0430451424 Molex
Hersteller: Molex
Conn Wire to Board HDR 14Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray
Produktrezensionen
Produktbewertung abgeben
Technische Details 0430451424 Molex
Description: CONN HEADER VERT 14POS 3MM, Features: Board Guide, Board Lock, Packaging: Tray, Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Number of Positions: 14, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Kinked Pin, Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.125" (3.18mm), Insulation Height: 0.390" (9.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Weitere Produktangebote 0430451424 nach Preis ab 3.21 EUR bis 6.03 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|
0430451424 | Molex |
Conn Wire to Board HDR 14Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray |
auf Bestellung 700 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||
|
0430451424 | Molex |
Description: CONN HEADER VERT 14POS 3MMFeatures: Board Guide, Board Lock Packaging: Tray Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 14 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Kinked Pin, Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 932 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||
|
0430451424 | Molex |
Conn Wire to Board HDR 14Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray |
auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 0430451424 |
![]() |
Hersteller: Molex
Conn Wire to Board HDR 14Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray
Conn Wire to Board HDR 14Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray
auf Bestellung 700 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 100+ | 3.21 EUR |
| 0430451424 |
![]() |
Hersteller: Molex
Description: CONN HEADER VERT 14POS 3MM
Features: Board Guide, Board Lock
Packaging: Tray
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Kinked Pin, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER VERT 14POS 3MM
Features: Board Guide, Board Lock
Packaging: Tray
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Kinked Pin, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 932 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.03 EUR |
| 10+ | 5.12 EUR |
| 100+ | 4.36 EUR |
| 0430451424 |
![]() |
Hersteller: Molex
Conn Wire to Board HDR 14Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray
Conn Wire to Board HDR 14Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)


