Produkte > MOLEX > 0430452019
0430452019

0430452019 Molex

430452019displaypdf.pdf
Hersteller: Molex
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 522 Stücke:
Lieferzeit 14-21 Tag (e)
AnzahlPrivatkunde
38+4.64 EUR
39+4.51 EUR
40+4.34 EUR
100+4.18 EUR
250+4.05 EUR
500+3.92 EUR
Mindestbestellmenge: 38 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 0430452019 Molex

Description: CONN HEADER SMD 20POS 3MM, Row Spacing - Mating: 0.118" (3.00mm), Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.390" (9.91mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.118" (3.00mm), Insulation Color: Black, Contact Material: Brass, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Male Pin, Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 20, Mounting Type: Surface Mount, Current Rating (Amps): 8A, Voltage Rating: 600V, Connector Type: Header, Features: Solder Retention, Packaging: Tape & Reel (TR).

Weitere Produktangebote 0430452019 nach Preis ab 3.37 EUR bis 12.13 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
0430452019 0430452019 Molex 430452019displaypdf.pdf Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 522 Stücke:
Lieferzeit 14-21 Tag (e)
26+7 EUR
38+4.47 EUR
39+4.25 EUR
40+4.02 EUR
100+3.8 EUR
250+3.58 EUR
500+3.37 EUR
Mindestbestellmenge: 26 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 0430452019 Molex 430452019displaypdf.pdf Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
1000+7.01 EUR
2000+6.53 EUR
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 0430452019 Molex 430452019displaypdf.pdf Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
1000+7.02 EUR
2000+6.68 EUR
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 0430452019 Molex 430450219_sd.pdf Description: CONN HEADER SMD 20POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.390" (9.91mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 20
Mounting Type: Surface Mount
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
200+8.34 EUR
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 0430452019 Molex 430450219_sd.pdf Description: CONN HEADER SMD 20POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.390" (9.91mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 20
Mounting Type: Surface Mount
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 272 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.13 EUR
10+10.31 EUR
100+8.76 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 430452019displaypdf.pdf
0430452019
Hersteller: Molex
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 522 Stücke:
Lieferzeit 14-21 Tag (e)
AnzahlPrivatkunde
26+7 EUR
38+4.47 EUR
39+4.25 EUR
40+4.02 EUR
100+3.8 EUR
250+3.58 EUR
500+3.37 EUR
Mindestbestellmenge: 26 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 430452019displaypdf.pdf
0430452019
Hersteller: Molex
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
AnzahlPrivatkunde
1000+7.01 EUR
2000+6.53 EUR
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 430452019displaypdf.pdf
0430452019
Hersteller: Molex
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
AnzahlPrivatkunde
1000+7.02 EUR
2000+6.68 EUR
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 430450219_sd.pdf
0430452019
Hersteller: Molex
Description: CONN HEADER SMD 20POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.390" (9.91mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 20
Mounting Type: Surface Mount
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
200+8.34 EUR
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
0430452019 430450219_sd.pdf
0430452019
Hersteller: Molex
Description: CONN HEADER SMD 20POS 3MM
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.390" (9.91mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 20
Mounting Type: Surface Mount
Current Rating (Amps): 8A
Voltage Rating: 600V
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 272 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.13 EUR
10+10.31 EUR
100+8.76 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH