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0447692003 Molex


447690401_sd.pdf
Hersteller: Molex
Description: CONN RCPT 20POS 0.118 GOLD PCB
Number of Rows: 2
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Height: 0.535" (13.60mm)
Contact Length - Post: 0.134" (3.40mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Mated Stacking Heights: 16.86mm
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -40°C ~ 105°C
Style: Board to Board or Cable
Number of Positions: 20
Mounting Type: Through Hole
Current Rating (Amps): 5A
Voltage Rating: 250VAC
Connector Type: Receptacle
Features: Blind Mating, Board Guide
Packaging: Tray
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Technische Details 0447692003 Molex

Description: CONN RCPT 20POS 0.118 GOLD PCB, Number of Rows: 2, Row Spacing - Mating: 0.118" (3.00mm), Insulation Height: 0.535" (13.60mm), Contact Length - Post: 0.134" (3.40mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.118" (3.00mm), Insulation Color: Black, Mated Stacking Heights: 16.86mm, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -40°C ~ 105°C, Style: Board to Board or Cable, Number of Positions: 20, Mounting Type: Through Hole, Current Rating (Amps): 5A, Voltage Rating: 250VAC, Connector Type: Receptacle, Features: Blind Mating, Board Guide, Packaging: Tray.

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Mindestbestellmenge: 1620 Stücke
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0447692003 447690401_sd.pdf
Hersteller: Molex
Headers & Wire Housings MICRO-FIT 3.0 BMI HDR 2X10P VT
Produkt ist nicht verfügbar
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0447692003 dtemp447692003.pdf
Hersteller: Molex
Conn Wire to Board RCP 20 POS 3mm Solder ST SMD Micro-Fit BMI Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1620 Stücke
Im Einkaufswagen  Stück im Wert von  UAH