0459714315 Molex
Hersteller: MolexDescription: CONN HD ARRAY RCPT 400P SMD GOLD
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9mm, 9.5mm, 10mm, 11mm, 11.5mm, 13.5mm
Number of Rows: 10
auf Bestellung 341 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 59.07 EUR |
| 10+ | 47.32 EUR |
| 25+ | 43.85 EUR |
| 50+ | 41.59 EUR |
| 100+ | 39.59 EUR |
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Technische Details 0459714315 Molex
Description: CONN HD ARRAY RCPT 400P SMD GOLD, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 400, Pitch: 0.050" (1.27mm), Height Above Board: 0.258" (6.55mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 8.5mm, 9mm, 9.5mm, 10mm, 11mm, 11.5mm, 13.5mm, Number of Rows: 10.
Weitere Produktangebote 0459714315
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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0459714315 | Hersteller : Molex |
Conn Board to Board RCP 400 POS 1.27mm Solder ST SMD SEARAY T/R |
Produkt ist nicht verfügbar |
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0459714315 | Hersteller : Molex |
Description: CONN HD ARRAY RCPT 400P SMD GOLD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 400 Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9mm, 9.5mm, 10mm, 11mm, 11.5mm, 13.5mm Number of Rows: 10 |
Produkt ist nicht verfügbar |