0513382674 Molex
Hersteller: MolexDescription: CONN RCPT 26POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.016" (0.40mm)
Height Above Board: 0.053" (1.35mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 1.5mm
Part Status: Active
Number of Rows: 2
auf Bestellung 2124 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 4.1 EUR |
| 10+ | 3.49 EUR |
| 25+ | 3.27 EUR |
| 50+ | 3.12 EUR |
| 100+ | 2.97 EUR |
| 250+ | 2.78 EUR |
| 500+ | 2.65 EUR |
| 1000+ | 2.61 EUR |
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Technische Details 0513382674 Molex
Description: CONN RCPT 26POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 26, Pitch: 0.016" (0.40mm), Height Above Board: 0.053" (1.35mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 1.5mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote 0513382674
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0513382674 | Hersteller : Molex |
Conn Board to Board RCP 26 POS 0.4mm Solder ST SMD SlimStack™ T/R |
Produkt ist nicht verfügbar |
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0513382674 | Hersteller : Molex |
Description: CONN RCPT 26POS SMD GOLDPackaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 26 Pitch: 0.016" (0.40mm) Height Above Board: 0.053" (1.35mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 1.5mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |