A 6POS 3MM Features: Board Lock Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount, Right Angle Number of Positions: 6 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 1431 Stücke: Lieferzeit 10-14 Tag (e) |
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| 0430450606 |
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Hersteller: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 737 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 77+ | 2.21 EUR |
| 78+ | 2.12 EUR |
| 100+ | 2.02 EUR |
| 250+ | 1.93 EUR |
| 500+ | 1.83 EUR |
| 0430450606 |
|
Hersteller: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 737 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 77+ | 2.26 EUR |
| 78+ | 2.2 EUR |
| 100+ | 2.14 EUR |
| 250+ | 2.09 EUR |
| 500+ | 2.05 EUR |
| 0430450606 |
|
Hersteller: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 3600 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3600+ | 2.7 EUR |
| 0430450606 |
|
Hersteller: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 800 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 800+ | 3.55 EUR |
| 0430450606 |
|
Hersteller: Molex
Description: CONN HEADER SMD R/A 6POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.290" (7.37mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 6
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Board Lock
Packaging: Tape & Reel (TR)
Description: CONN HEADER SMD R/A 6POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.290" (7.37mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 6
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Board Lock
Packaging: Tape & Reel (TR)
auf Bestellung 1400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 3.58 EUR |
| 400+ | 3.42 EUR |
| 600+ | 3.32 EUR |
| 1000+ | 3.2 EUR |
| 1400+ | 3.12 EUR |
| 0430450606 |
|
Hersteller: Molex
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 6Power POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 1800 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1800+ | 4.43 EUR |
| 0430450606 |
|
Hersteller: Molex
Description: CONN HEADER SMD R/A 6POS 3MM
Features: Board Lock
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD R/A 6POS 3MM
Features: Board Lock
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 1431 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 5.21 EUR |
| 10+ | 4.43 EUR |
| 25+ | 4.15 EUR |
| 50+ | 3.95 EUR |
| 100+ | 3.76 EUR |