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Technische Details 0447642001 Molex
Description: CONN RCPT 20P 0.118 TIN PCB R/A, Packaging: Tray, Features: Blind Mating, Board Guide, Connector Type: Receptacle, Voltage Rating: 600VAC, Current Rating (Amps): 5A, Mounting Type: Through Hole, Right Angle, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -40°C ~ 105°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 40.0µin (1.02µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.155" (3.94mm), Insulation Height: 0.402" (10.20mm), Row Spacing - Mating: 0.118" (3.00mm), Number of Rows: 2.
Weitere Produktangebote 0447642001 nach Preis ab 6.66 EUR bis 13.8 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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0447642001 | Molex |
 Conn Wire to Board RCP 20Power POS 3mm Solder RA Thru-Hole Tray |
auf Bestellung 83 Stücke: Lieferzeit 14-21 Tag (e) |
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0447642001 | Molex |
Description: CONN RCPT 20P 0.118 TIN PCB R/A Packaging: Tray Features: Blind Mating, Board Guide Connector Type: Receptacle Voltage Rating: 600VAC Current Rating (Amps): 5A Mounting Type: Through Hole, Right Angle Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -40°C ~ 105°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 40.0µin (1.02µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.155" (3.94mm) Insulation Height: 0.402" (10.20mm) Row Spacing - Mating: 0.118" (3.00mm) Number of Rows: 2 |
auf Bestellung 1463 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 0447642001 |
|
Hersteller: Molex
Conn Wire to Board RCP 20Power POS 3mm Solder RA Thru-Hole Tray
Conn Wire to Board RCP 20Power POS 3mm Solder RA Thru-Hole Tray
auf Bestellung 83 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 25+ | 7.13 EUR |
| 26+ | 6.66 EUR |
| 0447642001 |
|
Hersteller: Molex
Description: CONN RCPT 20P 0.118 TIN PCB R/A
Packaging: Tray
Features: Blind Mating, Board Guide
Connector Type: Receptacle
Voltage Rating: 600VAC
Current Rating (Amps): 5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -40°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 40.0µin (1.02µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.155" (3.94mm)
Insulation Height: 0.402" (10.20mm)
Row Spacing - Mating: 0.118" (3.00mm)
Number of Rows: 2
Description: CONN RCPT 20P 0.118 TIN PCB R/A
Packaging: Tray
Features: Blind Mating, Board Guide
Connector Type: Receptacle
Voltage Rating: 600VAC
Current Rating (Amps): 5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -40°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 40.0µin (1.02µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.155" (3.94mm)
Insulation Height: 0.402" (10.20mm)
Row Spacing - Mating: 0.118" (3.00mm)
Number of Rows: 2
auf Bestellung 1463 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.8 EUR |
| 10+ | 11.73 EUR |
| 400+ | 9.04 EUR |
| 800+ | 8.62 EUR |
| 1200+ | 8.37 EUR |