0430450818 Molex
| Anzahl | Privatkunde |
|---|---|
| 200+ | 2.23 EUR |
| 400+ | 2.05 EUR |
| 600+ | 1.92 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
200 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 0430450818 Molex
Description: CONN HEADER SMD 8POS 3MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 8, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.390" (9.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Weitere Produktangebote 0430450818 nach Preis ab 2 EUR bis 5.55 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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0430450818 | Molex |
 Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 7000 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450818 | Molex |
Description: CONN HEADER SMD 8POS 3MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 8 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 22514 Stücke: Lieferzeit 10-14 Tag (e) |
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0430450818 | Molex |
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 1000 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450818 | Molex |
Description: CONN HEADER SMD 8POS 3MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 8 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 22549 Stücke: Lieferzeit 10-14 Tag (e) |
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0430450818 | Molex |
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 1034 Stücke: Lieferzeit 14-21 Tag (e) |
|
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|
|
0430450818 | Molex |
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 1034 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 0430450818 |
|
Hersteller: Molex
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 7000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 2.23 EUR |
| 400+ | 2.09 EUR |
| 600+ | 2 EUR |
| 0430450818 |
|
Hersteller: Molex
Description: CONN HEADER SMD 8POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD 8POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 22514 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 2.83 EUR |
| 400+ | 2.7 EUR |
| 600+ | 2.62 EUR |
| 1000+ | 2.52 EUR |
| 1400+ | 2.46 EUR |
| 2000+ | 2.4 EUR |
| 0430450818 |
|
Hersteller: Molex
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 1000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 3.09 EUR |
| 0430450818 |
|
Hersteller: Molex
Description: CONN HEADER SMD 8POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD 8POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 22549 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4.13 EUR |
| 10+ | 3.5 EUR |
| 100+ | 2.98 EUR |
| 0430450818 |
|
Hersteller: Molex
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 1034 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 31+ | 5.33 EUR |
| 100+ | 5.05 EUR |
| 250+ | 4.77 EUR |
| 500+ | 4.5 EUR |
| 1000+ | 4.22 EUR |
| 0430450818 |
|
Hersteller: Molex
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 1034 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 31+ | 5.55 EUR |
| 100+ | 5.33 EUR |
| 250+ | 5.16 EUR |
| 500+ | 5.01 EUR |
| 1000+ | 4.81 EUR |