0459713115 Molex
Hersteller: MolexDescription: CONN HD ARRAY RCPT 300P SMD GOLD
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 300
Pitch: 0.050" (1.27mm)
Height Above Board: 0.199" (5.05mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 7.5mm, 8mm, 8.5mm, 9.5mm, 10mm, 12mm
Number of Rows: 10
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 63.41 EUR |
| 10+ | 54.85 EUR |
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Technische Details 0459713115 Molex
Description: CONN HD ARRAY RCPT 300P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 300, Pitch: 0.050" (1.27mm), Height Above Board: 0.199" (5.05mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 7.5mm, 8mm, 8.5mm, 9.5mm, 10mm, 12mm, Number of Rows: 10.
Weitere Produktangebote 0459713115
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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0459713115 | Hersteller : Molex |
Conn Board to Board RCP 300 POS 1.27mm Solder ST SMD SEARAY T/R |
Produkt ist nicht verfügbar |
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0459713115 | Hersteller : Molex |
Description: CONN HD ARRAY RCPT 300P SMD GOLD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 300 Pitch: 0.050" (1.27mm) Height Above Board: 0.199" (5.05mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 7.5mm, 8mm, 8.5mm, 9.5mm, 10mm, 12mm Number of Rows: 10 |
Produkt ist nicht verfügbar |