0430452019 Molex
| Anzahl | Privatkunde |
|---|---|
| 38+ | 4.7 EUR |
| 39+ | 4.56 EUR |
| 40+ | 4.39 EUR |
| 100+ | 4.22 EUR |
| 250+ | 4.09 EUR |
| 500+ | 3.96 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
38 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 0430452019 Molex
Description: CONN HEADER SMD 20POS 3MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): 8A, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.390" (9.91mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Weitere Produktangebote 0430452019 nach Preis ab 3.4 EUR bis 16.73 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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0430452019 | Molex |
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 522 Stücke: Lieferzeit 14-21 Tag (e) |
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0430452019 | Molex |
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 16000 Stücke: Lieferzeit 14-21 Tag (e) |
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0430452019 | Molex |
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 16000 Stücke: Lieferzeit 14-21 Tag (e) |
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0430452019 | Molex |
Description: CONN HEADER SMD 20POS 3MMFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 2600 Stücke: Lieferzeit 10-14 Tag (e) |
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0430452019 | Molex |
Description: CONN HEADER SMD 20POS 3MMFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): 8A Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.390" (9.91mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 2688 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 0430452019 |
![]() |
Hersteller: Molex
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 522 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 26+ | 7.08 EUR |
| 38+ | 4.53 EUR |
| 39+ | 4.3 EUR |
| 40+ | 4.06 EUR |
| 100+ | 3.83 EUR |
| 250+ | 3.62 EUR |
| 500+ | 3.4 EUR |
| 0430452019 |
![]() |
Hersteller: Molex
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 7.09 EUR |
| 2000+ | 6.76 EUR |
| 0430452019 |
![]() |
Hersteller: Molex
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 7.09 EUR |
| 2000+ | 6.6 EUR |
| 0430452019 |
![]() |
Hersteller: Molex
Description: CONN HEADER SMD 20POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD 20POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 2600 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 11.51 EUR |
| 400+ | 10.96 EUR |
| 600+ | 10.65 EUR |
| 1000+ | 10.27 EUR |
| 1400+ | 10.03 EUR |
| 0430452019 |
![]() |
Hersteller: Molex
Description: CONN HEADER SMD 20POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD 20POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): 8A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.390" (9.91mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 2688 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.73 EUR |
| 10+ | 14.21 EUR |
| 100+ | 12.08 EUR |


